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| Изображение | Тип | Марка | Объяснение | Установленная цена | Количество | RoHS | Contact Plating | Mounting Type | Housing Material | Base Product Number | Contact Finish Mating | Contact Materials | Factory Pack QuantityFactory Pack Quantity | Ihs Manufacturer | Manufacturer Part Number | Manufacturer Series | Maximum Operating Temperature | Mfr | Minimum Operating Temperature | Mounting Styles | Number of Rows Loaded | Package | Part Life Cycle Code | Product Status | Risk Rank | RoHS | Rohs Code | Samacsys Description | Tradename | Voltage, Rating | Operating Temperature | Packaging | Series | JESD-609 Code | Pbfree Code | Termination | Connector Type | Number of Positions | Color | Number of Rows | MIL Conformance | DIN Conformance | IEC Conformance | Filter Feature | Mixed Contacts | Option | Current Rating (Amps) | Pitch | Total Number of Contacts | Terminal Pitch | Number of Positions Loaded | Reach Compliance Code | Current Rating | Contact Finish | Termination Style | Contact Gender | Housing Color | Row Spacing | Termination Type | Connector Style | Accessory Type | Contact Finish Termination | Contact Layout, Typical | Number of Columns | Connector Usage | Product | Mounting Angle | Features | Contact Finish Thickness | Material Flammability Rating |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
  | Mfr. ТипHDTM-3-04-2-S-VT-0-4Anlielectronics Тип | Samtec, Inc. |
High Speed / Modular Connectors XCede HD 1.80 mm Vertical Backplane Header
Сборник данных
Сравнение
| Min.:1 Mult.:1 | Gold | - | Liquid Crystal Polymer (LCP) | - | - | Copper Alloy | 60 | - | - | - | + 105 C | - | - 40 C | - | - | - | - | - | - | Details | - | - | XCede | - | - | Tray | HDTM | - | - | - | - | - | - | 4 Row | - | - | - | - | - | - | - | 1.8 mm | - | - | - | - | - | - | Solder Pin | - | Black | - | - | - | - | - | - | - | - | Headers | Vertical | - | - | - | ||
| HDTM-3-04-2-S-VT-0-4 | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| | Mfr. ТипHDTM-6-08-1-S-VT-0-1Anlielectronics Тип | Samtec, Inc. |
High Speed / Modular Connectors XCede HD 1.80 mm Vertical Backplane Header
Сборник данных
Сравнение
| Min.:1 Mult.:1 | Gold | Through Hole | Liquid Crystal Polymer (LCP) | HDTM-6 | - | Copper Alloy | 45 | SAMTEC INC | HDTM-6-08-1-S-VT-0-1 | - | + 105 C | Samtec Inc. | - 40 C | - | - | Tray | Active | Active | 5.75 | Details | - | - | XCede | - | -40°C ~ 105°C | Tray | HDTM | - | - | Press-Fit | Header, Male Blades | 96 Position | Black | 8 Row | - | - | - | - | - | - | - | 1.8 mm | - | - | All | compliant | - | Gold | Press Fit | - | Black | - | - | XCede® | - | - | - | 8 | Backplane | Headers | Vertical | - | 30.0µin (0.76µm) | - | ||
| HDTM-6-08-1-S-VT-0-1 | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| | Mfr. ТипESW-104-49-L-SAnlielectronics Тип | Samtec, Inc. |
PC / 104 Connectors .100" Elevated Socket Strip
Сборник данных
Сравнение
| Min.:1 Mult.:1 | Gold | - | Polyester | - | - | Phosphor Bronze | 1 | - | - | - | - | - | - | - | - | - | - | - | - | Details | - | - | - | - | - | Bulk | ESW | - | - | - | - | 4 Position | - | - | - | - | - | - | - | - | - | 2.54 mm | - | - | - | - | - | - | Solder Pin | - | Black | - | - | - | - | - | - | - | - | Stackthrough | - | - | - | - | ||
| ESW-104-49-L-S | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| | Mfr. ТипESQ-115-12-L-S-LLAnlielectronics Тип | Samtec, Inc. |
PC / 104 Connectors .100" PC/104 Elevated Socket Strip
Сборник данных
Сравнение
| Min.:1 Mult.:1 | - | - | Polyester | - | - | Phosphor Bronze | 14 | - | - | - | - | - | - | - | - | - | - | - | - | Details | - | - | PC/104 | - | - | Tube | ESQ | - | - | - | - | 15 Position | - | - | - | - | - | - | - | - | - | 2.54 mm | - | - | - | - | - | - | Solder Pin | - | Black | - | - | - | - | - | - | - | - | Stackthrough | - | - | - | - | ||
| ESQ-115-12-L-S-LL | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| | Mfr. ТипESQ-120-23-L-S-LLAnlielectronics Тип | Samtec, Inc. |
PC / 104 Connectors .100" PC/104 Elevated Socket Strip
Сборник данных
Сравнение
| Min.:1 Mult.:1 | - | - | Polyester | - | - | Phosphor Bronze | 11 | - | - | - | - | - | - | - | - | - | - | - | - | Details | - | - | PC/104 | - | - | Tube | ESQ | - | - | - | - | 20 Position | - | - | - | - | - | - | - | - | - | 2.54 mm | - | - | - | - | - | - | Solder Pin | - | Black | - | - | - | - | - | - | - | - | Stackthrough | - | - | - | - | ||
| ESQ-120-23-L-S-LL | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| | Mfr. ТипHDTF-3-06-S-RA-HS-100Anlielectronics Тип | Samtec, Inc. |
High Speed / Modular Connectors XCede HD 1.80 mm RightAngle Backplane Receptacle
Сборник данных
Сравнение
| Min.:1 Mult.:1 | Gold | - | Liquid Crystal Polymer (LCP) | - | - | Copper Alloy | 42 | SAMTEC INC | HDTF-3-06-S-RA-HS-100 | - | + 105 C | - | - 40 C | - | - | - | Active | - | 5.77 | Details | - | - | XCede | - | - | Tray | HDTF | - | - | - | BOARD CONNECTOR | - | - | 6 Row | - | - | - | - | - | - | - | 1.8 mm | - | - | - | compliant | - | - | Solder Pin | - | Black | - | - | - | - | - | - | - | - | Receptacles | Right Angle | - | - | - | ||
| HDTF-3-06-S-RA-HS-100 | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| | Mfr. ТипESW-120-58-H-DAnlielectronics Тип | Samtec, Inc. |
PC / 104 Connectors .100" Elevated Socket Strip
Сборник данных
Сравнение
| Min.:1 Mult.:1 | Gold | BOARD | Polyester | - | GOLD | Phosphor Bronze | 11 | SAMTEC INC | ESW-120-58-H-D | ESW | - | - | - | STRAIGHT | 2 | - | Active | - | 5.68 | Details | Yes | 40 Position, .100 Elevated Socket Strip, Double Row | - | - | - | Tube | ESW | e4 | Yes | - | BOARD CONNECTOR | 40 Position | - | - | NO | NO | NO | NO | NO | GENERAL PURPOSE | - | 2.54 mm | 40 | 2.54 mm | - | compliant | - | - | Solder Pin | FEMALE | Black | - | SOLDER | - | - | GOLD | - | - | - | Stackthrough | - | - | - | - | ||
| ESW-120-58-H-D | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| | Mfr. ТипHDTF-6-04-S-RA-LC-100Anlielectronics Тип | Samtec, Inc. |
High Speed / Modular Connectors XCede HD 1.80 mm RightAngle Backplane Receptacle
Сборник данных
Сравнение
| Min.:1 Mult.:1 | Gold | - | Liquid Crystal Polymer (LCP) | - | - | Copper Alloy | 28 | SAMTEC INC | HDTF-6-04-S-RA-LC-100 | - | + 105 C | - | - 40 C | - | - | - | Active | - | 5.77 | Details | - | - | XCede | - | - | Tray | HDTF | - | - | - | BOARD CONNECTOR | - | - | 4 Row | - | - | - | - | - | - | - | 1.8 mm | - | - | - | compliant | - | - | Solder Pin | - | Black | - | - | - | - | - | - | - | - | Receptacles | Right Angle | - | - | - | ||
| HDTF-6-04-S-RA-LC-100 | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| | Mfr. ТипHDTF-6-08-S-RA-HS-100Anlielectronics Тип | Samtec, Inc. |
High Speed / Modular Connectors XCede HD 1.80 mm RightAngle Backplane Receptacle
Сборник данных
Сравнение
| Min.:1 Mult.:1 | Gold | Board Edge, Through Hole, Right Angle | Liquid Crystal Polymer (LCP) | HDTF-6 | - | Copper Alloy | 1 | SAMTEC INC | HDTF-6-08-S-RA-HS-100 | - | + 105 C | Samtec Inc. | - 40 C | - | - | Bulk | Active | Active | 5.77 | Details | - | - | XCede | - | -40°C ~ 105°C | Bulk | HDTF | - | - | Press-Fit | Receptacle, Female Sockets | 96 Position | Black | 8 Row | - | - | - | - | - | - | - | 1.8 mm | - | - | All | compliant | - | Gold | Press Fit | - | Black | - | - | XCede® | - | - | - | 8 | Backplane | Receptacles | Right Angle | - | 30.0µin (0.76µm) | - | ||
| HDTF-6-08-S-RA-HS-100 | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| | Mfr. ТипHPW-04-04-T-S-299-250Anlielectronics Тип | Samtec, Inc. |
Power to the Board .200" Power Board Stacker
Сборник данных
Сравнение
| Min.:1 Mult.:1 | Tin | - | Liquid Crystal Polymer (LCP) | - | - | Copper Alloy | 1 | - | - | - | + 105 C | - | - 55 C | - | - | - | - | - | - | Details | - | - | - | 850 V | - | Bulk | HPW | - | - | - | - | 4 Position | - | 1 Row | - | - | - | - | - | - | - | 5.08 mm | - | - | - | - | 16.6 A | - | - | Pin (Male) | Black | - | - | - | - | - | - | - | - | Headers | Straight | - | - | - | ||
| HPW-04-04-T-S-299-250 | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| | Mfr. ТипHPW-06-04-T-S-900-325Anlielectronics Тип | Samtec, Inc. |
Power to the Board .200" Power Board Stacker
Сборник данных
Сравнение
| Min.:1 Mult.:1 | Tin | - | Liquid Crystal Polymer (LCP) | - | - | Copper Alloy | 1 | - | - | - | + 105 C | - | - 55 C | - | - | - | - | - | - | Details | - | - | - | 850 V | - | Bulk | HPW | - | - | - | - | 6 Position | - | 1 Row | - | - | - | - | - | - | - | 5.08 mm | - | - | - | - | 16.6 A | - | - | Pin (Male) | Black | - | - | - | - | - | - | - | - | Headers | Straight | - | - | - | ||
| HPW-06-04-T-S-900-325 | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| | Mfr. ТипHDTM-6-08-1-S-VT-0-2Anlielectronics Тип | Samtec, Inc. |
High Speed / Modular Connectors XCede HD 1.80 mm Vertical Backplane Header
Сборник данных
Сравнение
| Min.:1 Mult.:1 | Gold | - | Liquid Crystal Polymer (LCP) | - | - | Copper Alloy | 102 | - | - | - | + 105 C | - | - 40 C | - | - | - | - | - | - | Details | - | - | XCede | - | - | Tray | HDTM | - | - | - | - | - | - | 8 Row | - | - | - | - | - | - | - | 1.8 mm | - | - | - | - | - | - | Solder Pin | - | Black | - | - | - | - | - | - | - | - | Headers | Vertical | - | - | - | ||
| HDTM-6-08-1-S-VT-0-2 | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| | Mfr. ТипHDTM-6-04-1-S-VT-0-1Anlielectronics Тип | Samtec, Inc. |
High Speed / Modular Connectors XCede HD 1.80 mm Vertical Backplane Header
Сборник данных
Сравнение
| Min.:1 Mult.:1 | Gold | - | Liquid Crystal Polymer (LCP) | - | - | Copper Alloy | 50 | SAMTEC INC | HDTM-6-04-1-S-VT-0-1 | - | + 105 C | - | - 40 C | - | - | - | Active | - | 5.77 | Details | - | - | XCede | - | - | Tray | HDTM | - | - | - | BOARD CONNECTOR | - | - | 4 Row | - | - | - | - | - | - | - | 1.8 mm | - | - | - | compliant | - | - | Solder Pin | - | Black | - | - | - | - | - | - | - | - | Headers | Vertical | - | - | - | ||
| HDTM-6-04-1-S-VT-0-1 | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| | Mfr. ТипHPW-03-04-T-S-750-110-VS-PAnlielectronics Тип | Samtec, Inc. |
Power to the Board .200" Power Board Stacker
Сборник данных
Сравнение
| Min.:1 Mult.:1 | Tin | - | Liquid Crystal Polymer (LCP) | - | - | Copper Alloy | 38 | - | - | - | + 105 C | - | - 55 C | - | - | - | - | - | - | Details | - | - | - | 850 V | - | Tube | HPW | - | - | - | - | 3 Position | - | 1 Row | - | - | - | - | - | - | - | 5.08 mm | - | - | - | - | 16.6 A | - | - | Pin (Male) | Black | - | - | - | - | - | - | - | - | Headers | Straight | - | - | - | ||
| HPW-03-04-T-S-750-110-VS-P | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| | Mfr. ТипHDTM-6-06-1-S-VT-0-1Anlielectronics Тип | Samtec, Inc. |
High Speed / Modular Connectors XCede HD 1.80 mm Vertical Backplane Header
Сборник данных
Сравнение
| Min.:1 Mult.:1 | Gold | - | Liquid Crystal Polymer (LCP) | - | - | Copper Alloy | 66 | - | - | - | + 105 C | - | - 40 C | - | - | - | - | - | - | Details | - | - | XCede | - | - | Tray | HDTM | - | - | - | - | - | - | 6 Row | - | - | - | - | - | - | - | 1.8 mm | - | - | - | - | - | - | Solder Pin | - | Black | - | - | - | - | - | - | - | - | Headers | Vertical | - | - | - | ||
| HDTM-6-06-1-S-VT-0-1 | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| | Mfr. ТипHPW-05-04-T-S-200-235Anlielectronics Тип | Samtec, Inc. |
Power to the Board .200" Power Board Stacker
Сборник данных
Сравнение
| Min.:1 Mult.:1 | Tin | - | Liquid Crystal Polymer (LCP) | - | - | Copper Alloy | 1 | - | - | - | + 105 C | - | - 55 C | - | - | - | - | - | - | Details | - | - | - | 850 V | - | Bulk | HPW | - | - | - | - | 5 Position | - | 1 Row | - | - | - | - | - | - | - | 5.08 mm | - | - | - | - | 16.6 A | - | - | Pin (Male) | Black | - | - | - | - | - | - | - | - | Headers | Straight | - | - | - | ||
| HPW-05-04-T-S-200-235 | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| | Mfr. ТипHDTM-3-08-2-S-VT-0-4Anlielectronics Тип | Samtec, Inc. |
High Speed / Modular Connectors XCede HD 1.80 mm Vertical Backplane Header
Сборник данных
Сравнение
| Min.:1 Mult.:1 | Gold | - | Liquid Crystal Polymer (LCP) | - | - | Copper Alloy | 60 | - | - | - | + 105 C | - | - 40 C | - | - | - | - | - | - | Details | - | - | XCede | - | - | Tray | HDTM | - | - | - | - | - | - | 8 Row | - | - | - | - | - | - | - | 1.8 mm | - | - | - | - | - | - | Solder Pin | - | Black | - | - | - | - | - | - | - | - | Headers | Vertical | - | - | - | ||
| HDTM-3-08-2-S-VT-0-4 | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| | Mfr. ТипHDTF-3-04-S-RA-HS-100Anlielectronics Тип | Samtec, Inc. |
High Speed / Modular Connectors XCede HD 1.80 mm RightAngle Backplane Receptacle
Сборник данных
Сравнение
| Min.:1 Mult.:1 | Gold | - | Liquid Crystal Polymer (LCP) | - | - | Copper Alloy | 42 | SAMTEC INC | HDTF-3-04-S-RA-HS-100 | - | + 105 C | - | - 40 C | - | - | - | Active | - | 5.77 | Details | - | - | XCede | - | - | Tray | HDTF | - | - | - | BOARD CONNECTOR | - | - | 4 Row | - | - | - | - | - | - | - | 1.8 mm | - | - | - | compliant | - | - | Solder Pin | - | Black | - | - | - | - | - | - | - | - | Receptacles | Right Angle | - | - | - | ||
| HDTF-3-04-S-RA-HS-100 | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| | Mfr. ТипJW-03-04-T-S-280-280Anlielectronics Тип | Samtec, Inc. |
Power to the Board .156" Flex Stack, Power Flexible Board Stacker
Сборник данных
Сравнение
| Min.:1 Mult.:1 | Tin | - | Liquid Crystal Polymer (LCP) | - | - | Phosphor Bronze | 1 | - | - | - | + 105 C | - | - 55 C | - | - | - | - | - | - | - | - | - | - | 600 V | - | Bulk | JW | - | - | - | - | - | - | 1 Row | - | - | - | - | - | - | - | 3.96 mm | - | - | - | - | - | - | - | Pin (Male) | Natural | - | - | - | - | - | - | - | - | Headers | Straight | - | - | - | ||
| JW-03-04-T-S-280-280 | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| | Mfr. ТипHDTF-6-06-S-RA-HS-100Anlielectronics Тип | Samtec, Inc. |
High Speed / Modular Connectors XCede HD 1.80 mm RightAngle Backplane Receptacle
Сборник данных
Сравнение
| Min.:1 Mult.:1 | Gold | - | Liquid Crystal Polymer (LCP) | - | - | Copper Alloy | 28 | SAMTEC INC | HDTF-6-06-S-RA-HS-100 | - | + 105 C | - | - 40 C | - | - | - | Active | - | 5.77 | Details | - | - | XCede | - | - | Tray | HDTF | - | - | - | BOARD CONNECTOR | - | - | 6 Row | - | - | - | - | - | - | - | 1.8 mm | - | - | - | compliant | - | - | Solder Pin | - | Black | - | - | - | - | - | - | - | - | Receptacles | Right Angle | - | - | - | ||
| HDTF-6-06-S-RA-HS-100 |
Индекс :
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