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| Изображение | Тип | Марка | Объяснение | Установленная цена | Количество | RoHS | Alias # | Card & Socket Accessory Typeu2009 | Centerline (Pitch)u2009(in) | Centerline (Pitch)u2009(mm) | Compatible With IC Socket Typeu2009 | Connector Systemu2009 | Contact Mating Area Plating Material Thicknessu2009(µin) | DRAM Typeu2009 | IC Socket Typeu2009 | Mating Pin Diameter Rangeu2009 | Mating Pin Diameter Rangeu2009(in) | Mating Pin Diameter Rangeu2009(mm) | Module Orientationu2009 | Number of Positionsu2009 | Operating Temperature Rangeu2009 | PCB Hole Diameteru2009 | PCB Mounting Styleu2009 | Socket Lengthu2009 | Socket Sleeve Styleu2009 | Stack Heightu2009 | TE Internal # | TE Internal Description | Wire Sizeu2009(AWG) | Wire Sizeu2009(mm²) |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
  | Mfr. Тип50864Anlielectronics Тип | TE Connectivity |
Pin Sockets, Socket Length 6.53 mm [.257 in], PCB Hole Diameter .062 in [1.57 mm], Closed Bottom, .326 – .518 mm² Wire Size, 22 – 20 AWG Wire Size
Сборник данных
Сравнение
| Min.:1 Mult.:1 | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | 1.57u2009mmu2009[u2009.062u2009inu2009] | - | 6.53u2009mmu2009[u2009.257u2009inu2009] | Closed Bottom | - | 50864 | SOCKET,MIN-SPR AU SER-3 | 22 – 20 | .326 – .518 | ||
| 50864 | ||||||||||||||||||||||||||||||
| | Mfr. Тип1-332070-3Anlielectronics Тип | TE Connectivity |
Pin Sockets, Socket Length 3.63 mm [.143 in], PCB Hole Diameter .072 in [1.83 mm], Open Bottom, .518 – .653 mm² Wire Size, 20 – 19 AWG Wire Size
Сборник данных
Сравнение
| Min.:1 Mult.:1 | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | 1.83u2009mmu2009[u2009.072u2009inu2009] | - | 3.63u2009mmu2009[u2009.143u2009inu2009] | Open Bottom | - | 1-332070-3 | SOCKET,MIN-SPR W/H AU SER-4 | 20 – 19 | .518 – .653 | ||
| 1-332070-3 | ||||||||||||||||||||||||||||||
| | Mfr. Тип3-1489841-2Anlielectronics Тип | TE Connectivity |
DIMM Sockets, Double Data Rate (DDR) 2, Board-to-Board, 240 Position, Through Hole - Solder Mount, Vertical Module Orientation
Сборник данных
Сравнение
| Min.:1 Mult.:1 | - | - | - | - | - | Board-to-Board | - | Double Data Rate (DDR) 2 | - | - | - | - | Vertical | 240 | - | - | Through Hole - Solder | - | - | - | 3-1489841-2 | DDR2 240P PB FREE 3.18 15AU HD | - | - | ||
| 3-1489841-2 | ||||||||||||||||||||||||||||||
| | Mfr. Тип1932031-5Anlielectronics Тип | TE Connectivity |
DIMM Sockets, Double Data Rate (DDR) 3, Board-to-Board, 240 Position, Through Hole - Solder Mount, Vertical Module Orientation, DDR3 DIMM
Сборник данных
Сравнение
| Min.:1 Mult.:1 | - | - | - | - | - | Board-to-Board | - | Double Data Rate (DDR) 3 | - | - | - | - | Vertical | 240 | - | - | Through Hole - Solder | - | - | - | 1932031-5 | VERTICAL DDR3 DIMM, 240 POSITION, LR | - | - | ||
| 1932031-5 | ||||||||||||||||||||||||||||||
| | Mfr. Тип2-2013022-2Anlielectronics Тип | TE Connectivity |
SO DIMM Sockets, Double Data Rate (DDR) 3, Stack Height .157 in [4 mm], Right Angle Module Orientation, 204 Position, .024 in [.6 mm] Centerline
Сборник данных
Сравнение
| Min.:1 Mult.:1 | - | - | - | - | - | Cable-to-Board | - | Double Data Rate (DDR) 3 | - | - | - | - | Right Angle | 204 | - | - | - | - | - | 4u2009mmu2009[u2009.157u2009inu2009] | 2-2013022-2 | EMBOSS TAPE DDR3 204P 4H STD A | - | - | ||
| 2-2013022-2 | ||||||||||||||||||||||||||||||
| | Mfr. Тип1-1932031-1Anlielectronics Тип | TE Connectivity |
DIMM Sockets, Double Data Rate (DDR) 3, Board-to-Board, 240 Position, Through Hole - Solder Mount, Vertical Module Orientation, DDR3 DIMM
Сборник данных
Сравнение
| Min.:1 Mult.:1 | - | - | - | - | - | Board-to-Board | - | Double Data Rate (DDR) 3 | - | - | - | - | Vertical | 240 | - | - | Through Hole - Solder | - | - | - | 1-1932031-1 | VERTICAL DDR3 DIMM, 240 POSITION, LR | - | - | ||
| 1-1932031-1 | ||||||||||||||||||||||||||||||
| | Mfr. Тип5-2199155-2Anlielectronics Тип | TE Connectivity |
DIMM Sockets, Double Data Rate (DDR) 4, Board-to-Bus Bar, 288 Position, Surface Mount Mount, Vertical Module Orientation, DDR4 DIMM
Сборник данных
Сравнение
| Min.:1 Mult.:1 | - | - | - | - | - | Board-to-Bus Bar | - | Double Data Rate (DDR) 4 | - | - | - | - | Vertical | 288 | - | - | Surface Mount | - | - | - | 5-2199155-2 | DDR4 DIMM 288 Pin SMT type | - | - | ||
| 5-2199155-2 | ||||||||||||||||||||||||||||||
| | Mfr. Тип322-HCS6P2-100Anlielectronics Тип | TE Connectivity |
Pin Sockets, Socket Length 3.45 mm [.136 in], PCB Hole Diameter .064 in [1.61 mm], Open Bottom, .081 – .162 mm² Wire Size, 28 – 25 AWG Wire Size
Сборник данных
Сравнение
| Min.:1 Mult.:1 | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | 1.61u2009mmu2009[u2009.064u2009inu2009] | - | 3.45u2009mmu2009[u2009.136u2009inu2009] | Open Bottom | - | 4-1437514-3 | 322-HCS6P2-100=HOLT CNT SKT RE | 28 – 25 | .081 – .162 | ||
| 322-HCS6P2-100 | ||||||||||||||||||||||||||||||
| | Mfr. Тип322-HCS5P2-100Anlielectronics Тип | TE Connectivity |
Pin Sockets, Socket Length 2.54 mm [.1 in], PCB Hole Diameter .041 in [1.04 mm], Open Bottom, Cable-to-Board, Signal, -67 – 257 °F [-55 – 125 °C]
Сборник данных
Сравнение
| Min.:1 Mult.:1 | - | - | - | - | - | Cable-to-Board | - | - | - | - | .011 – .018, .016 – .021 | .28 – .46, .41 – .53 | - | - | - | 1.04u2009mmu2009[u2009.041u2009inu2009] | - | 2.54u2009mmu2009[u2009.1u2009inu2009] | Open Bottom | - | 2-1437514-0 | 322-HCS5P2-100=HOLTITE CNT | - | - | ||
| 322-HCS5P2-100 | ||||||||||||||||||||||||||||||
| | Mfr. Тип5-1612773-1Anlielectronics Тип | TE Connectivity |
SO DIMM Sockets, Double Data Rate (DDR), Stack Height .256 in [6.5 mm], Right Angle Module Orientation, 200 Position, DDR SODIMM
Сборник данных
Сравнение
| Min.:1 Mult.:1 | - | - | - | - | - | Cable-to-Board | - | Double Data Rate (DDR) | - | - | - | - | Right Angle | 200 | - | - | - | - | - | 6.5u2009mmu2009[u2009.256u2009inu2009] | 5-1612773-1 | SEMI-HARD TRAY DDR SODIMM 200P | - | - | ||
| 5-1612773-1 | ||||||||||||||||||||||||||||||
| | Mfr. Тип2-2129710-7Anlielectronics Тип | TE Connectivity |
LGA Sockets, LGA 3647, 1824 Position, .034 in / .039 in [.86 mm / .99 mm] Centerline, Surface Mount Solder Ball Mount
Сборник данных
Сравнение
| Min.:1 Mult.:1 | - | - | .034, .039 | .86, .99 | - | Board-to-Board | 30 | - | LGA 3647 | - | - | - | - | 1824 | - | - | - | - | - | - | 2-2129710-7 | LEFT SIDE LGA3647-1 SOCKET-P1 FOR ODM | - | - | ||
| 2-2129710-7 | ||||||||||||||||||||||||||||||
| | Mfr. Тип2-2129710-8Anlielectronics Тип | TE Connectivity |
LGA Sockets, LGA 3647, 1823 Position, .034 in / .039 in [.86 mm / .99 mm] Centerline, Surface Mount Solder Ball Mount
Сборник данных
Сравнение
| Min.:1 Mult.:1 | - | - | .034, .039 | .86, .99 | - | Board-to-Board | 30 | - | LGA 3647 | - | - | - | - | 1823 | - | - | - | - | - | - | 2-2129710-8 | RIGHT SIDE LGA3647-1 SOCKET-P1 FOR ODM | - | - | ||
| 2-2129710-8 | ||||||||||||||||||||||||||||||
| | Mfr. Тип1-1932000-0Anlielectronics Тип | TE Connectivity |
DIMM Sockets, Double Data Rate (DDR) 3, Board-to-Board, 240 Position, Through Hole - Solder Mount, Vertical Module Orientation, DDR3 DIMM
Сборник данных
Сравнение
| Min.:1 Mult.:1 | - | - | - | - | - | Board-to-Board | - | Double Data Rate (DDR) 3 | - | - | - | - | Vertical | 240 | - | - | Through Hole - Solder | - | - | - | 1-1932000-0 | VERTICAL DDR3 DIMM, 240 POSITION | - | - | ||
| 1-1932000-0 | ||||||||||||||||||||||||||||||
| | Mfr. Тип2309414-5Anlielectronics Тип | TE Connectivity |
SO DIMM Sockets, Small Outline (SO), Stack Height .362 in [9.2 mm], Right Angle Module Orientation, 260 Position, .02 in [.5 mm] Centerline, DDR4 DIMM
Сборник данных
Сравнение
| Min.:1 Mult.:1 | - | - | - | - | - | Cable-to-Board | - | Small Outline (SO) | - | - | - | - | Right Angle | 260 | - | - | - | - | - | 9.2u2009mmu2009[u2009.362u2009inu2009] | 2309414-5 | DDR4 SODIMM 260P 9.2H RVS | - | - | ||
| 2309414-5 | ||||||||||||||||||||||||||||||
| | Mfr. Тип2309412-5Anlielectronics Тип | TE Connectivity |
SO DIMM Sockets, Small Outline (SO), Stack Height .315 in [8 mm], Right Angle Module Orientation, 260 Position, .02 in [.5 mm] Centerline, DDR4 DIMM
Сборник данных
Сравнение
| Min.:1 Mult.:1 | - | - | - | - | - | Cable-to-Board | - | Small Outline (SO) | - | - | - | - | Right Angle | 260 | - | - | - | - | - | 8u2009mmu2009[u2009.315u2009inu2009] | 2309412-5 | DDR4 SODIMM 260P 8.0H RVS | - | - | ||
| 2309412-5 | ||||||||||||||||||||||||||||||
| | Mfr. Тип2309413-3Anlielectronics Тип | TE Connectivity |
SO DIMM Sockets, Small Outline (SO), Stack Height .362 in [9.2 mm], Right Angle Module Orientation, 260 Position, .02 in [.5 mm] Centerline, DDR4 DIMM
Сборник данных
Сравнение
| Min.:1 Mult.:1 | - | - | - | - | - | Cable-to-Board | - | Small Outline (SO) | - | - | - | - | Right Angle | 260 | - | - | - | - | - | 9.2u2009mmu2009[u2009.362u2009inu2009] | 2309413-3 | DDR4 SODIMM 260P 9.2H STD | - | - | ||
| 2309413-3 | ||||||||||||||||||||||||||||||
| | Mfr. Тип2310924-1Anlielectronics Тип | TE Connectivity |
IC Socket Hardware, LGA 3647, Bolster Assembly
Сборник данных
Сравнение
| Min.:1 Mult.:1 | - | Bolster Assembly | - | - | LGA 3647 | - | - | - | - | - | - | - | - | - | -25 – 100u2009°Cu2009[u2009-13 – 212u2009°Fu2009] | - | - | - | - | - | 2310924-1 | NRW FABRIC BOLSTER ASSY, W/ COVER | - | - | ||
| 2310924-1 | ||||||||||||||||||||||||||||||
| | Mfr. Тип1-2308107-8Anlielectronics Тип | TE Connectivity |
DIMM Sockets, Double Data Rate (DDR) 4, Board-to-Bus Bar, 288 Position, Through Hole - Solder Mount, Vertical Module Orientation
Сборник данных
Сравнение
| Min.:1 Mult.:1 | - | - | - | - | - | Board-to-Bus Bar | - | Double Data Rate (DDR) 4 | - | - | - | - | Vertical | 288 | - | - | Through Hole - Solder | - | - | - | 1-2308107-8 | DDR4 DIMM 288 PIN TH TYPE | - | - | ||
| 1-2308107-8 | ||||||||||||||||||||||||||||||
| | Mfr. Тип6-1437514-7Anlielectronics Тип | TE Connectivity |
Pin Sockets, Socket Length 3.51 mm [.138 in], PCB Hole Diameter .062 in [1.57 mm], Open Bottom, Cable-to-Board, Signal, -85 – 257 °F [-65 – 125 °C]
Сборник данных
Сравнение
| Min.:1 Mult.:1 | 8134-HC-5P3 | - | - | - | - | Cable-to-Board | - | - | - | .66 – .74u2009mmu2009[u2009.026 – .029u2009inu2009] | - | - | - | - | - | 1.57u2009mmu2009[u2009.062u2009inu2009] | - | 3.51u2009mmu2009[u2009.138u2009inu2009] | Open Bottom | - | 6-1437514-7 | 8134-HC-5P3=CONTACT,T/L PLT. 3 | - | - | ||
| 6-1437514-7 | ||||||||||||||||||||||||||||||
| | Mfr. Тип147444-1Anlielectronics Тип | TE Connectivity |
Pin Sockets, Socket Length 5.84 mm [.23 in], PCB Hole Diameter .04 in [1.02 mm], Closed, Cable-to-Board, Power & Signal
Сборник данных
Сравнение
| Min.:1 Mult.:1 | - | - | - | - | - | Cable-to-Board | - | - | - | .33 – .51u2009mmu2009[u2009.013 – .02u2009inu2009] | - | - | - | - | - | 1.02u2009mmu2009[u2009.04u2009inu2009] | - | 5.84u2009mmu2009[u2009.23u2009inu2009] | Closed | - | 147444-1 | SOCKET,MIN-SPR AU-AU SER-1 | - | - | ||
| 147444-1 |
Индекс :
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