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| Изображение | Тип | Марка | Объяснение | Установленная цена | Количество | RoHS | Lifecycle Status | Mount | Mounting Type | Package / Case | Surface Mount | Number of Pins | Supplier Device Package | Number of Terminals | Access Time-Max | Base Product Number | Brand | Clock Frequency-Max | Clock Frequency-Max (fCLK) | Data RAM Size | Factory Pack QuantityFactory Pack Quantity | For Use With/Related Products | Ihs Manufacturer | L1 Cache Data Memory | L1 Cache Instruction Memory | Manufacturer Part Number | Maximum Clock Frequency | Maximum Operating Supply Voltage | Maximum Operating Temperature | Mfr | Minimum Operating Supply Voltage | Minimum Operating Temperature | Moisture Sensitive | Moisture Sensitivity Levels | Mounting Styles | Number of I/Os | Number of Logic Array Blocks - LABs | Number of Logic Elements | Number of Words | Number of Words Code | Operating Temperature-Max | Operating Temperature-Min | Package | Package Body Material | Package Code | Package Description | Package Equivalence Code | Package Shape | Package Style | Part Life Cycle Code | Part Package Code | Product Status | Reflow Temperature-Max (s) | Risk Rank | RoHS | Rohs Code | Samacsys Description | Supply Voltage-Max | Supply Voltage-Min | Supply Voltage-Nom | Supply Voltage-Nom (Vsup) | Tradename | Typical Operating Supply Voltage | Unit Weight | Operating Temperature | Packaging | Series | JESD-609 Code | ECCN Code | Type | Terminal Finish | Max Operating Temperature | Min Operating Temperature | Additional Feature | HTS Code | Subcategory | Voltage - Supply | Terminal Position | Terminal Form | Peak Reflow Temperature (Cel) | Number of Functions | Terminal Pitch | Reach Compliance Code | Pin Count | JESD-30 Code | Number of Outputs | Qualification Status | Operating Supply Voltage | Supply Voltage-Max (Vsup) | Power Supplies | Temperature Grade | Supply Voltage-Min (Vsup) | Note | Speed | RAM Size | Operating Mode | Core Processor | Peripherals | Program Memory Size | Connectivity | Supply Current-Max | Data Rate | Architecture | Number of Inputs | Organization | Seated Height-Max | Memory Width | Programmable Logic Type | Number of Logic Elements/Cells | Product Type | Standby Current-Max | Memory Density | Total RAM Bits | Number of Gates | Contents | Parallel/Serial | Memory IC Type | Speed Grade | Number of Transceivers | Primary Attributes | Write Protection | Platform | Number of CLBs | Number of Logic Cells | Number of Cores | Number of Equivalent Gates | Flash Size | Product | Interconnect System | Suggested Programming Environment | Product Category | Length | Width |
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  | Mfr. ТипRTPF-DEV-KIT-CG-1Anlielectronics Тип | Microchip |
RT POLARFIRE DEV KIT-CG-1
Сборник данных
Сравнение
| Min.:1 Mult.:1 | - | - | - | - | - | - | - | - | - | RTPF500 | - | - | - | - | - | RTPF500T | - | - | - | - | - | - | - | Microchip Technology | - | - | - | - | - | - | - | - | - | - | - | - | Box | - | - | - | - | - | - | - | - | Active | - | - | - | - | - | - | - | - | - | - | - | - | - | - | RT PolarFire® | - | - | FPGA + MCU/MPU SoC | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | Board(s), Cable(s), Power Supply, Accessories | - | - | - | - | - | - | Radiation-Tolerant PolarFire SoC FPGA | - | - | - | - | - | Development Kits | FMC, Pmod | Libero SoC | - | - | - | ||
| RTPF-DEV-KIT-CG-1 | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| | Mfr. ТипAT17LV128-10CCAnlielectronics Тип | Microchip |
FPGA - Configuration Memory 2M bit FPGA
Сборник данных
Сравнение
| Min.:1 Mult.:1 | - | - | - | - | YES | - | - | 8 | 75 ns | - | - | - | 10 MHz | - | - | - | ATMEL CORP | - | - | AT17LV128-10CC | - | - | - | - | - | - | - | 3 | - | - | - | - | 131072 words | 128000 | 70 °C | - | - | UNSPECIFIED | SON | SON, SOLCC8,.25 | SOLCC8,.25 | SQUARE | SMALL OUTLINE | Obsolete | SOIC | - | 30 | 5.88 | - | No | - | - | - | - | 3.3 V | - | - | - | - | - | - | e0 | EAR99 | - | Tin/Lead (Sn/Pb) | - | - | IT CAN OPERATES ON 4.75-5.25 RANGE SUPPLY VOLTAGE ALSO | 8542.32.00.51 | - | - | DUAL | NO LEAD | 240 | 1 | 1.27 mm | compliant | 8 | S-XDSO-N8 | - | Not Qualified | - | 3.6 V | 3.3 V | COMMERCIAL | 3 V | - | - | - | SYNCHRONOUS | - | - | - | - | 0.005 mA | - | - | - | 128KX1 | 1.14 mm | 1 | - | - | - | 0.00005 A | 131072 bit | - | - | - | SERIAL | CONFIGURATION MEMORY | - | - | - | - | - | - | - | - | - | - | - | - | - | - | 5.99 mm | 5.99 mm | ||
| AT17LV128-10CC | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| | Mfr. ТипAT17LV010-10SCAnlielectronics Тип | Microchip |
FPGA - Configuration Memory Serial EEPROM
Сборник данных
Сравнение
| Min.:1 Mult.:1 | - | - | - | - | YES | - | - | 20 | - | - | - | - | 15 MHz | - | - | - | ATMEL CORP | - | - | AT17LV010-10SC | - | - | - | - | - | - | - | 1 | - | - | - | - | 1048576 words | 1000000 | 70 °C | - | - | PLASTIC/EPOXY | SOP | SOP, SOP20,.4 | SOP20,.4 | RECTANGULAR | SMALL OUTLINE | Obsolete | SOIC | - | 30 | 5.82 | - | No | - | - | - | - | 3.3 V | - | - | - | - | - | - | e0 | EAR99 | - | Tin/Lead (Sn/Pb) | - | - | IT CAN OPERATES ON 4.75-5.25 RANGE SUPPLY VOLTAGE ALSO | 8542.32.00.51 | - | - | DUAL | GULL WING | 240 | 1 | 1.27 mm | compliant | 20 | R-PDSO-G20 | - | Not Qualified | - | 3.6 V | 3.3/5 V | COMMERCIAL | 3 V | - | - | - | SYNCHRONOUS | - | - | - | - | 0.01 mA | - | - | - | 1MX1 | 2.65 mm | 1 | - | - | - | - | 1048576 bit | - | - | - | SERIAL | CONFIGURATION MEMORY | - | - | - | HARDWARE | - | - | - | - | - | - | - | - | - | - | 12.8 mm | 7.5 mm | ||
| AT17LV010-10SC | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| | Mfr. ТипM2GL005-VF256IAnlielectronics Тип | Microchip |
FPGA IGLOO2 6060 Cells 340MHz 65nm Technology 1.2V 256-Pin VBGA
Сборник данных
Сравнение
| Min.:1 Mult.:1 | - | - | Surface Mount | VFBGA-256 | YES | - | 256-FPBGA (14x14) | 256 | - | M2GL005 | Microchip Technology / Atmel | - | - | - | 119 | - | MICROSEMI CORP | - | - | M2GL005-VF256I | - | - | + 100 C | Microchip Technology | - | - 40 C | Yes | - | SMD/SMT | 161 I/O | - | 6060 LE | - | - | - | - | Tray | PLASTIC/EPOXY | LFBGA | LFBGA, | - | SQUARE | GRID ARRAY, LOW PROFILE, FINE PITCH | Active | - | Active | 20 | 5.27 | N | No | IC FPGA 161 I/O 256VFBGA | 1.26 V | 1.14 V | 1.2 V | - | IGLOO2 | - | 0.321234 oz | -40°C ~ 100°C (TJ) | Tray | M2GL005 | e0 | - | - | Tin/Lead (Sn/Pb) | - | - | - | 8542.39.00.01 | Programmable Logic ICs | 1.14V ~ 2.625V | BOTTOM | BALL | 240 | - | 0.8 mm | compliant | - | S-PBGA-B256 | - | - | 1.2 V | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | 1.56 mm | - | FIELD PROGRAMMABLE GATE ARRAY | 6060 | FPGA - Field Programmable Gate Array | - | - | 719872 | - | - | - | - | STD | - | - | - | - | - | - | - | - | - | - | - | - | FPGA - Field Programmable Gate Array | 14 mm | 14 mm | ||
| M2GL005-VF256I | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| | Mfr. ТипM1A3P1000L-FG256IAnlielectronics Тип | Microchip |
FPGA ProASIC3L Family 1M Gates 781.25MHz 130nm (CMOS) Technology 1.2V 256-Pin FBGA
Сборник данных
Сравнение
| Min.:1 Mult.:1 | - | - | Surface Mount | 256-LBGA | YES | - | 256-FPBGA (17x17) | 256 | - | M1A3P1000 | - | 350 MHz | - | - | - | - | MICROSEMI CORP | - | - | M1A3P1000L-FG256I | - | 1.26 V | - | Microchip Technology | 1.14 V | - | - | 3 | - | 177 | - | - | - | - | 85 °C | -40 °C | Tray | PLASTIC/EPOXY | BGA | 17 X 17 MM, 1.60 MM HEIGHT, 1 MM PITCH, FBGA-256 | BGA256,16X16,40 | SQUARE | GRID ARRAY | Active | - | Active | 30 | 5.24 | - | No | - | 1.575 V | 1.14 V | 1.2 V | - | - | 1.2000 V | - | -40 to 85 °C | - | ProASIC3L | - | - | - | TIN LEAD/TIN LEAD SILVER | - | - | - | 8542.39.00.01 | - | 1.14V ~ 1.575V | BOTTOM | BALL | 225 | - | 1 mm | compliant | - | S-PBGA-B256 | 177 | Not Qualified | - | - | 1.5/3.3 V | INDUSTRIAL | - | - | - | - | - | - | - | - | - | - | - | - | 177 | 24576 CLBS, 1000000 GATES | 1.8 mm | - | FIELD PROGRAMMABLE GATE ARRAY | - | - | - | - | 147456 | 1000000 | - | - | - | STD | - | - | - | - | 24576 | 24576 | - | 1000000 | - | - | - | - | - | 17 mm | 17 mm | ||
| M1A3P1000L-FG256I | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| | Mfr. ТипM2S090TS-1FG676IAnlielectronics Тип | Microchip |
FPGA SmartFusion2 Family 86184 Cells 65nm Technology 1.2V 676-Pin FBGA Tray
Сборник данных
Сравнение
| Min.:1 Mult.:1 | - | - | - | BGA-676 | YES | - | 676-FBGA (27x27) | 676 | - | M2S090 | Microchip Technology / Atmel | - | - | 64 kB | 40 | - | MICROSEMI CORP | - | - | M2S090TS-1FG676I | 166 MHz | - | - | Microchip Technology | - | - | Yes | 3 | SMD/SMT | 425 | 7193 LAB | 86316 LE | - | - | - | - | Tray | PLASTIC/EPOXY | BGA | FBGA-676 | BGA676,26X26,40 | SQUARE | GRID ARRAY | Active | - | Active | 30 | 5.29 | N | No | - | 1.26 V | 1.14 V | 1.2 V | - | - | - | 1.071118 oz | -40°C ~ 100°C (TJ) | Tray | SmartFusion2 | e0 | - | - | Tin/Lead (Sn/Pb) | - | - | - | 8542.39.00.01 | - | - | BOTTOM | BALL | 240 | - | 1 mm | not_compliant | - | S-PBGA-B676 | 425 | Not Qualified | - | - | 1.2 V | - | - | - | 166MHz | 64KB | - | ARM® Cortex®-M3 | DDR, PCIe, SERDES | 512 kB | CANbus, Ethernet, I²C, SPI, UART/USART, USB | - | - | MCU, FPGA | 425 | - | 2.44 mm | - | FIELD PROGRAMMABLE GATE ARRAY | - | SoC FPGA | - | - | - | - | - | - | - | - | - | FPGA - 90K Logic Modules | - | - | - | 86316 | 1 Core | - | 512KB | - | - | - | SoC FPGA | 27 mm | 27 mm | ||
| M2S090TS-1FG676I | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| | Mfr. ТипM2GL090TS-FCS325Anlielectronics Тип | Microchip |
M2GL090TS-FCS325 325 Tfbga 11X13.5X1.16MM Tray Rohs Compliant: Yes
Сборник данных
Сравнение
| Min.:1 Mult.:1 | - | - | Surface Mount | 325-TFBGA, FCBGA | YES | - | 325-FCBGA (11x11) | 325 | - | M2GL090 | - | - | - | - | - | - | MICROSEMI CORP | - | - | M2GL090TS-FCS325 | - | - | - | Microchip Technology | - | - | - | - | - | 180 | - | - | - | - | 85 °C | - | Tray | PLASTIC/EPOXY | BGA | BGA, BGA325,21X21,20 | BGA325,21X21,20 | SQUARE | GRID ARRAY | Active | - | Active | 20 | 5.27 | - | No | - | 1.26 V | 1.14 V | 1.2 V | - | - | - | - | 0°C ~ 85°C (TJ) | - | IGLOO2 | - | - | - | - | - | - | - | 8542.39.00.01 | - | 1.14V ~ 2.625V | BOTTOM | BALL | 240 | - | - | compliant | - | S-PBGA-B325 | 180 | Not Qualified | - | - | 1.2 V | OTHER | - | - | - | - | - | - | - | - | - | - | - | - | 180 | - | - | - | FIELD PROGRAMMABLE GATE ARRAY | 86184 | - | - | - | 2648064 | - | - | - | - | - | - | - | - | - | - | 86316 | - | - | - | - | - | - | - | - | - | ||
| M2GL090TS-FCS325 | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| | Mfr. ТипM1AFS600-FG256KAnlielectronics Тип | Microchip |
IC FPGA 4MB Flash 600K 256-FBGA
Сборник данных
Сравнение
| Min.:1 Mult.:1 | Production (Last Updated: 1 month ago) | Surface Mount | Surface Mount | 256-LBGA | YES | 256 | 256-FPBGA (17x17) | 256 | - | M1AFS600 | - | - | - | - | - | - | MICROSEMI CORP | - | - | M1AFS600-FG256K | - | - | - | Microchip Technology | - | - | - | 3 | - | 119 | - | - | - | - | 100 °C | -55 °C | Tray | PLASTIC/EPOXY | LBGA | LBGA, | - | SQUARE | GRID ARRAY, LOW PROFILE | Active | - | Active | 20 | 5.3 | Non-Compliant | No | - | 1.575 V | 1.425 V | 1.5 V | - | - | - | - | -55°C ~ 100°C (TJ) | - | Fusion® | e0 | - | - | Tin/Lead (Sn/Pb) | 100 °C | -55 °C | - | 8542.39.00.01 | - | 1.425V ~ 1.575V | BOTTOM | BALL | 225 | - | 1 mm | compliant | - | S-PBGA-B256 | - | Not Qualified | - | - | - | OTHER | - | - | - | 13.5 kB | - | - | - | - | - | - | - | - | - | 600000 GATES | 1.7 mm | - | FIELD PROGRAMMABLE GATE ARRAY | - | - | - | - | 110592 | 600000 | - | - | - | - | - | - | - | - | - | - | - | 600000 | - | - | - | - | - | 17 mm | 17 mm | ||
| M1AFS600-FG256K | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| | Mfr. ТипM2S090-1FCS325IAnlielectronics Тип | Microchip |
M2S090-1FCS325I 325 TFBGA 11X13.5X1.16MM TRAY ROHS COMPLIANT: YES
Сборник данных
Сравнение
| Min.:1 Mult.:1 | - | - | - | 325-TFBGA, FCBGA | YES | - | 325-FCBGA (11x13.5) | 325 | - | M2S090 | - | - | - | 64 kB | - | - | MICROSEMI CORP | - | - | M2S090-1FCS325I | 166 MHz | - | - | Microchip Technology | - | - | - | - | SMD/SMT | 180 | - | 86316 LE | - | - | - | - | Tray | PLASTIC/EPOXY | TFBGA | FBGA-325 | BGA325,21X21,20 | RECTANGULAR | GRID ARRAY, THIN PROFILE, FINE PITCH | Active | - | Active | 30 | 5.77 | - | No | - | 1.26 V | 1.14 V | 1.2 V | - | - | - | - | -40°C ~ 100°C (TJ) | - | SmartFusion®2 | e0 | - | - | Tin/Lead (Sn/Pb) | - | - | LG-MIN, WD-MIN | 8542.39.00.01 | - | - | BOTTOM | BALL | 240 | - | 0.5 mm | not_compliant | - | R-PBGA-B325 | 180 | Not Qualified | - | - | 1.2 V | - | - | - | 166MHz | 64KB | - | ARM® Cortex®-M3 | DDR, PCIe, SERDES | 512 kB | CANbus, Ethernet, I²C, SPI, UART/USART, USB | - | - | MCU, FPGA | 180 | - | 1.16 mm | - | FIELD PROGRAMMABLE GATE ARRAY | - | - | - | - | - | - | - | - | - | - | - | FPGA - 90K Logic Modules | - | - | - | 86316 | 1 Core | - | 512KB | - | - | - | - | 13.5 mm | 11 mm | ||
| M2S090-1FCS325I | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| | Mfr. ТипM2S150-1FCS536IAnlielectronics Тип | Microchip |
FPGA SmartFusion2 146124 Cells 166MHz 65nm Technology 1.2V 536-Pin FBGA
Сборник данных
Сравнение
| Min.:1 Mult.:1 | - | - | - | 536-LFBGA, CSPBGA | YES | - | 536-CSPBGA (16x16) | 536 | - | M2S150 | - | - | - | 64 kB | - | - | MICROSEMI CORP | - | - | M2S150-1FCS536I | 166 MHz | - | - | Microchip Technology | - | - | - | - | - | 293 | - | 146124 LE | - | - | - | - | Tray | PLASTIC/EPOXY | BGA | BGA, BGA536,30X30,20 | BGA536,30X30,20 | SQUARE | GRID ARRAY | Active | - | Active | 30 | 5.81 | - | No | - | 1.26 V | 1.14 V | 1.2 V | - | - | 1.2000 V | - | -40 to 100 °C | - | SmartFusion®2 | e0 | - | - | Tin/Lead (Sn/Pb) | - | - | - | 8542.39.00.01 | - | - | BOTTOM | BALL | 240 | - | - | not_compliant | - | S-PBGA-B536 | 293 | Not Qualified | - | - | 1.2 V | - | - | - | 166MHz | 64KB | - | ARM® Cortex®-M3 | DDR, PCIe, SERDES | 512 kB | CANbus, Ethernet, I²C, SPI, UART/USART, USB | - | - | MCU, FPGA | 293 | - | - | - | FIELD PROGRAMMABLE GATE ARRAY | - | - | - | - | - | - | - | - | - | 1 | - | FPGA - 150K Logic Modules | - | - | - | 146124 | 1 Core | - | 512KB | - | - | - | - | - | - | ||
| M2S150-1FCS536I | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| | Mfr. ТипM2S060TS-1FG484Anlielectronics Тип | Microchip |
M2S060TS-1FG484 484 Pbga 23X23X2.44MM Tray Rohs Compliant: Yes
Сборник данных
Сравнение
| Min.:1 Mult.:1 | Production (Last Updated: 2 months ago) | - | - | 484-BGA | YES | - | 484-FPBGA (23x23) | 484 | - | M2S060 | - | - | - | 64 kB | - | - | MICROSEMI CORP | - | - | M2S060TS-1FG484 | 166 MHz | - | - | Microchip Technology | - | - | - | 3 | - | 267 | - | 56520 LE | - | - | 85 °C | - | Tray | PLASTIC/EPOXY | BGA | FBGA-484 | BGA484,22X22,40 | SQUARE | GRID ARRAY | Active | - | Active | 30 | 5.84 | Non-Compliant | No | - | 1.26 V | 1.14 V | 1.2 V | - | - | - | - | 0°C ~ 85°C (TJ) | - | SmartFusion®2 | e0 | - | - | Tin/Lead (Sn/Pb) | - | - | - | 8542.39.00.01 | - | - | BOTTOM | BALL | 240 | - | 1 mm | not_compliant | - | S-PBGA-B484 | 267 | Not Qualified | - | - | 1.2 V | OTHER | - | - | 166MHz | 64KB | - | ARM® Cortex®-M3 | DDR, PCIe, SERDES | 256 kB | CANbus, Ethernet, I²C, SPI, UART/USART, USB | - | - | MCU, FPGA | 267 | - | 2.44 mm | - | FIELD PROGRAMMABLE GATE ARRAY | - | - | - | - | - | - | - | - | - | - | - | FPGA - 60K Logic Modules | - | - | - | 56520 | 1 Core | - | 256KB | - | - | - | - | 23 mm | 23 mm | ||
| M2S060TS-1FG484 | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| | Mfr. ТипM2GL060T-FG676IAnlielectronics Тип | Microchip |
M2GL060T-FG676I 676 Pbga 27X27X2.44MM Tray Rohs Compliant: Yes
Сборник данных
Сравнение
| Min.:1 Mult.:1 | - | - | Surface Mount | 676-BGA | YES | - | 676-FBGA (27x27) | 676 | - | M2GL060 | - | - | - | - | - | - | MICROSEMI CORP | - | - | M2GL060T-FG676I | - | - | + 100 C | Microchip Technology | - | - 40 C | - | 3 | SMD/SMT | 387 | - | 56520 LE | - | - | - | - | Tray | PLASTIC/EPOXY | BGA | BGA, | - | SQUARE | GRID ARRAY | Active | - | Active | 20 | 5.26 | - | No | - | 1.26 V | 1.14 V | 1.2 V | - | - | - | - | -40°C ~ 100°C (TJ) | - | IGLOO2 | - | - | - | - | - | - | - | 8542.39.00.01 | - | 1.14V ~ 2.625V | BOTTOM | BALL | 240 | - | 1 mm | compliant | - | S-PBGA-B676 | - | - | 1.2 V | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | 2.44 mm | - | FIELD PROGRAMMABLE GATE ARRAY | 56520 | - | - | - | 1869824 | - | - | - | - | - | 4 Transceiver | - | - | - | - | - | - | - | - | - | - | - | - | 27 mm | 27 mm | ||
| M2GL060T-FG676I | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| | Mfr. ТипM2GL060TS-VF400Anlielectronics Тип | Microchip |
M2GL060TS-VF400 400 Lfbga 17X17X1.51MM Tray Rohs Compliant: Yes
Сборник данных
Сравнение
| Min.:1 Mult.:1 | - | - | Surface Mount | 400-LFBGA | YES | - | 400-VFBGA (17x17) | 400 | - | M2GL060 | - | - | - | - | - | - | MICROSEMI CORP | - | - | M2GL060TS-VF400 | - | - | + 85 C | Microchip Technology | - | 0 C | - | - | SMD/SMT | 207 | - | 56520 LE | - | - | 85 °C | - | Tray | PLASTIC/EPOXY | LFBGA | 17 X 17 MM, 0.80 MM PITCH, VFBGA-400 | - | SQUARE | GRID ARRAY, LOW PROFILE, FINE PITCH | Active | - | Active | 20 | 5.26 | - | No | - | 1.26 V | 1.14 V | 1.2 V | - | - | - | - | 0°C ~ 85°C (TJ) | - | IGLOO2 | - | - | - | - | - | - | - | 8542.39.00.01 | - | 1.14V ~ 2.625V | BOTTOM | BALL | 240 | - | 0.8 mm | compliant | - | S-PBGA-B400 | - | - | 1.2 V | - | - | OTHER | - | - | - | - | - | - | - | - | - | - | - | - | - | - | 1.51 mm | - | FIELD PROGRAMMABLE GATE ARRAY | 56520 | - | - | - | 1869824 | - | - | - | - | - | 4 Transceiver | - | - | - | - | - | - | - | - | - | - | - | - | 17 mm | 17 mm | ||
| M2GL060TS-VF400 | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| | Mfr. ТипM2GL150-FC1152IAnlielectronics Тип | Microchip |
FPGA IGLOO2 146124 Cells 340MHz 65nm Technology 1.2V 1152-Pin F-BGA
Сборник данных
Сравнение
| Min.:1 Mult.:1 | - | - | Surface Mount | 1152-BBGA, FCBGA | YES | - | 1152-FCBGA (35x35) | 1152 | - | M2GL150 | - | - | - | - | - | - | MICROSEMI CORP | - | - | M2GL150-FC1152I | - | 1.26 V | - | Microchip Technology | 1.14 V | - | - | - | - | 574 | - | - | - | - | - | - | Tray | PLASTIC/EPOXY | BGA | BGA, BGA1152,34X34,40 | BGA1152,34X34,40 | SQUARE | GRID ARRAY | Active | - | Active | 20 | 5.27 | - | No | FPGA - Field Programmable Gate Array IGLOO 2 | 1.26 V | 1.14 V | 1.2 V | - | - | 1.2000 V | - | -40 to 100 °C | - | IGLOO2 | - | - | - | - | - | - | - | 8542.39.00.01 | - | 1.14V ~ 2.625V | BOTTOM | BALL | 240 | - | 1 mm | compliant | - | S-PBGA-B1152 | 574 | Not Qualified | - | - | 1.2 V | - | - | - | - | - | - | - | - | - | - | - | - | - | 574 | - | 2.9 mm | - | FIELD PROGRAMMABLE GATE ARRAY | 146124 | - | - | - | 5120000 | - | - | - | - | STD | - | - | - | - | - | 146124 | - | - | - | - | - | - | - | 35 mm | 35 mm | ||
| M2GL150-FC1152I | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| | Mfr. ТипM2GL025T-VF400Anlielectronics Тип | Microchip |
M2GL025T-VF400 400 Lfbga 17X17X1.51MM Tray Rohs Compliant: Yes
Сборник данных
Сравнение
| Min.:1 Mult.:1 | Production (Last Updated: 2 months ago) | - | Surface Mount | 400-LFBGA | YES | 400 | 400-VFBGA (17x17) | 400 | - | M2GL025 | - | - | - | - | - | - | MICROSEMI CORP | - | - | M2GL025T-VF400 | - | - | + 85 C | Microchip Technology | - | 0 C | - | - | SMD/SMT | 207 | - | 27696 LE | - | - | 85 °C | - | Tray | PLASTIC/EPOXY | LFBGA | LFBGA, BGA400,20X20,32 | BGA400,20X20,32 | SQUARE | GRID ARRAY, LOW PROFILE, FINE PITCH | Active | - | Active | 20 | 5.3 | Non-Compliant | No | - | 1.26 V | 1.14 V | 1.2 V | - | - | - | - | 0°C ~ 85°C (TJ) | - | IGLOO2 | - | - | - | - | 85 °C | 0 °C | - | 8542.39.00.01 | - | 1.14V ~ 2.625V | BOTTOM | BALL | 240 | - | 0.8 mm | compliant | - | S-PBGA-B400 | 207 | Not Qualified | 1.2 V | - | 1.2 V | OTHER | - | - | - | 138 kB | - | - | - | - | - | - | - | - | 207 | - | 1.51 mm | - | FIELD PROGRAMMABLE GATE ARRAY | 27696 | - | - | - | 1130496 | - | - | - | - | - | 4 Transceiver | - | - | - | - | 27696 | - | - | - | - | - | - | - | 17 mm | 17 mm | ||
| M2GL025T-VF400 | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| | Mfr. ТипM2S005-1FG484IAnlielectronics Тип | Microchip |
FPGA SmartFusion2 Family 4956 Cells 65nm (CMOS) Technology 1.2V 484-Pin FBGA
Сборник данных
Сравнение
| Min.:1 Mult.:1 | - | - | - | 484-BGA | YES | - | 484-FPBGA (23x23) | 484 | - | M2S005 | - | - | - | 64 kB | - | - | MICROSEMI CORP | - | - | M2S005-1FG484I | 166 MHz | 1.26 V | - | Microchip Technology | 1.14 V | - | - | 3 | SMD/SMT | 209 | - | 6060 LE | - | - | - | - | Tray | PLASTIC/EPOXY | BGA | FBGA-484 | BGA484,22X22,40 | SQUARE | GRID ARRAY | Active | - | Active | 30 | 5.86 | - | No | - | 1.26 V | 1.14 V | 1.2 V | - | - | 1.2000 V | - | -40 to 100 °C | - | SmartFusion®2 | e0 | - | - | Tin/Lead (Sn/Pb) | - | - | - | 8542.39.00.01 | - | - | BOTTOM | BALL | 240 | - | 1 mm | not_compliant | - | S-PBGA-B484 | 217 | Not Qualified | - | - | 1.2 V | - | - | - | 166MHz | 64KB | - | ARM® Cortex®-M3 | DDR | 128 kB | CANbus, Ethernet, I²C, SPI, UART/USART, USB | - | - | MCU, FPGA | 217 | - | 2.44 mm | - | FIELD PROGRAMMABLE GATE ARRAY | - | - | - | - | - | - | - | - | - | 1 | - | FPGA - 5K Logic Modules | - | - | - | 4956 | 1 Core | - | 128KB | - | - | - | - | 23 mm | 23 mm | ||
| M2S005-1FG484I | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| | Mfr. ТипM2GL010-1VF400Anlielectronics Тип | Microchip |
FPGA IGLOO2 12084 Cells 65nm Technology 3.3V 400-Pin FP-BGA
Сборник данных
Сравнение
| Min.:1 Mult.:1 | Production (Last Updated: 2 months ago) | - | Surface Mount | 400-LFBGA | YES | 400 | 400-VFBGA (17x17) | 400 | - | M2GL010 | - | - | - | - | - | - | MICROSEMI CORP | - | - | M2GL010-1VF400 | - | - | + 85 C | Microchip Technology | - | 0 C | - | - | SMD/SMT | 195 | - | 12084 LE | - | - | 85 °C | - | Tray | PLASTIC/EPOXY | LFBGA | LFBGA, BGA400,20X20,32 | BGA400,20X20,32 | SQUARE | GRID ARRAY, LOW PROFILE, FINE PITCH | Active | - | Active | 20 | 5.3 | Non-Compliant | No | - | 1.26 V | 1.14 V | 1.2 V | - | - | - | - | 0°C ~ 85°C (TJ) | - | IGLOO2 | - | - | - | - | 85 °C | 0 °C | - | 8542.39.00.01 | - | 1.14V ~ 2.625V | BOTTOM | BALL | 240 | - | 0.8 mm | compliant | - | S-PBGA-B400 | 195 | Not Qualified | 1.2 V | - | 1.2 V | OTHER | - | - | - | 114 kB | - | - | - | - | - | - | - | - | 195 | - | 1.51 mm | - | FIELD PROGRAMMABLE GATE ARRAY | 12084 | - | - | - | 933888 | - | - | - | - | 1 | - | - | - | - | - | 12084 | - | - | - | - | - | - | - | 17 mm | 17 mm | ||
| M2GL010-1VF400 | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| | Mfr. ТипM2GL060-FG676IAnlielectronics Тип | Microchip |
Res Thick Film 1206 0.931 Ohm 1% 0.5W(1/2W) ±100ppm/C Pad SMD Automotive T/R
Сборник данных
Сравнение
| Min.:1 Mult.:1 | - | - | Surface Mount | 676-BGA | YES | - | 676-FBGA (27x27) | 676 | - | M2GL060 | - | - | - | - | - | - | MICROSEMI CORP | - | - | M2GL060-FG676I | - | - | + 100 C | Microchip Technology | - | - 40 C | - | 3 | SMD/SMT | 387 | - | 56520 LE | - | - | - | - | Tray | PLASTIC/EPOXY | BGA | BGA, | - | SQUARE | GRID ARRAY | Active | - | Active | 20 | 5.26 | - | No | FPGA - Field Programmable Gate Array IGLOO 2 | 1.26 V | 1.14 V | 1.2 V | - | - | - | - | -40°C ~ 100°C (TJ) | - | IGLOO2 | e0 | - | - | Tin/Lead (Sn/Pb) | - | - | - | 8542.39.00.01 | - | 1.14V ~ 2.625V | BOTTOM | BALL | 240 | - | 1 mm | compliant | - | S-PBGA-B676 | - | - | 1.2 V | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | 2.44 mm | - | FIELD PROGRAMMABLE GATE ARRAY | 56520 | - | - | - | 1869824 | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | 27 mm | 27 mm | ||
| M2GL060-FG676I | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| | Mfr. ТипM2S010T-FG484IAnlielectronics Тип | Microchip |
FPGA SmartFusion2 12084 Cells 166MHz 65nm Technology 1.2V 484-Pin FBGA
Сборник данных
Сравнение
| Min.:1 Mult.:1 | Production (Last Updated: 1 month ago) | - | - | 484-BGA | YES | - | 484-FPBGA (23x23) | 484 | - | M2S010 | - | - | - | 64 kB | - | - | MICROSEMI CORP | - | - | M2S010T-FG484I | 166 MHz | - | - | Microchip Technology | - | - | - | 3 | SMD/SMT | 233 | - | 12084 LE | - | - | - | - | Tray | PLASTIC/EPOXY | BGA | FBGA-484 | BGA484,22X22,40 | SQUARE | GRID ARRAY | Active | - | Active | 30 | 5.81 | Non-Compliant | No | - | 1.26 V | 1.14 V | 1.2 V | - | - | 1.2000 V | - | -40 to 100 °C | - | SmartFusion®2 | e0 | - | - | Tin/Lead (Sn/Pb) | - | - | - | 8542.39.00.01 | - | - | BOTTOM | BALL | 240 | - | 1 mm | not_compliant | - | S-PBGA-B484 | 233 | Not Qualified | - | - | 1.2 V | - | - | - | 166MHz | 64KB | - | ARM® Cortex®-M3 | DDR, PCIe, SERDES | 256 kB | CANbus, Ethernet, I²C, SPI, UART/USART, USB | - | - | MCU, FPGA | 233 | - | 2.44 mm | - | FIELD PROGRAMMABLE GATE ARRAY | - | - | - | - | - | - | - | - | - | STD | - | FPGA - 10K Logic Modules | - | - | - | 12084 | 1 Core | - | 256KB | - | - | - | - | 23 mm | 23 mm | ||
| M2S010T-FG484I | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| | Mfr. ТипM2S050TS-FCSG325IAnlielectronics Тип | Microchip |
M2S050TS-FCSG325I 325 TFBGA 11X11X1.01MM TRAY ROHS COMPLIANT: YES
Сборник данных
Сравнение
| Min.:1 Mult.:1 | Production (Last Updated: 2 months ago) | - | - | 325-TFBGA, FCBGA | YES | - | 325-FCBGA (11x11) | 325 | - | M2S050 | - | - | - | 64 kB | - | - | MICROSEMI CORP | - | - | M2S050TS-FCSG325I | 166 MHz | - | - | Microchip Technology | - | - | - | 3 | SMD/SMT | 200 | - | 56340 LE | - | - | - | - | Tray | PLASTIC/EPOXY | TFBGA | FBGA-325 | BGA325,21X21,20 | SQUARE | GRID ARRAY, THIN PROFILE, FINE PITCH | Active | - | Active | 40 | 5.82 | Non-Compliant | Yes | - | 1.26 V | 1.14 V | 1.2 V | - | - | - | - | -40°C ~ 100°C (TJ) | - | SmartFusion®2 | e1 | - | - | Tin/Silver/Copper (Sn/Ag/Cu) | - | - | LG-MIN, WD-MIN | 8542.39.00.01 | - | - | BOTTOM | BALL | 250 | - | 0.5 mm | compliant | - | S-PBGA-B325 | 200 | Not Qualified | - | - | 1.2 V | - | - | - | 166MHz | 64KB | - | ARM® Cortex®-M3 | DDR, PCIe, SERDES | 256 kB | CANbus, Ethernet, I²C, SPI, UART/USART, USB | - | - | MCU, FPGA | 200 | - | 1.01 mm | - | FIELD PROGRAMMABLE GATE ARRAY | - | - | - | - | - | - | - | - | - | - | - | FPGA - 50K Logic Modules | - | - | - | 56340 | 1 Core | - | 256KB | - | - | - | - | 11 mm | 11 mm | ||
| M2S050TS-FCSG325I |
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