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Изображение | Тип | Марка | Объяснение | Установленная цена | Количество | RoHS | Lifecycle Status | Contact Plating | Mount | Mounting Type | Package / Case | Surface Mount | Number of Pins | Supplier Device Package | Weight | Number of Terminals | Base Product Number | Brand | Clock Frequency-Max | Data RAM Size | Factory Pack QuantityFactory Pack Quantity | Ihs Manufacturer | L1 Cache Data Memory | L1 Cache Instruction Memory | Manufacturer Part Number | Maximum Clock Frequency | Maximum Operating Temperature | Mfr | Minimum Operating Temperature | Moisture Sensitive | Moisture Sensitivity Levels | Mounting Styles | Number of I/Os | Number of Logic Elements | Operating Temperature-Max | Operating Temperature-Min | Package | Package Body Material | Package Code | Package Description | Package Equivalence Code | Package Shape | Package Style | Part Life Cycle Code | Product Status | Reflow Temperature-Max (s) | Risk Rank | RoHS | Rohs Code | Schedule B | Supply Voltage-Max | Supply Voltage-Min | Supply Voltage-Nom | Tradename | Typical Operating Supply Voltage | Unit Weight | Usage Level | Operating Temperature | Packaging | Series | JESD-609 Code | ECCN Code | Terminal Finish | Max Operating Temperature | Min Operating Temperature | Additional Feature | HTS Code | Voltage - Supply | Terminal Position | Terminal Form | Peak Reflow Temperature (Cel) | Terminal Pitch | Reach Compliance Code | Frequency | JESD-30 Code | Number of Outputs | Qualification Status | Operating Supply Voltage | Power Supplies | Temperature Grade | Max Supply Voltage | Min Supply Voltage | Memory Size | Operating Supply Current | Speed | RAM Size | Core Processor | Peripherals | Program Memory Size | Propagation Delay | Connectivity | Data Rate | Architecture | Number of Inputs | Organization | Seated Height-Max | Programmable Logic Type | Number of Logic Elements/Cells | Product Type | Total RAM Bits | Number of Gates | Max Frequency | Screening Level | Number of Logic Blocks (LABs) | Speed Grade | Number of Transceivers | Primary Attributes | Number of Registers | Combinatorial Delay of a CLB-Max | Number of CLBs | Number of Logic Cells | Number of Cores | Number of Equivalent Gates | Flash Size | Product Category | Height | Length | Width | Radiation Hardening | Lead Free |
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Mfr. ТипM2GL010S-1FG484IAnlielectronics Тип | Microchip |
IGLOO2 FPGA, Gpio, 5G Serdes, Pci Express
Сборник данных
Сравнение
| Min.:1 Mult.:1 | - | - | Surface Mount | - | - | YES | - | - | - | 484 | - | - | - | - | - | MICROSEMI CORP | - | - | M2GL010S-1FG484I | - | - | - | - | - | - | - | 233 | - | - | - | - | PLASTIC/EPOXY | BGA | BGA, BGA484,22X22,40 | BGA484,22X22,40 | SQUARE | GRID ARRAY | Active | - | - | 5.88 | Non-Compliant | No | - | - | - | 1.2 V | - | - | - | - | - | - | - | - | - | - | 100 °C | -40 °C | - | - | - | BOTTOM | BALL | - | 1 mm | unknown | - | S-PBGA-B484 | 233 | Not Qualified | - | 1.2 V | - | - | - | - | - | - | 114 kB | - | - | - | - | - | - | - | 233 | - | - | FIELD PROGRAMMABLE GATE ARRAY | 12084 | - | - | - | - | - | - | - | - | - | - | - | - | 12084 | - | - | - | - | - | - | - | - | - | |||
M2GL010S-1FG484I | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
Mfr. ТипM2S025S-1FGG484IAnlielectronics Тип | Microchip |
IC FPGA Soc 25K Luts 484FBGA
Сборник данных
Сравнение
| Min.:1 Mult.:1 | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | MICROSEMI CORP | - | - | M2S025S-1FGG484I | - | - | - | - | - | 3 | - | - | - | - | - | - | - | - | - | - | - | - | Active | - | 30 | 5.78 | - | Yes | - | - | - | - | - | - | - | - | - | - | - | e1 | - | Tin/Silver/Copper (Sn/Ag/Cu) | - | - | - | - | - | - | - | 250 | - | compliant | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | FIELD PROGRAMMABLE GATE ARRAY | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | |||
M2S025S-1FGG484I | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
Mfr. ТипM2GL010T-1FGG484IAnlielectronics Тип | Microchip |
FPGA IGLOO2 12084 Cells 400MHz 65nm Technology 1.2V 484-Pin FBGA
Сборник данных
Сравнение
| Min.:1 Mult.:1 | Production (Last Updated: 2 months ago) | - | - | Surface Mount | FBGA-484 | YES | - | 484-FPBGA (23x23) | - | 484 | M2GL010 | Microchip Technology / Atmel | - | - | 60 | MICROSEMI CORP | - | - | M2GL010T-1FGG484I | - | + 100 C | Microchip Technology | - 40 C | Yes | 3 | SMD/SMT | 233 | 12084 LE | - | - | Tray | PLASTIC/EPOXY | BGA | 23 X 23 MM, 1 MM PITCH, ROHS COMPLIANT, FBGA-484 | BGA484,22X22,40 | SQUARE | GRID ARRAY | Active | Active | 30 | 5.3 | Compliant | Yes | - | 1.26 V | 1.14 V | 1.2 V | IGLOO2 | - | 0.892167 oz | - | -40°C ~ 100°C (TJ) | Tray | M2GL010T | - | - | - | 100 °C | -40 °C | - | 8542.39.00.01 | 1.14V ~ 2.625V | BOTTOM | BALL | 260 | 1 mm | compliant | - | S-PBGA-B484 | 233 | Not Qualified | 1.2 V | 1.2 V | - | - | - | - | - | - | 114 kB | - | - | - | - | - | 667 Mb/s | - | 233 | - | 2.44 mm | FIELD PROGRAMMABLE GATE ARRAY | 12084 | FPGA - Field Programmable Gate Array | 933888 | - | - | - | - | 1 | 4 Transceiver | - | - | - | - | 12084 | - | - | - | FPGA - Field Programmable Gate Array | - | 23 mm | 23 mm | - | - | |||
M2GL010T-1FGG484I | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
Mfr. ТипM2GL050TS-FGG484IAnlielectronics Тип | Microchip |
M2GL050TS-FGG484I 484 Pbga 23X23X2.44MM Tray Rohs Compliant: Yes
Сборник данных
Сравнение
| Min.:1 Mult.:1 | - | - | - | Surface Mount | 484-BGA | YES | - | 484-FPBGA (23x23) | - | 484 | M2GL050 | - | - | - | - | MICROSEMI CORP | - | - | M2GL050TS-FGG484I | - | - | Microchip Technology | - | - | 3 | - | 267 | - | - | - | Tray | PLASTIC/EPOXY | BGA | BGA, BGA484,22X22,40 | BGA484,22X22,40 | SQUARE | GRID ARRAY | Active | Active | 30 | 5.27 | - | Yes | - | 1.26 V | 1.14 V | 1.2 V | - | - | - | - | -40°C ~ 100°C (TJ) | - | IGLOO2 | - | - | - | - | - | - | 8542.39.00.01 | 1.14V ~ 2.625V | BOTTOM | BALL | 260 | 1 mm | compliant | - | S-PBGA-B484 | 267 | Not Qualified | - | 1.2 V | - | - | - | - | - | - | - | - | - | - | - | - | - | - | 267 | - | 2.44 mm | FIELD PROGRAMMABLE GATE ARRAY | 56340 | - | 1869824 | - | - | - | - | - | - | - | - | - | - | 56340 | - | - | - | - | - | 23 mm | 23 mm | - | - | |||
M2GL050TS-FGG484I | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
Mfr. ТипM2S150T-1FCG1152IAnlielectronics Тип | Microchip |
FPGA SmartFusion2 146124 Cells 65nm Technology 1.2V 1152-Pin FP-BGA
Сборник данных
Сравнение
| Min.:1 Mult.:1 | - | - | - | - | 1152-BBGA, FCBGA | YES | - | 1152-FCBGA (35x35) | - | 1152 | M2S150 | - | - | 64 kB | - | MICROSEMI CORP | - | - | M2S150T-1FCG1152I | 166 MHz | - | Microchip Technology | - | - | 4 | SMD/SMT | 574 | 146124 LE | - | - | Tray | PLASTIC/EPOXY | BGA | BGA, BGA1152,34X34,40 | BGA1152,34X34,40 | SQUARE | GRID ARRAY | Active | Active | 40 | 5.77 | - | Yes | - | 1.26 V | 1.14 V | 1.2 V | - | - | - | - | -40°C ~ 100°C (TJ) | - | SmartFusion®2 | e1 | - | Tin/Silver/Copper (Sn/Ag/Cu) | - | - | - | 8542.39.00.01 | - | BOTTOM | BALL | 250 | 1 mm | compliant | - | S-PBGA-B1152 | 574 | Not Qualified | - | 1.2 V | - | - | - | - | - | 166MHz | 64KB | ARM® Cortex®-M3 | DDR, PCIe, SERDES | 512 kB | - | CANbus, Ethernet, I²C, SPI, UART/USART, USB | - | MCU, FPGA | 574 | - | 2.9 mm | FIELD PROGRAMMABLE GATE ARRAY | - | - | - | - | - | - | - | 1 | - | FPGA - 150K Logic Modules | - | - | - | 146124 | 1 Core | - | 512KB | - | - | 35 mm | 35 mm | - | - | |||
M2S150T-1FCG1152I | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
Mfr. ТипM2GL010T-1VFG256Anlielectronics Тип | Microchip |
M2GL010T-1VFG256 256 Lfbga 14X14X1.56MM Tray Rohs Compliant: Yes
Сборник данных
Сравнение
| Min.:1 Mult.:1 | - | - | - | Surface Mount | 256-LFBGA | YES | - | 256-FPBGA (14x14) | - | 256 | M2GL010 | - | - | - | - | MICROSEMI CORP | - | - | M2GL010T-1VFG256 | - | + 85 C | Microchip Technology | 0 C | - | 3 | SMD/SMT | 138 | 12084 LE | 85 °C | - | Tray | PLASTIC/EPOXY | LFBGA | LFBGA, | - | SQUARE | GRID ARRAY, LOW PROFILE, FINE PITCH | Active | Active | 30 | 5.27 | - | Yes | - | 1.26 V | 1.14 V | 1.2 V | - | - | - | - | 0°C ~ 85°C (TJ) | - | IGLOO2 | - | - | - | - | - | - | 8542.39.00.01 | 1.14V ~ 2.625V | BOTTOM | BALL | 260 | 0.8 mm | compliant | - | S-PBGA-B256 | - | - | 1.2 V | - | OTHER | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | 1.56 mm | FIELD PROGRAMMABLE GATE ARRAY | 12084 | - | 933888 | - | - | - | - | - | 2 Transceiver | - | - | - | - | - | - | - | - | - | - | 14 mm | 14 mm | - | - | |||
M2GL010T-1VFG256 | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
Mfr. ТипM2S060T-1FG676IAnlielectronics Тип | Microchip |
M2S060T-1FG676I 676 Pbga 27X27X2.44MM Tray Rohs Compliant: Yes
Сборник данных
Сравнение
| Min.:1 Mult.:1 | Production (Last Updated: 2 months ago) | - | - | - | 676-BGA | YES | - | 676-FBGA (27x27) | - | 676 | M2S060 | - | - | 64 kB | - | MICROSEMI CORP | - | - | M2S060T-1FG676I | 166 MHz | - | Microchip Technology | - | - | 3 | - | 387 | 56520 LE | - | - | Tray | PLASTIC/EPOXY | BGA | FBGA-676 | BGA676,26X26,40 | SQUARE | GRID ARRAY | Active | Active | 30 | 5.88 | Non-Compliant | No | - | 1.26 V | 1.14 V | 1.2 V | - | - | - | - | -40°C ~ 100°C (TJ) | - | SmartFusion®2 | e0 | - | Tin/Lead (Sn/Pb) | - | - | - | 8542.39.00.01 | - | BOTTOM | BALL | 240 | 1 mm | not_compliant | - | S-PBGA-B676 | 387 | Not Qualified | - | 1.2 V | - | - | - | - | - | 166MHz | 64KB | ARM® Cortex®-M3 | DDR, PCIe, SERDES | 256 kB | - | CANbus, Ethernet, I²C, SPI, UART/USART, USB | - | MCU, FPGA | 387 | - | 2.44 mm | FIELD PROGRAMMABLE GATE ARRAY | - | - | - | - | - | - | - | - | - | FPGA - 60K Logic Modules | - | - | - | 56520 | 1 Core | - | 256KB | - | - | 27 mm | 27 mm | - | - | |||
M2S060T-1FG676I | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
Mfr. ТипM2GL025-1FCS325Anlielectronics Тип | Microchip |
M2GL025-1FCS325 325 TFBGA 11X11X1.01MM TRAY ROHS COMPLIANT: YES
Сборник данных
Сравнение
| Min.:1 Mult.:1 | - | - | - | Surface Mount | 325-TFBGA, FCBGA | YES | - | 325-FCBGA (11x11) | - | 325 | M2GL025 | - | - | - | - | MICROSEMI CORP | - | - | M2GL025-1FCS325 | - | + 85 C | Microchip Technology | 0 C | - | - | SMD/SMT | 180 | 27696 LE | 85 °C | - | Tray | PLASTIC/EPOXY | BGA | BGA, BGA325,21X21,20 | BGA325,21X21,20 | SQUARE | GRID ARRAY | Active | Active | 20 | 5.27 | - | No | - | 1.26 V | 1.14 V | 1.2 V | - | - | - | - | 0°C ~ 85°C (TJ) | - | IGLOO2 | - | - | - | - | - | - | 8542.39.00.01 | 1.14V ~ 2.625V | BOTTOM | BALL | 240 | - | compliant | - | S-PBGA-B325 | 180 | Not Qualified | 1.2 V | 1.2 V | OTHER | - | - | - | - | - | - | - | - | - | - | - | - | - | 180 | - | - | FIELD PROGRAMMABLE GATE ARRAY | 27696 | - | 1130496 | - | - | - | - | - | - | - | - | - | - | 27696 | - | - | - | - | - | - | - | - | - | |||
M2GL025-1FCS325 | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
Mfr. ТипM2GL010-1VF400IAnlielectronics Тип | Microchip |
FPGA IGLOO2 12084 Cells 65nm Technology 3.3V 400-Pin FP-BGA
Сборник данных
Сравнение
| Min.:1 Mult.:1 | Production (Last Updated: 2 months ago) | - | - | Surface Mount | 400-LFBGA | YES | 400 | 400-VFBGA (17x17) | - | 400 | M2GL010 | - | - | - | - | MICROSEMI CORP | - | - | M2GL010-1VF400I | - | + 100 C | Microchip Technology | - 40 C | - | - | SMD/SMT | 195 | 12084 LE | - | - | Tray | PLASTIC/EPOXY | LFBGA | 17 X 17 MM, 0.80 MM PITCH, VFBGA-400 | BGA400,20X20,32 | SQUARE | GRID ARRAY, LOW PROFILE, FINE PITCH | Active | Active | 20 | 5.3 | Non-Compliant | No | - | 1.26 V | 1.14 V | 1.2 V | - | - | - | - | -40°C ~ 100°C (TJ) | - | IGLOO2 | - | - | - | 100 °C | -40 °C | - | 8542.39.00.01 | 1.14V ~ 2.625V | BOTTOM | BALL | 240 | 0.8 mm | compliant | - | S-PBGA-B400 | 195 | Not Qualified | 1.2 V | 1.2 V | - | 1.26 V | 1.14 V | - | - | - | 114 kB | - | - | - | - | - | - | - | 195 | - | 1.51 mm | FIELD PROGRAMMABLE GATE ARRAY | 12084 | - | 933888 | - | - | - | - | 1 | - | - | - | - | - | 12084 | - | - | - | - | - | 17 mm | 17 mm | - | - | |||
M2GL010-1VF400I | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
Mfr. ТипM2S010T-VFG400Anlielectronics Тип | Microchip |
FPGA SmartFusion2 Family 12084 Cells 166MHz 65nm Technology 2.5V/3.3V 400-Pin F-BGA
Сборник данных
Сравнение
| Min.:1 Mult.:1 | - | - | - | - | 400-LFBGA | YES | - | 400-VFBGA (17x17) | - | 400 | M2S010 | - | - | 64 kB | - | MICROSEMI CORP | - | - | M2S010T-VFG400 | 166 MHz | + 85 C | Microchip Technology | 0 C | - | 3 | SMD/SMT | 195 | 12084 LE | 85 °C | - | Tray | PLASTIC/EPOXY | LFBGA | VFBGA-400 | BGA400,20X20,32 | SQUARE | GRID ARRAY, LOW PROFILE, FINE PITCH | Active | Active | 40 | 5.25 | - | Yes | - | 1.26 V | 1.14 V | 1.2 V | - | - | - | - | 0°C ~ 85°C (TJ) | - | SmartFusion®2 | e1 | - | Tin/Silver/Copper (Sn/Ag/Cu) | - | - | - | 8542.39.00.01 | - | BOTTOM | BALL | 250 | 0.8 mm | compliant | - | S-PBGA-B400 | 195 | Not Qualified | 1.2 V | 1.2 V | OTHER | - | - | - | - | 166MHz | 64KB | ARM® Cortex®-M3 | DDR, PCIe, SERDES | 256 kB | - | CANbus, Ethernet, I²C, SPI, UART/USART, USB | - | MCU, FPGA | 195 | - | 1.51 mm | FIELD PROGRAMMABLE GATE ARRAY | - | - | - | - | - | - | - | STD | - | FPGA - 10K Logic Modules | - | - | - | 12084 | 1 Core | - | 256KB | - | - | 17 mm | 17 mm | - | - | |||
M2S010T-VFG400 | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
Mfr. ТипA3P250-FG256TAnlielectronics Тип | Microchip |
FPGA ProASIC3 Family 250K Gates 231MHz 130nm (CMOS) Technology 1.5V 256-Pin FBGA
Сборник данных
Сравнение
| Min.:1 Mult.:1 | - | - | - | Surface Mount | 256-LBGA | YES | - | 256-FPBGA (17x17) | - | 256 | A3P250 | - | 350 MHz | - | - | MICROSEMI CORP | - | - | A3P250-FG256T | - | - | Microchip Technology | - | - | 3 | - | 157 | - | 125 °C | -40 °C | Tray | PLASTIC/EPOXY | BGA | 1 MM PITCH, FBGA-256 | BGA256,16X16,40 | SQUARE | GRID ARRAY | Active | Active | 20 | 5.23 | - | No | - | 1.575 V | 1.425 V | 1.5 V | - | - | - | Automotive grade | -40°C ~ 125°C (TA) | - | Automotive, AEC-Q100, ProASIC3 | e0 | - | Tin/Lead (Sn/Pb) | - | - | - | 8542.39.00.01 | 1.425V ~ 1.575V | BOTTOM | BALL | 225 | 1 mm | compliant | - | S-PBGA-B256 | 157 | Not Qualified | - | 1.5/3.3 V | AUTOMOTIVE | - | - | - | - | - | - | - | - | - | - | - | - | - | 157 | 6144 CLBS, 250000 GATES | 1.8 mm | FIELD PROGRAMMABLE GATE ARRAY | - | - | 36864 | 250000 | - | AEC-Q100 | - | STD | - | - | - | - | 6144 | 6144 | - | 250000 | - | - | - | 17 mm | 17 mm | - | - | |||
A3P250-FG256T | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
Mfr. ТипA3P600L-FG256Anlielectronics Тип | Microchip |
FPGA ProASIC?3L Family 600K Gates 781.25MHz 130nm (CMOS) Technology 1.2V 256-Pin FBGA
Сборник данных
Сравнение
| Min.:1 Mult.:1 | Obsolete (Last Updated: 2 months ago) | - | Surface Mount | - | - | YES | 256 | - | 400.011771 mg | 256 | - | - | 350 MHz | - | - | MICROSEMI CORP | - | - | A3P600L-FG256 | - | - | - | - | - | 3 | - | 177 | - | 70 °C | - | - | PLASTIC/EPOXY | BGA | 17 X 17 MM, 1.60 MM HEIGHT, 1 MM PITCH, FBGA-256 | BGA256,16X16,40 | SQUARE | GRID ARRAY | Obsolete | - | 30 | 5.28 | Compliant | No | - | 1.575 V | 1.14 V | 1.2 V | - | - | - | - | - | - | - | - | - | TIN LEAD/TIN LEAD SILVER | 70 °C | 0 °C | - | 8542.39.00.01 | - | BOTTOM | BALL | 225 | 1 mm | compliant | - | S-PBGA-B256 | 177 | Not Qualified | 1.2 V | 1.5/3.3 V | COMMERCIAL | 1.26 V | 1.14 V | - | 5 mA | - | 13.5 kB | - | - | - | - | - | - | - | 177 | 13824 CLBS, 600000 GATES | 1.8 mm | FIELD PROGRAMMABLE GATE ARRAY | - | - | - | 600000 | 781.25 MHz | - | - | - | - | - | 13824 | - | 13824 | 13824 | - | 600000 | - | - | 1.2 mm | 17 mm | 17 mm | No | - | |||
A3P600L-FG256 | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
Mfr. ТипA3P400-FG484IAnlielectronics Тип | Microchip |
FPGA ProASIC?3 Family 400K Gates 231MHz 130nm (CMOS) Technology 1.5V 484-Pin FBGA
Сборник данных
Сравнение
| Min.:1 Mult.:1 | - | - | - | - | - | YES | - | - | - | 484 | - | - | 350 MHz | - | - | MICROSEMI CORP | - | - | A3P400-FG484I | - | - | - | - | - | 3 | - | - | - | 100 °C | -40 °C | - | PLASTIC/EPOXY | BGA | BGA, | - | SQUARE | GRID ARRAY | Obsolete | - | 30 | 7.76 | - | No | - | 1.575 V | 1.425 V | 1.5 V | - | - | - | - | - | - | - | e0 | - | Tin/Lead (Sn/Pb) | - | - | - | 8542.39.00.01 | - | BOTTOM | BALL | 225 | 1 mm | compliant | - | S-PBGA-B484 | - | Not Qualified | - | - | INDUSTRIAL | - | - | - | - | - | - | - | - | - | - | - | - | - | - | 9216 CLBS, 400000 GATES | 2.44 mm | FIELD PROGRAMMABLE GATE ARRAY | - | - | - | - | - | - | - | - | - | - | - | - | 9216 | - | - | 400000 | - | - | - | 23 mm | 23 mm | - | - | |||
A3P400-FG484I | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
Mfr. ТипA3P600-FGG144Anlielectronics Тип | Microchip |
FPGA ProASIC3 Family 600K Gates 231MHz 130nm (CMOS) Technology 1.5V 144-Pin F-BGA
Сборник данных
Сравнение
| Min.:1 Mult.:1 | Production (Last Updated: 1 month ago) | - | Surface Mount | Surface Mount | 144-LBGA | YES | 144 | 144-FPBGA (13x13) | - | 144 | A3P600 | - | 350 MHz | - | - | MICROSEMI CORP | - | - | A3P600-FGG144 | - | - | Microchip Technology | - | - | 3 | - | 97 | - | 85 °C | - | Tray | PLASTIC/EPOXY | LBGA | LBGA, | - | SQUARE | GRID ARRAY, LOW PROFILE | Active | Active | 40 | 0.76 | Compliant | Yes | 8542310000/8542310000/8542310000/8542310000/8542310000 | 1.575 V | 1.425 V | 1.5 V | - | - | - | - | 0°C ~ 85°C (TJ) | - | ProASIC3 | e1 | 3A001.A.7.A | Tin/Silver/Copper (Sn/Ag/Cu) | 70 °C | 0 °C | - | 8542.39.00.01 | 1.425V ~ 1.575V | BOTTOM | BALL | 260 | 1 mm | compliant | 231 MHz | S-PBGA-B144 | - | Not Qualified | 1.5 V | - | COMMERCIAL | 1.575 V | 1.425 V | 13.5 kB | 5 mA | - | 13.5 kB | - | - | - | - | - | - | - | - | 13824 CLBS, 600000 GATES | 1.55 mm | FIELD PROGRAMMABLE GATE ARRAY | 6500 | - | 110592 | 600000 | 231 MHz | - | - | STD | - | - | 13824 | - | 13824 | - | - | 600000 | - | - | 1.05 mm | 13 mm | 13 mm | No | Lead Free | |||
A3P600-FGG144 | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
Mfr. ТипAPA450-FG484IAnlielectronics Тип | Microchip |
APA Series 450000 System Gates 344 I/O 108 kb ProASICPLUS? FPGA - FPBGA-484
Сборник данных
Сравнение
| Min.:1 Mult.:1 | Production (Last Updated: 1 month ago) | Lead, Tin | Surface Mount | Surface Mount | 484-BGA | YES | 484 | 484-FPBGA (23x23) | 400.011771 mg | 484 | APA450 | - | 180 MHz | - | - | MICROSEMI CORP | - | - | APA450-FG484I | - | - | Microchip Technology | - | - | 3 | - | 344 | - | 85 °C | -40 °C | Tray | PLASTIC/EPOXY | BGA | BGA, BGA484,22X22,40 | BGA484,22X22,40 | SQUARE | GRID ARRAY | Active | Active | 30 | 5.25 | Compliant | No | - | 2.7 V | 2.3 V | 2.5 V | - | - | - | - | -40°C ~ 85°C (TA) | - | ProASICPLUS | e0 | - | Tin/Lead (Sn/Pb) | 85 °C | -40 °C | - | 8542.39.00.01 | 2.3V ~ 2.7V | BOTTOM | BALL | 225 | 1 mm | unknown | 180 MHz | S-PBGA-B484 | 344 | Not Qualified | 2.5 V | 2.5,2.5/3.3 V | INDUSTRIAL | 2.7 V | 2.3 V | - | - | - | 13.5 kB | - | - | - | - | - | - | - | 344 | 450000 GATES | 2.44 mm | FIELD PROGRAMMABLE GATE ARRAY | - | - | 110592 | 450000 | 180 MHz | - | - | STD | - | - | 12288 | - | - | 12288 | - | 450000 | - | - | 1.73 mm | 25 mm | 25 mm | No | Contains Lead | |||
APA450-FG484I | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
Mfr. ТипAFS250-FG256IAnlielectronics Тип | Microchip |
FPGA Fusion? Family 250K Gates 1098.9MHz 130nm Technology 1.5V 256-Pin FBGA Tray
Сборник данных
Сравнение
| Min.:1 Mult.:1 | Production (Last Updated: 2 months ago) | - | Surface Mount | Surface Mount | 256-LBGA | YES | 256 | 256-FPBGA (17x17) | 400.011771 mg | 256 | AFS250 | - | - | - | - | MICROSEMI CORP | - | - | AFS250-FG256I | - | - | Microchip Technology | - | - | 3 | - | 114 | - | 85 °C | -40 °C | Tray | PLASTIC/EPOXY | LBGA | LBGA, | - | SQUARE | GRID ARRAY, LOW PROFILE | Active | Active | 30 | 1.8 | Compliant | No | - | 1.575 V | 1.425 V | 1.5 V | - | 1.5000 V | - | - | -40 to 85 °C | - | Fusion® | e0 | 3A001.A.7.A | Tin/Lead (Sn/Pb) | 85 °C | -40 °C | - | 8542.39.00.01 | 1.425V ~ 1.575V | BOTTOM | BALL | 225 | 1 mm | unknown | 1.0989 GHz | S-PBGA-B256 | - | Not Qualified | 1.5 V | - | INDUSTRIAL | 1.575 V | 1.425 V | - | - | - | 4.5 kB | - | - | - | - | - | - | - | - | 6144 CLBS, 250000 GATES | 1.68 mm | FIELD PROGRAMMABLE GATE ARRAY | - | - | 36864 | 250000 | 1.0989 GHz | - | - | STD | - | - | 6144 | - | 6144 | - | - | 250000 | - | - | 1.2 mm | 17 mm | 17 mm | No | - | |||
AFS250-FG256I | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
Mfr. ТипA1225A-1PQG100IAnlielectronics Тип | Microchip |
IC FPGA 2500 Gates 100-PQFP Ind
Сборник данных
Сравнение
| Min.:1 Mult.:1 | - | - | Surface Mount | - | - | YES | 100 | - | - | 100 | - | - | 81.1 MHz | - | - | MICROSEMI CORP | - | - | A1225A-1PQG100I | - | - | - | - | - | 3 | - | 83 | - | 85 °C | -40 °C | - | PLASTIC/EPOXY | QFP | PLASTIC, QFP-100 | QFP100,.7X.9 | RECTANGULAR | FLATPACK | Obsolete | - | 40 | 5.8 | Compliant | Yes | - | 5.5 V | 4.5 V | 5 V | - | - | - | - | - | - | - | e3 | - | MATTE TIN | 85 °C | -40 °C | MAX 83 I/OS | - | - | QUAD | GULL WING | 245 | 0.65 mm | compliant | 120 MHz | R-PQFP-G100 | 83 | Not Qualified | 5 V | 5 V | INDUSTRIAL | 5.5 V | 4.5 V | - | - | - | - | - | - | - | 4.3 ns | - | - | - | 83 | 451 CLBS, 2500 GATES | 3.4 mm | FIELD PROGRAMMABLE GATE ARRAY | 451 | - | - | 2500 | - | - | 451 | - | - | - | - | 4.3 ns | 451 | 451 | - | 2500 | - | - | - | 20 mm | 14 mm | - | - | |||
A1225A-1PQG100I | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
Mfr. ТипA1020B-1PLG68IAnlielectronics Тип | Microchip |
Axcelerator FPGA 2K System Gates HiRel FPGAs
Сборник данных
Сравнение
| Min.:1 Mult.:1 | - | - | - | - | - | YES | - | - | - | 68 | - | - | 47.7 MHz | - | - | MICROSEMI CORP | - | - | A1020B-1PLG68I | - | - | - | - | - | 3 | - | - | - | 85 °C | -40 °C | - | PLASTIC/EPOXY | QCCJ | QCCJ, LDCC68,1.0SQ | LDCC68,1.0SQ | SQUARE | CHIP CARRIER | Obsolete | - | 40 | 5.8 | - | Yes | - | 5.5 V | 4.5 V | 5 V | - | - | - | - | - | - | - | e3 | - | MATTE TIN | - | - | MAX 57 I/OS | - | - | QUAD | J BEND | 245 | 1.27 mm | compliant | - | S-PQCC-J68 | 69 | Not Qualified | - | 5 V | INDUSTRIAL | - | - | - | - | - | - | - | - | - | - | - | - | - | 69 | 547 CLBS, 2000 GATES | 4.445 mm | FIELD PROGRAMMABLE GATE ARRAY | - | - | - | - | - | - | - | - | - | - | - | 3.8 ns | 547 | 547 | - | 2000 | - | - | - | 24.13 mm | 24.13 mm | - | - | |||
A1020B-1PLG68I | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
Mfr. ТипA14100A-RQ208IAnlielectronics Тип | Microchip |
FPGA ACT 3 Family 10K Gates 1377 Cells 100MHz 0.8um (CMOS) Technology 5V 208-Pin RQFP
Сборник данных
Сравнение
| Min.:1 Mult.:1 | - | - | - | - | - | YES | - | - | - | 208 | - | - | 100 MHz | - | - | MICROSEMI CORP | - | - | A14100A-RQ208I | - | - | - | - | - | 3 | - | - | - | 85 °C | -40 °C | - | PLASTIC/EPOXY | HFQFP | HFQFP, | - | SQUARE | FLATPACK, HEAT SINK/SLUG, FINE PITCH | Obsolete | - | - | 8.76 | - | No | - | 5.5 V | 4.5 V | 5 V | - | - | - | - | - | - | - | e0 | - | Tin/Lead (Sn/Pb) | - | - | - | 8542.39.00.01 | - | QUAD | GULL WING | - | 0.5 mm | compliant | - | S-PQFP-G208 | - | - | - | - | INDUSTRIAL | - | - | - | - | - | - | - | - | - | - | - | - | - | - | 1377 CLBS, 10000 GATES | 4.1 mm | FIELD PROGRAMMABLE GATE ARRAY | - | - | - | - | - | - | - | - | - | - | - | 3 ns | 1377 | - | - | 10000 | - | - | - | 28 mm | 28 mm | - | - | |||
A14100A-RQ208I | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
Mfr. ТипAGL125V5-QNG132IAnlielectronics Тип | Microchip |
FPGA IGLOO Family 125K Gates 130nm (CMOS) Technology 1.5V 132-Pin QFN EP
Сборник данных
Сравнение
| Min.:1 Mult.:1 | - | - | - | - | - | YES | - | - | - | 132 | - | - | 108 MHz | - | - | MICROSEMI CORP | - | - | AGL125V5-QNG132I | - | - | - | - | - | 3 | - | - | - | 85 °C | -40 °C | - | UNSPECIFIED | HVBCC | HVBCC, LGA132(UNSPEC) | LGA132(UNSPEC) | SQUARE | CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE | Obsolete | - | NOT SPECIFIED | 5.61 | - | Yes | - | 1.575 V | 1.425 V | 1.5 V | - | - | - | - | - | - | - | - | - | - | - | - | - | 8542.39.00.01 | - | BOTTOM | BUTT | NOT SPECIFIED | 0.5 mm | compliant | - | S-XBCC-B132 | 84 | Not Qualified | - | 1.5 V | INDUSTRIAL | - | - | - | - | - | - | - | - | - | - | - | - | - | 84 | 3072 CLBS, 125000 GATES | 0.8 mm | FIELD PROGRAMMABLE GATE ARRAY | - | - | - | - | - | - | - | - | - | - | - | - | 3072 | 3072 | - | 125000 | - | - | - | 8 mm | 8 mm | - | - | |||
AGL125V5-QNG132I |
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