Embedded - FPGAs (Field Programmable Gate Array) Products For Sale - PDF - Integrated Circuits (ICs) -Page23

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Embedded - FPGAs (Field Programmable Gate Array)

Изображение	Тип	Марка	Объяснение	Установленная цена	Количество	RoHS	Lifecycle Status	Mount	Mounting Type	Package / Case	Surface Mount	Number of Pins	Supplier Device Package	Weight	Number of Terminals	Base Product Number	Clock Frequency-Max	Device Logic Gates	Device System Gates	Distributed RAM	Embedded Block RAM - EBR	Factory Pack QuantityFactory Pack Quantity	Ihs Manufacturer	Manufacturer Part Number	Maximum Operating Frequency	Maximum Operating Supply Voltage	Maximum Operating Temperature	Mfr	Minimum Operating Supply Voltage	Minimum Operating Temperature	Moisture Sensitive	Moisture Sensitivity Levels	Mounting Styles	Number of I/Os	Number of Logic Array Blocks - LABs	Number of Logic Elements	Operating Temperature-Max	Operating Temperature-Min	Package	Package Body Material	Package Code	Package Description	Package Equivalence Code	Package Shape	Package Style	Part Life Cycle Code	Part Package Code	Product Status	Reflow Temperature-Max (s)	Risk Rank	RoHS	Rohs Code	Schedule B	Shipping Restrictions	Supply Voltage-Max	Supply Voltage-Min	Supply Voltage-Nom	Total Memory	Tradename	Typical Operating Supply Voltage	Unit Weight	Operating Temperature	Packaging	Series	JESD-609 Code	ECCN Code	Terminal Finish	Max Operating Temperature	Min Operating Temperature	Additional Feature	HTS Code	Technology	Voltage - Supply	Terminal Position	Terminal Form	Peak Reflow Temperature (Cel)	Terminal Pitch	Reach Compliance Code	Frequency	Pin Count	JESD-30 Code	Number of Outputs	Qualification Status	Operating Supply Voltage	Power Supplies	Temperature Grade	Max Supply Voltage	Min Supply Voltage	Operating Supply Current	RAM Size	Propagation Delay	Turn On Delay Time	Data Rate	Number of Inputs	Organization	Seated Height-Max	Programmable Logic Type	Number of Logic Elements/Cells	Total RAM Bits	Number of Gates	Max Frequency	Number of LABs/CLBs	Number of Logic Blocks (LABs)	Speed Grade	Number of Transceivers	Number of Registers	Combinatorial Delay of a CLB-Max	Number of CLBs	Number of Logic Cells	Number of Equivalent Gates	Height	Length	Width	Radiation Hardening

Изображение	Тип	Марка	Объяснение	Количество	Lifecycle Status	Mount	Mounting Type	Package / Case	Surface Mount	Number of Pins	Supplier Device Package	Weight	Number of Terminals	Base Product Number	Clock Frequency-Max	Device Logic Gates	Device System Gates	Distributed RAM	Embedded Block RAM - EBR	Factory Pack QuantityFactory Pack Quantity	Ihs Manufacturer	Manufacturer Part Number	Maximum Operating Frequency	Maximum Operating Supply Voltage	Maximum Operating Temperature	Mfr	Minimum Operating Supply Voltage	Minimum Operating Temperature	Moisture Sensitive	Moisture Sensitivity Levels	Mounting Styles	Number of I/Os	Number of Logic Array Blocks - LABs	Number of Logic Elements	Operating Temperature-Max	Operating Temperature-Min	Package	Package Body Material	Package Code	Package Description	Package Equivalence Code	Package Shape	Package Style	Part Life Cycle Code	Part Package Code	Product Status	Reflow Temperature-Max (s)	Risk Rank	RoHS	Rohs Code	Schedule B	Shipping Restrictions	Supply Voltage-Max	Supply Voltage-Min	Supply Voltage-Nom	Total Memory	Tradename	Typical Operating Supply Voltage	Unit Weight	Operating Temperature	Packaging	Series	JESD-609 Code	ECCN Code	Terminal Finish	Max Operating Temperature	Min Operating Temperature	Additional Feature	HTS Code	Technology	Voltage - Supply	Terminal Position	Terminal Form	Peak Reflow Temperature (Cel)	Terminal Pitch	Reach Compliance Code	Frequency	Pin Count	JESD-30 Code	Number of Outputs	Qualification Status	Operating Supply Voltage	Power Supplies	Temperature Grade	Max Supply Voltage	Min Supply Voltage	Operating Supply Current	RAM Size	Propagation Delay	Turn On Delay Time	Data Rate	Number of Inputs	Organization	Seated Height-Max	Programmable Logic Type	Number of Logic Elements/Cells	Total RAM Bits	Number of Gates	Max Frequency	Number of LABs/CLBs	Number of Logic Blocks (LABs)	Speed Grade	Number of Transceivers	Number of Registers	Combinatorial Delay of a CLB-Max	Number of CLBs	Number of Logic Cells	Number of Equivalent Gates	Height	Length	Width	Radiation Hardening
	Mfr. Тип M7A3P1000-FGG484 Anlielectronics Тип	Microchip Technology	FPGA - Field Programmable Gate Array M7A3P1000-FGG484 Сборник данных Сравнение	Min.:1 Mult.:1	-	Surface Mount	Surface Mount	FBGA	YES	484	484-FPBGA (23x23)	400.011771 mg	484	M7A3P1000	350 MHz	-	-	-	-	60	MICROSEMI CORP	M7A3P1000-FGG484	231 MHz	1.575 V	+ 70 C	Microchip Technology	1.425 V	0 C	Yes	3	SMD/SMT	300 I/O	-	-	70 °C	-	Tray	PLASTIC/EPOXY	BGA	BGA,	-	SQUARE	GRID ARRAY	Not Recommended	-	Active	40	5.25	Details	Yes	-	This product may require additional documentation to export from the United States.	1.575 V	1.425 V	1.5 V	-	ProASIC3	1.5000 V	0.014110 oz	0 to 70 °C	Tray	M7A3P1000	e1	-	Tin/Silver/Copper (Sn/Ag/Cu)	70 °C	0 °C	-	8542.39.00.01	CMOS	1.425V ~ 1.575V	BOTTOM	BALL	250	1 mm	compliant	231 MHz	-	S-PBGA-B484	-	Not Qualified	1.5 V	-	COMMERCIAL	1.575 V	1.425 V	-	18 kB	-	-	-	-	24576 CLBS, 1000000 GATES	2.44 mm	FIELD PROGRAMMABLE GATE ARRAY	-	147456	1000000	231 MHz	-	-	STD	-	24576	-	24576	-	1000000	1.73 mm	23 mm	23 mm	No
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	Mfr. Тип AFS1500-1FG256 Anlielectronics Тип	Microchip Technology	FPGA - Field Programmable Gate Array AFS1500-1FG256 Сборник данных Сравнение	Min.:1 Mult.:1	Production (Last Updated: 2 months ago)	Surface Mount	Surface Mount	FBGA	-	256	256-FPBGA (17x17)	400.011771 mg	-	AFS1500	-	-	-	-	-	90	-	-	1282.05 MHz	-	+ 70 C	Microchip Technology	-	0 C	Yes	-	SMD/SMT	119 I/O	-	-	-	-	Tray	-	-	-	-	-	-	-	-	Active	-	-	N	-	-	This product may require additional documentation to export from the United States.	1.575 V	1.425 V	-	-	Fusion	-	0.014110 oz	0°C ~ 85°C (TJ)	Tray	AFS1500	-	-	-	70 °C	0 °C	-	-	-	1.425V ~ 1.575V	-	-	-	-	-	-	-	-	-	-	1.5 V	-	-	1.575 V	1.425 V	-	33.8 kB	-	-	-	-	-	-	-	-	276480	1500000	1.28205 GHz	-	-	1	-	38400	-	-	-	-	1.2 mm	17 mm	17 mm	No
AFS1500-1FG256 Microchip Technology RoHS : Инкапсуляция : - Есть складские запасы : - 1 : -
	Mfr. Тип AX2000-2FGG896 Anlielectronics Тип	Microchip Technology	FPGA - Field Programmable Gate Array AX2000-2FGG896 LEAD FREE Сборник данных Сравнение	Min.:1 Mult.:1	Production (Last Updated: 2 months ago)	Surface Mount	Surface Mount	FBGA	YES	896	896-FBGA (31x31)	400.011771 mg	896	AX2000	870 MHz	-	-	-	-	27	MICROSEMI CORP	AX2000-2FGG896	870 MHz	-	+ 70 C	Microchip Technology	-	0 C	Yes	3	SMD/SMT	586 I/O	-	-	70 °C	-	Tray	PLASTIC/EPOXY	BGA	BGA, BGA896,30X30,40	BGA896,30X30,40	SQUARE	GRID ARRAY	Active	-	Active	40	5.26	Details	Yes	-	This product may require additional documentation to export from the United States.	1.575 V	1.425 V	1.5 V	-	Actel	-	0.014110 oz	0°C ~ 70°C (TA)	Tray	AX2000	e1	-	Tin/Silver/Copper (Sn/Ag/Cu)	70 °C	0 °C	2000000 SYSTEM GATES AVAILABLE	8542.39.00.01	CMOS	1.425V ~ 1.575V	BOTTOM	BALL	250	1 mm	compliant	870 MHz	-	S-PBGA-B896	684	Not Qualified	1.5 V	1.5,1.5/3.3,2.5/3.3 V	COMMERCIAL	1.575 V	1.425 V	-	36 kB	740 ps	740 ps	-	684	21504 CLBS, 2000000 GATES	2.44 mm	FIELD PROGRAMMABLE GATE ARRAY	21504	294912	2000000	870 MHz	32256	21504	2	-	21504	0.74 ns	21504	32256	2000000	1.73 mm	31 mm	31 mm	No
AX2000-2FGG896 Microchip Technology RoHS : Инкапсуляция : - Есть складские запасы : - 1 : -
	Mfr. Тип A3P1000-1FG256M Anlielectronics Тип	Microchip Technology	FPGA - Field Programmable Gate Array A3P1000-1FG256M Сборник данных Сравнение	Min.:1 Mult.:1	-	-	Surface Mount	FBGA-256	-	-	256-FPBGA (17x17)	-	-	A3P1000	-	-	-	144 kbit	144 kbit	90	-	-	350 MHz	1.575 V	+ 85 C	Microchip Technology	1.425 V	0 C	-	-	SMD/SMT	177 I/O	-	11000 LE	-	-	Tray	-	-	-	-	-	-	-	-	Active	-	-	-	-	-	This product may require additional documentation to export from the United States.	1.5 V	1.5 V	-	1 kbit	ProASIC3	-	-	-55 to 125 °C	Tray	A3P1000	-	-	-	-	-	-	-	-	1.14V ~ 1.575V	-	-	-	-	-	-	-	-	-	-	1.5 V	-	-	-	-	8 mA	-	-	-	700 Mb/s	-	-	-	-	-	147456	1000000	-	-	-	1	-	-	-	-	-	-	-	-	-	-
A3P1000-1FG256M Microchip Technology RoHS : Инкапсуляция : - Есть складские запасы : - 1 : -
	Mfr. Тип M1A3P400-2FG256 Anlielectronics Тип	Microchip Technology	FPGA - Field Programmable Gate Array M1A3P400-2FG256 Сборник данных Сравнение	Min.:1 Mult.:1	-	-	Surface Mount	FPBGA-256	YES	-	256-FPBGA (17x17)	-	256	M1A3P400	350 MHz	400000	400000	-	-	90	MICROSEMI CORP	M1A3P400-2FG256	-	-	-	Microchip Technology	-	-	Yes	3	SMD/SMT	178	-	-	85 °C	-	Tray	PLASTIC/EPOXY	BGA	BGA,	-	SQUARE	GRID ARRAY	Active	-	Active	30	5.24	N	No	-	This product may require additional documentation to export from the United States.	1.575 V	1.425 V	1.5 V	-	ProASIC3	-	-	0°C ~ 85°C (TJ)	Tray	M1A3P400	-	-	TIN LEAD/TIN LEAD SILVER	-	-	-	8542.39.00.01	CMOS	1.425V ~ 1.575V	BOTTOM	BALL	225	1 mm	compliant	-	-	S-PBGA-B256	-	Not Qualified	-	-	COMMERCIAL	-	-	-	-	-	-	-	-	9216 CLBS, 400000 GATES	1.8 mm	FIELD PROGRAMMABLE GATE ARRAY	-	55296	400000	-	-	-	-	-	-	-	9216	-	400000	-	17 mm	17 mm	-
M1A3P400-2FG256 Microchip Technology RoHS : Инкапсуляция : - Есть складские запасы : - 1 : -
	Mfr. Тип A42MX36-BG272 Anlielectronics Тип	Microchip Technology	FPGA - Field Programmable Gate Array A42MX36-BG272 Сборник данных Сравнение	Min.:1 Mult.:1	Production (Last Updated: 2 months ago)	Surface Mount	Surface Mount	BGA-272	YES	272	272-PBGA (27x27)	-	272	A42MX36	73 MHz	-	-	-	-	40	MICROSEMI CORP	A42MX36-BG272	131 MHz	-	+ 70 C	Microchip Technology	-	0 C	Yes	3	SMD/SMT	202 I/O	-	-	70 °C	-	Tray	PLASTIC/EPOXY	BGA	PLASTIC, BGA-272	-	SQUARE	GRID ARRAY	Active	BGA	Obsolete	30	5.19	N	No	-	-	5.25 V	3 V	3.3 V	-	Actel	-	-	0°C ~ 70°C (TA)	Tray	A42MX36	e0	-	Tin/Lead/Silver (Sn/Pb/Ag)	70 °C	0 °C	ALSO OPERATES AT 5V SUPPLY	8542.39.00.01	CMOS	3V ~ 3.6V, 4.75V ~ 5.25V	BOTTOM	BALL	225	1.27 mm	compliant	-	272	S-PBGA-B272	-	Not Qualified	3.3 V, 5 V	-	COMMERCIAL	5.25 V	3 V	-	320 B	-	-	-	-	2438 CLBS, 54000 GATES	2.5 mm	FIELD PROGRAMMABLE GATE ARRAY	1184	2560	54000	131 MHz	-	1184	-	-	1822	2.7 ns	2438	-	54000	1.73 mm	27 mm	27 mm	No
A42MX36-BG272 Microchip Technology RoHS : Инкапсуляция : - Есть складские запасы : - 1 : -
	Mfr. Тип M1A3P1000-FG144M Anlielectronics Тип	Microchip Technology	FPGA - Field Programmable Gate Array M1A3P1000-FG144M Сборник данных Сравнение	Min.:1 Mult.:1	-	-	Surface Mount	FBGA	YES	-	144-FPBGA (13x13)	-	144	M1A3P1000	350 MHz	-	-	-	-	160	MICROSEMI CORP	M1A3P1000-FG144M	350 MHz	-	+ 125 C	Microchip Technology	-	- 55 C	Yes	3	SMD/SMT	97 I/O	-	-	125 °C	-55 °C	Tray	PLASTIC/EPOXY	LBGA	1 MM PITCH, FBGA-144	BGA144,12X12,40	SQUARE	GRID ARRAY, LOW PROFILE	Active	-	Active	30	5.23	N	No	-	This product may require additional documentation to export from the United States.	1.575 V	1.425 V	1.5 V	-	ProASIC3	-	0.014110 oz	-55°C ~ 125°C (TJ)	Tray	M1A3P1000	e0	3A001.A.2.C	Tin/Lead/Silver (Sn/Pb/Ag)	-	-	-	8542.39.00.01	CMOS	1.425V ~ 1.575V	BOTTOM	BALL	225	1 mm	compliant	-	-	S-PBGA-B144	97	Not Qualified	1.5 V	1.5,1.5/3.3 V	MILITARY	-	-	8 mA	-	-	-	-	97	24576 CLBS, 1000000 GATES	1.55 mm	FIELD PROGRAMMABLE GATE ARRAY	-	147456	1000000	-	-	-	-	-	-	-	24576	24576	1000000	-	13 mm	13 mm	-
M1A3P1000-FG144M Microchip Technology RoHS : Инкапсуляция : - Есть складские запасы : - 1 : -
	Mfr. Тип A54SX08A-1TQG100 Anlielectronics Тип	Microchip Technology	FPGA - Field Programmable Gate Array A54SX08A-1TQG100 Lead Free Сборник данных Сравнение	Min.:1 Mult.:1	-	-	Surface Mount	TQFP-100	YES	-	100-TQFP (14x14)	-	100	A54SX08	278 MHz	-	-	-	-	90	MICROSEMI CORP	A54SX08A-1TQG100	278 MHz	-	+ 70 C	Microchip Technology	-	0 C	Yes	3	SMD/SMT	81 I/O	-	-	70 °C	-	Tray	PLASTIC/EPOXY	LFQFP	LFQFP, QFP100,.63SQ,20	QFP100,.63SQ,20	SQUARE	FLATPACK, LOW PROFILE, FINE PITCH	Active	-	Active	40	5.24	Details	Yes	-	-	2.75 V	2.25 V	2.5 V	-	Actel	-	0.023175 oz	0°C ~ 70°C (TA)	Tray	A54SX08A	e3	-	Matte Tin (Sn)	-	-	8000 TYPICAL GATES AVAILABLE	8542.39.00.01	CMOS	2.25V ~ 5.25V	QUAD	GULL WING	260	0.5 mm	compliant	-	-	S-PQFP-G100	127	Not Qualified	2.5 V	2.5,3.3/5 V	COMMERCIAL	-	-	-	-	-	-	-	127	768 CLBS, 12000 GATES	1.6 mm	FIELD PROGRAMMABLE GATE ARRAY	-	-	12000	-	768	-	-	-	-	1.1 ns	768	768	12000	1.4 mm	14 mm	14 mm	-
A54SX08A-1TQG100 Microchip Technology RoHS : Инкапсуляция : - Есть складские запасы : - 1 : -
	Mfr. Тип M1A3PE1500-1FGG676I Anlielectronics Тип	Microchip Technology	FPGA - Field Programmable Gate Array M1A3PE1500-1FGG676I Сборник данных Сравнение	Min.:1 Mult.:1	-	-	Surface Mount	FBGA	YES	-	676-FBGA (27x27)	-	676	M1A3PE1500	350 MHz	-	-	-	-	40	MICROSEMI CORP	M1A3PE1500-1FGG676I	272 MHz	1.575 V	+ 85 C	Microchip Technology	1.425 V	- 40 C	Yes	3	SMD/SMT	444 I/O	-	-	85 °C	-40 °C	Tray	PLASTIC/EPOXY	BGA	BGA, BGA676,26X26,40	BGA676,26X26,40	SQUARE	GRID ARRAY	Active	-	Active	40	5.3	Details	Yes	-	This product may require additional documentation to export from the United States.	1.575 V	1.425 V	1.5 V	-	ProASIC3	1.5000 V	0.014110 oz	-40 to 85 °C	Tray	M1A3PE1500	e1	-	Tin/Silver/Copper (Sn/Ag/Cu)	-	-	-	8542.39.00.01	CMOS	1.425V ~ 1.575V	BOTTOM	BALL	250	1 mm	compliant	-	-	S-PBGA-B676	444	Not Qualified	1.5 V	1.5/3.3 V	INDUSTRIAL	-	-	-	-	-	-	-	444	38400 CLBS, 1500000 GATES	2.44 mm	FIELD PROGRAMMABLE GATE ARRAY	-	276480	1500000	-	-	-	1	-	-	-	38400	38400	1500000	1.73 mm	27 mm	27 mm	-
M1A3PE1500-1FGG676I Microchip Technology RoHS : Инкапсуляция : - Есть складские запасы : - 1 : -
	Mfr. Тип M2GL090T-1FGG676 Anlielectronics Тип	Microchip Technology	FPGA - Field Programmable Gate Array M2GL090T-1FGG676 Сборник данных Сравнение	Min.:1 Mult.:1	Production (Last Updated: 2 months ago)	-	Surface Mount	FPBGA-676	-	676	676-FBGA (27x27)	-	-	M2GL090	-	-	-	-	-	40	-	-	-	1.26 V	+ 85 C	Microchip Technology	1.14 V	0 C	Yes	-	SMD/SMT	425 I/O	-	86184 LE	-	-	Tray	-	-	-	-	-	-	-	-	Active	-	-	Details	-	-	This product may require additional documentation to export from the United States.	1.2 V	1.2 V	-	-	IGLOO2	1.2000 V	-	0 to 85 °C	Tray	M2GL090T	-	-	-	85 °C	0 °C	-	-	-	1.14V ~ 2.625V	-	-	-	-	-	-	-	-	-	-	1.2 V	-	-	-	-	-	323.3 kB	-	-	-	-	-	-	-	86316	2648064	-	-	-	-	1	4 Transceiver	-	-	-	-	-	-	-	-	-
M2GL090T-1FGG676 Microchip Technology RoHS : Инкапсуляция : - Есть складские запасы : - 1 : -
	Mfr. Тип M2GL010TS-1VF256I Anlielectronics Тип	Microchip Technology	FPGA - Field Programmable Gate Array M2GL010TS-1VF256I Сборник данных Сравнение	Min.:1 Mult.:1	-	-	Surface Mount	VFPBGA-256	YES	-	256-FPBGA (14x14)	-	256	M2GL010	-	-	-	-	-	119	MICROSEMI CORP	M2GL010TS-1VF256I	-	-	+ 100 C	Microchip Technology	-	- 40 C	Yes	-	SMD/SMT	138 I/O	-	12084 LE	-	-	Tray	PLASTIC/EPOXY	LFBGA	14 X 14 MM, 0.80 MM PITCH, VFBGA-256	-	SQUARE	GRID ARRAY, LOW PROFILE, FINE PITCH	Active	-	Active	20	5.27	N	No	-	This product may require additional documentation to export from the United States.	1.2 V	1.2 V	1.2 V	-	IGLOO2	-	-	-40°C ~ 100°C (TJ)	Tray	M2GL010TS	-	-	-	-	-	-	8542.39.00.01	-	1.14V ~ 2.625V	BOTTOM	BALL	240	0.8 mm	compliant	-	-	S-PBGA-B256	-	-	1.2 V	-	-	-	-	-	-	-	-	-	-	-	1.56 mm	FIELD PROGRAMMABLE GATE ARRAY	12084	933888	-	-	-	-	-	2 Transceiver	-	-	-	-	-	-	14 mm	14 mm	-
M2GL010TS-1VF256I Microchip Technology RoHS : Инкапсуляция : - Есть складские запасы : - 1 : -
	Mfr. Тип AX2000-2FG896I Anlielectronics Тип	Microchip Technology	FPGA - Field Programmable Gate Array AX2000-2FG896I Сборник данных Сравнение	Min.:1 Mult.:1	Production (Last Updated: 2 months ago)	Surface Mount	Surface Mount	FBGA	YES	896	896-FBGA (31x31)	400.011771 mg	896	AX2000	870 MHz	-	-	-	-	27	MICROSEMI CORP	AX2000-2FG896I	870 MHz	-	+ 85 C	Microchip Technology	-	- 40 C	Yes	3	SMD/SMT	586 I/O	-	-	85 °C	-40 °C	Tray	PLASTIC/EPOXY	BGA	BGA, BGA896,30X30,40	BGA896,30X30,40	SQUARE	GRID ARRAY	Active	-	Active	30	5.26	N	No	8542390000, 8542390000/8542390000, 8542390000/8542390000/8542390000, 8542390000/8542390000/8542390000/8542390000	This product may require additional documentation to export from the United States.	1.575 V	1.425 V	1.5 V	-	Actel	-	0.014110 oz	-40°C ~ 85°C (TA)	Tray	AX2000	e0	-	TIN LEAD	85 °C	-40 °C	2000000 SYSTEM GATES AVAILABLE	8542.39.00.01	CMOS	1.425V ~ 1.575V	BOTTOM	BALL	225	1 mm	unknown	870 MHz	-	S-PBGA-B896	684	Not Qualified	1.5 V	1.5,1.5/3.3,2.5/3.3 V	INDUSTRIAL	1.575 V	1.425 V	-	36 kB	740 ps	740 ps	-	684	21504 CLBS, 2000000 GATES	2.44 mm	FIELD PROGRAMMABLE GATE ARRAY	21504	294912	2000000	870 MHz	32256	21504	2	-	21504	0.74 ns	21504	32256	2000000	1.73 mm	31 mm	31 mm	No
AX2000-2FG896I Microchip Technology RoHS : Инкапсуляция : - Есть складские запасы : - 1 : -
	Mfr. Тип AFS600-2FG256 Anlielectronics Тип	Microchip Technology	FPGA - Field Programmable Gate Array AFS600-2FG256 Сборник данных Сравнение	Min.:1 Mult.:1	Production (Last Updated: 2 months ago)	Surface Mount	Surface Mount	FBGA	-	256	256-FPBGA (17x17)	400.011771 mg	-	AFS600	-	-	-	-	-	90	-	-	1470.59 MHz	-	+ 70 C	Microchip Technology	-	0 C	Yes	-	SMD/SMT	119 I/O	-	7000 LE	-	-	Tray	-	-	-	-	-	-	-	-	Active	-	-	N	-	-	This product may require additional documentation to export from the United States.	1.575 V	1.425 V	-	-	Fusion	-	0.014110 oz	0°C ~ 85°C (TJ)	Tray	AFS600	-	-	-	70 °C	0 °C	-	-	-	1.425V ~ 1.575V	-	-	-	-	-	-	-	-	-	-	1.5 V	-	-	1.575 V	1.425 V	-	13.5 kB	-	-	-	-	-	-	-	-	110592	600000	1.47059 GHz	-	-	2	-	13824	-	-	-	-	1.2 mm	17 mm	17 mm	No
AFS600-2FG256 Microchip Technology RoHS : Инкапсуляция : - Есть складские запасы : - 1 : -
	Mfr. Тип AFS600-2FG484 Anlielectronics Тип	Microchip Technology	FPGA - Field Programmable Gate Array AFS600-2FG484 Сборник данных Сравнение	Min.:1 Mult.:1	Production (Last Updated: 2 months ago)	Surface Mount	Surface Mount	FBGA	-	484	484-FPBGA (23x23)	400.011771 mg	-	AFS600	-	-	-	-	-	60	-	-	1470.59 MHz	-	+ 70 C	Microchip Technology	-	0 C	Yes	-	SMD/SMT	172 I/O	-	7000 LE	-	-	Tray	-	-	-	-	-	-	-	-	Active	-	-	N	-	-	This product may require additional documentation to export from the United States.	1.575 V	1.425 V	-	-	Fusion	-	0.014110 oz	0°C ~ 85°C (TJ)	Tray	AFS600	-	-	-	70 °C	0 °C	-	-	-	1.425V ~ 1.575V	-	-	-	-	-	-	-	-	-	-	1.5 V	-	-	1.575 V	1.425 V	-	13.5 kB	-	-	-	-	-	-	-	-	110592	600000	1.47059 GHz	-	-	2	-	13824	-	-	-	-	1.73 mm	23 mm	23 mm	No
AFS600-2FG484 Microchip Technology RoHS : Инкапсуляция : - Есть складские запасы : - 1 : -
	Mfr. Тип M1A3PE1500-2FGG484I Anlielectronics Тип	Microchip Technology	FPGA - Field Programmable Gate Array M1A3PE1500-2FGG484I Сборник данных Сравнение	Min.:1 Mult.:1	-	-	Surface Mount	FBGA	YES	-	484-FPBGA (23x23)	-	484	M1A3PE1500	350 MHz	-	-	-	-	60	MICROSEMI CORP	M1A3PE1500-2FGG484I	310 MHz	-	+ 85 C	Microchip Technology	-	- 40 C	Yes	3	SMD/SMT	280 I/O	-	-	85 °C	-40 °C	Tray	PLASTIC/EPOXY	BGA	23 X 23 MM, 2.23 MM HEIGHT, 1 MM PITCH, GREEN, FBGA-484	BGA484,22X22,40	SQUARE	GRID ARRAY	Active	-	Active	40	5.3	Details	Yes	-	This product may require additional documentation to export from the United States.	1.575 V	1.425 V	1.5 V	-	ProASIC3	-	0.014110 oz	-40°C ~ 100°C (TJ)	Tray	M1A3PE1500	e1	-	Tin/Silver/Copper (Sn/Ag/Cu)	-	-	-	8542.39.00.01	CMOS	1.425V ~ 1.575V	BOTTOM	BALL	250	1 mm	compliant	-	-	S-PBGA-B484	280	Not Qualified	1.5 V	1.5/3.3 V	INDUSTRIAL	-	-	-	-	-	-	-	280	38400 CLBS, 1500000 GATES	2.44 mm	FIELD PROGRAMMABLE GATE ARRAY	-	276480	1500000	-	-	-	2	-	-	-	38400	38400	1500000	1.73 mm	23 mm	23 mm	-
M1A3PE1500-2FGG484I Microchip Technology RoHS : Инкапсуляция : - Есть складские запасы : - 1 : -
	Mfr. Тип M1A3P250-2FG144 Anlielectronics Тип	Microchip Technology	FPGA - Field Programmable Gate Array M1A3P250-2FG144 Сборник данных Сравнение	Min.:1 Mult.:1	-	-	Surface Mount	FBGA	YES	-	144-FPBGA (13x13)	-	144	M1A3P250	350 MHz	-	-	-	-	160	MICROSEMI CORP	M1A3P250-2FG144	310 MHz	-	+ 70 C	Microchip Technology	-	0 C	Yes	3	SMD/SMT	97 I/O	-	-	85 °C	-	Tray	PLASTIC/EPOXY	LBGA	13X 13 MM, 1.45 MM HEIGHT, 1 MM PITCH, FBGA-144	-	SQUARE	GRID ARRAY, LOW PROFILE	Active	-	Active	30	5.24	N	No	-	-	1.575 V	1.425 V	1.5 V	-	ProASIC3	1.5000 V	0.014110 oz	0 to 70 °C	Tray	M1A3P250	e0	-	Tin/Lead/Silver (Sn/Pb/Ag)	-	-	-	8542.39.00.01	CMOS	1.425V ~ 1.575V	BOTTOM	BALL	225	1 mm	compliant	-	-	S-PBGA-B144	-	Not Qualified	1.5 V	-	COMMERCIAL	-	-	-	-	-	-	-	-	6144 CLBS, 250000 GATES	1.55 mm	FIELD PROGRAMMABLE GATE ARRAY	-	36864	250000	-	-	-	2	-	-	-	6144	-	250000	1.05 mm	13 mm	13 mm	-
M1A3P250-2FG144 Microchip Technology RoHS : Инкапсуляция : - Есть складские запасы : - 1 : -
	Mfr. Тип AFS600-1FG256I Anlielectronics Тип	Microchip Technology	FPGA - Field Programmable Gate Array AFS600-1FG256I Сборник данных Сравнение	Min.:1 Mult.:1	Production (Last Updated: 2 months ago)	Surface Mount	Surface Mount	FBGA	-	256	256-FPBGA (17x17)	400.011771 mg	-	AFS600	-	-	-	-	-	90	-	-	1282.05 MHz	-	+ 85 C	Microchip Technology	-	- 40 C	Yes	-	SMD/SMT	119 I/O	-	7000 LE	-	-	Tray	-	-	-	-	-	-	-	-	Active	-	-	N	-	-	This product may require additional documentation to export from the United States.	1.575 V	1.425 V	-	-	Fusion	-	0.014110 oz	-40°C ~ 100°C (TJ)	Tray	AFS600	-	-	-	85 °C	-40 °C	-	-	-	1.425V ~ 1.575V	-	-	-	-	-	-	-	-	-	-	1.5 V	-	-	1.575 V	1.425 V	-	13.5 kB	-	-	-	-	-	-	-	-	110592	600000	1.28205 GHz	-	-	1	-	13824	-	-	-	-	1.2 mm	17 mm	17 mm	No
AFS600-1FG256I Microchip Technology RoHS : Инкапсуляция : - Есть складские запасы : - 1 : -
	Mfr. Тип M1A3PE1500-2FGG676 Anlielectronics Тип	Microchip Technology	FPGA - Field Programmable Gate Array M1A3PE1500-2FGG676 Сборник данных Сравнение	Min.:1 Mult.:1	-	-	Surface Mount	FBGA	YES	-	676-FBGA (27x27)	-	676	M1A3PE1500	350 MHz	-	-	-	-	40	MICROSEMI CORP	M1A3PE1500-2FGG676	310 MHz	1.575 V	+ 70 C	Microchip Technology	1.425 V	0 C	Yes	3	SMD/SMT	444 I/O	-	-	70 °C	-	Tray	PLASTIC/EPOXY	BGA	27 X 27 MM, 2.23 MM HEIGHT, 1 MM PITCH, GREEN, FBGA-676	BGA676,26X26,40	SQUARE	GRID ARRAY	Active	-	Active	40	5.3	Details	Yes	-	This product may require additional documentation to export from the United States.	1.575 V	1.425 V	1.5 V	-	ProASIC3	1.5000 V	0.014110 oz	0 to 70 °C	Tray	M1A3PE1500	e1	-	Tin/Silver/Copper (Sn/Ag/Cu)	-	-	-	8542.39.00.01	CMOS	1.425V ~ 1.575V	BOTTOM	BALL	250	1 mm	compliant	-	-	S-PBGA-B676	444	Not Qualified	1.5 V	1.5/3.3 V	COMMERCIAL	-	-	-	-	-	-	-	444	38400 CLBS, 1500000 GATES	2.44 mm	FIELD PROGRAMMABLE GATE ARRAY	-	276480	1500000	-	-	-	2	-	-	-	38400	38400	1500000	1.73 mm	27 mm	27 mm	-
M1A3PE1500-2FGG676 Microchip Technology RoHS : Инкапсуляция : - Есть складские запасы : - 1 : -
	Mfr. Тип AFS600-1FGG256K Anlielectronics Тип	Microchip Technology	FPGA - Field Programmable Gate Array AFS600-1FGG256K Сборник данных Сравнение	Min.:1 Mult.:1	Production (Last Updated: 2 months ago)	Surface Mount	Surface Mount	256-LBGA	-	256	256-FPBGA (17x17)	-	-	AFS600	-	-	-	-	-	90	-	-	-	-	-	Microchip Technology	-	-	Yes	-	-	119	-	7000 LE	-	-	Tray	-	-	-	-	-	-	-	-	Active	-	-	Details	-	-	This product may require additional documentation to export from the United States.	-	-	-	-	Fusion	-	-	-55°C ~ 100°C (TJ)	Tray	AFS600	-	-	-	100 °C	-55 °C	-	-	-	1.425V ~ 1.575V	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	13.5 kB	-	-	-	-	-	-	-	-	110592	600000	-	-	-	-	-	-	-	-	-	-	-	-	-	-
AFS600-1FGG256K Microchip Technology RoHS : Инкапсуляция : - Есть складские запасы : - 1 : -
	Mfr. Тип M2GL090-FCSG325I Anlielectronics Тип	Microchip Technology	FPGA - Field Programmable Gate Array M2GL090-FCSG325I Сборник данных Сравнение	Min.:1 Mult.:1	-	-	Surface Mount	FCBGA-325	YES	-	325-FCBGA (11x11)	-	325	M2GL090	-	-	-	-	-	176	MICROSEMI CORP	M2GL090-FCSG325I	-	-	+ 100 C	Microchip Technology	-	- 40 C	Yes	3	SMD/SMT	180 I/O	-	86184 LE	-	-	Tray	PLASTIC	-	, BGA325,21X21,20	BGA325,21X21,20	-	-	Active	-	Active	-	5.3	Details	Yes	-	This product may require additional documentation to export from the United States.	1.2 V	1.2 V	1.2 V	-	IGLOO2	-	-	-40°C ~ 100°C (TJ)	Tray	M2GL090	-	-	-	-	-	-	8542.39.00.01	CMOS	1.14V ~ 2.625V	-	-	-	-	compliant	-	-	-	180	Not Qualified	1.2 V	1.2 V	-	-	-	-	-	-	-	-	180	-	-	FIELD PROGRAMMABLE GATE ARRAY	86184	2648064	-	-	-	-	-	-	-	-	-	86316	-	-	-	-	-
M2GL090-FCSG325I Microchip Technology RoHS : Инкапсуляция : - Есть складские запасы : - 1 : -

Integrated Circuits (ICs)

Embedded - FPGAs (Field Programmable Gate Array) definition: A field-programmable gate array (FPGA) is an integrated circuit designed to be configured by a customer or a designer after manufacturing. I... Embedded - FPGAs (Field Programmable Gate Array) Product Listing: M7A3P1000-FGG484,AFS1500-1FG256,AX2000-2FGG896,A3P1000-1FG256M,M1A3P400-2FG256.Integrated Circuits (ICs) type:Embedded - Microcontrollers(129432),Memory(111901),PMIC - Supervisors(101743),PMIC - Voltage Regulators - Linear(101187),PMIC - Voltage Regulators - DC DC Switching Regulators(62822) .Embedded - FPGAs (Field Programmable Gate Array) has 5152 pieces of spot stock price information, you can click the "RFQ" button to confirm the inventory and price with the Anli.

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Integrated Circuits (ICs)