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![]() | Mfr. ТипM1AFS600-1FG484KAnlielectronics Тип | Microchip Technology |
FPGA - Field Programmable Gate Array M1AFS600-1FG484K
Сборник данных
Сравнение
| Min.:1 Mult.:1 | - | - | Surface Mount | 484-BGA | YES | - | 484-FPBGA (23x23) | - | 484 | M1AFS600 | 350 MHz | 60 | MICROSEMI CORP | M1AFS600-1FG484K | - | - | - | - | Microchip Technology | - | - | Yes | 3 | - | 172 | - | - | - | - | Tray | PLASTIC/EPOXY | BGA | - | BGA484,22X22,40 | SQUARE | GRID ARRAY | Active | Active | 20 | 5.87 | N | No | - | This product may require additional documentation to export from the United States. | - | - | - | Fusion | - | - | - | -55°C ~ 100°C (TJ) | Tray | M1AFS600 | e0 | - | Tin/Lead (Sn/Pb) | - | - | - | 8542.39.00.01 | CMOS | 1.425V ~ 1.575V | BOTTOM | BALL | 225 | 1 mm | compliant | - | - | S-PBGA-B484 | 172 | Not Qualified | - | 1.5,3.3 V | - | - | - | - | - | - | - | - | 172 | - | - | FIELD PROGRAMMABLE GATE ARRAY | - | 110592 | 600000 | - | - | - | - | - | - | - | - | - | 13824 | - | - | - | - | - | - | ||
| M1AFS600-1FG484K | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | Mfr. ТипAGL1000V2-FG256Anlielectronics Тип | Microchip Technology |
FPGA - Field Programmable Gate Array AGL1000V2-FG256
Сборник данных
Сравнение
| Min.:1 Mult.:1 | - | - | Surface Mount | FBGA | YES | - | 256-FPBGA (17x17) | - | 256 | AGL1000 | 108 MHz | 90 | MICROSEMI CORP | AGL1000V2-FG256 | 526.32 MHz, 892.86 MHz | 1.575 V | + 70 C | - | Microchip Technology | 1.14 V | 0 C | Yes | 3 | SMD/SMT | 177 I/O | - | 11000 LE | 85 °C | - | Tray | PLASTIC/EPOXY | BGA | BGA, | - | SQUARE | GRID ARRAY | Active | Active | 30 | 5.26 | N | No | - | This product may require additional documentation to export from the United States. | 1.575 V | 1.14 V | 1.2 V | IGLOOe | 1.2, 1.5 V | 0.014110 oz | - | 0 to 70 °C | Tray | AGL1000V2 | e0 | - | Tin/Lead/Silver (Sn/Pb/Ag) | - | - | - | 8542.39.00.01 | CMOS | 1.14V ~ 1.575V | BOTTOM | BALL | 230 | 1 mm | unknown | - | - | S-PBGA-B256 | - | Not Qualified | 1.2 V to 1.5 V | - | OTHER | - | - | - | - | - | - | - | - | 24576 CLBS, 1000000 GATES | 1.8 mm | FIELD PROGRAMMABLE GATE ARRAY | 24576 | 147456 | 1000000 | - | - | - | - | STD | - | - | 24576 | - | - | - | 1000000 | 1.2 mm | 17 mm | 17 mm | - | ||
| AGL1000V2-FG256 | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | Mfr. ТипAPA1000-FG896IAnlielectronics Тип | Microchip Technology |
FPGA - Field Programmable Gate Array APA1000-FG896I ProAsic Plus
Сборник данных
Сравнение
| Min.:1 Mult.:1 | - | - | Surface Mount | FBGA | YES | - | 896-FBGA (31x31) | - | 896 | APA1000 | 180 MHz | 27 | MICROSEMI CORP | APA1000-FG896I | 180 MHz | 2.7 V | + 85 C | - | Microchip Technology | 2.3 V | - 40 C | Yes | 3 | SMD/SMT | 642 I/O | - | - | 85 °C | -40 °C | Tray | PLASTIC/EPOXY | BGA | BGA, BGA896,30X30,40 | BGA896,30X30,40 | SQUARE | GRID ARRAY | Active | Active | 30 | 5.26 | N | No | - | This product may require additional documentation to export from the United States. | 2.7 V | 2.3 V | 2.5 V | Actel | 2.5000 V | 0.014110 oz | - | -40 to 85 °C | Tray | APA1000 | e0 | 3A001.A.7.A | TIN LEAD | - | - | - | 8542.39.00.01 | CMOS | 2.3V ~ 2.7V | BOTTOM | BALL | 225 | 1 mm | unknown | - | 896 | S-PBGA-B896 | 642 | Not Qualified | 2.5 V | 2.5,2.5/3.3 V | INDUSTRIAL | - | - | - | - | - | - | - | 642 | 1000000 GATES | 2.44 mm | FIELD PROGRAMMABLE GATE ARRAY | - | 202752 | 1000000 | - | - | - | - | STD | - | - | - | - | 56320 | - | 1000000 | 1.73 mm | 31 mm | 31 mm | - | ||
| APA1000-FG896I | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | Mfr. ТипAGL600V5-CS281Anlielectronics Тип | Microchip Technology |
FPGA - Field Programmable Gate Array AGL600V5-CS281
Сборник данных
Сравнение
| Min.:1 Mult.:1 | - | - | Surface Mount | CSP | YES | - | 281-CSP (10x10) | - | 281 | AGL600 | 108 MHz | 184 | MICROSEMI CORP | AGL600V5-CS281 | 250 MHz | 1.575 V | + 70 C | - | Microchip Technology | 1.425 V | 0 C | Yes | - | SMD/SMT | 215 I/O | - | - | 85 °C | - | Tray | PLASTIC/EPOXY | TFBGA | TFBGA, | - | SQUARE | GRID ARRAY, THIN PROFILE, FINE PITCH | Active | Active | NOT SPECIFIED | 5.26 | N | No | - | This product may require additional documentation to export from the United States. | 1.575 V | 1.425 V | 1.5 V | IGLOOe | 1.5000 V | - | - | 0 to 70 °C | Tray | AGL600V5 | - | - | - | - | - | - | 8542.39.00.01 | CMOS | 1.425V ~ 1.575V | BOTTOM | BALL | NOT SPECIFIED | 0.5 mm | unknown | - | 281 | S-PBGA-B281 | - | Not Qualified | 1.5 V | - | OTHER | - | - | - | 30 uA | - | - | - | - | 13824 CLBS, 600000 GATES | 1.05 mm | FIELD PROGRAMMABLE GATE ARRAY | 13824 | 110592 | 600000 | - | - | - | - | STD | - | - | 13824 | - | - | - | 600000 | 0.71 mm | 10 mm | 10 mm | - | ||
| AGL600V5-CS281 | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | Mfr. ТипA54SX72A-1FG256IAnlielectronics Тип | Microchip Technology |
FPGA - Field Programmable Gate Array A54SX72A-1FG256I
Сборник данных
Сравнение
| Min.:1 Mult.:1 | - | - | Surface Mount | FBGA | YES | - | 256-FPBGA (17x17) | - | 256 | A54SX72 | 250 MHz | 90 | MICROSEMI CORP | A54SX72A-1FG256I | 250 MHz | - | + 85 C | - | Microchip Technology | - | - 40 C | Yes | 3 | SMD/SMT | 203 I/O | - | - | 85 °C | -40 °C | Tray | PLASTIC/EPOXY | BGA | BGA, BGA256,16X16,40 | BGA256,16X16,40 | SQUARE | GRID ARRAY | Active | Active | 30 | 5.24 | N | No | - | - | 2.75 V | 2.25 V | 2.5 V | Actel | - | 0.014110 oz | - | -40°C ~ 85°C (TA) | Tray | A54SX72A | e0 | - | TIN LEAD/TIN LEAD SILVER | - | - | 72000 TYPICAL GATES AVAILABLE | 8542.39.00.01 | CMOS | 2.25V ~ 5.25V | BOTTOM | BALL | 225 | 1 mm | unknown | - | - | S-PBGA-B256 | 203 | Not Qualified | 2.5 V | 2.5,3.3/5 V | INDUSTRIAL | - | - | - | - | - | - | - | 203 | 6036 CLBS, 108000 GATES | 1.97 mm | FIELD PROGRAMMABLE GATE ARRAY | - | - | 108000 | - | 6036 | - | - | - | - | 1.3 ns | 6036 | - | 6036 | - | 108000 | 1.2 mm | 17 mm | 17 mm | - | ||
| A54SX72A-1FG256I | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | Mfr. ТипAFS600-1FG256KAnlielectronics Тип | Microchip Technology |
FPGA - Field Programmable Gate Array AFS600-1FG256K
Сборник данных
Сравнение
| Min.:1 Mult.:1 | Production (Last Updated: 2 months ago) | Surface Mount | Surface Mount | 256-LBGA | YES | 256 | 256-FPBGA (17x17) | - | 256 | AFS600 | - | 90 | MICROSEMI CORP | AFS600-1FG256K | - | - | - | - | Microchip Technology | - | - | Yes | 3 | - | 119 | - | 7000 LE | 100 °C | -55 °C | Tray | PLASTIC/EPOXY | LBGA | LBGA, | - | SQUARE | GRID ARRAY, LOW PROFILE | Active | Active | 20 | 5.29 | N | No | 8542320050, 8542390000, 8542390000/8542390000, 8542390000/8542390000/8542390000 | This product may require additional documentation to export from the United States. | 1.575 V | 1.425 V | 1.5 V | Fusion | - | - | - | -55°C ~ 100°C (TJ) | Tray | AFS600 | e0 | - | Tin/Lead (Sn/Pb) | 100 °C | -55 °C | - | 8542.39.00.01 | CMOS | 1.425V ~ 1.575V | BOTTOM | BALL | 225 | 1 mm | unknown | - | - | S-PBGA-B256 | - | Not Qualified | - | - | OTHER | - | - | - | - | 13.5 kB | - | - | - | 600000 GATES | 1.7 mm | FIELD PROGRAMMABLE GATE ARRAY | - | 110592 | 600000 | - | - | - | - | - | - | - | - | - | - | - | 600000 | - | 17 mm | 17 mm | - | ||
| AFS600-1FG256K | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | Mfr. ТипM1AFS600-FG484IAnlielectronics Тип | Microchip Technology |
FPGA - Field Programmable Gate Array M1AFS600-FG484I
Сборник данных
Сравнение
| Min.:1 Mult.:1 | Production (Last Updated: 1 month ago) | Surface Mount | Surface Mount | FBGA | YES | 484 | 484-FPBGA (23x23) | 400.011771 mg | 484 | M1AFS600 | - | 60 | MICROSEMI CORP | M1AFS600-FG484I | 1098.9 MHz | - | + 85 C | - | Microchip Technology | - | - 40 C | Yes | 3 | SMD/SMT | 172 I/O | - | - | 85 °C | -40 °C | Tray | PLASTIC/EPOXY | BGA | BGA, | - | SQUARE | GRID ARRAY | Active | Active | 30 | 5.3 | N | No | - | This product may require additional documentation to export from the United States. | 1.575 V | 1.425 V | 1.5 V | Fusion | - | 0.014110 oz | - | -40°C ~ 100°C (TJ) | Tray | M1AFS600 | e0 | - | Tin/Lead (Sn/Pb) | 85 °C | -40 °C | - | 8542.39.00.01 | CMOS | 1.425V ~ 1.575V | BOTTOM | BALL | 225 | 1 mm | compliant | 1.0989 GHz | - | S-PBGA-B484 | - | Not Qualified | 1.5 V | - | INDUSTRIAL | 1.575 V | 1.425 V | - | - | 13.5 kB | - | - | - | 13824 CLBS, 600000 GATES | 2.44 mm | FIELD PROGRAMMABLE GATE ARRAY | - | 110592 | 600000 | 1.0989 GHz | - | - | - | STD | 13824 | - | 13824 | - | - | - | 600000 | 1.73 mm | 23 mm | 23 mm | No | ||
| M1AFS600-FG484I | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | Mfr. ТипA3PE3000-1FGG484Anlielectronics Тип | Microchip Technology |
FPGA - Field Programmable Gate Array A3PE3000-1FGG484 LEAD FREE
Сборник данных
Сравнение
| Min.:1 Mult.:1 | Production (Last Updated: 2 months ago) | Surface Mount | Surface Mount | FBGA | YES | 484 | 484-FPBGA (23x23) | 400.011771 mg | 484 | A3PE3000 | - | 60 | MICROSEMI CORP | A3PE3000-1FGG484 | 272 MHz | 1.575 V | + 70 C | FLASH | Microchip Technology | 1.425 V | 0 C | Yes | 3 | SMD/SMT | 341 I/O | - | - | 70 °C | - | Tray | PLASTIC/EPOXY | BGA | BGA, | - | SQUARE | GRID ARRAY | Active | Active | 40 | 5.3 | Details | Yes | - | This product may require additional documentation to export from the United States. | 1.575 V | 1.425 V | 1.5 V | ProASIC3 | 1.5000 V | 0.014110 oz | - | 0 to 70 °C | Tray | A3PE3000 | e1 | - | Tin/Silver/Copper (Sn/Ag/Cu) | 70 °C | 0 °C | - | 8542.39.00.01 | CMOS | 1.425V ~ 1.575V | BOTTOM | BALL | 250 | 1 mm | compliant | 272 MHz | - | S-PBGA-B484 | - | Not Qualified | 1.5 V | - | COMMERCIAL | 1.575 V | 1.425 V | 128 B | - | 63 kB | - | - | - | 75264 CLBS, 3000000 GATES | 2.44 mm | FIELD PROGRAMMABLE GATE ARRAY | 35000 | 516096 | 3000000 | 272 MHz | - | - | - | 1 | 75264 | - | 75264 | 85 °C | - | 70 °C | 3000000 | 1.73 mm | 23 mm | 23 mm | No | ||
| A3PE3000-1FGG484 | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | Mfr. ТипAX2000-CQ352MAnlielectronics Тип | Microchip Technology |
FPGA - Field Programmable Gate Array AX2000-CQ352M
Сборник данных
Сравнение
| Min.:1 Mult.:1 | Production (Last Updated: 2 months ago) | Surface Mount | Surface Mount | CQFP | YES | 352 | 352-CQFP (75x75) | 10.567001 g | 352 | AX2000 | 649 MHz | 1 | MICROSEMI CORP | AX2000-CQ352M | 649 MHz | - | + 125 C | - | Microchip Technology | - | - 55 C | Yes | - | SMD/SMT | 198 I/O | - | - | 125 °C | -55 °C | Tray | CERAMIC, METAL-SEALED COFIRED | GQFF | GQFF, TPAK352,2.9SQ,20 | TPAK352,2.9SQ,20 | SQUARE | FLATPACK, GUARD RING | Active | Active | 20 | 5.3 | N | No | - | This product may require additional documentation to export from the United States. | 1.575 V | 1.425 V | 1.5 V | Actel | - | 0.372740 oz | Military grade | -55°C ~ 125°C (TA) | - | AX2000 | e0 | 3A001.A.2.C | Tin/Lead (Sn/Pb) | 125 °C | -55 °C | 2000000 SYSTEM GATES AVAILABLE | 8542.39.00.01 | CMOS | 1.425V ~ 1.575V | QUAD | FLAT | 225 | 0.5 mm | unknown | 649 MHz | - | S-CQFP-F352 | 684 | Not Qualified | 1.5 V | 1.5,1.5/3.3,2.5/3.3 V | MILITARY | 1.575 V | 1.425 V | - | - | 36 kB | 990 ps | 990 ps | 684 | 21504 CLBS, 2000000 GATES | 2.89 mm | FIELD PROGRAMMABLE GATE ARRAY | 21504 | 294912 | 2000000 | 649 MHz | 32256 | MIL-STD-883 Class B | 21504 | - | 21504 | 0.99 ns | 21504 | - | 32256 | - | 2000000 | 2.66 mm | 48 mm | 48 mm | No | ||
| AX2000-CQ352M | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | Mfr. ТипA54SX32A-1CQ256MAnlielectronics Тип | Microchip Technology |
FPGA - Field Programmable Gate Array A54SX32A-1CQ256M
Сборник данных
Сравнение
| Min.:1 Mult.:1 | - | - | Surface Mount | CQFP-256 | YES | - | 256-CQFP (75x75) | - | 256 | A54SX32 | 278 MHz | 1 | MICROSEMI CORP | A54SX32A-1CQ256M | 278 MHz | - | + 125 C | - | Microchip Technology | - | - 55 C | - | - | SMD/SMT | 249 I/O | - | - | 125 °C | -55 °C | Tray | CERAMIC, METAL-SEALED COFIRED | QFF | QFF, TPAK256,3SQ,20 | TPAK256,3SQ,20 | SQUARE | FLATPACK | Active | Active | 20 | 5.24 | N | No | - | This product may require additional documentation to export from the United States. | 2.5 V | 2.5 V | 2.5 V | Actel | - | - | - | -55°C ~ 125°C (TC) | - | A54SX32A | e0 | 3A001.A.2.C | TIN LEAD | - | - | 32000 TYPICAL GATES AVAILABLE | 8542.39.00.01 | CMOS | 2.25V ~ 5.25V | QUAD | FLAT | 225 | 0.5 mm | unknown | - | - | S-CQFP-F256 | 228 | Not Qualified | 2.5 V | 2.5,3.3/5 V | MILITARY | - | - | - | - | - | - | - | 228 | 2880 CLBS, 48000 GATES | 3.3 mm | FIELD PROGRAMMABLE GATE ARRAY | - | - | 48000 | - | 2880 | - | - | - | - | 1.1 ns | 2880 | - | 2880 | - | 48000 | - | 36 mm | 36 mm | - | ||
| A54SX32A-1CQ256M | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | Mfr. ТипAPA1000-FG896MAnlielectronics Тип | Microchip Technology |
FPGA - Field Programmable Gate Array APA1000-FG896M
Сборник данных
Сравнение
| Min.:1 Mult.:1 | - | - | Surface Mount | FBGA | YES | - | 896-FBGA (31x31) | - | 896 | APA1000 | 180 MHz | 27 | MICROSEMI CORP | APA1000-FG896M | 180 MHz | - | + 125 C | - | Microchip Technology | - | - 55 C | Yes | 3 | SMD/SMT | 642 I/O | - | - | 125 °C | -55 °C | Tray | PLASTIC/EPOXY | BGA | BGA, BGA896,30X30,40 | BGA896,30X30,40 | SQUARE | GRID ARRAY | Active | Active | 30 | 5.3 | N | No | - | This product may require additional documentation to export from the United States. | 2.7 V | 2.3 V | 2.5 V | Actel | - | 0.014110 oz | - | -55°C ~ 125°C (TC) | Tray | APA1000 | e0 | 3A001.A.2.C | Tin/Lead (Sn/Pb) | - | - | - | 8542.39.00.01 | CMOS | 2.3V ~ 2.7V | BOTTOM | BALL | 225 | 1 mm | unknown | - | - | S-PBGA-B896 | 642 | Not Qualified | 2.5 V | 2.5,2.5/3.3 V | MILITARY | - | - | - | - | - | - | - | 642 | 1000000 GATES | 2.44 mm | FIELD PROGRAMMABLE GATE ARRAY | - | 202752 | 1000000 | - | - | - | - | - | - | - | - | - | 56320 | - | 1000000 | 1.73 mm | 31 mm | 31 mm | - | ||
| APA1000-FG896M | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | Mfr. ТипA40MX04-1PLG68MAnlielectronics Тип | Microchip Technology |
FPGA - Field Programmable Gate Array A40MX04-1PLG68M LEAD FREE
Сборник данных
Сравнение
| Min.:1 Mult.:1 | - | - | Surface Mount | PLCC-68 | YES | - | 68-PLCC (24.23x24.23) | - | 68 | A40MX04 | 48 MHz | 19 | MICROSEMI CORP | A40MX04-1PLG68M | 160 MHz | - | + 125 C | - | Microchip Technology | - | - 55 C | Yes | 3 | SMD/SMT | 57 I/O | - | - | 125 °C | -55 °C | Tray | PLASTIC/EPOXY | QCCJ | QCCJ, | - | SQUARE | CHIP CARRIER | Active | Active | 40 | 5.29 | Details | Yes | - | This product may require additional documentation to export from the United States. | 5.5 V | 3 V | 3.3 V | Actel | - | 0.171777 oz | - | -55°C ~ 125°C (TC) | Tube | A40MX04 | e3 | 3A001.A.2.C | Matte Tin (Sn) | - | - | ALSO OPERATES AT 5V SUPPLY | 8542.39.00.01 | CMOS | 3V ~ 3.6V, 4.5V ~ 5.5V | QUAD | J BEND | 245 | 1.27 mm | compliant | - | - | S-PQCC-J68 | - | Not Qualified | 3.3 V, 5 V | - | MILITARY | - | - | - | - | - | - | - | - | 547 CLBS, 6000 GATES | 4.572 mm | FIELD PROGRAMMABLE GATE ARRAY | - | - | 6000 | - | - | - | - | - | - | 2.3 ns | 547 | - | - | - | 6000 | 3.68 mm | 24.23 mm | 24.23 mm | - | ||
| A40MX04-1PLG68M | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | Mfr. ТипA3PE3000-2FGG484IAnlielectronics Тип | Microchip Technology |
FPGA - Field Programmable Gate Array A3PE3000-2FGG484I LEAD FREE
Сборник данных
Сравнение
| Min.:1 Mult.:1 | Production (Last Updated: 2 months ago) | Surface Mount | Surface Mount | FBGA | YES | 484 | 484-FPBGA (23x23) | 400.011771 mg | 484 | A3PE3000 | - | 60 | MICROSEMI CORP | A3PE3000-2FGG484I | 310 MHz | 1.575 V | + 85 C | - | Microchip Technology | 1.425 V | - 40 C | Yes | 3 | SMD/SMT | 341 I/O | - | - | 85 °C | -40 °C | Tray | PLASTIC/EPOXY | BGA | BGA, | - | SQUARE | GRID ARRAY | Active | Active | 40 | 5.3 | Details | Yes | - | This product may require additional documentation to export from the United States. | 1.575 V | 1.425 V | 1.5 V | ProASIC3 | 1.5000 V | 0.014110 oz | - | -40 to 85 °C | Tray | A3PE3000 | e1 | 3A001.A.7.A | Tin/Silver/Copper (Sn/Ag/Cu) | 85 °C | -40 °C | - | 8542.39.00.01 | CMOS | 1.425V ~ 1.575V | BOTTOM | BALL | 250 | 1 mm | compliant | 310 MHz | - | S-PBGA-B484 | - | Not Qualified | 1.5 V | - | INDUSTRIAL | 1.575 V | 1.425 V | - | - | 63 kB | - | - | - | 75264 CLBS, 3000000 GATES | 2.44 mm | FIELD PROGRAMMABLE GATE ARRAY | - | 516096 | 3000000 | 310 MHz | - | - | - | 2 | 75264 | - | 75264 | - | 75264 | - | 3000000 | 1.73 mm | 23 mm | 23 mm | No | ||
| A3PE3000-2FGG484I | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | Mfr. ТипM1AFS600-2FGG256IAnlielectronics Тип | Microchip Technology |
FPGA - Field Programmable Gate Array M1AFS600-2FGG256I
Сборник данных
Сравнение
| Min.:1 Mult.:1 | Production (Last Updated: 1 month ago) | Surface Mount | Surface Mount | FBGA | YES | 256 | 256-FPBGA (17x17) | 400.011771 mg | 256 | M1AFS600 | - | 90 | MICROSEMI CORP | M1AFS600-2FGG256I | 1470.59 MHz | - | + 85 C | - | Microchip Technology | - | - 40 C | Yes | 3 | SMD/SMT | 119 I/O | - | - | 85 °C | -40 °C | Tray | PLASTIC/EPOXY | LBGA | FBGA-256 | - | SQUARE | GRID ARRAY, LOW PROFILE | Active | Active | 40 | 5.3 | Details | Yes | - | This product may require additional documentation to export from the United States. | 1.575 V | 1.425 V | 1.5 V | Fusion | - | 0.014110 oz | - | -40°C ~ 100°C (TJ) | Tray | M1AFS600 | e1 | - | Tin/Silver/Copper (Sn/Ag/Cu) | 85 °C | -40 °C | - | 8542.39.00.01 | CMOS | 1.425V ~ 1.575V | BOTTOM | BALL | 260 | 1 mm | compliant | - | - | S-PBGA-B256 | - | Not Qualified | 1.5 V | - | INDUSTRIAL | 1.575 V | 1.425 V | - | - | 13.5 kB | - | - | - | 600000 GATES | 1.7 mm | FIELD PROGRAMMABLE GATE ARRAY | - | 110592 | 600000 | 1.47059 GHz | - | - | - | 2 | 13824 | - | - | - | - | - | 600000 | 1.2 mm | 17 mm | 17 mm | No | ||
| M1AFS600-2FGG256I | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | Mfr. ТипA54SX16A-TQG100MAnlielectronics Тип | Microchip Technology |
FPGA - Field Programmable Gate Array A54SX16A-TQG100M LEAD FREE
Сборник данных
Сравнение
| Min.:1 Mult.:1 | - | - | Surface Mount | TQFP-100 | - | - | 100-TQFP (14x14) | - | - | A54SX16 | - | 90 | - | - | - | - | + 125 C | - | Microchip Technology | - | - 55 C | Yes | - | SMD/SMT | 81 I/O | 1452 LAB | - | - | - | Tray | - | - | - | - | - | - | - | Active | - | - | Details | - | - | This product may require additional documentation to export from the United States. | 2.75 V | 2.25 V | - | Actel | - | 0.023175 oz | - | -55°C ~ 125°C (TC) | Tray | A54SX16A | - | - | - | - | - | - | - | - | 2.25V ~ 5.25V | - | - | - | - | - | - | - | - | - | - | 2.25 V to 5.25 V | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | 24000 | - | 1452 | - | - | - | - | - | - | - | - | - | - | 1.4 mm | 14 mm | 14 mm | - | ||
| A54SX16A-TQG100M | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | Mfr. ТипP1AFS600-2FGG256IAnlielectronics Тип | Microchip Technology |
FPGA - Field Programmable Gate Array P1AFS600-2FGG256I
Сборник данных
Сравнение
| Min.:1 Mult.:1 | - | - | Surface Mount | 256-LBGA | - | - | 256-FPBGA (17x17) | - | - | P1AFS600 | - | 90 | - | - | - | - | - | - | Microchip Technology | - | - | Yes | - | - | 119 | - | - | - | - | Tray | - | - | - | - | - | - | - | Active | - | - | Details | - | - | This product may require additional documentation to export from the United States. | - | - | - | Fusion | - | - | - | -40°C ~ 100°C (TJ) | Tray | P1AFS600 | - | - | - | - | - | - | - | - | 1.425V ~ 1.575V | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | 110592 | 600000 | - | - | - | - | 2 | - | - | - | - | - | - | - | - | - | - | - | ||
| P1AFS600-2FGG256I | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | Mfr. ТипA42MX24-2TQG176IAnlielectronics Тип | Microchip Technology |
FPGA - Field Programmable Gate Array A42MX24-2TQG176I LEAD FREE
Сборник данных
Сравнение
| Min.:1 Mult.:1 | Production (Last Updated: 2 months ago) | Surface Mount | Surface Mount | TQFP-176 | YES | 176 | 176-TQFP (24x24) | - | 176 | A42MX24 | 114.75 MHz | 40 | MICROSEMI CORP | A42MX24-2TQG176I | - | - | + 85 C | - | Microchip Technology | - | - 40 C | Yes | 3 | SMD/SMT | 150 I/O | - | - | 85 °C | -40 °C | Tray | PLASTIC/EPOXY | LFQFP | LFQFP, | - | SQUARE | FLATPACK, LOW PROFILE, FINE PITCH | Active | Active | NOT SPECIFIED | 5.28 | Details | Yes | - | - | 5.5 V | 3 V | 3.3 V | Actel | - | - | - | -40°C ~ 85°C (TA) | Tray | A42MX24 | - | - | - | 85 °C | -40 °C | ALSO OPERATES AT 5V SUPPLY | 8542.39.00.01 | CMOS | 3V ~ 3.6V, 4.5V ~ 5.5V | QUAD | GULL WING | NOT SPECIFIED | 0.5 mm | compliant | - | - | S-PQFP-G176 | - | Not Qualified | 3.3 V, 5 V | - | INDUSTRIAL | 5.5 V | 3 V | - | - | - | - | - | - | 1890 CLBS, 36000 GATES | 1.6 mm | FIELD PROGRAMMABLE GATE ARRAY | 912 | - | 36000 | - | - | - | 912 | 2 | 1410 | 1.8 ns | 1890 | - | - | - | 36000 | 1.4 mm | 24 mm | 24 mm | No | ||
| A42MX24-2TQG176I | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | Mfr. ТипM1A3P1000-1FG144IAnlielectronics Тип | Microchip Technology |
FPGA - Field Programmable Gate Array M1A3P1000-1FG144I
Сборник данных
Сравнение
| Min.:1 Mult.:1 | - | - | Surface Mount | FBGA | YES | - | 144-FPBGA (13x13) | - | 144 | M1A3P1000 | 350 MHz | 160 | MICROSEMI CORP | M1A3P1000-1FG144I | 272 MHz | 1.575 V | + 85 C | - | Microchip Technology | 1.425 V | - 40 C | Yes | 3 | SMD/SMT | 97 I/O | - | - | 100 °C | -40 °C | Tray | PLASTIC/EPOXY | LBGA | LBGA, | - | SQUARE | GRID ARRAY, LOW PROFILE | Active | Active | 30 | 5.23 | N | No | - | This product may require additional documentation to export from the United States. | 1.575 V | 1.425 V | 1.5 V | ProASIC3 | 1.5000 V | 0.014110 oz | - | -40 to 85 °C | Tray | M1A3P1000 | e0 | - | Tin/Lead/Silver (Sn/Pb/Ag) | - | - | - | 8542.39.00.01 | CMOS | 1.425V ~ 1.575V | BOTTOM | BALL | 225 | 1 mm | compliant | - | - | S-PBGA-B144 | - | Not Qualified | 1.5 V | - | INDUSTRIAL | - | - | - | - | - | - | - | - | 24576 CLBS, 1000000 GATES | 1.55 mm | FIELD PROGRAMMABLE GATE ARRAY | - | 147456 | 1000000 | - | - | - | - | 1 | - | - | 24576 | - | - | - | 1000000 | - | 13 mm | 13 mm | - | ||
| M1A3P1000-1FG144I | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | Mfr. ТипAFS1500-1FGG256KAnlielectronics Тип | Microchip Technology |
FPGA - Field Programmable Gate Array AFS1500-1FGG256K
Сборник данных
Сравнение
| Min.:1 Mult.:1 | Production (Last Updated: 2 months ago) | Surface Mount | Surface Mount | 256-LBGA | - | 256 | 256-FPBGA (17x17) | - | - | AFS1500 | - | 90 | - | - | - | - | - | - | Microchip Technology | - | - | Yes | - | - | 119 | - | - | - | - | Tray | - | - | - | - | - | - | - | Active | - | - | Details | - | - | This product may require additional documentation to export from the United States. | - | - | - | Fusion | - | - | - | -55°C ~ 100°C (TJ) | Tray | AFS1500 | - | - | - | 100 °C | -55 °C | - | - | - | 1.425V ~ 1.575V | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | 33.8 kB | - | - | - | - | - | - | - | 276480 | 1.5e+06 | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | ||
| AFS1500-1FGG256K | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | Mfr. ТипM1A3PE3000-FGG896Anlielectronics Тип | Microchip Technology |
FPGA - Field Programmable Gate Array M1A3PE3000-FGG896
Сборник данных
Сравнение
| Min.:1 Mult.:1 | - | - | Surface Mount | FBGA | YES | - | 896-FBGA (31x31) | - | 896 | M1A3PE3000 | 350 MHz | 27 | MICROSEMI CORP | M1A3PE3000-FGG896 | 231 MHz | 1.575 V | + 70 C | - | Microchip Technology | 1.425 V | 0 C | Yes | 3 | SMD/SMT | 620 I/O | - | - | 70 °C | - | Tray | PLASTIC/EPOXY | BGA | 31 X 31 MM, 2.23 MM HEIGHT, 1 MM PITCH, GREEN, FBGA-896 | BGA896,30X30,40 | SQUARE | GRID ARRAY | Active | Active | 40 | 5.3 | Details | Yes | - | This product may require additional documentation to export from the United States. | 1.575 V | 1.425 V | 1.5 V | ProASIC3 | 1.5000 V | 0.014110 oz | - | 0 to 70 °C | Tray | M1A3PE3000 | e1 | - | Tin/Silver/Copper (Sn/Ag/Cu) | - | - | - | 8542.39.00.01 | CMOS | 1.425V ~ 1.575V | BOTTOM | BALL | 250 | 1 mm | compliant | - | 896 | S-PBGA-B896 | 620 | Not Qualified | 1.5 V | 1.5/3.3 V | COMMERCIAL | - | - | - | - | - | - | - | 620 | 75264 CLBS, 3000000 GATES | 2.44 mm | FIELD PROGRAMMABLE GATE ARRAY | - | 516096 | 3000000 | - | - | - | - | STD | - | - | 75264 | - | 75264 | - | 3000000 | 1.73 mm | 31 mm | 31 mm | - | ||
| M1A3PE3000-FGG896 |
Индекс :
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