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| Изображение | Тип | Марка | Объяснение | Установленная цена | Количество | RoHS | Factory Lead Time | Mounting Type | Package / Case | Number of Pins | Supplier Device Package | Memory Types | Number of I/Os | Operating Temperature | Packaging | Published | Series | Part Status | Moisture Sensitivity Level (MSL) | Max Operating Temperature | Min Operating Temperature | Frequency | Interface | Max Supply Voltage | Min Supply Voltage | Memory Size | Oscillator Type | Speed | RAM Size | Voltage - Supply (Vcc/Vdd) | Core Processor | Program Memory Type | Core Size | Program Memory Size | Connectivity | Core Architecture | Speed Grade | REACH SVHC | RoHS Status |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
  | Mfr. ТипXS1-L6A-64-LQ64-I5Anlielectronics Тип | XMOS |
IC MCU 32BIT 64KB SRAM 64LQFP
Сборник данных
Сравнение
| Min.:1 Mult.:1 | 12 Weeks | Surface Mount | 64-LQFP Exposed Pad | 64 | - | - | 36 | -40°C~85°C TA | Tray | 2014 | XS1 | Active | 3 (168 Hours) | - | - | - | - | - | - | - | External | - | 64kB | 0.95V~3.6V | XCore | SRAM | 32-Bit 6-Core | 64KB 16K x 32 | Configurable | - | 500 MIPS | - | ROHS3 Compliant | ||
| XS1-L6A-64-LQ64-I5 | |||||||||||||||||||||||||||||||||||||||
 | Mfr. ТипXS1-L6A-64-TQ128-I5Anlielectronics Тип | XMOS |
IC MCU 32BIT 64KB SRAM 128TQFP
Сборник данных
Сравнение
| Min.:1 Mult.:1 | 12 Weeks | Surface Mount | 128-TQFP Exposed Pad | 128 | 128-TQFP (14x14) | - | 64 | -40°C~85°C TA | Tray | 2014 | XS1 | Active | 3 (168 Hours) | 85°C | -40°C | - | - | - | - | - | External | 500MIPS | 64kB | 0.95V~3.6V | XCore | SRAM | 32-Bit 6-Core | 64KB 16K x 32 | Configurable | - | 500 MIPS | - | ROHS3 Compliant | ||
| XS1-L6A-64-TQ128-I5 | |||||||||||||||||||||||||||||||||||||||
 | Mfr. ТипXS1-L12A-128-QF124-I8Anlielectronics Тип | XMOS |
IC MCU 32BIT 128KB SRAM 124QFN
Сборник данных
Сравнение
| Min.:1 Mult.:1 | 12 Weeks | Surface Mount | 124-TFQFN Dual Rows, Exposed Pad | 124 | 124-QFN DualRow (10x10) | - | 84 | -40°C~85°C TA | Tray | 2014 | XS1 | Active | 3 (168 Hours) | 85°C | -40°C | - | - | - | - | - | External | 800MIPS | 128kB | 0.95V~3.6V | XCore | SRAM | 32-Bit 12-Core | 128KB 32K x 32 | Configurable | - | 800 MIPS | - | ROHS3 Compliant | ||
| XS1-L12A-128-QF124-I8 | |||||||||||||||||||||||||||||||||||||||
| | Mfr. ТипXS1-L12A-128-QF124-C8Anlielectronics Тип | XMOS |
IC Mcu 32 Bit 128KB SRAM 124QFN
Сборник данных
Сравнение
| Min.:1 Mult.:1 | 12 Weeks | Surface Mount | 124-TFQFN Dual Rows, Exposed Pad | 124 | - | - | 84 | 0°C~70°C TA | Tray | 2014 | XS1 | Active | 3 (168 Hours) | - | - | - | - | - | - | - | External | - | 128kB | 0.95V~3.6V | XCore | SRAM | 32-Bit 12-Core | 128KB 32K x 32 | Configurable | - | 800 MIPS | - | ROHS3 Compliant | ||
| XS1-L12A-128-QF124-C8 | |||||||||||||||||||||||||||||||||||||||
| | Mfr. ТипXS1-L6A-64-LQ64-I4Anlielectronics Тип | XMOS |
IC MCU 32BIT 64KB SRAM 64LQFP
Сборник данных
Сравнение
| Min.:1 Mult.:1 | 12 Weeks | Surface Mount | 64-LQFP Exposed Pad | 64 | 64-LQFP (10x10) | - | 36 | -40°C~85°C TA | Tray | 2014 | XS1 | Active | 3 (168 Hours) | 85°C | -40°C | - | - | - | - | - | External | 400MIPS | 64kB | 0.95V~3.6V | XCore | SRAM | 32-Bit 6-Core | 64KB 16K x 32 | Configurable | - | 400 MIPS | - | ROHS3 Compliant | ||
| XS1-L6A-64-LQ64-I4 | |||||||||||||||||||||||||||||||||||||||
| | Mfr. ТипXS1-L8A-128-QF124-I8Anlielectronics Тип | XMOS |
IC MCU 32BIT 128KB SRAM 124QFN
Сборник данных
Сравнение
| Min.:1 Mult.:1 | 12 Weeks | Surface Mount | 124-TFQFN Dual Rows, Exposed Pad | 124 | 124-QFN DualRow (10x10) | - | 84 | -40°C~85°C TA | Tray | 2014 | XS1 | Active | 3 (168 Hours) | 85°C | -40°C | - | - | - | - | - | External | 800MIPS | 128kB | 0.95V~3.6V | XCore | SRAM | 32-Bit 8-Core | 128KB 32K x 32 | Configurable | - | 800 MIPS | - | ROHS3 Compliant | ||
| XS1-L8A-128-QF124-I8 | |||||||||||||||||||||||||||||||||||||||
 | Mfr. ТипXLF208-128-TQ64-C10Anlielectronics Тип | XMOS |
IC MCU 32BIT 1MB FLASH 64TQFP
Сборник данных
Сравнение
| Min.:1 Mult.:1 | 12 Weeks | Surface Mount | 64-TQFP Exposed Pad | 64 | - | - | 42 | 0°C~70°C TA | Tray | 2015 | XLF | Active | 3 (168 Hours) | - | - | 500MHz | - | - | - | 1MB | External | - | 128K x 8 | 0.95V~3.6V | XCore | FLASH | 32-Bit 8-Core | 1MB 1M x 8 | - | - | - | Unknown | ROHS3 Compliant | ||
| XLF208-128-TQ64-C10 | |||||||||||||||||||||||||||||||||||||||
| | Mfr. ТипXU216-256-TQ128-C20Anlielectronics Тип | XMOS |
IC MCU 32BIT ROMLESS 128TQFP
Сборник данных
Сравнение
| Min.:1 Mult.:1 | 12 Weeks | Surface Mount | 128-TQFP Exposed Pad | - | 128-TQFP (14x14) | ROMless | 81 | 0°C~70°C TA | Tray | 2015 | XU | Active | 3 (168 Hours) | 70°C | 0°C | - | USB | - | - | - | External | 2000MIPS | 256K x 8 | 0.95V~3.6V | XCore | ROMless | 32-Bit 16-Core | - | USB | XCore | - | - | ROHS3 Compliant | ||
| XU216-256-TQ128-C20 | |||||||||||||||||||||||||||||||||||||||
 | Mfr. ТипXU216-512-FB236-I20Anlielectronics Тип | XMOS |
IC MCU 32BIT ROMLESS 236FBGA
Сборник данных
Сравнение
| Min.:1 Mult.:1 | 12 Weeks | Surface Mount | 236-LFBGA | 236 | - | - | 104 | -40°C~85°C TA | Tray | 2015 | XU | Active | 3 (168 Hours) | - | - | - | - | - | - | - | External | 2000MIPS | 512K x 8 | 0.95V~3.6V | XCore | ROMless | 32-Bit 16-Core | - | USB | - | - | - | ROHS3 Compliant | ||
| XU216-512-FB236-I20 | |||||||||||||||||||||||||||||||||||||||
| | Mfr. ТипXL208-128-TQ64-C10Anlielectronics Тип | XMOS |
IC MCU 32BIT ROMLESS 64TQFP
Сборник данных
Сравнение
| Min.:1 Mult.:1 | 12 Weeks | Surface Mount | 64-TQFP Exposed Pad | 64 | - | - | 42 | 0°C~70°C TA | Tray | 2015 | XL | Active | 3 (168 Hours) | - | - | 500MHz | - | - | - | 128kB | External | - | 128K x 8 | 0.95V~3.6V | XCore | ROMless | 32-Bit 8-Core | - | - | - | - | Unknown | ROHS3 Compliant | ||
| XL208-128-TQ64-C10 | |||||||||||||||||||||||||||||||||||||||
| | Mfr. ТипXL210-256-FB236-I20Anlielectronics Тип | XMOS |
IC MCU 32BIT ROMLESS 236FBGA
Сборник данных
Сравнение
| Min.:1 Mult.:1 | 12 Weeks | Surface Mount | 236-LFBGA | 236 | 236-FBGA (10x10) | ROMless | 128 | -40°C~85°C TA | Tray | 2015 | XL | Active | 3 (168 Hours) | 85°C | -40°C | - | - | - | - | - | External | 2000MIPS | 256K x 8 | 0.95V~3.6V | XCore | ROMless | 32-Bit 10-Core | - | - | XCore | - | - | ROHS3 Compliant | ||
| XL210-256-FB236-I20 | |||||||||||||||||||||||||||||||||||||||
| | Mfr. ТипXL216-512-FB236-C20Anlielectronics Тип | XMOS |
IC MCU 32BIT ROMLESS 236FBGA
Сборник данных
Сравнение
| Min.:1 Mult.:1 | 12 Weeks | Surface Mount | 236-LFBGA | 236 | 236-FBGA (10x10) | ROMless | 128 | 0°C~70°C TA | Tray | 2015 | XL | Active | 3 (168 Hours) | 70°C | 0°C | - | - | - | - | - | External | 2000MIPS | 512K x 8 | 0.95V~3.6V | XCore | ROMless | 32-Bit 16-Core | - | - | XCore | - | - | ROHS3 Compliant | ||
| XL216-512-FB236-C20 | |||||||||||||||||||||||||||||||||||||||
 | Mfr. ТипXL224-512-FB374-I40Anlielectronics Тип | XMOS |
IC MCU 32BIT ROMLESS 374FBGA
Сборник данных
Сравнение
| Min.:1 Mult.:1 | 12 Weeks | Surface Mount | 374-LFBGA | 374 | 374-FBGA (18x18) | ROMless | 176 | -40°C~85°C TA | Tray | - | XL | Active | 3 (168 Hours) | 85°C | -40°C | - | - | - | - | - | External | 4000MIPS | 512K x 8 | 0.95V~3.6V | XCore | ROMless | 32-Bit 24-Core | - | - | XCore | - | - | ROHS3 Compliant | ||
| XL224-512-FB374-I40 | |||||||||||||||||||||||||||||||||||||||
| | Mfr. ТипXL216-512-FB236-I20Anlielectronics Тип | XMOS |
IC MCU 32BIT ROMLESS 236FBGA
Сборник данных
Сравнение
| Min.:1 Mult.:1 | 12 Weeks | Surface Mount | 236-LFBGA | 236 | 236-FBGA (10x10) | ROMless | 128 | -40°C~85°C TA | Tray | 2015 | XL | Active | 3 (168 Hours) | 85°C | -40°C | - | - | - | - | - | External | 2000MIPS | 512K x 8 | 0.95V~3.6V | XCore | ROMless | 32-Bit 16-Core | - | - | XCore | - | - | ROHS3 Compliant | ||
| XL216-512-FB236-I20 | |||||||||||||||||||||||||||||||||||||||
| | Mfr. ТипXL232-1024-FB374-I40Anlielectronics Тип | XMOS |
IC MCU 32BIT ROMLESS 374FBGA
Сборник данных
Сравнение
| Min.:1 Mult.:1 | 12 Weeks | Surface Mount | 374-LFBGA | 374 | 374-FBGA (18x18) | ROMless | 176 | -40°C~85°C TA | Tray | - | XL | Active | 3 (168 Hours) | 85°C | -40°C | - | - | - | - | - | External | 4000MIPS | 1M x 8 | 0.95V~3.6V | XCore | ROMless | 32-Bit 24-Core | - | - | XCore | - | - | ROHS3 Compliant | ||
| XL232-1024-FB374-I40 | |||||||||||||||||||||||||||||||||||||||
| | Mfr. ТипXLF212-256-FB236-C20Anlielectronics Тип | XMOS |
IC MCU 32BIT 2MB FLASH 236FBGA
Сборник данных
Сравнение
| Min.:1 Mult.:1 | 12 Weeks | Surface Mount | 236-LFBGA | 236 | 236-FBGA (10x10) | FLASH | 128 | 0°C~70°C TA | Tray | 2015 | XLF | Active | 3 (168 Hours) | 70°C | 0°C | - | - | - | - | 2MB | External | 2000MIPS | 256K x 8 | 0.95V~3.6V | XCore | FLASH | 32-Bit 12-Core | 2MB 2M x 8 | - | XCore | - | - | ROHS3 Compliant | ||
| XLF212-256-FB236-C20 | |||||||||||||||||||||||||||||||||||||||
| | Mfr. ТипXEF232-512-FB374-C40Anlielectronics Тип | XMOS |
XMOS XEF232-512-FB374-C40 32Core 32 Bit MCU, RISC Architecture, SRAM 512KB, 2MB Internal Flash, 1000 MPIS, JTAG, USB, FBGA-374
Сборник данных
Сравнение
| Min.:1 Mult.:1 | - | Surface Mount | 374-LFBGA | 374 | 374-FBGA (18x18) | FLASH | 176 | 0°C~70°C TA | Tray | 2001 | XEF | Discontinued | 3 (168 Hours) | 70°C | 0°C | 500MHz | USB | 1.05V | 950mV | 2MB | External | 4000MIPS | 512K x 8 | 0.95V~3.6V | XCore | FLASH | 32-Bit 32-Core | 2MB 2M x 8 | RGMII, USB | XCore | - | Unknown | ROHS3 Compliant | ||
| XEF232-512-FB374-C40 | |||||||||||||||||||||||||||||||||||||||
| | Mfr. ТипXL208-256-TQ128-C10Anlielectronics Тип | XMOS |
IC MCU 32BIT ROMLESS 128TQFP
Сборник данных
Сравнение
| Min.:1 Mult.:1 | 12 Weeks | Surface Mount | 128-TQFP Exposed Pad | - | 128-TQFP (14x14) | ROMless | 88 | 0°C~70°C TA | Tray | 2015 | XL | Active | 3 (168 Hours) | 70°C | 0°C | - | - | - | - | - | External | 1000MIPS | 256K x 8 | 0.95V~3.6V | XCore | ROMless | 32-Bit 8-Core | - | - | XCore | - | - | ROHS3 Compliant | ||
| XL208-256-TQ128-C10 | |||||||||||||||||||||||||||||||||||||||
| | Mfr. ТипXL232-1024-FB374-C40Anlielectronics Тип | XMOS |
IC MCU 32BIT ROMLESS 374FBGA
Сборник данных
Сравнение
| Min.:1 Mult.:1 | 12 Weeks | Surface Mount | 374-LFBGA | 374 | 374-FBGA (18x18) | ROMless | 176 | 0°C~70°C TA | Tray | - | XL | Active | 3 (168 Hours) | 70°C | 0°C | - | - | - | - | - | External | 4000MIPS | 1M x 8 | 0.95V~3.6V | XCore | ROMless | 32-Bit 24-Core | - | - | XCore | - | - | ROHS3 Compliant | ||
| XL232-1024-FB374-C40 | |||||||||||||||||||||||||||||||||||||||
| | Mfr. ТипXUF212-512-TQ128-C20Anlielectronics Тип | XMOS |
IC MCU 32BIT 2MB FLASH 128TQFP
Сборник данных
Сравнение
| Min.:1 Mult.:1 | 12 Weeks | Surface Mount | 128-TQFP Exposed Pad | - | 128-TQFP (14x14) | FLASH | 81 | 0°C~70°C TA | Tray | 2015 | XUF | Active | 3 (168 Hours) | 70°C | 0°C | - | USB | - | - | 2MB | External | 2000MIPS | 512K x 8 | 0.95V~3.6V | XCore | FLASH | 32-Bit 12-Core | 2MB 2M x 8 | USB | XCore | - | - | ROHS3 Compliant | ||
| XUF212-512-TQ128-C20 |
Индекс :
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