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| Изображение | Тип | Марка | Объяснение | Установленная цена | Количество | RoHS | Surface Mount | Number of Pins | Number of Terminals | Date Of Intro | Enclosure | For Use With | Ihs Manufacturer | Manufacturer | Manufacturer Part Number | Mfr | Moisture Sensitivity Levels | Mounting | Operating Temperature-Max | Operating Temperature-Min | Package | Package Body Material | Package Code | Package Description | Package Equivalence Code | Package Shape | Package Style | Part Life Cycle Code | Product Status | RoHS | Rohs Code | Supply Voltage-Nom | Operating Temperature | Series | Size / Dimension | JESD-609 Code | Connector Type | Terminal Finish | HTS Code | Terminal Position | Terminal Form | Peak Reflow Temperature (Cel) | Terminal Pitch | Reach Compliance Code | Time@Peak Reflow Temperature-Max (s) | JESD-30 Code | Temperature Grade | Speed | RAM Size | uPs/uCs/Peripheral ICs Type | Core Processor | Seated Height-Max | Core Architecture | Max Frequency | Bus Compatibility | Module/Board Type | Flash Size | Kit Contents | Co-Processor | IP Rating | Length | Width | Radiation Hardening |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
![]() | Mfr. ТипXCZU5CG-2LFBVB900IAnlielectronics Тип | AMD Xilinx |
Microcontroller,
Сборник данных
Сравнение
| Min.:1 Mult.:1 | YES | - | 900 | - | - | - | XILINX INC | - | - | - | 4 | - | 100 °C | -40 °C | - | PLASTIC/EPOXY | BGA | , | BGA900,30X30,40 | SQUARE | GRID ARRAY | Transferred | - | - | Yes | 0.85 V | - | - | - | e1 | - | Tin/Silver/Copper (Sn96.5Ag3.0Cu0.5) | 8542.31.00.01 | BOTTOM | BALL | 245 | 1 mm | compliant | 30 | S-PBGA-B900 | INDUSTRIAL | - | - | PROGRAMMABLE SoC | - | 2.88 mm | - | - | CAN, I2C, SPI, UART | - | - | - | - | - | 31 mm | 31 mm | - | ||
| XCZU5CG-2LFBVB900I | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | Mfr. ТипXCZU2CG-1LSBVA484IAnlielectronics Тип | AMD Xilinx |
Microprocessor Circuit,
Сборник данных
Сравнение
| Min.:1 Mult.:1 | YES | - | 484 | 2018-03-09 | - | - | XILINX INC | - | - | - | 4 | - | 100 °C | -40 °C | - | PLASTIC/EPOXY | FBGA | - | BGA484,22X22,32 | SQUARE | GRID ARRAY, FINE PITCH | Transferred | - | - | Yes | 0.85 V | - | - | - | e1 | - | Tin/Silver/Copper (Sn/Ag/Cu) | 8542.31.00.01 | BOTTOM | BALL | 250 | 0.8 mm | compliant | 30 | S-PBGA-B484 | INDUSTRIAL | - | - | PROGRAMMABLE SoC | - | 2.61 mm | - | - | CAN, I2C, SPI, UART | - | - | - | - | - | 19 mm | 19 mm | - | ||
| XCZU2CG-1LSBVA484I | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | Mfr. ТипXCZU3EG-2LSFVA625EAnlielectronics Тип | AMD Xilinx |
Microprocessor Circuit,
Сборник данных
Сравнение
| Min.:1 Mult.:1 | YES | - | 625 | 2018-03-09 | - | - | XILINX INC | - | - | - | 4 | - | 110 °C | - | - | PLASTIC/EPOXY | FBGA | - | BGA625,25X25,32 | SQUARE | GRID ARRAY, FINE PITCH | Transferred | - | - | Yes | 0.85 V | - | - | - | e1 | - | Tin/Silver/Copper (Sn/Ag/Cu) | 8542.31.00.01 | BOTTOM | BALL | 250 | 0.8 mm | compliant | 30 | S-PBGA-B625 | OTHER | - | - | PROGRAMMABLE SoC | - | 3.43 mm | - | - | CAN, I2C, SPI, UART | - | - | - | - | - | 21 mm | 21 mm | - | ||
| XCZU3EG-2LSFVA625E | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | Mfr. ТипXCZU5EV-2LSFVC784EAnlielectronics Тип | AMD Xilinx |
Microprocessor Circuit,
Сборник данных
Сравнение
| Min.:1 Mult.:1 | YES | - | 784 | 2018-03-09 | - | - | XILINX INC | - | - | - | 4 | - | 110 °C | - | - | PLASTIC/EPOXY | FBGA | - | BGA784,28X28,32 | SQUARE | GRID ARRAY, FINE PITCH | Transferred | - | - | Yes | 0.85 V | - | - | - | e1 | - | Tin/Silver/Copper (Sn96.5Ag3.0Cu0.5) | 8542.31.00.01 | BOTTOM | BALL | 250 | 0.8 mm | compliant | 30 | S-PBGA-B784 | OTHER | - | - | PROGRAMMABLE SoC | - | 3.32 mm | - | - | CAN, I2C, SPI, UART | - | - | - | - | - | 23 mm | 23 mm | - | ||
| XCZU5EV-2LSFVC784E | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | Mfr. ТипXCZU4CG-2LSFVC784EAnlielectronics Тип | AMD Xilinx |
Microprocessor Circuit,
Сборник данных
Сравнение
| Min.:1 Mult.:1 | YES | - | 784 | 2018-03-09 | - | - | XILINX INC | - | - | - | 4 | - | 110 °C | - | - | PLASTIC/EPOXY | FBGA | - | BGA784,28X28,32 | SQUARE | GRID ARRAY, FINE PITCH | Transferred | - | - | Yes | 0.85 V | - | - | - | e1 | - | TIN SILVER COPPER | 8542.31.00.01 | BOTTOM | BALL | 250 | 0.8 mm | compliant | 30 | S-PBGA-B784 | OTHER | - | - | PROGRAMMABLE SoC | - | 3.32 mm | - | - | CAN, I2C, SPI, UART | - | - | - | - | - | 23 mm | 23 mm | - | ||
| XCZU4CG-2LSFVC784E | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | Mfr. ТипXCZU7EV-1LFFVC1156IAnlielectronics Тип | AMD Xilinx |
Microprocessor Circuit,
Сборник данных
Сравнение
| Min.:1 Mult.:1 | YES | - | 1156 | 2018-03-09 | - | - | XILINX INC | - | - | - | 4 | - | 100 °C | -40 °C | - | PLASTIC/EPOXY | BGA | - | BGA1156,34X34,40 | SQUARE | GRID ARRAY | Transferred | - | - | Yes | 0.85 V | - | - | - | e1 | - | Tin/Silver/Copper (Sn/Ag/Cu) | 8542.31.00.01 | BOTTOM | BALL | 245 | 1 mm | compliant | 30 | S-PBGA-B1156 | INDUSTRIAL | - | - | PROGRAMMABLE SoC | - | 3.51 mm | - | - | CAN, I2C, SPI, UART | - | - | - | - | - | 35 mm | 35 mm | - | ||
| XCZU7EV-1LFFVC1156I | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | Mfr. ТипXCZU3CG-2LSFVC784EAnlielectronics Тип | AMD Xilinx |
Microprocessor Circuit,
Сборник данных
Сравнение
| Min.:1 Mult.:1 | YES | - | 784 | 2018-03-09 | - | - | XILINX INC | - | - | - | 4 | - | 110 °C | - | - | PLASTIC/EPOXY | FBGA | - | BGA784,28X28,32 | SQUARE | GRID ARRAY, FINE PITCH | Transferred | - | - | Yes | 0.85 V | - | - | - | e1 | - | TIN SILVER COPPER | 8542.31.00.01 | BOTTOM | BALL | 250 | 0.8 mm | compliant | 30 | S-PBGA-B784 | OTHER | - | - | PROGRAMMABLE SoC | - | 3.32 mm | - | - | CAN, I2C, SPI, UART | - | - | - | - | - | 23 mm | 23 mm | - | ||
| XCZU3CG-2LSFVC784E | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | Mfr. ТипXCF128XFTG64CESAnlielectronics Тип | Xilinx |
-
Сборник данных
Сравнение
| Min.:1 Mult.:1 | - | 64 | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | Compliant | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | No | ||
| XCF128XFTG64CES | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | Mfr. ТипSM-K26-XCL2GIAnlielectronics Тип | Xilinx |
Plug-In Module,XCK26-SFVC784-2LV-I, Kria SOM Carrier Card
Сборник данных
Сравнение
| Min.:1 Mult.:1 | - | - | - | - | FR4 | Kria SOM Carrier Card | - | Cutler Hammer, Div of Eaton Co | DG1-34087FB-C21C | AMD Xilinx | - | Panel | - | - | DG1FR4IP21 | - | - | - | - | - | - | - | Active | - | - | - | -40°C ~ 100°C (TJ) | Zynq® UltraScale+™ Kria™ | 3.030 L x 2.360 W (77.00mm x 60.00mm) | - | 2 x 240 Pin | - | - | - | - | - | - | - | - | - | - | 533MHz, 1.333GHz | 4GB | - | ARM® Cortex®-A53 | - | ARM | 400 Hz | - | FPGA Core | 16GB eMMC, 64MB QSPI | Kria K26 System-on-Module XCK26-SFVC784-2LV-I | Arm® Cortex®-R5F | IP21 | - | - | - | ||
| SM-K26-XCL2GI | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | Mfr. ТипXCZU3EG-1LSBVA484IAnlielectronics Тип | AMD Xilinx |
Microprocessor Circuit,
Сборник данных
Сравнение
| Min.:1 Mult.:1 | YES | - | 484 | 2018-03-09 | - | - | XILINX INC | - | - | - | 4 | - | 100 °C | -40 °C | - | PLASTIC/EPOXY | FBGA | - | BGA484,22X22,32 | SQUARE | GRID ARRAY, FINE PITCH | Transferred | - | - | Yes | 0.85 V | - | - | - | e1 | - | Tin/Silver/Copper (Sn/Ag/Cu) | 8542.31.00.01 | BOTTOM | BALL | 250 | 0.8 mm | compliant | 30 | S-PBGA-B484 | INDUSTRIAL | - | - | PROGRAMMABLE SoC | - | 2.61 mm | - | - | CAN, I2C, SPI, UART | - | - | - | - | - | 19 mm | 19 mm | - | ||
| XCZU3EG-1LSBVA484I | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | Mfr. ТипXCZU2CG-2LSFVC784IAnlielectronics Тип | AMD Xilinx |
Microcontroller,
Сборник данных
Сравнение
| Min.:1 Mult.:1 | YES | - | 784 | - | - | - | XILINX INC | - | - | - | 4 | - | 100 °C | -40 °C | - | PLASTIC/EPOXY | FBGA | , | BGA784,28X28,32 | SQUARE | GRID ARRAY, FINE PITCH | Transferred | - | - | Yes | 0.85 V | - | - | - | e1 | - | TIN SILVER COPPER | 8542.31.00.01 | BOTTOM | BALL | 250 | 0.8 mm | compliant | 30 | S-PBGA-B784 | INDUSTRIAL | - | - | PROGRAMMABLE SoC | - | 3.32 mm | - | - | CAN, I2C, SPI, UART | - | - | - | - | - | 23 mm | 23 mm | - | ||
| XCZU2CG-2LSFVC784I | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | Mfr. ТипXCZU7EG-2LFFVC1156EAnlielectronics Тип | AMD Xilinx |
Microprocessor Circuit,
Сборник данных
Сравнение
| Min.:1 Mult.:1 | YES | - | 1156 | 2018-03-09 | - | - | XILINX INC | - | - | - | 4 | - | 110 °C | - | - | PLASTIC/EPOXY | BGA | - | BGA1156,34X34,40 | SQUARE | GRID ARRAY | Transferred | - | - | Yes | 0.85 V | - | - | - | e1 | - | Tin/Silver/Copper (Sn/Ag/Cu) | 8542.31.00.01 | BOTTOM | BALL | 245 | 1 mm | compliant | 30 | S-PBGA-B1156 | OTHER | - | - | PROGRAMMABLE SoC | - | 3.51 mm | - | - | CAN, I2C, SPI, UART | - | - | - | - | - | 35 mm | 35 mm | - | ||
| XCZU7EG-2LFFVC1156E | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | Mfr. ТипXCZU11EG-2LFFVC1156EAnlielectronics Тип | AMD Xilinx |
Description: Microprocessor Circuit,
Сборник данных
Сравнение
| Min.:1 Mult.:1 | YES | - | 1156 | 2018-03-09 | - | - | XILINX INC | - | - | - | 4 | - | 110 °C | - | - | PLASTIC/EPOXY | BGA | - | BGA1156,34X34,40 | SQUARE | GRID ARRAY | Transferred | - | - | Yes | 0.85 V | - | - | - | e1 | - | Tin/Silver/Copper (Sn/Ag/Cu) | 8542.31.00.01 | BOTTOM | BALL | 245 | 1 mm | compliant | 30 | S-PBGA-B1156 | OTHER | - | - | PROGRAMMABLE SoC | - | 3.51 mm | - | - | CAN, I2C, SPI, UART | - | - | - | - | - | 35 mm | 35 mm | - | ||
| XCZU11EG-2LFFVC1156E | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | Mfr. ТипXCZU9CG-2LFFVB1156EAnlielectronics Тип | AMD Xilinx |
Description: Microprocessor Circuit,
Сборник данных
Сравнение
| Min.:1 Mult.:1 | YES | - | 1156 | 2018-03-09 | - | - | XILINX INC | - | - | - | 4 | - | 110 °C | - | - | PLASTIC/EPOXY | BGA | - | BGA1156,34X34,40 | SQUARE | GRID ARRAY | Transferred | - | - | Yes | 0.85 V | - | - | - | e1 | - | Tin/Silver/Copper (Sn/Ag/Cu) | 8542.31.00.01 | BOTTOM | BALL | 245 | 1 mm | compliant | 30 | S-PBGA-B1156 | OTHER | - | - | PROGRAMMABLE SoC | - | 3.42 mm | - | - | CAN, I2C, SPI, UART | - | - | - | - | - | 35 mm | 35 mm | - | ||
| XCZU9CG-2LFFVB1156E | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | Mfr. ТипXCZU6CG-2LFFVB1156IAnlielectronics Тип | AMD Xilinx |
Microcontroller,
Сборник данных
Сравнение
| Min.:1 Mult.:1 | YES | - | 1156 | - | - | - | XILINX INC | - | - | - | - | - | 100 °C | -40 °C | - | PLASTIC/EPOXY | BGA | , | BGA1156,34X34,40 | SQUARE | GRID ARRAY | Transferred | - | - | Yes | 0.85 V | - | - | - | - | - | - | 8542.31.00.01 | BOTTOM | BALL | - | 1 mm | compliant | - | S-PBGA-B1156 | INDUSTRIAL | - | - | PROGRAMMABLE SoC | - | 3.42 mm | - | - | CAN, I2C, SPI, UART | - | - | - | - | - | 35 mm | 35 mm | - | ||
| XCZU6CG-2LFFVB1156I | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | Mfr. ТипXCZU5CG-2LSFVC784IAnlielectronics Тип | AMD Xilinx |
Description: Microcontroller,
Сборник данных
Сравнение
| Min.:1 Mult.:1 | YES | - | 784 | - | - | - | XILINX INC | - | - | - | 4 | - | 100 °C | -40 °C | - | PLASTIC/EPOXY | FBGA | , | BGA784,28X28,32 | SQUARE | GRID ARRAY, FINE PITCH | Transferred | - | - | Yes | 0.85 V | - | - | - | e1 | - | TIN SILVER COPPER | 8542.31.00.01 | BOTTOM | BALL | 250 | 0.8 mm | compliant | 30 | S-PBGA-B784 | INDUSTRIAL | - | - | PROGRAMMABLE SoC | - | 3.32 mm | - | - | CAN, I2C, SPI, UART | - | - | - | - | - | 23 mm | 23 mm | - | ||
| XCZU5CG-2LSFVC784I | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | Mfr. ТипXCZU19EG-2LFFVD1760EAnlielectronics Тип | AMD Xilinx |
Microprocessor Circuit,
Сборник данных
Сравнение
| Min.:1 Mult.:1 | YES | - | 1760 | 2018-03-09 | - | - | XILINX INC | - | - | - | 4 | - | 110 °C | - | - | PLASTIC/EPOXY | BGA | - | BGA1760,42X42,40 | SQUARE | GRID ARRAY | Transferred | - | - | Yes | 0.85 V | - | - | - | e1 | - | Tin/Silver/Copper (Sn/Ag/Cu) | 8542.31.00.01 | BOTTOM | BALL | 245 | 1 mm | compliant | 30 | S-PBGA-B1760 | OTHER | - | - | PROGRAMMABLE SoC | - | 3.71 mm | - | - | CAN, I2C, SPI, UART | - | - | - | - | - | 42.5 mm | 42.5 mm | - | ||
| XCZU19EG-2LFFVD1760E | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | Mfr. ТипXCZU19EG-1LFFVE1924IAnlielectronics Тип | AMD Xilinx |
Microprocessor Circuit,
Сборник данных
Сравнение
| Min.:1 Mult.:1 | YES | - | 1924 | 2018-03-09 | - | - | XILINX INC | - | - | - | 4 | - | 100 °C | -40 °C | - | PLASTIC/EPOXY | BGA | - | BGA1924,44X44,40 | SQUARE | GRID ARRAY | Transferred | - | - | Yes | 0.85 V | - | - | - | e1 | - | Tin/Silver/Copper (Sn/Ag/Cu) | 8542.31.00.01 | BOTTOM | BALL | 245 | 1 mm | compliant | 30 | S-PBGA-B1924 | INDUSTRIAL | - | - | PROGRAMMABLE SoC | - | 3.71 mm | - | - | CAN, I2C, SPI, UART | - | - | - | - | - | 45 mm | 45 mm | - | ||
| XCZU19EG-1LFFVE1924I | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | Mfr. ТипXCZU4CG-2LFBVB900EAnlielectronics Тип | AMD Xilinx |
Microprocessor Circuit,
Сборник данных
Сравнение
| Min.:1 Mult.:1 | YES | - | 900 | 2018-03-09 | - | - | XILINX INC | - | - | - | 4 | - | 110 °C | - | - | PLASTIC/EPOXY | BGA | - | BGA900,30X30,40 | SQUARE | GRID ARRAY | Transferred | - | - | Yes | 0.85 V | - | - | - | e1 | - | Tin/Silver/Copper (Sn96.5Ag3.0Cu0.5) | 8542.31.00.01 | BOTTOM | BALL | - | 1 mm | compliant | - | S-PBGA-B900 | OTHER | - | - | PROGRAMMABLE SoC | - | 2.88 mm | - | - | CAN, I2C, SPI, UART | - | - | - | - | - | 31 mm | 31 mm | - | ||
| XCZU4CG-2LFBVB900E | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | Mfr. ТипXCZU7CG-2LFFVC1156EAnlielectronics Тип | AMD Xilinx |
Microprocessor Circuit,
Сборник данных
Сравнение
| Min.:1 Mult.:1 | YES | - | 1156 | 2018-03-09 | - | - | XILINX INC | - | - | - | 4 | - | 110 °C | - | - | PLASTIC/EPOXY | BGA | - | BGA1156,34X34,40 | SQUARE | GRID ARRAY | Transferred | - | - | Yes | 0.85 V | - | - | - | e1 | - | Tin/Silver/Copper (Sn/Ag/Cu) | 8542.31.00.01 | BOTTOM | BALL | 245 | 1 mm | compliant | 30 | S-PBGA-B1156 | OTHER | - | - | PROGRAMMABLE SoC | - | 3.51 mm | - | - | CAN, I2C, SPI, UART | - | - | - | - | - | 35 mm | 35 mm | - | ||
| XCZU7CG-2LFFVC1156E |
Индекс :
0123456789ABCDEFGHIJKLMNOPQRSTUVWXYZ
