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| Изображение | Тип | Марка | Объяснение | Установленная цена | Количество | RoHS | Surface Mount | Number of Terminals | Date Of Intro | Ihs Manufacturer | Moisture Sensitivity Levels | Operating Temperature-Max | Operating Temperature-Min | Package Body Material | Package Code | Package Description | Package Equivalence Code | Package Shape | Package Style | Part Life Cycle Code | Rohs Code | Supply Voltage-Nom | JESD-609 Code | Terminal Finish | HTS Code | Terminal Position | Terminal Form | Peak Reflow Temperature (Cel) | Terminal Pitch | Reach Compliance Code | Time@Peak Reflow Temperature-Max (s) | JESD-30 Code | Temperature Grade | uPs/uCs/Peripheral ICs Type | Seated Height-Max | Bus Compatibility | Length | Width |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
![]() | Mfr. ТипXCZU19EG-2LFFVD1760EAnlielectronics Тип | AMD Xilinx |
Microprocessor Circuit,
Сборник данных
Сравнение
| Min.:1 Mult.:1 | YES | 1760 | 2018-03-09 | XILINX INC | 4 | 110 °C | - | PLASTIC/EPOXY | BGA | - | BGA1760,42X42,40 | SQUARE | GRID ARRAY | Transferred | Yes | 0.85 V | e1 | Tin/Silver/Copper (Sn/Ag/Cu) | 8542.31.00.01 | BOTTOM | BALL | 245 | 1 mm | compliant | 30 | S-PBGA-B1760 | OTHER | PROGRAMMABLE SoC | 3.71 mm | CAN, I2C, SPI, UART | 42.5 mm | 42.5 mm | ||
| XCZU19EG-2LFFVD1760E | ||||||||||||||||||||||||||||||||||||||
![]() | Mfr. ТипXCZU7CG-2LFFVC1156EAnlielectronics Тип | AMD Xilinx |
Microprocessor Circuit,
Сборник данных
Сравнение
| Min.:1 Mult.:1 | YES | 1156 | 2018-03-09 | XILINX INC | 4 | 110 °C | - | PLASTIC/EPOXY | BGA | - | BGA1156,34X34,40 | SQUARE | GRID ARRAY | Transferred | Yes | 0.85 V | e1 | Tin/Silver/Copper (Sn/Ag/Cu) | 8542.31.00.01 | BOTTOM | BALL | 245 | 1 mm | compliant | 30 | S-PBGA-B1156 | OTHER | PROGRAMMABLE SoC | 3.51 mm | CAN, I2C, SPI, UART | 35 mm | 35 mm | ||
| XCZU7CG-2LFFVC1156E | ||||||||||||||||||||||||||||||||||||||
![]() | Mfr. ТипXCZU6CG-2LFFVB1156IAnlielectronics Тип | AMD Xilinx |
Microcontroller,
Сборник данных
Сравнение
| Min.:1 Mult.:1 | YES | 1156 | - | XILINX INC | - | 100 °C | -40 °C | PLASTIC/EPOXY | BGA | , | BGA1156,34X34,40 | SQUARE | GRID ARRAY | Transferred | Yes | 0.85 V | - | - | 8542.31.00.01 | BOTTOM | BALL | - | 1 mm | compliant | - | S-PBGA-B1156 | INDUSTRIAL | PROGRAMMABLE SoC | 3.42 mm | CAN, I2C, SPI, UART | 35 mm | 35 mm | ||
| XCZU6CG-2LFFVB1156I | ||||||||||||||||||||||||||||||||||||||
![]() | Mfr. ТипXCZU7CG-2LFFVF1517IAnlielectronics Тип | AMD Xilinx |
Microcontroller,
Сборник данных
Сравнение
| Min.:1 Mult.:1 | YES | 1517 | - | XILINX INC | - | 100 °C | -40 °C | PLASTIC/EPOXY | BGA | , | BGA1517,39X39,40 | SQUARE | GRID ARRAY | Transferred | Yes | 0.85 V | - | - | 8542.31.00.01 | BOTTOM | BALL | - | 1 mm | compliant | - | S-PBGA-B1517 | INDUSTRIAL | PROGRAMMABLE SoC | 3.51 mm | CAN, I2C, SPI, UART | 40 mm | 40 mm | ||
| XCZU7CG-2LFFVF1517I | ||||||||||||||||||||||||||||||||||||||
![]() | Mfr. ТипXCZU9CG-1LFFVB1156IAnlielectronics Тип | AMD Xilinx |
Microprocessor Circuit,
Сборник данных
Сравнение
| Min.:1 Mult.:1 | YES | 1156 | 2018-03-09 | XILINX INC | 4 | 100 °C | -40 °C | PLASTIC/EPOXY | BGA | - | BGA1156,34X34,40 | SQUARE | GRID ARRAY | Transferred | Yes | 0.85 V | e1 | Tin/Silver/Copper (Sn/Ag/Cu) | 8542.31.00.01 | BOTTOM | BALL | 245 | 1 mm | compliant | 30 | S-PBGA-B1156 | INDUSTRIAL | PROGRAMMABLE SoC | 3.42 mm | CAN, I2C, SPI, UART | 35 mm | 35 mm | ||
| XCZU9CG-1LFFVB1156I | ||||||||||||||||||||||||||||||||||||||
![]() | Mfr. ТипXCZU6CG-1LFFVC900IAnlielectronics Тип | AMD Xilinx |
Microprocessor Circuit,
Сборник данных
Сравнение
| Min.:1 Mult.:1 | YES | 900 | 2018-03-09 | XILINX INC | 4 | 100 °C | -40 °C | PLASTIC/EPOXY | BGA | - | BGA900,30X30,40 | SQUARE | GRID ARRAY | Transferred | Yes | 0.85 V | e1 | Tin/Silver/Copper (Sn/Ag/Cu) | 8542.31.00.01 | BOTTOM | BALL | 245 | 1 mm | compliant | 30 | S-PBGA-B900 | INDUSTRIAL | PROGRAMMABLE SoC | 3.42 mm | CAN, I2C, SPI, UART | 31 mm | 31 mm | ||
| XCZU6CG-1LFFVC900I | ||||||||||||||||||||||||||||||||||||||
![]() | Mfr. ТипXCZU3CG-2LSBVA484EAnlielectronics Тип | AMD Xilinx |
Microprocessor Circuit,
Сборник данных
Сравнение
| Min.:1 Mult.:1 | YES | 484 | 2018-03-09 | XILINX INC | 4 | 110 °C | - | PLASTIC/EPOXY | FBGA | - | BGA484,22X22,32 | SQUARE | GRID ARRAY, FINE PITCH | Transferred | Yes | 0.85 V | e1 | Tin/Silver/Copper (Sn/Ag/Cu) | 8542.31.00.01 | BOTTOM | BALL | 250 | 0.8 mm | compliant | 30 | S-PBGA-B484 | OTHER | PROGRAMMABLE SoC | 2.61 mm | CAN, I2C, SPI, UART | 19 mm | 19 mm | ||
| XCZU3CG-2LSBVA484E | ||||||||||||||||||||||||||||||||||||||
![]() | Mfr. ТипXCZU6CG-2LFFVC900EAnlielectronics Тип | AMD Xilinx |
Description: Microprocessor Circuit,
Сборник данных
Сравнение
| Min.:1 Mult.:1 | YES | 900 | 2018-03-09 | XILINX INC | 4 | 110 °C | - | PLASTIC/EPOXY | BGA | - | BGA900,30X30,40 | SQUARE | GRID ARRAY | Transferred | Yes | 0.85 V | e1 | Tin/Silver/Copper (Sn/Ag/Cu) | 8542.31.00.01 | BOTTOM | BALL | 245 | 1 mm | compliant | 30 | S-PBGA-B900 | OTHER | PROGRAMMABLE SoC | 3.42 mm | CAN, I2C, SPI, UART | 31 mm | 31 mm | ||
| XCZU6CG-2LFFVC900E | ||||||||||||||||||||||||||||||||||||||
![]() | Mfr. ТипXCZU3EG-2LSFVC784IAnlielectronics Тип | AMD Xilinx |
Description: Microcontroller,
Сборник данных
Сравнение
| Min.:1 Mult.:1 | YES | 784 | - | XILINX INC | 4 | 100 °C | -40 °C | PLASTIC/EPOXY | FBGA | , | BGA784,28X28,32 | SQUARE | GRID ARRAY, FINE PITCH | Transferred | Yes | 0.85 V | e1 | TIN SILVER COPPER | 8542.31.00.01 | BOTTOM | BALL | 250 | 0.8 mm | compliant | 30 | S-PBGA-B784 | INDUSTRIAL | PROGRAMMABLE SoC | 3.32 mm | CAN, I2C, SPI, UART | 23 mm | 23 mm | ||
| XCZU3EG-2LSFVC784I | ||||||||||||||||||||||||||||||||||||||
![]() | Mfr. ТипXCZU2EG-1LSBVA484IAnlielectronics Тип | AMD Xilinx |
Description: Microprocessor Circuit,
Сборник данных
Сравнение
| Min.:1 Mult.:1 | YES | 484 | 2018-03-09 | XILINX INC | 4 | 100 °C | -40 °C | PLASTIC/EPOXY | FBGA | - | BGA484,22X22,32 | SQUARE | GRID ARRAY, FINE PITCH | Transferred | Yes | 0.85 V | e1 | Tin/Silver/Copper (Sn/Ag/Cu) | 8542.31.00.01 | BOTTOM | BALL | 250 | 0.8 mm | compliant | 30 | S-PBGA-B484 | INDUSTRIAL | PROGRAMMABLE SoC | 2.61 mm | CAN, I2C, SPI, UART | 19 mm | 19 mm | ||
| XCZU2EG-1LSBVA484I | ||||||||||||||||||||||||||||||||||||||
![]() | Mfr. ТипXCZU6EG-2LFFVB1156EAnlielectronics Тип | AMD Xilinx |
Description: Microprocessor Circuit,
Сборник данных
Сравнение
| Min.:1 Mult.:1 | YES | 1156 | 2018-03-09 | XILINX INC | 4 | 110 °C | - | PLASTIC/EPOXY | BGA | - | BGA1156,34X34,40 | SQUARE | GRID ARRAY | Transferred | Yes | 0.85 V | e1 | Tin/Silver/Copper (Sn/Ag/Cu) | 8542.31.00.01 | BOTTOM | BALL | 245 | 1 mm | compliant | 30 | S-PBGA-B1156 | OTHER | PROGRAMMABLE SoC | 3.42 mm | CAN, I2C, SPI, UART | 35 mm | 35 mm | ||
| XCZU6EG-2LFFVB1156E | ||||||||||||||||||||||||||||||||||||||
![]() | Mfr. ТипXCZU9CG-2LFFVC900EAnlielectronics Тип | AMD Xilinx |
Description: Microprocessor Circuit,
Сборник данных
Сравнение
| Min.:1 Mult.:1 | YES | 900 | 2018-03-09 | XILINX INC | 4 | 110 °C | - | PLASTIC/EPOXY | BGA | - | BGA900,30X30,40 | SQUARE | GRID ARRAY | Transferred | Yes | 0.85 V | e1 | Tin/Silver/Copper (Sn/Ag/Cu) | 8542.31.00.01 | BOTTOM | BALL | 245 | 1 mm | compliant | 30 | S-PBGA-B900 | OTHER | PROGRAMMABLE SoC | 3.42 mm | CAN, I2C, SPI, UART | 31 mm | 31 mm | ||
| XCZU9CG-2LFFVC900E | ||||||||||||||||||||||||||||||||||||||
![]() | Mfr. ТипXCZU3EG-1LSBVA484IAnlielectronics Тип | AMD Xilinx |
Microprocessor Circuit,
Сборник данных
Сравнение
| Min.:1 Mult.:1 | YES | 484 | 2018-03-09 | XILINX INC | 4 | 100 °C | -40 °C | PLASTIC/EPOXY | FBGA | - | BGA484,22X22,32 | SQUARE | GRID ARRAY, FINE PITCH | Transferred | Yes | 0.85 V | e1 | Tin/Silver/Copper (Sn/Ag/Cu) | 8542.31.00.01 | BOTTOM | BALL | 250 | 0.8 mm | compliant | 30 | S-PBGA-B484 | INDUSTRIAL | PROGRAMMABLE SoC | 2.61 mm | CAN, I2C, SPI, UART | 19 mm | 19 mm | ||
| XCZU3EG-1LSBVA484I | ||||||||||||||||||||||||||||||||||||||
![]() | Mfr. ТипXCZU2CG-2LSFVC784IAnlielectronics Тип | AMD Xilinx |
Microcontroller,
Сборник данных
Сравнение
| Min.:1 Mult.:1 | YES | 784 | - | XILINX INC | 4 | 100 °C | -40 °C | PLASTIC/EPOXY | FBGA | , | BGA784,28X28,32 | SQUARE | GRID ARRAY, FINE PITCH | Transferred | Yes | 0.85 V | e1 | TIN SILVER COPPER | 8542.31.00.01 | BOTTOM | BALL | 250 | 0.8 mm | compliant | 30 | S-PBGA-B784 | INDUSTRIAL | PROGRAMMABLE SoC | 3.32 mm | CAN, I2C, SPI, UART | 23 mm | 23 mm | ||
| XCZU2CG-2LSFVC784I | ||||||||||||||||||||||||||||||||||||||
![]() | Mfr. ТипXCZU7EG-2LFFVC1156EAnlielectronics Тип | AMD Xilinx |
Microprocessor Circuit,
Сборник данных
Сравнение
| Min.:1 Mult.:1 | YES | 1156 | 2018-03-09 | XILINX INC | 4 | 110 °C | - | PLASTIC/EPOXY | BGA | - | BGA1156,34X34,40 | SQUARE | GRID ARRAY | Transferred | Yes | 0.85 V | e1 | Tin/Silver/Copper (Sn/Ag/Cu) | 8542.31.00.01 | BOTTOM | BALL | 245 | 1 mm | compliant | 30 | S-PBGA-B1156 | OTHER | PROGRAMMABLE SoC | 3.51 mm | CAN, I2C, SPI, UART | 35 mm | 35 mm | ||
| XCZU7EG-2LFFVC1156E |
Индекс :
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