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| Изображение | Тип | Марка | Объяснение | Установленная цена | Количество | RoHS | Surface Mount | Number of Terminals | Ihs Manufacturer | Mfr | Moisture Sensitivity Levels | Operating Temperature-Max | Operating Temperature-Min | Package | Package Body Material | Package Code | Package Description | Package Equivalence Code | Package Shape | Package Style | Part Life Cycle Code | Part Package Code | Product Status | Rohs Code | Supply Voltage-Max | Supply Voltage-Min | Supply Voltage-Nom | Series | JESD-609 Code | Terminal Finish | HTS Code | Terminal Position | Terminal Form | Peak Reflow Temperature (Cel) | Terminal Pitch | Reach Compliance Code | Time@Peak Reflow Temperature-Max (s) | Pin Count | JESD-30 Code | Qualification Status | Temperature Grade | uPs/uCs/Peripheral ICs Type | Seated Height-Max | Bus Compatibility | Length | Width |
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![]() | Mfr. ТипXCZU7EV-1LFFVC1156IAnlielectronics Тип | AMD |
Description: Programmable SoC, CMOS, PBGA1156, FCBGA-1156
Сборник данных
Сравнение
| Min.:1 Mult.:1 | YES | 1156 | ADVANCED MICRO DEVICES INC | - | 4 | 100 °C | -40 °C | - | PLASTIC/EPOXY | BGA | FCBGA-1156 | BGA1156,34X34,40 | SQUARE | GRID ARRAY | Active | - | - | Yes | - | - | 0.85 V | - | e1 | TIN SILVER COPPER | - | BOTTOM | BALL | - | 1 mm | compliant | - | - | S-PBGA-B1156 | - | INDUSTRIAL | PROGRAMMABLE SoC | 3.51 mm | CAN, I2C, SPI, UART | 35 mm | 35 mm | ||
| XCZU7EV-1LFFVC1156I | ||||||||||||||||||||||||||||||||||||||||||||||
![]() | Mfr. ТипAM33C93A-20KC/WAnlielectronics Тип | AMD |
AM33C93A-SCSI BUS CONTROLLER
Сборник данных
Сравнение
| Min.:1 Mult.:1 | - | - | - | Advanced Micro Devices | - | - | - | Bulk | - | - | - | - | - | - | - | - | Active | - | - | - | - | * | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | ||
| AM33C93A-20KC/W | ||||||||||||||||||||||||||||||||||||||||||||||
![]() | Mfr. ТипXCZU3CG-2LSFVA625EAnlielectronics Тип | AMD |
Programmable SoC, CMOS, PBGA625, FCBGA-625
Сборник данных
Сравнение
| Min.:1 Mult.:1 | YES | 625 | ADVANCED MICRO DEVICES INC | - | 4 | 110 °C | - | - | PLASTIC/EPOXY | FBGA | FCBGA-625 | BGA625,25X25,32 | SQUARE | GRID ARRAY, FINE PITCH | Active | - | - | Yes | - | - | 0.85 V | - | e1 | TIN SILVER COPPER | - | BOTTOM | BALL | - | 0.8 mm | compliant | - | - | S-PBGA-B625 | - | OTHER | PROGRAMMABLE SoC | 3.43 mm | CAN, I2C, SPI, UART | 21 mm | 21 mm | ||
| XCZU3CG-2LSFVA625E | ||||||||||||||||||||||||||||||||||||||||||||||
![]() | Mfr. ТипXCZU9CG-1SBVA484EAnlielectronics Тип | AMD |
Description: Programmable SoC, CMOS, PBGA484, BGA-484
Сборник данных
Сравнение
| Min.:1 Mult.:1 | YES | 484 | ADVANCED MICRO DEVICES INC | - | 4 | 100 °C | - | - | PLASTIC/EPOXY | FBGA | BGA-484 | BGA484,22X22,32 | SQUARE | GRID ARRAY, FINE PITCH | Active | - | - | Yes | 0.876 V | 0.825 V | 0.85 V | - | e1 | TIN SILVER COPPER | - | BOTTOM | BALL | 250 | 0.8 mm | compliant | 30 | - | S-PBGA-B484 | - | OTHER | PROGRAMMABLE SoC | 2.61 mm | I2C(2), PCI, SATA, SGMII, SPI(2), UART(2), USB(2) | 19 mm | 19 mm | ||
| XCZU9CG-1SBVA484E | ||||||||||||||||||||||||||||||||||||||||||||||
![]() | Mfr. ТипXCZU7EV-1LFBVB900IAnlielectronics Тип | AMD |
Programmable SoC, CMOS, PBGA900, FCBGA-900
Сборник данных
Сравнение
| Min.:1 Mult.:1 | YES | 900 | ADVANCED MICRO DEVICES INC | - | 4 | 100 °C | -40 °C | - | PLASTIC/EPOXY | BGA | FCBGA-900 | BGA900,30X30,40 | SQUARE | GRID ARRAY | Active | - | - | Yes | - | - | 0.85 V | - | e1 | TIN SILVER COPPER | - | BOTTOM | BALL | 245 | 1 mm | compliant | 30 | - | S-PBGA-B900 | - | INDUSTRIAL | PROGRAMMABLE SoC | 2.88 mm | CAN, I2C, SPI, UART | 31 mm | 31 mm | ||
| XCZU7EV-1LFBVB900I | ||||||||||||||||||||||||||||||||||||||||||||||
![]() | Mfr. ТипAM29803ADCAnlielectronics Тип | AMD |
Description: Microprocessor Circuit, Bipolar, CDIP16, HERMETIC SEALED, CERDIP-16
Сборник данных
Сравнение
| Min.:1 Mult.:1 | NO | 16 | ADVANCED MICRO DEVICES INC | - | - | 70 °C | - | - | CERAMIC, METAL-SEALED COFIRED | DIP | DIP, DIP16,.3 | DIP16,.3 | RECTANGULAR | IN-LINE | Obsolete | DIP | - | No | 5.25 V | 4.75 V | 5 V | - | e0 | Tin/Lead (Sn/Pb) | 8542.31.00.01 | DUAL | THROUGH-HOLE | - | 2.54 mm | unknown | - | 16 | R-CDIP-T16 | Not Qualified | COMMERCIAL | MICROPROCESSOR CIRCUIT | 5.08 mm | - | 19.6215 mm | 7.62 mm | ||
| AM29803ADC | ||||||||||||||||||||||||||||||||||||||||||||||
![]() | Mfr. ТипXCZU3CG-1LSBVA484IAnlielectronics Тип | AMD |
Programmable SoC, CMOS, PBGA484, FCBGA-484
Сборник данных
Сравнение
| Min.:1 Mult.:1 | YES | 484 | ADVANCED MICRO DEVICES INC | - | 4 | 100 °C | -40 °C | - | PLASTIC/EPOXY | FBGA | FCBGA-484 | BGA484,22X22,32 | SQUARE | GRID ARRAY, FINE PITCH | Active | - | - | Yes | - | - | 0.85 V | - | e1 | TIN SILVER COPPER | - | BOTTOM | BALL | - | 0.8 mm | compliant | - | - | S-PBGA-B484 | - | INDUSTRIAL | PROGRAMMABLE SoC | 2.61 mm | CAN, I2C, SPI, UART | 19 mm | 19 mm | ||
| XCZU3CG-1LSBVA484I | ||||||||||||||||||||||||||||||||||||||||||||||
![]() | Mfr. ТипXCZU9CG-1FBVB900IAnlielectronics Тип | AMD |
Description: Programmable SoC, CMOS, PBGA900, BGA-900
Сборник данных
Сравнение
| Min.:1 Mult.:1 | YES | 900 | ADVANCED MICRO DEVICES INC | - | 4 | 100 °C | -40 °C | - | PLASTIC/EPOXY | BGA | BGA-900 | BGA900,30X30,40 | SQUARE | GRID ARRAY | Active | - | - | Yes | 0.876 V | 0.825 V | 0.85 V | - | e1 | TIN SILVER COPPER | - | BOTTOM | BALL | 245 | 1 mm | compliant | 30 | - | S-PBGA-B900 | - | INDUSTRIAL | PROGRAMMABLE SoC | 2.88 mm | I2C(2), PCI, SATA, SGMII, SPI(2), UART(2), USB(2) | 31 mm | 31 mm | ||
| XCZU9CG-1FBVB900I | ||||||||||||||||||||||||||||||||||||||||||||||
![]() | Mfr. ТипXCZU2CG-2LSFVC784IAnlielectronics Тип | AMD |
Description: Programmable SoC, CMOS, PBGA784, FCBGA-784
Сборник данных
Сравнение
| Min.:1 Mult.:1 | YES | 784 | ADVANCED MICRO DEVICES INC | - | 4 | 100 °C | -40 °C | - | PLASTIC/EPOXY | FBGA | FCBGA-784 | BGA784,28X28,32 | SQUARE | GRID ARRAY, FINE PITCH | Active | - | - | Yes | - | - | 0.85 V | - | e1 | TIN SILVER COPPER | - | BOTTOM | BALL | 250 | 0.8 mm | compliant | 30 | - | S-PBGA-B784 | - | INDUSTRIAL | PROGRAMMABLE SoC | 3.32 mm | CAN, I2C, SPI, UART | 23 mm | 23 mm | ||
| XCZU2CG-2LSFVC784I | ||||||||||||||||||||||||||||||||||||||||||||||
![]() | Mfr. ТипXCZU19EG-3FFVE1924IAnlielectronics Тип | AMD |
Description: Programmable SoC, CMOS, PBGA1924, FCBGA-1924
Сборник данных
Сравнение
| Min.:1 Mult.:1 | YES | 1924 | ADVANCED MICRO DEVICES INC | - | 4 | 100 °C | -40 °C | - | PLASTIC/EPOXY | BGA | FCBGA-1924 | - | SQUARE | GRID ARRAY | Active | - | - | Yes | - | - | 0.9 V | - | e1 | TIN SILVER COPPER | - | BOTTOM | BALL | 245 | 1 mm | compliant | 30 | - | S-PBGA-B1924 | - | INDUSTRIAL | PROGRAMMABLE SoC | 3.71 mm | - | 45 mm | 45 mm | ||
| XCZU19EG-3FFVE1924I | ||||||||||||||||||||||||||||||||||||||||||||||
![]() | Mfr. ТипXCZU7EG-2LFFVC1156EAnlielectronics Тип | AMD |
Programmable SoC, CMOS, PBGA1156, FCBGA-1156
Сборник данных
Сравнение
| Min.:1 Mult.:1 | YES | 1156 | ADVANCED MICRO DEVICES INC | - | 4 | 110 °C | - | - | PLASTIC/EPOXY | BGA | FCBGA-1156 | BGA1156,34X34,40 | SQUARE | GRID ARRAY | Active | - | - | Yes | - | - | 0.85 V | - | e1 | TIN SILVER COPPER | - | BOTTOM | BALL | - | 1 mm | compliant | - | - | S-PBGA-B1156 | - | OTHER | PROGRAMMABLE SoC | 3.51 mm | CAN, I2C, SPI, UART | 35 mm | 35 mm | ||
| XCZU7EG-2LFFVC1156E | ||||||||||||||||||||||||||||||||||||||||||||||
![]() | Mfr. ТипXCZU11EG-2LFFVC1156EAnlielectronics Тип | AMD |
Programmable SoC, CMOS, PBGA1156, FCBGA-1156
Сборник данных
Сравнение
| Min.:1 Mult.:1 | YES | 1156 | ADVANCED MICRO DEVICES INC | - | 4 | 110 °C | - | - | PLASTIC/EPOXY | BGA | FCBGA-1156 | BGA1156,34X34,40 | SQUARE | GRID ARRAY | Active | - | - | Yes | - | - | 0.85 V | - | e1 | TIN SILVER COPPER | - | BOTTOM | BALL | - | 1 mm | compliant | - | - | S-PBGA-B1156 | - | OTHER | PROGRAMMABLE SoC | 3.51 mm | CAN, I2C, SPI, UART | 35 mm | 35 mm | ||
| XCZU11EG-2LFFVC1156E | ||||||||||||||||||||||||||||||||||||||||||||||
![]() | Mfr. ТипXCZU3CG-2LSFVA625IAnlielectronics Тип | AMD |
Programmable SoC, CMOS, PBGA625, FCBGA-625
Сборник данных
Сравнение
| Min.:1 Mult.:1 | YES | 625 | ADVANCED MICRO DEVICES INC | - | - | 100 °C | -40 °C | - | PLASTIC/EPOXY | FBGA | FCBGA-625 | BGA625,25X25,32 | SQUARE | GRID ARRAY, FINE PITCH | Active | - | - | Yes | - | - | 0.85 V | - | - | - | - | BOTTOM | BALL | - | 0.8 mm | compliant | - | - | S-PBGA-B625 | - | INDUSTRIAL | PROGRAMMABLE SoC | 3.43 mm | CAN, I2C, SPI, UART | 21 mm | 21 mm | ||
| XCZU3CG-2LSFVA625I | ||||||||||||||||||||||||||||||||||||||||||||||
![]() | Mfr. ТипXCZU3CG-2LSFVC784IAnlielectronics Тип | AMD |
Description: Programmable SoC, CMOS, PBGA784, FCBGA-784
Сборник данных
Сравнение
| Min.:1 Mult.:1 | YES | 784 | ADVANCED MICRO DEVICES INC | - | 4 | 100 °C | -40 °C | - | PLASTIC/EPOXY | FBGA | FCBGA-784 | BGA784,28X28,32 | SQUARE | GRID ARRAY, FINE PITCH | Active | - | - | Yes | - | - | 0.85 V | - | e1 | TIN SILVER COPPER | - | BOTTOM | BALL | 250 | 0.8 mm | compliant | 30 | - | S-PBGA-B784 | - | INDUSTRIAL | PROGRAMMABLE SoC | 3.32 mm | CAN, I2C, SPI, UART | 23 mm | 23 mm | ||
| XCZU3CG-2LSFVC784I | ||||||||||||||||||||||||||||||||||||||||||||||
![]() | Mfr. ТипXCZU9CG-2LFFVB1156EAnlielectronics Тип | AMD |
Description: Programmable SoC, CMOS, PBGA1156, FCBGA-1156
Сборник данных
Сравнение
| Min.:1 Mult.:1 | YES | 1156 | ADVANCED MICRO DEVICES INC | - | 4 | 110 °C | - | - | PLASTIC/EPOXY | BGA | FCBGA-1156 | BGA1156,34X34,40 | SQUARE | GRID ARRAY | Active | - | - | Yes | - | - | 0.85 V | - | e1 | TIN SILVER COPPER | - | BOTTOM | BALL | - | 1 mm | compliant | - | - | S-PBGA-B1156 | - | OTHER | PROGRAMMABLE SoC | 3.42 mm | CAN, I2C, SPI, UART | 35 mm | 35 mm | ||
| XCZU9CG-2LFFVB1156E | ||||||||||||||||||||||||||||||||||||||||||||||
![]() | Mfr. ТипXCZU7EV-3FBVB900IAnlielectronics Тип | AMD |
Programmable SoC, CMOS, PBGA900, FCBGA-900
Сборник данных
Сравнение
| Min.:1 Mult.:1 | YES | 900 | ADVANCED MICRO DEVICES INC | - | 4 | 100 °C | -40 °C | - | PLASTIC/EPOXY | BGA | FCBGA-900 | - | SQUARE | GRID ARRAY | Active | - | - | Yes | - | - | 0.9 V | - | e1 | TIN SILVER COPPER | - | BOTTOM | BALL | 245 | 1 mm | compliant | 30 | - | S-PBGA-B900 | - | INDUSTRIAL | PROGRAMMABLE SoC | 2.97 mm | - | 31 mm | 31 mm | ||
| XCZU7EV-3FBVB900I | ||||||||||||||||||||||||||||||||||||||||||||||
![]() | Mfr. ТипXCZU9CG-2SBVA484EAnlielectronics Тип | AMD |
Programmable SoC, CMOS, PBGA484, BGA-484
Сборник данных
Сравнение
| Min.:1 Mult.:1 | YES | 484 | ADVANCED MICRO DEVICES INC | - | 4 | 100 °C | - | - | PLASTIC/EPOXY | FBGA | BGA-484 | BGA484,22X22,32 | SQUARE | GRID ARRAY, FINE PITCH | Active | - | - | Yes | 0.876 V | 0.825 V | 0.85 V | - | e1 | TIN SILVER COPPER | - | BOTTOM | BALL | 250 | 0.8 mm | compliant | 30 | - | S-PBGA-B484 | - | OTHER | PROGRAMMABLE SoC | 2.61 mm | I2C(2), PCI, SATA, SGMII, SPI(2), UART(2), USB(2) | 19 mm | 19 mm | ||
| XCZU9CG-2SBVA484E | ||||||||||||||||||||||||||||||||||||||||||||||
![]() | Mfr. ТипXCZU6CG-2SFVC784IAnlielectronics Тип | AMD |
Programmable SoC, CMOS, PBGA784, BGA-784
Сборник данных
Сравнение
| Min.:1 Mult.:1 | YES | 784 | ADVANCED MICRO DEVICES INC | - | 4 | 100 °C | -40 °C | - | PLASTIC/EPOXY | FBGA | BGA-784 | BGA78428X28,32 | SQUARE | GRID ARRAY, FINE PITCH | Active | - | - | Yes | 0.876 V | 0.825 V | 0.85 V | - | e1 | TIN SILVER COPPER | - | BOTTOM | BALL | 250 | 0.8 mm | compliant | 30 | - | S-PBGA-B784 | - | INDUSTRIAL | PROGRAMMABLE SoC | 3.32 mm | I2C(2), PCI, SATA, SGMII, SPI(2), UART(2), USB(2) | 23 mm | 23 mm | ||
| XCZU6CG-2SFVC784I | ||||||||||||||||||||||||||||||||||||||||||||||
![]() | Mfr. ТипXCZU4CG-2LSFVC784EAnlielectronics Тип | AMD |
Programmable SoC, CMOS, PBGA784, FCBGA-784
Сборник данных
Сравнение
| Min.:1 Mult.:1 | YES | 784 | ADVANCED MICRO DEVICES INC | - | 4 | 110 °C | - | - | PLASTIC/EPOXY | FBGA | FCBGA-784 | BGA784,28X28,32 | SQUARE | GRID ARRAY, FINE PITCH | Active | - | - | Yes | - | - | 0.85 V | - | e1 | TIN SILVER COPPER | - | BOTTOM | BALL | 250 | 0.8 mm | compliant | 30 | - | S-PBGA-B784 | - | OTHER | PROGRAMMABLE SoC | 3.32 mm | CAN, I2C, SPI, UART | 23 mm | 23 mm | ||
| XCZU4CG-2LSFVC784E | ||||||||||||||||||||||||||||||||||||||||||||||
![]() | Mfr. ТипXCZU4CG-2LFBVB900EAnlielectronics Тип | AMD |
Programmable SoC, CMOS, PBGA900, FCBGA-900
Сборник данных
Сравнение
| Min.:1 Mult.:1 | YES | 900 | ADVANCED MICRO DEVICES INC | - | 4 | 110 °C | - | - | PLASTIC/EPOXY | BGA | FCBGA-900 | BGA900,30X30,40 | SQUARE | GRID ARRAY | Active | - | - | Yes | - | - | 0.85 V | - | e1 | TIN SILVER COPPER | - | BOTTOM | BALL | 245 | 1 mm | compliant | 30 | - | S-PBGA-B900 | - | OTHER | PROGRAMMABLE SoC | 2.88 mm | CAN, I2C, SPI, UART | 31 mm | 31 mm | ||
| XCZU4CG-2LFBVB900E |
Индекс :
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