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| Изображение | Тип | Марка | Объяснение | Установленная цена | Количество | RoHS | Surface Mount | Number of Terminals | Clock Frequency-Max | Ihs Manufacturer | Moisture Sensitivity Levels | Operating Temperature-Max | Operating Temperature-Min | Package Body Material | Package Code | Package Description | Package Equivalence Code | Package Shape | Package Style | Part Life Cycle Code | Part Package Code | Rohs Code | Supply Voltage-Max | Supply Voltage-Min | Supply Voltage-Nom | JESD-609 Code | Terminal Finish | HTS Code | Terminal Position | Terminal Form | Peak Reflow Temperature (Cel) | Terminal Pitch | Reach Compliance Code | Time@Peak Reflow Temperature-Max (s) | Pin Count | JESD-30 Code | Qualification Status | Temperature Grade | uPs/uCs/Peripheral ICs Type | Supply Current-Max | Seated Height-Max | Boundary Scan | Low Power Mode | External Data Bus Width | RAM (words) | Number of Serial I/Os | Bus Compatibility | Communication Protocol | Data Encoding/Decoding Method | Length | Width |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
  | Mfr. ТипAM9551CCAnlielectronics Тип | AMD |
Description: Serial I/O Controller, 1 Channel(s), NMOS, CDIP28, HERMETIC SEALED, CERAMIC, DIP-28
Сборник данных
Сравнение
| Min.:1 Mult.:1 | NO | 28 | 3.125 MHz | ADVANCED MICRO DEVICES INC | - | 70 °C | - | CERAMIC, METAL-SEALED COFIRED | DIP | DIP, DIP28,.6 | DIP28,.6 | RECTANGULAR | IN-LINE | Obsolete | DIP | No | 5.25 V | 4.75 V | 5 V | e0 | Tin/Lead (Sn/Pb) | 8542.31.00.01 | DUAL | THROUGH-HOLE | - | 2.54 mm | unknown | - | 28 | R-CDIP-T28 | Not Qualified | COMMERCIAL | SERIAL IO/COMMUNICATION CONTROLLER, SERIAL | 120 mA | 5.715 mm | NO | NO | 8 | 0 | 1 | 8080A | ASYNC, BIT; ETHERNET | NRZ | 37.338 mm | 15.24 mm | ||
| AM9551CC | |||||||||||||||||||||||||||||||||||||||||||||||||||
| | Mfr. ТипXCZU19EG-2LFFVE1924EAnlielectronics Тип | AMD |
Programmable SoC, CMOS, PBGA1924, FCBGA-1924
Сборник данных
Сравнение
| Min.:1 Mult.:1 | YES | 1924 | - | ADVANCED MICRO DEVICES INC | 4 | 110 °C | - | PLASTIC/EPOXY | BGA | FCBGA-1924 | BGA1924,44X44,40 | SQUARE | GRID ARRAY | Active | - | Yes | - | - | 0.85 V | e1 | TIN SILVER COPPER | - | BOTTOM | BALL | - | 1 mm | compliant | - | - | S-PBGA-B1924 | - | OTHER | PROGRAMMABLE SoC | - | 3.71 mm | - | - | - | - | - | CAN, I2C, SPI, UART | - | - | 45 mm | 45 mm | ||
| XCZU19EG-2LFFVE1924E | |||||||||||||||||||||||||||||||||||||||||||||||||||
| | Mfr. ТипXCZU19EG-2LFFVB1517EAnlielectronics Тип | AMD |
Description: Programmable SoC, CMOS, PBGA1517, FCBGA-1517
Сборник данных
Сравнение
| Min.:1 Mult.:1 | YES | 1517 | - | ADVANCED MICRO DEVICES INC | 4 | 110 °C | - | PLASTIC/EPOXY | BGA | FCBGA-1517 | BGA1517,39X39,40 | SQUARE | GRID ARRAY | Active | - | Yes | - | - | 0.85 V | e1 | TIN SILVER COPPER | - | BOTTOM | BALL | - | 1 mm | compliant | - | - | S-PBGA-B1517 | - | OTHER | PROGRAMMABLE SoC | - | 3.51 mm | - | - | - | - | - | CAN, I2C, SPI, UART | - | - | 40 mm | 40 mm | ||
| XCZU19EG-2LFFVB1517E | |||||||||||||||||||||||||||||||||||||||||||||||||||
| | Mfr. ТипXCZU9CG-1SBVA484EAnlielectronics Тип | AMD |
Description: Programmable SoC, CMOS, PBGA484, BGA-484
Сборник данных
Сравнение
| Min.:1 Mult.:1 | YES | 484 | - | ADVANCED MICRO DEVICES INC | 4 | 100 °C | - | PLASTIC/EPOXY | FBGA | BGA-484 | BGA484,22X22,32 | SQUARE | GRID ARRAY, FINE PITCH | Active | - | Yes | 0.876 V | 0.825 V | 0.85 V | e1 | TIN SILVER COPPER | - | BOTTOM | BALL | 250 | 0.8 mm | compliant | 30 | - | S-PBGA-B484 | - | OTHER | PROGRAMMABLE SoC | - | 2.61 mm | - | - | - | - | - | I2C(2), PCI, SATA, SGMII, SPI(2), UART(2), USB(2) | - | - | 19 mm | 19 mm | ||
| XCZU9CG-1SBVA484E | |||||||||||||||||||||||||||||||||||||||||||||||||||
| | Mfr. ТипXCZU4CG-2LFBVB900EAnlielectronics Тип | AMD |
Programmable SoC, CMOS, PBGA900, FCBGA-900
Сборник данных
Сравнение
| Min.:1 Mult.:1 | YES | 900 | - | ADVANCED MICRO DEVICES INC | 4 | 110 °C | - | PLASTIC/EPOXY | BGA | FCBGA-900 | BGA900,30X30,40 | SQUARE | GRID ARRAY | Active | - | Yes | - | - | 0.85 V | e1 | TIN SILVER COPPER | - | BOTTOM | BALL | 245 | 1 mm | compliant | 30 | - | S-PBGA-B900 | - | OTHER | PROGRAMMABLE SoC | - | 2.88 mm | - | - | - | - | - | CAN, I2C, SPI, UART | - | - | 31 mm | 31 mm | ||
| XCZU4CG-2LFBVB900E | |||||||||||||||||||||||||||||||||||||||||||||||||||
| | Mfr. ТипXCZU4CG-2LSFVC784EAnlielectronics Тип | AMD |
Programmable SoC, CMOS, PBGA784, FCBGA-784
Сборник данных
Сравнение
| Min.:1 Mult.:1 | YES | 784 | - | ADVANCED MICRO DEVICES INC | 4 | 110 °C | - | PLASTIC/EPOXY | FBGA | FCBGA-784 | BGA784,28X28,32 | SQUARE | GRID ARRAY, FINE PITCH | Active | - | Yes | - | - | 0.85 V | e1 | TIN SILVER COPPER | - | BOTTOM | BALL | 250 | 0.8 mm | compliant | 30 | - | S-PBGA-B784 | - | OTHER | PROGRAMMABLE SoC | - | 3.32 mm | - | - | - | - | - | CAN, I2C, SPI, UART | - | - | 23 mm | 23 mm | ||
| XCZU4CG-2LSFVC784E | |||||||||||||||||||||||||||||||||||||||||||||||||||
| | Mfr. ТипXCZU7EV-1LFBVB900IAnlielectronics Тип | AMD |
Programmable SoC, CMOS, PBGA900, FCBGA-900
Сборник данных
Сравнение
| Min.:1 Mult.:1 | YES | 900 | - | ADVANCED MICRO DEVICES INC | 4 | 100 °C | -40 °C | PLASTIC/EPOXY | BGA | FCBGA-900 | BGA900,30X30,40 | SQUARE | GRID ARRAY | Active | - | Yes | - | - | 0.85 V | e1 | TIN SILVER COPPER | - | BOTTOM | BALL | 245 | 1 mm | compliant | 30 | - | S-PBGA-B900 | - | INDUSTRIAL | PROGRAMMABLE SoC | - | 2.88 mm | - | - | - | - | - | CAN, I2C, SPI, UART | - | - | 31 mm | 31 mm | ||
| XCZU7EV-1LFBVB900I | |||||||||||||||||||||||||||||||||||||||||||||||||||
| | Mfr. ТипAM29803ADCAnlielectronics Тип | AMD |
Description: Microprocessor Circuit, Bipolar, CDIP16, HERMETIC SEALED, CERDIP-16
Сборник данных
Сравнение
| Min.:1 Mult.:1 | NO | 16 | - | ADVANCED MICRO DEVICES INC | - | 70 °C | - | CERAMIC, METAL-SEALED COFIRED | DIP | DIP, DIP16,.3 | DIP16,.3 | RECTANGULAR | IN-LINE | Obsolete | DIP | No | 5.25 V | 4.75 V | 5 V | e0 | Tin/Lead (Sn/Pb) | 8542.31.00.01 | DUAL | THROUGH-HOLE | - | 2.54 mm | unknown | - | 16 | R-CDIP-T16 | Not Qualified | COMMERCIAL | MICROPROCESSOR CIRCUIT | - | 5.08 mm | - | - | - | - | - | - | - | - | 19.6215 mm | 7.62 mm | ||
| AM29803ADC | |||||||||||||||||||||||||||||||||||||||||||||||||||
| | Mfr. ТипXCZU3CG-1LSBVA484IAnlielectronics Тип | AMD |
Programmable SoC, CMOS, PBGA484, FCBGA-484
Сборник данных
Сравнение
| Min.:1 Mult.:1 | YES | 484 | - | ADVANCED MICRO DEVICES INC | 4 | 100 °C | -40 °C | PLASTIC/EPOXY | FBGA | FCBGA-484 | BGA484,22X22,32 | SQUARE | GRID ARRAY, FINE PITCH | Active | - | Yes | - | - | 0.85 V | e1 | TIN SILVER COPPER | - | BOTTOM | BALL | - | 0.8 mm | compliant | - | - | S-PBGA-B484 | - | INDUSTRIAL | PROGRAMMABLE SoC | - | 2.61 mm | - | - | - | - | - | CAN, I2C, SPI, UART | - | - | 19 mm | 19 mm | ||
| XCZU3CG-1LSBVA484I | |||||||||||||||||||||||||||||||||||||||||||||||||||
| | Mfr. ТипXCZU9CG-2SFVA625EAnlielectronics Тип | AMD |
Programmable SoC, CMOS, PBGA625, BGA-625
Сборник данных
Сравнение
| Min.:1 Mult.:1 | YES | 625 | - | ADVANCED MICRO DEVICES INC | 4 | 100 °C | - | PLASTIC/EPOXY | FBGA | BGA-625 | BGA625,25X25,32 | SQUARE | GRID ARRAY, FINE PITCH | Active | - | Yes | 0.876 V | 0.825 V | 0.85 V | e1 | TIN SILVER COPPER | - | BOTTOM | BALL | 250 | 0.8 mm | compliant | 30 | - | S-PBGA-B625 | - | OTHER | PROGRAMMABLE SoC | - | 3.43 mm | - | - | - | - | - | I2C(2), PCI, SATA, SGMII, SPI(2), UART(2), USB(2) | - | - | 21 mm | 21 mm | ||
| XCZU9CG-2SFVA625E | |||||||||||||||||||||||||||||||||||||||||||||||||||
| | Mfr. ТипXCZU6EG-2LFFVC900EAnlielectronics Тип | AMD |
Description: Programmable SoC, CMOS, PBGA900, FCBGA-900
Сборник данных
Сравнение
| Min.:1 Mult.:1 | YES | 900 | - | ADVANCED MICRO DEVICES INC | 4 | 110 °C | - | PLASTIC/EPOXY | BGA | FCBGA-900 | BGA900,30X30,40 | SQUARE | GRID ARRAY | Active | - | Yes | - | - | 0.85 V | e1 | TIN SILVER COPPER | - | BOTTOM | BALL | - | 1 mm | compliant | - | - | S-PBGA-B900 | - | OTHER | PROGRAMMABLE SoC | - | 3.42 mm | - | - | - | - | - | CAN, I2C, SPI, UART | - | - | 31 mm | 31 mm | ||
| XCZU6EG-2LFFVC900E | |||||||||||||||||||||||||||||||||||||||||||||||||||
| | Mfr. ТипXCZU6CG-1SFVA625EAnlielectronics Тип | AMD |
Programmable SoC, CMOS, PBGA625, BGA-625
Сборник данных
Сравнение
| Min.:1 Mult.:1 | YES | 625 | - | ADVANCED MICRO DEVICES INC | 4 | 100 °C | - | PLASTIC/EPOXY | FBGA | BGA-625 | BGA625,25X25,32 | SQUARE | GRID ARRAY, FINE PITCH | Active | - | Yes | 0.876 V | 0.825 V | 0.85 V | e1 | TIN SILVER COPPER | - | BOTTOM | BALL | 250 | 0.8 mm | compliant | 30 | - | S-PBGA-B625 | - | OTHER | PROGRAMMABLE SoC | - | 3.43 mm | - | - | - | - | - | I2C(2), PCI, SATA, SGMII, SPI(2), UART(2), USB(2) | - | - | 21 mm | 21 mm | ||
| XCZU6CG-1SFVA625E | |||||||||||||||||||||||||||||||||||||||||||||||||||
| | Mfr. ТипXCZU6CG-2SFVC784IAnlielectronics Тип | AMD |
Programmable SoC, CMOS, PBGA784, BGA-784
Сборник данных
Сравнение
| Min.:1 Mult.:1 | YES | 784 | - | ADVANCED MICRO DEVICES INC | 4 | 100 °C | -40 °C | PLASTIC/EPOXY | FBGA | BGA-784 | BGA78428X28,32 | SQUARE | GRID ARRAY, FINE PITCH | Active | - | Yes | 0.876 V | 0.825 V | 0.85 V | e1 | TIN SILVER COPPER | - | BOTTOM | BALL | 250 | 0.8 mm | compliant | 30 | - | S-PBGA-B784 | - | INDUSTRIAL | PROGRAMMABLE SoC | - | 3.32 mm | - | - | - | - | - | I2C(2), PCI, SATA, SGMII, SPI(2), UART(2), USB(2) | - | - | 23 mm | 23 mm | ||
| XCZU6CG-2SFVC784I | |||||||||||||||||||||||||||||||||||||||||||||||||||
| | Mfr. ТипXQ7Z030-1RF900IAnlielectronics Тип | AMD |
Description: Programmable SoC, CMOS, PBGA900, 31 X 31 MM, 1 MM PITCH, BGA-900
Сборник данных
Сравнение
| Min.:1 Mult.:1 | YES | 900 | - | ADVANCED MICRO DEVICES INC | - | - | - | PLASTIC/EPOXY | BGA | 31 X 31 MM, 1 MM PITCH, BGA-900 | BGA900,30X30,40 | SQUARE | GRID ARRAY | Active | - | No | - | - | - | e0 | Tin/Lead (Sn/Pb) | - | BOTTOM | BALL | - | 1 mm | compliant | - | - | S-PBGA-B900 | Not Qualified | - | PROGRAMMABLE SoC | - | 3.44 mm | - | - | - | - | - | - | - | - | 31 mm | 31 mm | ||
| XQ7Z030-1RF900I | |||||||||||||||||||||||||||||||||||||||||||||||||||
| | Mfr. ТипXCZU9CG-2SBVA484IAnlielectronics Тип | AMD |
Description: Programmable SoC, CMOS, PBGA484, BGA-484
Сборник данных
Сравнение
| Min.:1 Mult.:1 | YES | 484 | - | ADVANCED MICRO DEVICES INC | 4 | 100 °C | -40 °C | PLASTIC/EPOXY | FBGA | BGA-484 | BGA484,22X22,32 | SQUARE | GRID ARRAY, FINE PITCH | Active | - | Yes | 0.876 V | 0.825 V | 0.85 V | e1 | TIN SILVER COPPER | - | BOTTOM | BALL | 250 | 0.8 mm | compliant | 30 | - | S-PBGA-B484 | - | INDUSTRIAL | PROGRAMMABLE SoC | - | 2.61 mm | - | - | - | - | - | I2C(2), PCI, SATA, SGMII, SPI(2), UART(2), USB(2) | - | - | 19 mm | 19 mm | ||
| XCZU9CG-2SBVA484I | |||||||||||||||||||||||||||||||||||||||||||||||||||
| | Mfr. ТипXCZU4CG-1LSFVC784IAnlielectronics Тип | AMD |
Programmable SoC, CMOS, PBGA784, FCBGA-784
Сборник данных
Сравнение
| Min.:1 Mult.:1 | YES | 784 | - | ADVANCED MICRO DEVICES INC | 4 | 100 °C | -40 °C | PLASTIC/EPOXY | FBGA | FCBGA-784 | BGA784,28X28,32 | SQUARE | GRID ARRAY, FINE PITCH | Active | - | Yes | - | - | 0.85 V | e1 | TIN SILVER COPPER | - | BOTTOM | BALL | 250 | 0.8 mm | compliant | 30 | - | S-PBGA-B784 | - | INDUSTRIAL | PROGRAMMABLE SoC | - | 3.32 mm | - | - | - | - | - | CAN, I2C, SPI, UART | - | - | 23 mm | 23 mm | ||
| XCZU4CG-1LSFVC784I | |||||||||||||||||||||||||||||||||||||||||||||||||||
| | Mfr. ТипXCZU7CG-2LFBVB900IAnlielectronics Тип | AMD |
Description: Programmable SoC, CMOS, PBGA900, FCBGA-900
Сборник данных
Сравнение
| Min.:1 Mult.:1 | YES | 900 | - | ADVANCED MICRO DEVICES INC | 4 | 100 °C | -40 °C | PLASTIC/EPOXY | BGA | FCBGA-900 | BGA900,30X30,40 | SQUARE | GRID ARRAY | Active | - | Yes | - | - | 0.85 V | e1 | TIN SILVER COPPER | - | BOTTOM | BALL | 245 | 1 mm | compliant | 30 | - | S-PBGA-B900 | - | INDUSTRIAL | PROGRAMMABLE SoC | - | 2.88 mm | - | - | - | - | - | CAN, I2C, SPI, UART | - | - | 31 mm | 31 mm | ||
| XCZU7CG-2LFBVB900I | |||||||||||||||||||||||||||||||||||||||||||||||||||
| | Mfr. ТипXCZU9CG-1SBVA484IAnlielectronics Тип | AMD |
Programmable SoC, CMOS, PBGA484, BGA-484
Сборник данных
Сравнение
| Min.:1 Mult.:1 | YES | 484 | - | ADVANCED MICRO DEVICES INC | 4 | 100 °C | -40 °C | PLASTIC/EPOXY | FBGA | BGA-484 | BGA484,22X22,32 | SQUARE | GRID ARRAY, FINE PITCH | Active | - | Yes | 0.876 V | 0.825 V | 0.85 V | e1 | TIN SILVER COPPER | - | BOTTOM | BALL | 250 | 0.8 mm | compliant | 30 | - | S-PBGA-B484 | - | INDUSTRIAL | PROGRAMMABLE SoC | - | 2.61 mm | - | - | - | - | - | I2C(2), PCI, SATA, SGMII, SPI(2), UART(2), USB(2) | - | - | 19 mm | 19 mm | ||
| XCZU9CG-1SBVA484I | |||||||||||||||||||||||||||||||||||||||||||||||||||
| | Mfr. ТипXCZU7EV-3FFVF1517IAnlielectronics Тип | AMD |
Programmable SoC, CMOS, PBGA1517, FCBGA-1517
Сборник данных
Сравнение
| Min.:1 Mult.:1 | YES | 1517 | - | ADVANCED MICRO DEVICES INC | 4 | 100 °C | -40 °C | PLASTIC/EPOXY | BGA | FCBGA-1517 | - | SQUARE | GRID ARRAY | Active | - | Yes | - | - | 0.9 V | e1 | TIN SILVER COPPER | - | BOTTOM | BALL | 245 | 1 mm | compliant | 30 | - | S-PBGA-B1517 | - | INDUSTRIAL | PROGRAMMABLE SoC | - | 3.51 mm | - | - | - | - | - | - | - | - | 40 mm | 40 mm | ||
| XCZU7EV-3FFVF1517I | |||||||||||||||||||||||||||||||||||||||||||||||||||
| | Mfr. ТипXCZU2CG-1LSFVA625IAnlielectronics Тип | AMD |
Programmable SoC, CMOS, PBGA625, FCBGA-625
Сборник данных
Сравнение
| Min.:1 Mult.:1 | YES | 625 | - | ADVANCED MICRO DEVICES INC | 4 | 100 °C | -40 °C | PLASTIC/EPOXY | FBGA | FCBGA-625 | BGA625,25X25,32 | SQUARE | GRID ARRAY, FINE PITCH | Active | - | Yes | - | - | 0.85 V | e1 | TIN SILVER COPPER | - | BOTTOM | BALL | - | 0.8 mm | compliant | - | - | S-PBGA-B625 | - | INDUSTRIAL | PROGRAMMABLE SoC | - | 3.43 mm | - | - | - | - | - | CAN, I2C, SPI, UART | - | - | 21 mm | 21 mm | ||
| XCZU2CG-1LSFVA625I |
Индекс :
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