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| Изображение | Тип | Марка | Объяснение | Установленная цена | Количество | RoHS | Surface Mount | Number of Terminals | Date Of Intro | Ihs Manufacturer | Moisture Sensitivity Levels | Operating Temperature-Max | Operating Temperature-Min | Package Body Material | Package Code | Package Description | Package Equivalence Code | Package Shape | Package Style | Part Life Cycle Code | Rohs Code | Supply Voltage-Max | Supply Voltage-Min | Supply Voltage-Nom | JESD-609 Code | Terminal Finish | HTS Code | Terminal Position | Terminal Form | Peak Reflow Temperature (Cel) | Terminal Pitch | Reach Compliance Code | Time@Peak Reflow Temperature-Max (s) | JESD-30 Code | Qualification Status | Temperature Grade | uPs/uCs/Peripheral ICs Type | Seated Height-Max | Bus Compatibility | Length | Width |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
![]() | Mfr. ТипXCZU3EG-3SBVA484EAnlielectronics Тип | AMD Xilinx |
Description: Microprocessor Circuit, CMOS, PBGA484, FLIPCHIP-484
Сборник данных
Сравнение
| Min.:1 Mult.:1 | YES | 484 | - | XILINX INC | 4 | 100 °C | - | PLASTIC/EPOXY | BGA | BGA, | - | SQUARE | GRID ARRAY | Transferred | Yes | - | - | 0.9 V | e1 | TIN SILVER COPPER | 8542.31.00.01 | BOTTOM | BALL | 250 | - | compliant | 30 | S-PBGA-B484 | - | OTHER | PROGRAMMABLE SoC | - | - | - | - | ||
| XCZU3EG-3SBVA484E | |||||||||||||||||||||||||||||||||||||||||
![]() | Mfr. ТипXCZU7EV-3FFVF1517IAnlielectronics Тип | AMD Xilinx |
Microprocessor Circuit, CMOS, PBGA1517, FCBGA-1517
Сборник данных
Сравнение
| Min.:1 Mult.:1 | YES | 1517 | 2017-02-15 | XILINX INC | 4 | 100 °C | -40 °C | PLASTIC/EPOXY | BGA | BGA, | - | SQUARE | GRID ARRAY | Transferred | Yes | - | - | 0.9 V | e1 | TIN SILVER COPPER | 8542.31.00.01 | BOTTOM | BALL | - | 1 mm | compliant | - | S-PBGA-B1517 | - | INDUSTRIAL | PROGRAMMABLE SoC | 3.51 mm | - | 40 mm | 40 mm | ||
| XCZU7EV-3FFVF1517I | |||||||||||||||||||||||||||||||||||||||||
![]() | Mfr. ТипXCZU6CG-1SBVA484EAnlielectronics Тип | AMD Xilinx |
Description: Microprocessor Circuit, CMOS, PBGA484, BGA-484
Сборник данных
Сравнение
| Min.:1 Mult.:1 | YES | 484 | - | XILINX INC | - | 100 °C | - | PLASTIC/EPOXY | FBGA | FBGA, BGA484,22X22,32 | BGA484,22X22,32 | SQUARE | GRID ARRAY, FINE PITCH | Transferred | Yes | 0.876 V | 0.825 V | 0.85 V | - | - | 8542.31.00.01 | BOTTOM | BALL | - | 0.8 mm | unknown | - | S-PBGA-B484 | - | OTHER | PROGRAMMABLE SoC | 2.61 mm | I2C(2), PCI, SATA, SGMII, SPI(2), UART(2), USB(2) | 19 mm | 19 mm | ||
| XCZU6CG-1SBVA484E | |||||||||||||||||||||||||||||||||||||||||
![]() | Mfr. ТипXCZU11EG-3FFVC1156IAnlielectronics Тип | AMD Xilinx |
Description: Microprocessor Circuit, CMOS, PBGA1156, FCBGA-1156
Сборник данных
Сравнение
| Min.:1 Mult.:1 | YES | 1156 | 2017-02-15 | XILINX INC | 4 | 100 °C | -40 °C | PLASTIC/EPOXY | BGA | BGA, | - | SQUARE | GRID ARRAY | Transferred | Yes | - | - | 0.9 V | e1 | TIN SILVER COPPER | 8542.31.00.01 | BOTTOM | BALL | - | 1 mm | compliant | - | S-PBGA-B1156 | - | INDUSTRIAL | PROGRAMMABLE SoC | 3.51 mm | - | 35 mm | 35 mm | ||
| XCZU11EG-3FFVC1156I | |||||||||||||||||||||||||||||||||||||||||
![]() | Mfr. ТипXCZU19EG-3FFVD1760IAnlielectronics Тип | AMD Xilinx |
Description: Microprocessor Circuit, CMOS, PBGA1760, FCBGA-1760
Сборник данных
Сравнение
| Min.:1 Mult.:1 | YES | 1760 | 2017-02-15 | XILINX INC | 4 | 100 °C | -40 °C | PLASTIC/EPOXY | BGA | BGA, | - | SQUARE | GRID ARRAY | Transferred | Yes | - | - | 0.9 V | e1 | TIN SILVER COPPER | 8542.31.00.01 | BOTTOM | BALL | - | 1 mm | compliant | - | S-PBGA-B1760 | - | INDUSTRIAL | PROGRAMMABLE SoC | 3.71 mm | - | 42.5 mm | 42.5 mm | ||
| XCZU19EG-3FFVD1760I | |||||||||||||||||||||||||||||||||||||||||
![]() | Mfr. ТипXQ7Z030-1RF900QAnlielectronics Тип | AMD Xilinx |
Description: Microprocessor Circuit, CMOS, PBGA900, 31 X 31 MM, 1 MM PITCH, BGA-900
Сборник данных
Сравнение
| Min.:1 Mult.:1 | YES | 900 | - | XILINX INC | - | 125 °C | -40 °C | PLASTIC/EPOXY | BGA | 31 X 31 MM, 1 MM PITCH, BGA-900 | BGA900,30X30,40 | SQUARE | GRID ARRAY | Transferred | No | - | - | - | e0 | TIN LEAD | 8542.31.00.01 | BOTTOM | BALL | - | 1 mm | not_compliant | - | S-PBGA-B900 | Not Qualified | AUTOMOTIVE | PROGRAMMABLE SoC | 3.44 mm | - | 31 mm | 31 mm | ||
| XQ7Z030-1RF900Q | |||||||||||||||||||||||||||||||||||||||||
![]() | Mfr. ТипXCZU6CG-2SBVA484IAnlielectronics Тип | AMD Xilinx |
Description: Microprocessor Circuit, CMOS, PBGA484, BGA-484
Сборник данных
Сравнение
| Min.:1 Mult.:1 | YES | 484 | - | XILINX INC | - | 100 °C | -40 °C | PLASTIC/EPOXY | FBGA | FBGA, BGA484,22X22,32 | BGA484,22X22,32 | SQUARE | GRID ARRAY, FINE PITCH | Transferred | Yes | 0.876 V | 0.825 V | 0.85 V | - | - | 8542.31.00.01 | BOTTOM | BALL | - | 0.8 mm | unknown | - | S-PBGA-B484 | - | INDUSTRIAL | PROGRAMMABLE SoC | 2.61 mm | I2C(2), PCI, SATA, SGMII, SPI(2), UART(2), USB(2) | 19 mm | 19 mm | ||
| XCZU6CG-2SBVA484I | |||||||||||||||||||||||||||||||||||||||||
![]() | Mfr. ТипXCZU9CG-1SFVC784IAnlielectronics Тип | AMD Xilinx |
Description: Microprocessor Circuit, CMOS, PBGA784, BGA-784
Сборник данных
Сравнение
| Min.:1 Mult.:1 | YES | 784 | - | XILINX INC | 4 | 100 °C | -40 °C | PLASTIC/EPOXY | FBGA | FBGA, BGA78428X28,32 | BGA78428X28,32 | SQUARE | GRID ARRAY, FINE PITCH | Transferred | Yes | 0.876 V | 0.825 V | 0.85 V | - | TIN SILVER COPPER | 8542.31.00.01 | BOTTOM | BALL | 250 | 0.8 mm | unknown | 30 | S-PBGA-B784 | - | INDUSTRIAL | PROGRAMMABLE SoC | 3.32 mm | I2C(2), PCI, SATA, SGMII, SPI(2), UART(2), USB(2) | 23 mm | 23 mm | ||
| XCZU9CG-1SFVC784I | |||||||||||||||||||||||||||||||||||||||||
![]() | Mfr. ТипXCZU7EG-3FFVC1156IAnlielectronics Тип | AMD Xilinx |
Microprocessor Circuit, CMOS, PBGA1156, FCBGA-1156
Сборник данных
Сравнение
| Min.:1 Mult.:1 | YES | 1156 | 2017-02-15 | XILINX INC | 4 | 100 °C | -40 °C | PLASTIC/EPOXY | BGA | BGA, | - | SQUARE | GRID ARRAY | Transferred | Yes | - | - | 0.9 V | e1 | TIN SILVER COPPER | 8542.31.00.01 | BOTTOM | BALL | - | 1 mm | compliant | - | S-PBGA-B1156 | - | INDUSTRIAL | PROGRAMMABLE SoC | 3.51 mm | - | 35 mm | 35 mm | ||
| XCZU7EG-3FFVC1156I | |||||||||||||||||||||||||||||||||||||||||
![]() | Mfr. ТипXCZU9CG-1FBVB900IAnlielectronics Тип | AMD Xilinx |
Description: Microprocessor Circuit, CMOS, PBGA900, BGA-900
Сборник данных
Сравнение
| Min.:1 Mult.:1 | YES | 900 | - | XILINX INC | - | 100 °C | -40 °C | PLASTIC/EPOXY | BGA | BGA, BGA900,30X30,40 | BGA900,30X30,40 | SQUARE | GRID ARRAY | Transferred | Yes | 0.876 V | 0.825 V | 0.85 V | - | - | 8542.31.00.01 | BOTTOM | BALL | - | 1 mm | unknown | - | S-PBGA-B900 | - | INDUSTRIAL | PROGRAMMABLE SoC | 2.88 mm | I2C(2), PCI, SATA, SGMII, SPI(2), UART(2), USB(2) | 31 mm | 31 mm | ||
| XCZU9CG-1FBVB900I | |||||||||||||||||||||||||||||||||||||||||
![]() | Mfr. ТипXCZU6CG-1SBVA484IAnlielectronics Тип | AMD Xilinx |
Microprocessor Circuit, CMOS, PBGA484, BGA-484
Сборник данных
Сравнение
| Min.:1 Mult.:1 | YES | 484 | - | XILINX INC | - | 100 °C | -40 °C | PLASTIC/EPOXY | FBGA | FBGA, BGA484,22X22,32 | BGA484,22X22,32 | SQUARE | GRID ARRAY, FINE PITCH | Transferred | Yes | 0.876 V | 0.825 V | 0.85 V | - | - | 8542.31.00.01 | BOTTOM | BALL | - | 0.8 mm | unknown | - | S-PBGA-B484 | - | INDUSTRIAL | PROGRAMMABLE SoC | 2.61 mm | I2C(2), PCI, SATA, SGMII, SPI(2), UART(2), USB(2) | 19 mm | 19 mm | ||
| XCZU6CG-1SBVA484I |
Индекс :
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