Embedded - System On Chip (SoC) Products For Sale - PDF - Integrated Circuits (ICs) -Page16

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Embedded - System On Chip (SoC)

Изображение	Тип	Марка	Объяснение	Установленная цена	Количество	RoHS	Factory Lead Time	Lifecycle Status	Package / Case	Surface Mount	Number of Pins	Supplier Device Package	Number of I/Os	Operating Temperature	Packaging	Published	Series	JESD-609 Code	Pbfree Code	Part Status	Moisture Sensitivity Level (MSL)	Number of Terminations	ECCN Code	Terminal Finish	Max Operating Temperature	Min Operating Temperature	Additional Feature	HTS Code	Terminal Position	Terminal Form	Peak Reflow Temperature (Cel)	Supply Voltage	Terminal Pitch	Reach Compliance Code	Frequency	Time@Peak Reflow Temperature-Max (s)	Base Part Number	JESD-30 Code	Number of Outputs	Qualification Status	Operating Supply Voltage	Supply Voltage-Max (Vsup)	Power Supplies	Supply Voltage-Min (Vsup)	Interface	Memory Size	Operating Supply Current	Speed	RAM Size	Core Processor	Peripherals	Connectivity	Architecture	Number of Inputs	Organization	Programmable Logic Type	Number of Logic Elements/Cells	Core Architecture	Number of Gates	Number of Logic Blocks (LABs)	Primary Attributes	Number of Logic Cells	Number of Equivalent Gates	Flash Size	Height Seated (Max)	Length	Width	Radiation Hardening	RoHS Status

Изображение	Тип	Марка	Объяснение	Количество	Factory Lead Time	Lifecycle Status	Package / Case	Surface Mount	Number of Pins	Supplier Device Package	Number of I/Os	Operating Temperature	Packaging	Published	Series	JESD-609 Code	Pbfree Code	Part Status	Moisture Sensitivity Level (MSL)	Number of Terminations	ECCN Code	Terminal Finish	Max Operating Temperature	Min Operating Temperature	Additional Feature	HTS Code	Terminal Position	Terminal Form	Peak Reflow Temperature (Cel)	Supply Voltage	Terminal Pitch	Reach Compliance Code	Frequency	Time@Peak Reflow Temperature-Max (s)	Base Part Number	JESD-30 Code	Number of Outputs	Qualification Status	Operating Supply Voltage	Supply Voltage-Max (Vsup)	Power Supplies	Supply Voltage-Min (Vsup)	Interface	Memory Size	Operating Supply Current	Speed	RAM Size	Core Processor	Peripherals	Connectivity	Architecture	Number of Inputs	Organization	Programmable Logic Type	Number of Logic Elements/Cells	Core Architecture	Number of Gates	Number of Logic Blocks (LABs)	Primary Attributes	Number of Logic Cells	Number of Equivalent Gates	Flash Size	Height Seated (Max)	Length	Width	Radiation Hardening	RoHS Status
	Mfr. Тип M2S150T-FCVG484I Anlielectronics Тип	Microsemi Corporation	IC SOC CORTEX-M3 166MHZ 484FBGA Сборник данных Сравнение	Min.:1 Mult.:1	10 Weeks	IN PRODUCTION (Last Updated: 1 month ago)	484-BFBGA	YES	-	-	273	-40°C~100°C TJ	Tray	2015	SmartFusion®2	e3	-	Active	3 (168 Hours)	484	-	MATTE TIN	-	-	LG-MIN, WD-MIN	8542.39.00.01	BOTTOM	BALL	NOT SPECIFIED	1.2V	0.8mm	-	-	NOT SPECIFIED	-	S-PBGA-B484	273	Not Qualified	-	1.26V	1.2V	1.14V	-	-	-	166MHz	64KB	ARM® Cortex®-M3	DDR, PCIe, SERDES	CANbus, Ethernet, I2C, SPI, UART/USART, USB	MCU, FPGA	273	-	FIELD PROGRAMMABLE GATE ARRAY	-	-	-	-	FPGA - 150K Logic Modules	146124	-	512KB	3.15mm	19mm	19mm	-	RoHS Compliant
M2S150T-FCVG484I Microsemi Corporation RoHS : Инкапсуляция : - Есть складские запасы : - 1 : -
	Mfr. Тип M2S090T-FG676 Anlielectronics Тип	Microsemi Corporation	IC SOC CORTEX-M3 166MHZ 676FBGA Сборник данных Сравнение	Min.:1 Mult.:1	10 Weeks	IN PRODUCTION (Last Updated: 3 weeks ago)	676-BGA	YES	-	-	425	0°C~85°C TJ	Tray	2009	SmartFusion®2	e0	-	Active	3 (168 Hours)	676	-	Tin/Lead (Sn/Pb)	-	-	-	8542.39.00.01	BOTTOM	BALL	NOT SPECIFIED	1.2V	1mm	not_compliant	166MHz	NOT SPECIFIED	M2S090T	S-PBGA-B676	425	Not Qualified	-	1.26V	1.2V	1.14V	CAN, Ethernet, I2C, SPI, UART, USART, USB	-	-	-	64KB	ARM® Cortex®-M3	DDR, PCIe, SERDES	CANbus, Ethernet, I2C, SPI, UART/USART, USB	MCU, FPGA	425	-	FIELD PROGRAMMABLE GATE ARRAY	-	ARM	-	-	FPGA - 90K Logic Modules	86316	-	512KB	2.44mm	27mm	27mm	-	Non-RoHS Compliant
M2S090T-FG676 Microsemi Corporation RoHS : Инкапсуляция : - Есть складские запасы : - 1 : -
	Mfr. Тип M2S150-1FCVG484I Anlielectronics Тип	Microsemi Corporation	IC SOC CORTEX-M3 166MHZ 484FBGA Сборник данных Сравнение	Min.:1 Mult.:1	12 Weeks	IN PRODUCTION (Last Updated: 3 weeks ago)	484-BFBGA	YES	-	-	273	-40°C~100°C TJ	Tray	2015	SmartFusion®2	e3	-	Active	3 (168 Hours)	484	-	MATTE TIN	-	-	LG-MIN, WD-MIN	8542.39.00.01	BOTTOM	BALL	NOT SPECIFIED	1.2V	0.8mm	-	-	NOT SPECIFIED	-	S-PBGA-B484	273	Not Qualified	-	1.26V	1.2V	1.14V	-	-	-	166MHz	64KB	ARM® Cortex®-M3	DDR, PCIe, SERDES	CANbus, Ethernet, I2C, SPI, UART/USART, USB	MCU, FPGA	273	-	FIELD PROGRAMMABLE GATE ARRAY	-	-	-	-	FPGA - 150K Logic Modules	146124	-	512KB	3.15mm	19mm	19mm	-	RoHS Compliant
M2S150-1FCVG484I Microsemi Corporation RoHS : Инкапсуляция : - Есть складские запасы : - 1 : -
	Mfr. Тип M2S150TS-FCSG536 Anlielectronics Тип	Microsemi Corporation	IC SOC CORTEX-M3 166MHZ 536BGA Сборник данных Сравнение	Min.:1 Mult.:1	10 Weeks	IN PRODUCTION (Last Updated: 1 month ago)	536-LFBGA, CSPBGA	YES	-	-	293	0°C~85°C TJ	Tray	2015	SmartFusion®2	e3	yes	Active	3 (168 Hours)	536	-	MATTE TIN	-	-	-	8542.39.00.01	BOTTOM	BALL	NOT SPECIFIED	1.2V	-	-	-	NOT SPECIFIED	-	S-PBGA-B536	-	-	-	1.26V	-	1.14V	-	-	-	166MHz	64KB	ARM® Cortex®-M3	DDR, PCIe, SERDES	CANbus, Ethernet, I2C, SPI, UART/USART, USB	MCU, FPGA	-	-	FIELD PROGRAMMABLE GATE ARRAY	-	-	-	-	FPGA - 150K Logic Modules	-	-	512KB	-	-	-	-	RoHS Compliant
M2S150TS-FCSG536 Microsemi Corporation RoHS : Инкапсуляция : - Есть складские запасы : - 1 : -
	Mfr. Тип M2S090TS-1FG676 Anlielectronics Тип	Microsemi Corporation	IC SOC CORTEX-M3 166MHZ 676FBGA Сборник данных Сравнение	Min.:1 Mult.:1	10 Weeks	IN PRODUCTION (Last Updated: 3 weeks ago)	676-BGA	YES	-	-	425	0°C~85°C TJ	Tray	2015	SmartFusion®2	e0	-	Active	3 (168 Hours)	676	-	Tin/Lead (Sn/Pb)	-	-	-	8542.39.00.01	BOTTOM	BALL	NOT SPECIFIED	1.2V	1mm	not_compliant	-	NOT SPECIFIED	-	S-PBGA-B676	425	Not Qualified	-	1.26V	1.2V	1.14V	-	-	-	166MHz	64KB	ARM® Cortex®-M3	DDR, PCIe, SERDES	CANbus, Ethernet, I2C, SPI, UART/USART, USB	MCU, FPGA	425	-	FIELD PROGRAMMABLE GATE ARRAY	-	-	-	-	FPGA - 90K Logic Modules	86316	-	512KB	2.44mm	27mm	27mm	-	Non-RoHS Compliant
M2S090TS-1FG676 Microsemi Corporation RoHS : Инкапсуляция : - Есть складские запасы : - 1 : -
	Mfr. Тип M2S050TS-1FGG484M Anlielectronics Тип	Microsemi Corporation	IC SOC CORTEX-M3 166MHZ 484FBGA Сборник данных Сравнение	Min.:1 Mult.:1	10 Weeks	IN PRODUCTION (Last Updated: 2 weeks ago)	484-BGA	YES	-	-	267	-55°C~125°C TJ	Tray	-	SmartFusion®2	e3	-	Active	3 (168 Hours)	484	3A001.A.2.C	MATTE TIN	-	-	-	8542.39.00.01	BOTTOM	BALL	NOT SPECIFIED	1.2V	1mm	-	-	NOT SPECIFIED	-	S-PBGA-B484	267	Not Qualified	-	1.26V	1.2V	1.14V	-	-	-	166MHz	64KB	ARM® Cortex®-M3	DDR, PCIe, SERDES	CANbus, Ethernet, I2C, SPI, UART/USART, USB	MCU, FPGA	267	-	FIELD PROGRAMMABLE GATE ARRAY	-	-	-	-	FPGA - 50K Logic Modules	56340	-	256KB	2.44mm	23mm	23mm	-	RoHS Compliant
M2S050TS-1FGG484M Microsemi Corporation RoHS : Инкапсуляция : - Есть складские запасы : - 1 : -
	Mfr. Тип M2S150TS-1FCS536 Anlielectronics Тип	Microsemi Corporation	IC SOC CORTEX-M3 166MHZ 536BGA Сборник данных Сравнение	Min.:1 Mult.:1	10 Weeks	IN PRODUCTION (Last Updated: 1 month ago)	536-LFBGA, CSPBGA	YES	-	-	293	0°C~85°C TJ	Tray	2015	SmartFusion®2	e0	no	Active	3 (168 Hours)	536	-	Tin/Lead (Sn/Pb)	-	-	-	8542.39.00.01	BOTTOM	BALL	NOT SPECIFIED	1.2V	-	not_compliant	-	NOT SPECIFIED	-	S-PBGA-B536	-	-	-	1.26V	-	1.14V	-	-	-	166MHz	64KB	ARM® Cortex®-M3	DDR, PCIe, SERDES	CANbus, Ethernet, I2C, SPI, UART/USART, USB	MCU, FPGA	-	-	FIELD PROGRAMMABLE GATE ARRAY	-	-	-	-	FPGA - 150K Logic Modules	-	-	512KB	-	-	-	-	Non-RoHS Compliant
M2S150TS-1FCS536 Microsemi Corporation RoHS : Инкапсуляция : - Есть складские запасы : - 1 : -
	Mfr. Тип M2S150T-1FCS536I Anlielectronics Тип	Microsemi Corporation	IC SOC CORTEX-M3 166MHZ 536BGA Сборник данных Сравнение	Min.:1 Mult.:1	10 Weeks	IN PRODUCTION (Last Updated: 1 month ago)	536-LFBGA, CSPBGA	YES	-	-	293	-40°C~100°C TJ	Tray	2015	SmartFusion®2	e0	-	Active	3 (168 Hours)	536	-	Tin/Lead (Sn/Pb)	-	-	-	8542.39.00.01	BOTTOM	BALL	NOT SPECIFIED	1.2V	-	not_compliant	-	NOT SPECIFIED	-	S-PBGA-B536	293	Not Qualified	-	1.26V	1.2V	1.14V	-	-	-	166MHz	64KB	ARM® Cortex®-M3	DDR, PCIe, SERDES	CANbus, Ethernet, I2C, SPI, UART/USART, USB	MCU, FPGA	293	-	FIELD PROGRAMMABLE GATE ARRAY	-	-	-	-	FPGA - 150K Logic Modules	146124	-	512KB	-	-	-	-	Non-RoHS Compliant
M2S150T-1FCS536I Microsemi Corporation RoHS : Инкапсуляция : - Есть складские запасы : - 1 : -
	Mfr. Тип A2F500M3G-FG256M Anlielectronics Тип	Microsemi Corporation	IC FPGA 500K GATES 512KB 256FBGA Сборник данных Сравнение	Min.:1 Mult.:1	12 Weeks	-	256-LBGA	YES	256	-	MCU - 25, FPGA - 66	-55°C~125°C TJ	Tray	-	SmartFusion®	-	-	Active	3 (168 Hours)	256	-	-	-	-	-	8542.39.00.01	BOTTOM	BALL	-	1.5V	1mm	unknown	80MHz	-	A2F500M3G	-	66	-	-	1.575V	-	1.425V	EBI/EMI, Ethernet, I2C, SPI, UART, USART	-	-	-	64KB	ARM® Cortex®-M3	DMA, POR, WDT	EBI/EMI, Ethernet, I2C, SPI, UART/USART	MCU, FPGA	-	11520 CLBS, 500000 GATES	FIELD PROGRAMMABLE GATE ARRAY	-	ARM	-	-	ProASIC®3 FPGA, 500K Gates, 11520 D-Flip-Flops	-	500000	512KB	1.7mm	17mm	17mm	-	Non-RoHS Compliant
A2F500M3G-FG256M Microsemi Corporation RoHS : Инкапсуляция : - Есть складские запасы : - 1 : -
	Mfr. Тип M2S005-FGG484 Anlielectronics Тип	Microsemi Corporation	IC SOC CORTEX-M3 166MHZ 484FBGA Сборник данных Сравнение	Min.:1 Mult.:1	11 Weeks	IN PRODUCTION (Last Updated: 1 month ago)	484-BGA	-	484	484-FPBGA (23x23)	209	0°C~85°C TJ	Tray	2009	SmartFusion®2	-	-	Active	3 (168 Hours)	-	-	-	85°C	0°C	-	-	-	-	-	-	-	-	166MHz	-	M2S005	-	-	-	1.2V	-	-	-	CAN, Ethernet, I2C, SPI, UART, USART, USB	23.9kB	-	166MHz	64KB	ARM® Cortex®-M3	DDR	CANbus, Ethernet, I2C, SPI, UART/USART, USB	MCU, FPGA	-	-	-	6060	ARM	-	505	FPGA - 5K Logic Modules	-	-	128KB	-	23mm	23mm	-	RoHS Compliant
M2S005-FGG484 Microsemi Corporation RoHS : Инкапсуляция : - Есть складские запасы : - 1 : -
	Mfr. Тип M2S005S-VF400I Anlielectronics Тип	Microsemi Corporation	IC SOC CORTEX-M3 166MHZ 400VFBGA Сборник данных Сравнение	Min.:1 Mult.:1	12 Weeks	IN PRODUCTION (Last Updated: 1 month ago)	400-LFBGA	YES	-	-	169	-40°C~100°C TJ	Tray	2010	SmartFusion®2	e0	no	Active	3 (168 Hours)	400	-	Tin/Lead (Sn/Pb)	-	-	-	8542.39.00.01	BOTTOM	BALL	NOT SPECIFIED	1.2V	0.8mm	not_compliant	-	NOT SPECIFIED	-	S-PBGA-B400	-	-	-	1.26V	-	1.14V	-	-	-	166MHz	64KB	ARM® Cortex®-M3	DDR	CANbus, Ethernet, I2C, SPI, UART/USART, USB	MCU, FPGA	-	-	FIELD PROGRAMMABLE GATE ARRAY	-	-	-	-	FPGA - 5K Logic Modules	-	-	128KB	1.51mm	17mm	17mm	-	Non-RoHS Compliant
M2S005S-VF400I Microsemi Corporation RoHS : Инкапсуляция : - Есть складские запасы : - 1 : -
	Mfr. Тип M2S005S-VFG256 Anlielectronics Тип	Microsemi Corporation	IC SOC CORTEX-M3 166MHZ 256FBGA Сборник данных Сравнение	Min.:1 Mult.:1	12 Weeks	IN PRODUCTION (Last Updated: 1 month ago)	256-LBGA	YES	-	-	161	0°C~85°C TJ	Tray	2015	SmartFusion®2	e3	-	Active	3 (168 Hours)	256	-	MATTE TIN	-	-	LG-MIN, WD-MIN	8542.39.00.01	BOTTOM	BALL	NOT SPECIFIED	1.2V	0.8mm	-	-	NOT SPECIFIED	-	S-PBGA-B256	161	Not Qualified	-	1.26V	1.2V	1.14V	-	-	-	166MHz	64KB	ARM® Cortex®-M3	DDR	CANbus, Ethernet, I2C, SPI, UART/USART, USB	MCU, FPGA	161	-	FIELD PROGRAMMABLE GATE ARRAY	-	-	-	-	FPGA - 5K Logic Modules	6060	-	128KB	1.56mm	14mm	14mm	-	RoHS Compliant
M2S005S-VFG256 Microsemi Corporation RoHS : Инкапсуляция : - Есть складские запасы : - 1 : -
	Mfr. Тип M2S010T-1VF256 Anlielectronics Тип	Microsemi Corporation	IC SOC CORTEX-M3 166MHZ 256FBGA Сборник данных Сравнение	Min.:1 Mult.:1	10 Weeks	IN PRODUCTION (Last Updated: 3 days ago)	256-LFBGA	YES	-	-	138	0°C~85°C TJ	Tray	2015	SmartFusion®2	e0	-	Active	3 (168 Hours)	256	-	Tin/Lead (Sn/Pb)	-	-	LG-MIN, WD-MIN	8542.39.00.01	BOTTOM	BALL	NOT SPECIFIED	1.2V	0.8mm	not_compliant	-	NOT SPECIFIED	-	S-PBGA-B256	138	Not Qualified	-	1.26V	1.2V	1.14V	-	-	-	166MHz	64KB	ARM® Cortex®-M3	DDR, PCIe, SERDES	CANbus, Ethernet, I2C, SPI, UART/USART, USB	MCU, FPGA	138	-	FIELD PROGRAMMABLE GATE ARRAY	-	-	-	-	FPGA - 10K Logic Modules	12084	-	256KB	1.56mm	14mm	14mm	-	Non-RoHS Compliant
M2S010T-1VF256 Microsemi Corporation RoHS : Инкапсуляция : - Есть складские запасы : - 1 : -
	Mfr. Тип A2F200M3F-1FGG256I Anlielectronics Тип	Microsemi Corporation	IC FPGA 200K GATES 256KB 256-BGA Сборник данных Сравнение	Min.:1 Mult.:1	12 Weeks	-	256-LBGA	-	-	256-FPBGA (17x17)	MCU - 25, FPGA - 66	-40°C~100°C TJ	Tray	2015	SmartFusion®	-	-	Active	3 (168 Hours)	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	A2F200	-	-	-	-	-	-	-	-	-	-	100MHz	64KB	ARM® Cortex®-M3	DMA, POR, WDT	EBI/EMI, Ethernet, I2C, SPI, UART/USART	MCU, FPGA	-	-	-	-	-	-	-	ProASIC®3 FPGA, 200K Gates, 4608 D-Flip-Flops	-	-	256KB	-	-	-	-	RoHS Compliant
A2F200M3F-1FGG256I Microsemi Corporation RoHS : Инкапсуляция : - Есть складские запасы : - 1 : -
	Mfr. Тип M2S010T-1VFG400 Anlielectronics Тип	Microsemi Corporation	IC SOC CORTEX-M3 166MHZ 400VFBGA Сборник данных Сравнение	Min.:1 Mult.:1	10 Weeks	IN PRODUCTION (Last Updated: 1 month ago)	400-LFBGA	-	400	400-VFBGA (17x17)	195	0°C~85°C TJ	Tray	2009	SmartFusion®2	-	-	Active	3 (168 Hours)	-	-	-	85°C	0°C	-	-	-	-	-	-	-	-	166MHz	-	M2S010T	-	-	-	-	-	-	-	CAN, Ethernet, I2C, SPI, UART, USART, USB	-	-	166MHz	64KB	ARM® Cortex®-M3	DDR, PCIe, SERDES	CANbus, Ethernet, I2C, SPI, UART/USART, USB	MCU, FPGA	-	-	-	-	ARM	-	-	FPGA - 10K Logic Modules	-	-	256KB	-	-	-	-	RoHS Compliant
M2S010T-1VFG400 Microsemi Corporation RoHS : Инкапсуляция : - Есть складские запасы : - 1 : -
	Mfr. Тип A2F200M3F-1FG484I Anlielectronics Тип	Microsemi Corporation	IC FPGA 200K GATES 256KB 484-BGA Сборник данных Сравнение	Min.:1 Mult.:1	12 Weeks	-	484-BGA	YES	484	-	MCU - 41, FPGA - 94	-40°C~100°C TJ	Tray	2009	SmartFusion®	e0	-	Active	3 (168 Hours)	484	-	Tin/Lead (Sn/Pb)	-	-	-	-	BOTTOM	BALL	225	1.5V	1mm	-	100MHz	20	A2F200	-	94	-	-	1.575V	-	1.425V	EBI/EMI, Ethernet, I2C, SPI, UART, USART	-	1mA	-	64KB	ARM® Cortex®-M3	DMA, POR, WDT	EBI/EMI, Ethernet, I2C, SPI, UART/USART	MCU, FPGA	-	-	FIELD PROGRAMMABLE GATE ARRAY	-	ARM	200000	8	ProASIC®3 FPGA, 200K Gates, 4608 D-Flip-Flops	-	-	256KB	2.44mm	23mm	23mm	No	Non-RoHS Compliant
A2F200M3F-1FG484I Microsemi Corporation RoHS : Инкапсуляция : - Есть складские запасы : - 1 : -
	Mfr. Тип M2S010-1FGG484 Anlielectronics Тип	Microsemi Corporation	IC SOC CORTEX-M3 166MHZ 484FBGA Сборник данных Сравнение	Min.:1 Mult.:1	8 Weeks	IN PRODUCTION (Last Updated: 1 month ago)	484-BGA	-	-	484-FPBGA (23x23)	233	0°C~85°C TJ	Tray	2009	SmartFusion®2	-	-	Active	3 (168 Hours)	-	-	-	85°C	0°C	-	-	-	-	-	-	-	-	166MHz	-	M2S010	-	-	-	-	-	-	-	CAN, Ethernet, I2C, SPI, UART, USART, USB	-	-	166MHz	64KB	ARM® Cortex®-M3	DDR, PCIe, SERDES	CANbus, Ethernet, I2C, SPI, UART/USART, USB	MCU, FPGA	-	-	-	-	ARM	-	-	FPGA - 10K Logic Modules	-	-	256KB	-	-	-	-	RoHS Compliant
M2S010-1FGG484 Microsemi Corporation RoHS : Инкапсуляция : - Есть складские запасы : - 1 : -
	Mfr. Тип M2S005-VFG400I Anlielectronics Тип	Microsemi Corporation	IC SOC CORTEX-M3 166MHZ 400VFBGA Сборник данных Сравнение	Min.:1 Mult.:1	7 Weeks	IN PRODUCTION (Last Updated: 1 month ago)	400-LFBGA	YES	-	-	169	-40°C~100°C TJ	Tray	2015	SmartFusion®2	e3	-	Active	3 (168 Hours)	400	-	MATTE TIN	-	-	-	8542.39.00.01	BOTTOM	BALL	NOT SPECIFIED	1.2V	0.8mm	-	-	NOT SPECIFIED	-	S-PBGA-B400	171	Not Qualified	-	1.26V	1.2V	1.14V	-	-	-	166MHz	64KB	ARM® Cortex®-M3	DDR	CANbus, Ethernet, I2C, SPI, UART/USART, USB	MCU, FPGA	171	-	FIELD PROGRAMMABLE GATE ARRAY	-	-	-	-	FPGA - 5K Logic Modules	6060	-	128KB	1.51mm	17mm	17mm	-	RoHS Compliant
M2S005-VFG400I Microsemi Corporation RoHS : Инкапсуляция : - Есть складские запасы : - 1 : -
	Mfr. Тип M2S010TS-VFG400I Anlielectronics Тип	Microsemi Corporation	IC SOC CORTEX-M3 166MHZ 400VFBGA Сборник данных Сравнение	Min.:1 Mult.:1	10 Weeks	-	400-LFBGA	YES	-	-	195	-40°C~100°C TJ	Tray	2015	SmartFusion®2	e3	-	Active	3 (168 Hours)	400	-	MATTE TIN	-	-	-	8542.39.00.01	BOTTOM	BALL	NOT SPECIFIED	1.2V	0.8mm	-	-	NOT SPECIFIED	-	S-PBGA-B400	195	Not Qualified	-	1.26V	1.2V	1.14V	-	-	-	166MHz	64KB	ARM® Cortex®-M3	DDR, PCIe, SERDES	CANbus, Ethernet, I2C, SPI, UART/USART, USB	MCU, FPGA	195	-	FIELD PROGRAMMABLE GATE ARRAY	-	-	-	-	FPGA - 10K Logic Modules	12084	-	256KB	1.51mm	17mm	17mm	-	RoHS Compliant
M2S010TS-VFG400I Microsemi Corporation RoHS : Инкапсуляция : - Есть складские запасы : - 1 : -
	Mfr. Тип M2S010T-VFG400I Anlielectronics Тип	Microsemi Corporation	IC SOC CORTEX-M3 166MHZ 400VFBGA Сборник данных Сравнение	Min.:1 Mult.:1	10 Weeks	IN PRODUCTION (Last Updated: 1 month ago)	400-LFBGA	YES	-	-	195	-40°C~100°C TJ	Tray	2014	SmartFusion®2	e3	-	Active	3 (168 Hours)	400	-	MATTE TIN	-	-	-	8542.39.00.01	BOTTOM	BALL	NOT SPECIFIED	1.2V	0.8mm	-	-	NOT SPECIFIED	-	S-PBGA-B400	195	Not Qualified	-	1.26V	1.2V	1.14V	-	-	-	166MHz	64KB	ARM® Cortex®-M3	DDR, PCIe, SERDES	CANbus, Ethernet, I2C, SPI, UART/USART, USB	MCU, FPGA	195	-	FIELD PROGRAMMABLE GATE ARRAY	-	-	-	-	FPGA - 10K Logic Modules	12084	-	256KB	1.51mm	17mm	17mm	-	RoHS Compliant
M2S010T-VFG400I Microsemi Corporation RoHS : Инкапсуляция : - Есть складские запасы : - 1 : -

Integrated Circuits (ICs)

Embedded - System On Chip (SoC) definition: A System On Chip (SoC) combines the required electronic circuits of various computer components onto a single, integrated chip (IC). SoC is ... Embedded - System On Chip (SoC) Product Listing: M2S150T-FCVG484I,M2S090T-FG676,M2S150-1FCVG484I,M2S150TS-FCSG536,M2S090TS-1FG676.Integrated Circuits (ICs) type:Embedded - Microcontrollers(129432),Memory(111901),PMIC - Supervisors(101743),PMIC - Voltage Regulators - Linear(101187),PMIC - Voltage Regulators - DC DC Switching Regulators(62822) .Embedded - System On Chip (SoC) has 760 pieces of spot stock price information, you can click the "RFQ" button to confirm the inventory and price with the Anli.

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Integrated Circuits (ICs)