Embedded - System On Chip (SoC) Products For Sale - PDF - Integrated Circuits (ICs) -Page17

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Embedded - System On Chip (SoC)

Изображение	Тип	Марка	Объяснение	Установленная цена	Количество	RoHS	Factory Lead Time	Lifecycle Status	Package / Case	Surface Mount	Number of Pins	Supplier Device Package	Number of I/Os	Operating Temperature	Packaging	Published	Series	JESD-609 Code	Pbfree Code	Part Status	Moisture Sensitivity Level (MSL)	Number of Terminations	ECCN Code	Terminal Finish	Max Operating Temperature	Min Operating Temperature	Additional Feature	HTS Code	Terminal Position	Terminal Form	Peak Reflow Temperature (Cel)	Supply Voltage	Terminal Pitch	Reach Compliance Code	Frequency	Time@Peak Reflow Temperature-Max (s)	Base Part Number	JESD-30 Code	Number of Outputs	Qualification Status	Operating Supply Voltage	Supply Voltage-Max (Vsup)	Power Supplies	Supply Voltage-Min (Vsup)	Interface	Max Supply Voltage	Min Supply Voltage	Speed	RAM Size	Core Processor	Peripherals	Connectivity	Architecture	Number of Inputs	Organization	Programmable Logic Type	Core Architecture	Speed Grade	Primary Attributes	Number of Logic Cells	Number of Equivalent Gates	Flash Size	Height Seated (Max)	Length	Width	RoHS Status	Lead Free

Изображение	Тип	Марка	Объяснение	Количество	Factory Lead Time	Lifecycle Status	Package / Case	Surface Mount	Number of Pins	Supplier Device Package	Number of I/Os	Operating Temperature	Packaging	Published	Series	JESD-609 Code	Pbfree Code	Part Status	Moisture Sensitivity Level (MSL)	Number of Terminations	ECCN Code	Terminal Finish	Max Operating Temperature	Min Operating Temperature	Additional Feature	HTS Code	Terminal Position	Terminal Form	Peak Reflow Temperature (Cel)	Supply Voltage	Terminal Pitch	Reach Compliance Code	Frequency	Time@Peak Reflow Temperature-Max (s)	Base Part Number	JESD-30 Code	Number of Outputs	Qualification Status	Operating Supply Voltage	Supply Voltage-Max (Vsup)	Power Supplies	Supply Voltage-Min (Vsup)	Interface	Max Supply Voltage	Min Supply Voltage	Speed	RAM Size	Core Processor	Peripherals	Connectivity	Architecture	Number of Inputs	Organization	Programmable Logic Type	Core Architecture	Speed Grade	Primary Attributes	Number of Logic Cells	Number of Equivalent Gates	Flash Size	Height Seated (Max)	Length	Width	RoHS Status	Lead Free
	Mfr. Тип M2S010-1TQG144I Anlielectronics Тип	Microsemi Corporation	IC SOC CORTEX-M3 166MHZ 144TQFP Сборник данных Сравнение	Min.:1 Mult.:1	10 Weeks	IN PRODUCTION (Last Updated: 1 month ago)	144-LQFP	YES	-	-	84	-40°C~100°C TJ	Tray	2015	SmartFusion®2	e3	yes	Active	3 (168 Hours)	144	-	MATTE TIN	-	-	-	8542.39.00.01	QUAD	GULL WING	NOT SPECIFIED	1.2V	0.5mm	-	-	NOT SPECIFIED	-	S-PQFP-G144	-	-	-	1.26V	-	1.14V	-	-	-	166MHz	64KB	ARM® Cortex®-M3	DDR, PCIe, SERDES	CANbus, Ethernet, I2C, SPI, UART/USART, USB	MCU, FPGA	-	-	FIELD PROGRAMMABLE GATE ARRAY	-	-	FPGA - 10K Logic Modules	-	-	256KB	1.6mm	20mm	20mm	RoHS Compliant	-
M2S010-1TQG144I Microsemi Corporation RoHS : Инкапсуляция : - Есть складские запасы : - 1 : -
	Mfr. Тип M2S010T-1FG484I Anlielectronics Тип	Microsemi Corporation	IC SOC CORTEX-M3 166MHZ 484FBGA Сборник данных Сравнение	Min.:1 Mult.:1	10 Weeks	IN PRODUCTION (Last Updated: 3 weeks ago)	484-BGA	-	-	484-FPBGA (23x23)	233	-40°C~100°C TJ	Tray	2009	SmartFusion®2	-	-	Active	3 (168 Hours)	-	-	-	100°C	-40°C	-	-	-	-	-	-	-	-	166MHz	-	M2S010T	-	-	-	-	-	-	-	CAN, Ethernet, I2C, SPI, UART, USART, USB	-	-	166MHz	64KB	ARM® Cortex®-M3	DDR, PCIe, SERDES	CANbus, Ethernet, I2C, SPI, UART/USART, USB	MCU, FPGA	-	-	-	ARM	-	FPGA - 10K Logic Modules	-	-	256KB	-	-	-	Non-RoHS Compliant	-
M2S010T-1FG484I Microsemi Corporation RoHS : Инкапсуляция : - Есть складские запасы : - 1 : -
	Mfr. Тип M2S025-VF256 Anlielectronics Тип	Microsemi Corporation	IC SOC CORTEX-M3 166MHZ 256FBGA Сборник данных Сравнение	Min.:1 Mult.:1	11 Weeks	-	256-LFBGA	YES	-	-	138	0°C~85°C TJ	Tray	2015	SmartFusion®2	e0	-	Active	3 (168 Hours)	256	-	Tin/Lead (Sn/Pb)	-	-	LG-MIN, WD-MIN	8542.39.00.01	BOTTOM	BALL	NOT SPECIFIED	1.2V	0.8mm	not_compliant	-	NOT SPECIFIED	-	S-PBGA-B256	138	Not Qualified	-	1.26V	1.2V	1.14V	-	-	-	166MHz	64KB	ARM® Cortex®-M3	DDR, PCIe, SERDES	CANbus, Ethernet, I2C, SPI, UART/USART, USB	MCU, FPGA	138	-	FIELD PROGRAMMABLE GATE ARRAY	-	-	FPGA - 25K Logic Modules	27696	-	256KB	1.56mm	14mm	14mm	Non-RoHS Compliant	-
M2S025-VF256 Microsemi Corporation RoHS : Инкапсуляция : - Есть складские запасы : - 1 : -
	Mfr. Тип M2S010TS-1VF256I Anlielectronics Тип	Microsemi Corporation	IC SOC CORTEX-M3 166MHZ 256FBGA Сборник данных Сравнение	Min.:1 Mult.:1	10 Weeks	-	256-LFBGA	YES	-	-	138	-40°C~100°C TJ	Tray	2015	SmartFusion®2	e0	-	Active	3 (168 Hours)	256	-	Tin/Lead (Sn/Pb)	-	-	LG-MIN, WD-MIN	8542.39.00.01	BOTTOM	BALL	NOT SPECIFIED	1.2V	0.8mm	not_compliant	-	NOT SPECIFIED	-	S-PBGA-B256	138	Not Qualified	-	1.26V	1.2V	1.14V	-	-	-	166MHz	64KB	ARM® Cortex®-M3	DDR, PCIe, SERDES	CANbus, Ethernet, I2C, SPI, UART/USART, USB	MCU, FPGA	138	-	FIELD PROGRAMMABLE GATE ARRAY	-	-	FPGA - 10K Logic Modules	12084	-	256KB	1.56mm	14mm	14mm	Non-RoHS Compliant	-
M2S010TS-1VF256I Microsemi Corporation RoHS : Инкапсуляция : - Есть складские запасы : - 1 : -
	Mfr. Тип M2S025-VFG256 Anlielectronics Тип	Microsemi Corporation	IC SOC CORTEX-M3 166MHZ 256FBGA Сборник данных Сравнение	Min.:1 Mult.:1	11 Weeks	-	256-LBGA	YES	-	-	138	0°C~85°C TJ	Tray	2015	SmartFusion®2	e3	-	Active	3 (168 Hours)	256	-	MATTE TIN	-	-	LG-MIN, WD-MIN	8542.39.00.01	BOTTOM	BALL	NOT SPECIFIED	1.2V	0.8mm	-	-	NOT SPECIFIED	-	S-PBGA-B256	138	Not Qualified	-	1.26V	1.2V	1.14V	-	-	-	166MHz	64KB	ARM® Cortex®-M3	DDR, PCIe, SERDES	CANbus, Ethernet, I2C, SPI, UART/USART, USB	MCU, FPGA	138	-	FIELD PROGRAMMABLE GATE ARRAY	-	-	FPGA - 25K Logic Modules	27696	-	256KB	1.56mm	14mm	14mm	RoHS Compliant	-
M2S025-VFG256 Microsemi Corporation RoHS : Инкапсуляция : - Есть складские запасы : - 1 : -
	Mfr. Тип M2S025TS-FCSG325 Anlielectronics Тип	Microsemi Corporation	IC SOC CORTEX-M3 166MHZ 325BGA Сборник данных Сравнение	Min.:1 Mult.:1	10 Weeks	IN PRODUCTION (Last Updated: 2 weeks ago)	325-TFBGA, CSPBGA	YES	-	-	180	0°C~85°C TJ	Tray	-	SmartFusion®2	e3	-	Active	3 (168 Hours)	325	-	MATTE TIN	-	-	LG-MIN, WD-MIN	8542.39.00.01	BOTTOM	BALL	NOT SPECIFIED	1.2V	0.5mm	-	-	NOT SPECIFIED	-	S-PBGA-B325	180	Not Qualified	-	1.26V	1.2V	1.14V	-	-	-	166MHz	64KB	ARM® Cortex®-M3	DDR, PCIe, SERDES	CANbus, Ethernet, I2C, SPI, UART/USART, USB	MCU, FPGA	180	-	FIELD PROGRAMMABLE GATE ARRAY	-	-	FPGA - 25K Logic Modules	27696	-	256KB	1.01mm	11mm	11mm	RoHS Compliant	-
M2S025TS-FCSG325 Microsemi Corporation RoHS : Инкапсуляция : - Есть складские запасы : - 1 : -
	Mfr. Тип M2S025T-1FCSG325 Anlielectronics Тип	Microsemi Corporation	IC SOC CORTEX-M3 166MHZ 325BGA Сборник данных Сравнение	Min.:1 Mult.:1	10 Weeks	-	325-TFBGA, CSPBGA	YES	-	-	180	0°C~85°C TJ	Tray	2015	SmartFusion®2	e3	-	Active	3 (168 Hours)	325	-	MATTE TIN	-	-	LG-MIN, WD-MIN	8542.39.00.01	BOTTOM	BALL	NOT SPECIFIED	1.2V	0.5mm	-	-	NOT SPECIFIED	-	S-PBGA-B325	180	Not Qualified	-	1.26V	1.2V	1.14V	-	-	-	166MHz	64KB	ARM® Cortex®-M3	DDR, PCIe, SERDES	CANbus, Ethernet, I2C, SPI, UART/USART, USB	MCU, FPGA	180	-	FIELD PROGRAMMABLE GATE ARRAY	-	-	FPGA - 25K Logic Modules	27696	-	256KB	1.01mm	11mm	11mm	RoHS Compliant	-
M2S025T-1FCSG325 Microsemi Corporation RoHS : Инкапсуляция : - Есть складские запасы : - 1 : -
	Mfr. Тип A2F500M3G-1PQG208 Anlielectronics Тип	Microsemi Corporation	IC FPGA 500K GATES 512KB 208QFP Сборник данных Сравнение	Min.:1 Mult.:1	12 Weeks	-	208-BFQFP	YES	208	-	MCU - 22, FPGA - 66	0°C~85°C TJ	Tray	2015	SmartFusion®	-	-	Active	3 (168 Hours)	208	-	Pure Matte Tin (Sn)	-	-	-	8542.39.00.01	QUAD	GULL WING	245	1.5V	0.5mm	-	100MHz	30	A2F500M3G	-	-	-	1.5V	-	-	-	Ethernet, I2C, SPI, UART, USART	1.575V	1.425V	-	64KB	ARM® Cortex®-M3	DMA, POR, WDT	Ethernet, I2C, SPI, UART/USART	MCU, FPGA	-	11520 CLBS, 500000 GATES	FIELD PROGRAMMABLE GATE ARRAY	ARM	-	ProASIC®3 FPGA, 500K Gates, 11520 D-Flip-Flops	-	500000	512KB	4.1mm	28mm	28mm	RoHS Compliant	-
A2F500M3G-1PQG208 Microsemi Corporation RoHS : Инкапсуляция : - Есть складские запасы : - 1 : -
	Mfr. Тип M2S025TS-1FCS325I Anlielectronics Тип	Microsemi Corporation	IC SOC CORTEX-M3 166MHZ 325BGA Сборник данных Сравнение	Min.:1 Mult.:1	10 Weeks	IN PRODUCTION (Last Updated: 2 weeks ago)	325-TFBGA, CSPBGA	YES	-	-	180	-40°C~100°C TJ	Tray	2015	SmartFusion®2	e0	-	Active	3 (168 Hours)	325	-	Tin/Lead (Sn/Pb)	-	-	LG-MIN, WD-MIN	8542.39.00.01	BOTTOM	BALL	NOT SPECIFIED	1.2V	0.5mm	not_compliant	-	NOT SPECIFIED	-	S-PBGA-B325	180	Not Qualified	-	1.26V	1.2V	1.14V	-	-	-	166MHz	64KB	ARM® Cortex®-M3	DDR, PCIe, SERDES	CANbus, Ethernet, I2C, SPI, UART/USART, USB	MCU, FPGA	180	-	FIELD PROGRAMMABLE GATE ARRAY	-	-	FPGA - 25K Logic Modules	27696	-	256KB	1.01mm	11mm	11mm	Non-RoHS Compliant	-
M2S025TS-1FCS325I Microsemi Corporation RoHS : Инкапсуляция : - Есть складские запасы : - 1 : -
	Mfr. Тип M2S010TS-1FGG484T2 Anlielectronics Тип	Microsemi Corporation	IC SOC CORTEX-M3 166MHZ 484FBGA Сборник данных Сравнение	Min.:1 Mult.:1	10 Weeks	IN PRODUCTION (Last Updated: 1 month ago)	484-BGA	-	-	-	233	-40°C~125°C TJ	Tray	-	Automotive, AEC-Q100, SmartFusion®2	-	yes	Active	3 (168 Hours)	-	-	-	-	-	-	-	-	-	NOT SPECIFIED	-	-	-	-	NOT SPECIFIED	-	-	-	-	-	-	-	-	-	-	-	166MHz	64KB	ARM® Cortex®-M3	DDR, PCIe, SERDES	CANbus, Ethernet, I2C, SPI, UART/USART, USB	MCU, FPGA	-	-	FIELD PROGRAMMABLE GATE ARRAY	-	-	FPGA - 10K Logic Modules	-	-	256KB	-	-	-	RoHS Compliant	-
M2S010TS-1FGG484T2 Microsemi Corporation RoHS : Инкапсуляция : - Есть складские запасы : - 1 : -
	Mfr. Тип M2S060-FCSG325 Anlielectronics Тип	Microsemi Corporation	IC SOC CORTEX-M3 166MHZ 325BGA Сборник данных Сравнение	Min.:1 Mult.:1	10 Weeks	IN PRODUCTION (Last Updated: 2 weeks ago)	325-TFBGA, CSPBGA	YES	-	-	200	0°C~85°C TJ	Tray	2015	SmartFusion®2	e3	-	Active	3 (168 Hours)	325	-	MATTE TIN	-	-	LG-MIN, WD-MIN	8542.39.00.01	BOTTOM	BALL	NOT SPECIFIED	1.2V	0.5mm	-	-	NOT SPECIFIED	-	S-PBGA-B325	200	Not Qualified	-	1.26V	1.2V	1.14V	-	-	-	166MHz	64KB	ARM® Cortex®-M3	DDR, PCIe, SERDES	CANbus, Ethernet, I2C, SPI, UART/USART, USB	MCU, FPGA	200	-	FIELD PROGRAMMABLE GATE ARRAY	-	-	FPGA - 60K Logic Modules	56520	-	256KB	1.01mm	11mm	11mm	RoHS Compliant	-
M2S060-FCSG325 Microsemi Corporation RoHS : Инкапсуляция : - Есть складские запасы : - 1 : -
	Mfr. Тип M2S025-VF256I Anlielectronics Тип	Microsemi Corporation	IC SOC CORTEX-M3 166MHZ 256FBGA Сборник данных Сравнение	Min.:1 Mult.:1	6 Weeks	-	256-LFBGA	YES	-	-	138	-40°C~100°C TJ	Tray	2015	SmartFusion®2	e0	-	Active	3 (168 Hours)	256	-	Tin/Lead (Sn/Pb)	-	-	LG-MIN, WD-MIN	8542.39.00.01	BOTTOM	BALL	NOT SPECIFIED	1.2V	0.8mm	not_compliant	-	NOT SPECIFIED	-	S-PBGA-B256	138	Not Qualified	-	1.26V	1.2V	1.14V	-	-	-	166MHz	64KB	ARM® Cortex®-M3	DDR, PCIe, SERDES	CANbus, Ethernet, I2C, SPI, UART/USART, USB	MCU, FPGA	138	-	FIELD PROGRAMMABLE GATE ARRAY	-	-	FPGA - 25K Logic Modules	27696	-	256KB	1.56mm	14mm	14mm	Non-RoHS Compliant	-
M2S025-VF256I Microsemi Corporation RoHS : Инкапсуляция : - Есть складские запасы : - 1 : -
	Mfr. Тип M2S025TS-FCS325 Anlielectronics Тип	Microsemi Corporation	IC SOC CORTEX-M3 166MHZ 325BGA Сборник данных Сравнение	Min.:1 Mult.:1	10 Weeks	IN PRODUCTION (Last Updated: 2 weeks ago)	325-TFBGA, CSPBGA	YES	-	-	180	0°C~85°C TJ	Tray	-	SmartFusion®2	e0	-	Active	3 (168 Hours)	325	-	Tin/Lead (Sn/Pb)	-	-	LG-MIN, WD-MIN	8542.39.00.01	BOTTOM	BALL	NOT SPECIFIED	1.2V	0.5mm	not_compliant	-	NOT SPECIFIED	-	S-PBGA-B325	180	Not Qualified	-	1.26V	1.2V	1.14V	-	-	-	166MHz	64KB	ARM® Cortex®-M3	DDR, PCIe, SERDES	CANbus, Ethernet, I2C, SPI, UART/USART, USB	MCU, FPGA	180	-	FIELD PROGRAMMABLE GATE ARRAY	-	-	FPGA - 25K Logic Modules	27696	-	256KB	1.01mm	11mm	11mm	Non-RoHS Compliant	-
M2S025TS-FCS325 Microsemi Corporation RoHS : Инкапсуляция : - Есть складские запасы : - 1 : -
	Mfr. Тип M2S025-1VF256I Anlielectronics Тип	Microsemi Corporation	IC SOC CORTEX-M3 166MHZ 256FBGA Сборник данных Сравнение	Min.:1 Mult.:1	10 Weeks	-	256-LFBGA	YES	-	-	138	-40°C~100°C TJ	Tray	2015	SmartFusion®2	e0	-	Active	3 (168 Hours)	256	-	Tin/Lead (Sn/Pb)	-	-	LG-MIN, WD-MIN	8542.39.00.01	BOTTOM	BALL	NOT SPECIFIED	1.2V	0.8mm	not_compliant	-	NOT SPECIFIED	-	S-PBGA-B256	138	Not Qualified	-	1.26V	1.2V	1.14V	-	-	-	166MHz	64KB	ARM® Cortex®-M3	DDR, PCIe, SERDES	CANbus, Ethernet, I2C, SPI, UART/USART, USB	MCU, FPGA	138	-	FIELD PROGRAMMABLE GATE ARRAY	-	-	FPGA - 25K Logic Modules	27696	-	256KB	1.56mm	14mm	14mm	Non-RoHS Compliant	-
M2S025-1VF256I Microsemi Corporation RoHS : Инкапсуляция : - Есть складские запасы : - 1 : -
	Mfr. Тип M2S025TS-FCSG325I Anlielectronics Тип	Microsemi Corporation	IC SOC CORTEX-M3 166MHZ 325BGA Сборник данных Сравнение	Min.:1 Mult.:1	10 Weeks	IN PRODUCTION (Last Updated: 2 weeks ago)	325-TFBGA, CSPBGA	YES	-	-	180	-40°C~100°C TJ	Tray	2015	SmartFusion®2	e3	-	Active	3 (168 Hours)	325	-	MATTE TIN	-	-	LG-MIN, WD-MIN	8542.39.00.01	BOTTOM	BALL	NOT SPECIFIED	1.2V	0.5mm	-	-	NOT SPECIFIED	-	S-PBGA-B325	180	Not Qualified	-	1.26V	1.2V	1.14V	-	-	-	166MHz	64KB	ARM® Cortex®-M3	DDR, PCIe, SERDES	CANbus, Ethernet, I2C, SPI, UART/USART, USB	MCU, FPGA	180	-	FIELD PROGRAMMABLE GATE ARRAY	-	-	FPGA - 25K Logic Modules	27696	-	256KB	1.01mm	11mm	11mm	RoHS Compliant	-
M2S025TS-FCSG325I Microsemi Corporation RoHS : Инкапсуляция : - Есть складские запасы : - 1 : -
	Mfr. Тип M2S060T-FCS325I Anlielectronics Тип	Microsemi Corporation	M2S Series 1314kb RAM 200 I/O Auto IGLOO2 & SmartFusion2 SoC FPGA - FCBGA-325 Сборник данных Сравнение	Min.:1 Mult.:1	10 Weeks	IN PRODUCTION (Last Updated: 3 weeks ago)	325-TFBGA, CSPBGA	YES	-	-	200	-40°C~100°C TJ	Tray	-	SmartFusion®2	e0	-	Active	3 (168 Hours)	325	-	Tin/Lead (Sn/Pb)	-	-	LG-MIN, WD-MIN	8542.39.00.01	BOTTOM	BALL	NOT SPECIFIED	1.2V	0.5mm	not_compliant	-	NOT SPECIFIED	-	S-PBGA-B325	200	Not Qualified	-	1.26V	1.2V	1.14V	-	-	-	166MHz	64KB	ARM® Cortex®-M3	DDR, PCIe, SERDES	CANbus, Ethernet, I2C, SPI, UART/USART, USB	MCU, FPGA	200	-	FIELD PROGRAMMABLE GATE ARRAY	-	-	FPGA - 60K Logic Modules	56520	-	256KB	1.01mm	11mm	11mm	Non-RoHS Compliant	Contains Lead
M2S060T-FCS325I Microsemi Corporation RoHS : Инкапсуляция : - Есть складские запасы : - 1 : -
	Mfr. Тип M2S025T-1VFG400I Anlielectronics Тип	Microsemi Corporation	IC SOC CORTEX-M3 166MHZ 400VFBGA Сборник данных Сравнение	Min.:1 Mult.:1	10 Weeks	IN PRODUCTION (Last Updated: 1 month ago)	400-LFBGA	-	400	400-VFBGA (17x17)	207	-40°C~100°C TJ	Tray	2009	SmartFusion®2	-	-	Active	3 (168 Hours)	-	-	-	100°C	-40°C	-	-	-	-	-	-	-	-	166MHz	-	M2S025T	-	-	-	1.2V	-	-	-	CAN, Ethernet, I2C, SPI, UART, USART, USB	-	-	166MHz	64KB	ARM® Cortex®-M3	DDR, PCIe, SERDES	CANbus, Ethernet, I2C, SPI, UART/USART, USB	MCU, FPGA	-	-	-	ARM	1	FPGA - 25K Logic Modules	-	-	256KB	-	-	-	RoHS Compliant	Lead Free
M2S025T-1VFG400I Microsemi Corporation RoHS : Инкапсуляция : - Есть складские запасы : - 1 : -
	Mfr. Тип M2S060T-1FCS325 Anlielectronics Тип	Microsemi Corporation	IC SOC CORTEX-M3 166MHZ 325BGA Сборник данных Сравнение	Min.:1 Mult.:1	10 Weeks	IN PRODUCTION (Last Updated: 3 weeks ago)	325-TFBGA, CSPBGA	YES	-	-	200	0°C~85°C TJ	Tray	2015	SmartFusion®2	e0	-	Active	3 (168 Hours)	325	-	Tin/Lead (Sn/Pb)	-	-	LG-MIN, WD-MIN	8542.39.00.01	BOTTOM	BALL	NOT SPECIFIED	1.2V	0.5mm	not_compliant	-	NOT SPECIFIED	-	S-PBGA-B325	200	Not Qualified	-	1.26V	1.2V	1.14V	-	-	-	166MHz	64KB	ARM® Cortex®-M3	DDR, PCIe, SERDES	CANbus, Ethernet, I2C, SPI, UART/USART, USB	MCU, FPGA	200	-	FIELD PROGRAMMABLE GATE ARRAY	-	-	FPGA - 60K Logic Modules	56520	-	256KB	1.01mm	11mm	11mm	Non-RoHS Compliant	-
M2S060T-1FCS325 Microsemi Corporation RoHS : Инкапсуляция : - Есть складские запасы : - 1 : -
	Mfr. Тип M2S050-1FCSG325I Anlielectronics Тип	Microsemi Corporation	IC SOC CORTEX-M3 166MHZ 325BGA Сборник данных Сравнение	Min.:1 Mult.:1	10 Weeks	IN PRODUCTION (Last Updated: 2 weeks ago)	325-TFBGA, CSPBGA	YES	-	-	200	-40°C~100°C TJ	Tray	2015	SmartFusion®2	e3	-	Active	3 (168 Hours)	325	3A991.D	MATTE TIN	-	-	LG-MIN, WD-MIN	8542.39.00.01	BOTTOM	BALL	NOT SPECIFIED	1.2V	0.5mm	-	-	NOT SPECIFIED	-	S-PBGA-B325	200	Not Qualified	-	1.26V	1.2V	1.14V	-	-	-	166MHz	64KB	ARM® Cortex®-M3	DDR, PCIe, SERDES	CANbus, Ethernet, I2C, SPI, UART/USART, USB	MCU, FPGA	200	-	FIELD PROGRAMMABLE GATE ARRAY	-	-	FPGA - 50K Logic Modules	56340	-	256KB	1.01mm	11mm	11mm	RoHS Compliant	Lead Free
M2S050-1FCSG325I Microsemi Corporation RoHS : Инкапсуляция : - Есть складские запасы : - 1 : -
	Mfr. Тип M2S025TS-1VF400I Anlielectronics Тип	Microsemi Corporation	IC SOC CORTEX-M3 166MHZ 400VFBGA Сборник данных Сравнение	Min.:1 Mult.:1	10 Weeks	IN PRODUCTION (Last Updated: 1 month ago)	400-LFBGA	-	400	400-VFBGA (17x17)	207	-40°C~100°C TJ	Tray	2016	SmartFusion®2	-	-	Active	3 (168 Hours)	-	-	-	100°C	-40°C	-	-	-	-	-	-	-	-	166MHz	-	M2S025TS	-	-	-	-	-	-	-	CAN, Ethernet, I2C, SPI, UART, USART, USB	-	-	166MHz	64KB	ARM® Cortex®-M3	DDR, PCIe, SERDES	CANbus, Ethernet, I2C, SPI, UART/USART, USB	MCU, FPGA	-	-	-	ARM	-	FPGA - 25K Logic Modules	-	-	256KB	-	-	-	Non-RoHS Compliant	-
M2S025TS-1VF400I Microsemi Corporation RoHS : Инкапсуляция : - Есть складские запасы : - 1 : -

Integrated Circuits (ICs)

Embedded - System On Chip (SoC) definition: A System On Chip (SoC) combines the required electronic circuits of various computer components onto a single, integrated chip (IC). SoC is ... Embedded - System On Chip (SoC) Product Listing: M2S010-1TQG144I,M2S010T-1FG484I,M2S025-VF256,M2S010TS-1VF256I,M2S025-VFG256.Integrated Circuits (ICs) type:Embedded - Microcontrollers(129432),Memory(111901),PMIC - Supervisors(101743),PMIC - Voltage Regulators - Linear(101187),PMIC - Voltage Regulators - DC DC Switching Regulators(62822) .Embedded - System On Chip (SoC) has 760 pieces of spot stock price information, you can click the "RFQ" button to confirm the inventory and price with the Anli.

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Integrated Circuits (ICs)