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Изображение	Тип	Марка	Объяснение	Установленная цена	Количество	RoHS	Lifecycle Status	Package / Case	Surface Mount	Supplier Device Package	Number of Terminals	Base Product Number	Core	Data RAM Size	Factory Pack QuantityFactory Pack Quantity	I/O Voltage	Ihs Manufacturer	Instruction Set Architecture	JTAG Support	L1 Cache Data Memory	L1 Cache Instruction Memory	Manufacturer Part Number	Maximum Clock Frequency	Maximum Operating Supply Voltage	Maximum Operating Temperature	Mfr	Minimum Operating Supply Voltage	Minimum Operating Temperature	Moisture Sensitive	Moisture Sensitivity Levels	Mounting Styles	MSL	Number of CPU Cores	Number of I/Os	Number of Logic Array Blocks - LABs	Number of Logic Elements	Operating Temperature-Max	Operating Temperature-Min	Package	Package Body Material	Package Code	Package Description	Package Equivalence Code	Package Shape	Package Style	Part Life Cycle Code	Product Status	Reflow Temperature-Max (s)	Risk Rank	RoHS	Rohs Code	Shipping Restrictions	Supply Voltage-Max	Supply Voltage-Min	Supply Voltage-Nom	Tradename	Typical Operating Supply Voltage	Usage Level	Operating Temperature	Packaging	Series	JESD-609 Code	Pbfree Code	Terminal Finish	Additional Feature	HTS Code	Technology	Terminal Position	Terminal Form	Peak Reflow Temperature (Cel)	Terminal Pitch	Reach Compliance Code	Time@Peak Reflow Temperature-Max (s)	Pin Count	JESD-30 Code	Number of Outputs	Qualification Status	Operating Supply Voltage	Power Supplies	Temperature Grade	Interface	Speed	RAM Size	Core Processor	Peripherals	Program Memory Size	Connectivity	Architecture	Data Bus Width	Number of Inputs	Seated Height-Max	Programmable Logic Type	Total RAM Bits	Screening Level	Speed Grade	Primary Attributes	Number of Logic Cells	Number of Cores	Flash Size	Device Core	Length	Width	Lead Free

Изображение	Тип	Марка	Объяснение	Количество	Lifecycle Status	Package / Case	Surface Mount	Supplier Device Package	Number of Terminals	Base Product Number	Core	Data RAM Size	Factory Pack QuantityFactory Pack Quantity	I/O Voltage	Ihs Manufacturer	Instruction Set Architecture	JTAG Support	L1 Cache Data Memory	L1 Cache Instruction Memory	Manufacturer Part Number	Maximum Clock Frequency	Maximum Operating Supply Voltage	Maximum Operating Temperature	Mfr	Minimum Operating Supply Voltage	Minimum Operating Temperature	Moisture Sensitive	Moisture Sensitivity Levels	Mounting Styles	MSL	Number of CPU Cores	Number of I/Os	Number of Logic Array Blocks - LABs	Number of Logic Elements	Operating Temperature-Max	Operating Temperature-Min	Package	Package Body Material	Package Code	Package Description	Package Equivalence Code	Package Shape	Package Style	Part Life Cycle Code	Product Status	Reflow Temperature-Max (s)	Risk Rank	RoHS	Rohs Code	Shipping Restrictions	Supply Voltage-Max	Supply Voltage-Min	Supply Voltage-Nom	Tradename	Typical Operating Supply Voltage	Usage Level	Operating Temperature	Packaging	Series	JESD-609 Code	Pbfree Code	Terminal Finish	Additional Feature	HTS Code	Technology	Terminal Position	Terminal Form	Peak Reflow Temperature (Cel)	Terminal Pitch	Reach Compliance Code	Time@Peak Reflow Temperature-Max (s)	Pin Count	JESD-30 Code	Number of Outputs	Qualification Status	Operating Supply Voltage	Power Supplies	Temperature Grade	Interface	Speed	RAM Size	Core Processor	Peripherals	Program Memory Size	Connectivity	Architecture	Data Bus Width	Number of Inputs	Seated Height-Max	Programmable Logic Type	Total RAM Bits	Screening Level	Speed Grade	Primary Attributes	Number of Logic Cells	Number of Cores	Flash Size	Device Core	Length	Width	Lead Free
	Mfr. Тип MPFS025TS-FCVG484I Anlielectronics Тип	Microchip Technology	SoC FPGA MPFS025TS-FCVG484I Сборник данных Сравнение	Min.:1 Mult.:1	-	484-BFBGA	-	484-FBGA (19x19)	-	-	RV64GC, RV64IMAC	-	1	-	-	-	-	4 x 32 kB	16 kB, 4 x 32 kB	-	667 MHz, 667 MHz	-	+ 100 C	Microchip Technology	-	- 40 C	-	-	SMD/SMT	-	-	108 I/O	-	23000 LE	-	-	Tray	-	-	-	-	-	-	-	Active	-	-	-	-	This product may require additional documentation to export from the United States.	-	-	-	-	-	-	-40°C ~ 100°C	Tray	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	1 V	-	-	-	-	230.4KB	RISC-V	DMA, PCI, PWM	-	CAN, Ethernet, I²C, MMC, QSPI, SPI, UART/USART, USB OTG	MPU, FPGA	-	-	-	-	-	-	-	FPGA - 23K Logic Modules	-	5 Core	128KB	-	-	-	-
MPFS025TS-FCVG484I Microchip Technology RoHS : Инкапсуляция : - Есть складские запасы : - 1 : -
	Mfr. Тип MPFS025TLS-FCSG325I Anlielectronics Тип	Microchip Technology	SoC FPGA MPFS025TLS-FCSG325I Сборник данных Сравнение	Min.:1 Mult.:1	-	325-TFBGA	-	325-BGA (11x11)	-	-	RV64GC, RV64IMAC	-	1	-	-	-	-	4 x 32 kB	16 kB, 4 x 32 kB	-	667 MHz, 667 MHz	-	+ 100 C	Microchip Technology	-	- 40 C	-	-	SMD/SMT	-	-	108 I/O	-	23000 LE	-	-	Tray	-	-	-	-	-	-	-	Active	-	-	-	-	This product may require additional documentation to export from the United States.	-	-	-	-	-	-	-40°C ~ 100°C	Tray	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	1 V	-	-	-	-	230.4KB	RISC-V	DMA, PCI, PWM	-	CAN, Ethernet, I²C, MMC, QSPI, SPI, UART/USART, USB OTG	MPU, FPGA	-	-	-	-	-	-	-	FPGA - 23K Logic Modules	-	5 Core	128KB	-	-	-	-
MPFS025TLS-FCSG325I Microchip Technology RoHS : Инкапсуляция : - Есть складские запасы : - 1 : -
	Mfr. Тип MPFS025TL-FCVG484I Anlielectronics Тип	Microchip Technology	SoC FPGA MPFS025TL-FCVG484I Сборник данных Сравнение	Min.:1 Mult.:1	-	484-BFBGA	-	484-FBGA (19x19)	-	-	RV64GC, RV64IMAC	-	1	-	-	-	-	4 x 32 kB	16 kB, 4 x 32 kB	-	667 MHz, 667 MHz	-	+ 100 C	Microchip Technology	-	- 40 C	-	-	SMD/SMT	-	-	108 I/O	-	23000 LE	-	-	Tray	-	-	-	-	-	-	-	Active	-	-	-	-	This product may require additional documentation to export from the United States.	-	-	-	-	-	-	-40°C ~ 100°C	Tray	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	1 V	-	-	-	-	230.4KB	RISC-V	DMA, PCI, PWM	-	CAN, Ethernet, I²C, MMC, QSPI, SPI, UART/USART, USB OTG	MPU, FPGA	-	-	-	-	-	-	-	FPGA - 23K Logic Modules	-	5 Core	128KB	-	-	-	-
MPFS025TL-FCVG484I Microchip Technology RoHS : Инкапсуляция : - Есть складские запасы : - 1 : -
	Mfr. Тип MPFS025T-FCSG325E Anlielectronics Тип	Microchip Technology	SoC FPGA MPFS025T-FCSG325E Сборник данных Сравнение	Min.:1 Mult.:1	-	FCSG-325	-	325-BGA (11x11)	-	-	RV64GC, RV64IMAC	-	1	-	-	-	-	4 x 32 kB	16 kB, 4 x 32 kB	-	667 MHz, 667 MHz	-	+ 100 C	Microchip Technology	-	0 C	-	-	SMD/SMT	MSL 3 - 168 hours	-	108 I/O	-	23000 LE	-	-	Tray	-	-	-	-	-	-	-	Active	-	-	-	-	-	-	-	-	-	-	-	0°C ~ 100°C	Tray	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	1 V	-	-	-	-	230.4KB	RISC-V	DMA, PCI, PWM	-	CAN, Ethernet, I²C, MMC, QSPI, SPI, UART/USART, USB OTG	MPU, FPGA	-	-	-	-	1843.2Kbit	-	-	FPGA - 23K Logic Modules	-	5 Core	128KB	-	-	-	-
MPFS025T-FCSG325E Microchip Technology RoHS : Инкапсуляция : - Есть складские запасы : - 1 : -
	Mfr. Тип M2S005S-1FG484I Anlielectronics Тип	Microchip Technology	SoC FPGA M2S005S-1FG484I Сборник данных Сравнение	Min.:1 Mult.:1	-	FPBGA-484	-	484-FPBGA (23x23)	-	M2S005	ARM Cortex M3	64 kB	60	-	-	-	-	-	-	-	166 MHz	-	-	Microchip Technology	-	-	Yes	-	SMD/SMT	-	-	209	505 LAB	6060 LE	-	-	Tray	-	-	-	-	-	-	-	Active	-	-	N	-	This product may require additional documentation to export from the United States.	-	-	-	-	1.2000 V	-	-40 to 100 °C	Tray	SmartFusion2	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	166MHz	64KB	ARM® Cortex®-M3	DDR	128 kB	CANbus, Ethernet, I²C, SPI, UART/USART, USB	MCU, FPGA	-	-	-	-	-	-	1	FPGA - 5K Logic Modules	-	1 Core	128KB	-	-	-	-
M2S005S-1FG484I Microchip Technology RoHS : Инкапсуляция : - Есть складские запасы : - 1 : -
	Mfr. Тип M2S060T-1FCS325 Anlielectronics Тип	Microchip Technology	SoC FPGA M2S060T-1FCS325 Сборник данных Сравнение	Min.:1 Mult.:1	Production (Last Updated: 2 months ago)	325-TFBGA, FCBGA	YES	325-FCBGA (11x11)	325	M2S060	ARM Cortex M3	64 kB	176	-	MICROSEMI CORP	-	-	-	-	M2S060T-1FCS325	166 MHz	-	-	Microchip Technology	-	-	Yes	-	-	-	-	200	4710 LAB	56520 LE	85 °C	-	Tray	PLASTIC/EPOXY	TFBGA	TFBGA, BGA325,21X21,20	BGA325,21X21,20	SQUARE	GRID ARRAY, THIN PROFILE, FINE PITCH	Active	Active	30	5.86	N	No	This product may require additional documentation to export from the United States.	1.26 V	1.14 V	1.2 V	SmartFusion2	-	-	0°C ~ 85°C (TJ)	Tray	SmartFusion2	e0	-	Tin/Lead (Sn/Pb)	LG-MIN, WD-MIN	8542.39.00.01	CMOS	BOTTOM	BALL	240	0.5 mm	not_compliant	-	-	S-PBGA-B325	200	Not Qualified	-	1.2 V	OTHER	-	166MHz	64KB	ARM® Cortex®-M3	DDR, PCIe, SERDES	256 kB	CANbus, Ethernet, I²C, SPI, UART/USART, USB	MCU, FPGA	-	200	1.01 mm	FIELD PROGRAMMABLE GATE ARRAY	-	-	-	FPGA - 60K Logic Modules	56520	1 Core	256KB	-	11 mm	11 mm	-
M2S060T-1FCS325 Microchip Technology RoHS : Инкапсуляция : - Есть складские запасы : - 1 : -
	Mfr. Тип M2S050-FCS325 Anlielectronics Тип	Microchip Technology	SoC FPGA M2S050-FCS325 Сборник данных Сравнение	Min.:1 Mult.:1	Production (Last Updated: 2 months ago)	325-TFBGA, FCBGA	YES	325-FCBGA (11x11)	325	M2S050	ARM Cortex M3	64 kB	176	-	MICROSEMI CORP	-	-	-	-	M2S050-FCS325	166 MHz	-	-	Microchip Technology	-	-	Yes	-	-	-	-	200	4695 LAB	56340 LE	85 °C	-	Tray	PLASTIC/EPOXY	TFBGA	FBGA-325	BGA325,21X21,20	SQUARE	GRID ARRAY, THIN PROFILE, FINE PITCH	Active	Active	30	5.81	N	No	This product may require additional documentation to export from the United States.	1.26 V	1.14 V	1.2 V	-	-	-	0°C ~ 85°C (TJ)	Tray	SmartFusion2	e0	-	Tin/Lead (Sn/Pb)	LG-MIN, WD-MIN	8542.39.00.01	CMOS	BOTTOM	BALL	240	0.5 mm	not_compliant	-	-	S-PBGA-B325	200	Not Qualified	-	1.2 V	OTHER	-	166MHz	64KB	ARM® Cortex®-M3	DDR, PCIe, SERDES	256 kB	CANbus, Ethernet, I²C, SPI, UART/USART, USB	MCU, FPGA	-	200	1.01 mm	FIELD PROGRAMMABLE GATE ARRAY	-	-	-	FPGA - 50K Logic Modules	56340	1 Core	256KB	-	11 mm	11 mm	Contains Lead
M2S050-FCS325 Microchip Technology RoHS : Инкапсуляция : - Есть складские запасы : - 1 : -
	Mfr. Тип M2S050-VFG400I Anlielectronics Тип	Microchip Technology	SoC FPGA M2S050-VFG400I Сборник данных Сравнение	Min.:1 Mult.:1	-	VFPBGA-400	YES	400-VFBGA (17x17)	400	M2S050	ARM Cortex M3	64 kB	90	-	MICROSEMI CORP	-	-	-	-	M2S050-VFG400I	166 MHz	-	-	Microchip Technology	-	-	Yes	3	SMD/SMT	-	-	207	4695 LAB	56340 LE	-	-	Tray	PLASTIC/EPOXY	LFBGA	LFBGA, BGA400,20X20,32	BGA400,20X20,32	SQUARE	GRID ARRAY, LOW PROFILE, FINE PITCH	Active	Active	40	5.76	Details	Yes	This product may require additional documentation to export from the United States.	1.26 V	1.14 V	1.2 V	-	-	-	-40°C ~ 100°C (TJ)	Tray	SmartFusion2	e1	-	Tin/Silver/Copper (Sn/Ag/Cu)	-	8542.39.00.01	CMOS	BOTTOM	BALL	250	0.8 mm	compliant	-	-	S-PBGA-B400	207	Not Qualified	-	1.2 V	-	-	166MHz	64KB	ARM® Cortex®-M3	DDR, PCIe, SERDES	256 kB	CANbus, Ethernet, I²C, SPI, UART/USART, USB	MCU, FPGA	-	207	1.51 mm	FIELD PROGRAMMABLE GATE ARRAY	-	-	-	FPGA - 50K Logic Modules	56340	1 Core	256KB	-	17 mm	17 mm	-
M2S050-VFG400I Microchip Technology RoHS : Инкапсуляция : - Есть складские запасы : - 1 : -
	Mfr. Тип M2S005-1VFG400I Anlielectronics Тип	Microchip Technology	SoC FPGA M2S005-1VFG400I Сборник данных Сравнение	Min.:1 Mult.:1	-	VFPBGA-400	YES	400-VFBGA (17x17)	400	M2S005	ARM Cortex M3	64 kB	90	-	MICROSEMI CORP	-	-	-	-	M2S005-1VFG400I	166 MHz	1.26 V	-	Microchip Technology	1.14 V	-	Yes	3	SMD/SMT	-	-	169	505 LAB	6060 LE	-	-	Tray	PLASTIC/EPOXY	LFBGA	VFBGA-400	BGA400,20X20,32	SQUARE	GRID ARRAY, LOW PROFILE, FINE PITCH	Active	Active	40	5.79	Details	Yes	This product may require additional documentation to export from the United States.	1.26 V	1.14 V	1.2 V	-	1.2000 V	-	-40 to 100 °C	Tray	SmartFusion2	e1	-	Tin/Silver/Copper (Sn/Ag/Cu)	-	8542.39.00.01	CMOS	BOTTOM	BALL	250	0.8 mm	compliant	-	-	S-PBGA-B400	171	Not Qualified	-	1.2 V	-	-	166MHz	64KB	ARM® Cortex®-M3	DDR	128 kB	CANbus, Ethernet, I²C, SPI, UART/USART, USB	MCU, FPGA	-	171	1.51 mm	FIELD PROGRAMMABLE GATE ARRAY	-	-	1	FPGA - 5K Logic Modules	6060	1 Core	128KB	-	17 mm	17 mm	-
M2S005-1VFG400I Microchip Technology RoHS : Инкапсуляция : - Есть складские запасы : - 1 : -
	Mfr. Тип M2S060T-FGG676I Anlielectronics Тип	Microchip Technology	SoC FPGA M2S060T-FGG676I Сборник данных Сравнение	Min.:1 Mult.:1	Production (Last Updated: 2 months ago)	676-BGA	-	676-FBGA (27x27)	-	M2S060	ARM Cortex M3	64 kB	40	-	-	-	-	-	-	-	166 MHz	-	-	Microchip Technology	-	-	Yes	-	-	-	-	387	4710 LAB	56520 LE	-	-	Tray	-	-	-	-	-	-	-	Active	-	-	Details	-	This product may require additional documentation to export from the United States.	-	-	-	SmartFusion2	-	-	-40°C ~ 100°C (TJ)	Tray	SmartFusion2	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	166MHz	64KB	ARM® Cortex®-M3	DDR, PCIe, SERDES	256 kB	CANbus, Ethernet, I²C, SPI, UART/USART, USB	MCU, FPGA	-	-	-	-	-	-	-	FPGA - 60K Logic Modules	-	1 Core	256KB	-	-	-	-
M2S060T-FGG676I Microchip Technology RoHS : Инкапсуляция : - Есть складские запасы : - 1 : -
	Mfr. Тип M2S050TS-1FGG484 Anlielectronics Тип	Microchip Technology	SoC FPGA M2S050TS-1FGG484 Сборник данных Сравнение	Min.:1 Mult.:1	Production (Last Updated: 2 months ago)	FPBGA-484	-	484-FPBGA (23x23)	-	M2S050	ARM Cortex M3	64 kB	60	-	-	-	-	-	-	-	166 MHz	-	-	Microchip Technology	-	-	Yes	-	SMD/SMT	-	-	267	4695 LAB	56340 LE	-	-	Tray	-	-	-	-	-	-	-	Active	-	-	Details	-	This product may require additional documentation to export from the United States.	-	-	-	-	-	-	0°C ~ 85°C (TJ)	Tray	SmartFusion2	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	166MHz	64KB	ARM® Cortex®-M3	DDR, PCIe, SERDES	256 kB	CANbus, Ethernet, I²C, SPI, UART/USART, USB	MCU, FPGA	-	-	-	-	-	-	-	FPGA - 50K Logic Modules	-	1 Core	256KB	-	-	-	-
M2S050TS-1FGG484 Microchip Technology RoHS : Инкапсуляция : - Есть складские запасы : - 1 : -
	Mfr. Тип M2S150TS-FCG1152 Anlielectronics Тип	Microchip Technology	SoC FPGA M2S150TS-FCG1152 Сборник данных Сравнение	Min.:1 Mult.:1	-	1152-BBGA, FCBGA	YES	1152-FCBGA (35x35)	1152	M2S150	ARM Cortex M3	64 kB	24	-	MICROSEMI CORP	-	-	-	-	M2S150TS-FCG1152	166 MHz	-	-	Microchip Technology	-	-	Yes	4	-	-	-	574	12177 LAB	146124 LE	85 °C	-	Tray	PLASTIC/EPOXY	BGA	BGA, BGA1152,34X34,40	BGA1152,34X34,40	SQUARE	GRID ARRAY	Active	Active	-	5.8	Details	Yes	This product may require additional documentation to export from the United States.	1.26 V	1.14 V	1.2 V	-	-	-	0°C ~ 85°C (TJ)	Tray	SmartFusion2	e1	-	Tin/Silver/Copper (Sn/Ag/Cu)	-	-	CMOS	BOTTOM	BALL	250	1 mm	compliant	40	-	S-PBGA-B1152	574	Not Qualified	-	1.2 V	OTHER	-	166MHz	64KB	ARM® Cortex®-M3	DDR, PCIe, SERDES	512 kB	CANbus, Ethernet, I²C, SPI, UART/USART, USB	MCU, FPGA	-	574	2.9 mm	FIELD PROGRAMMABLE GATE ARRAY	-	-	STD	FPGA - 150K Logic Modules	146124	1 Core	512KB	-	35 mm	35 mm	-
M2S150TS-FCG1152 Microchip Technology RoHS : Инкапсуляция : - Есть складские запасы : - 1 : -
	Mfr. Тип M2S050T-1FCS325I Anlielectronics Тип	Microchip Technology	SoC FPGA M2S050T-1FCS325I Сборник данных Сравнение	Min.:1 Mult.:1	Production (Last Updated: 2 months ago)	FCBGA-325	YES	325-FCBGA (11x11)	325	M2S050	ARM Cortex M3	64 kB	176	-	MICROSEMI CORP	-	-	-	-	M2S050T-1FCS325I	166 MHz	-	-	Microchip Technology	-	-	Yes	-	SMD/SMT	-	-	200	4695 LAB	56340 LE	-	-	Tray	PLASTIC/EPOXY	TFBGA	FBGA-325	BGA325,21X21,20	SQUARE	GRID ARRAY, THIN PROFILE, FINE PITCH	Active	Active	30	5.81	N	No	This product may require additional documentation to export from the United States.	1.26 V	1.14 V	1.2 V	-	-	-	-40°C ~ 100°C (TJ)	Tray	SmartFusion2	e0	-	Tin/Lead (Sn/Pb)	LG-MIN, WD-MIN	8542.39.00.01	CMOS	BOTTOM	BALL	240	0.5 mm	not_compliant	-	-	S-PBGA-B325	200	Not Qualified	-	1.2 V	-	-	166MHz	64KB	ARM® Cortex®-M3	DDR, PCIe, SERDES	256 kB	CANbus, Ethernet, I²C, SPI, UART/USART, USB	MCU, FPGA	-	200	1.01 mm	FIELD PROGRAMMABLE GATE ARRAY	-	-	-	FPGA - 50K Logic Modules	56340	1 Core	256KB	-	11 mm	11 mm	-
M2S050T-1FCS325I Microchip Technology RoHS : Инкапсуляция : - Есть складские запасы : - 1 : -
	Mfr. Тип M2S010TS-1VF400 Anlielectronics Тип	Microchip Technology	SoC FPGA M2S010TS-1VF400 Сборник данных Сравнение	Min.:1 Mult.:1	Production (Last Updated: 1 month ago)	VFPBGA-400	YES	400-VFBGA (17x17)	400	M2S010	ARM Cortex M3	64 kB	90	-	MICROSEMI CORP	-	-	-	-	M2S010TS-1VF400	166 MHz	-	-	Microchip Technology	-	-	Yes	-	SMD/SMT	-	-	195	1007 LAB	12084 LE	85 °C	-	Tray	PLASTIC/EPOXY	LFBGA	LFBGA, BGA400,20X20,32	BGA400,20X20,32	SQUARE	GRID ARRAY, LOW PROFILE, FINE PITCH	Active	Active	30	5.88	N	No	This product may require additional documentation to export from the United States.	1.26 V	1.14 V	1.2 V	-	-	-	0°C ~ 85°C (TJ)	Tray	SmartFusion2	e0	-	Tin/Lead (Sn/Pb)	-	8542.39.00.01	CMOS	BOTTOM	BALL	240	0.8 mm	not_compliant	-	-	S-PBGA-B400	195	Not Qualified	-	1.2 V	OTHER	-	166MHz	64KB	ARM® Cortex®-M3	DDR, PCIe, SERDES	256 kB	CANbus, Ethernet, I²C, SPI, UART/USART, USB	MCU, FPGA	-	195	1.51 mm	FIELD PROGRAMMABLE GATE ARRAY	-	-	-	FPGA - 10K Logic Modules	12084	1 Core	256KB	-	17 mm	17 mm	-
M2S010TS-1VF400 Microchip Technology RoHS : Инкапсуляция : - Есть складские запасы : - 1 : -
	Mfr. Тип M2S025T-FCS325I Anlielectronics Тип	Microchip Technology	SoC FPGA M2S025T-FCS325I Сборник данных Сравнение	Min.:1 Mult.:1	Production (Last Updated: 2 months ago)	FCBGA-325	YES	325-FCBGA (11x11)	325	M2S025	ARM Cortex M3	64 kB	176	-	MICROSEMI CORP	-	-	-	-	M2S025T-FCS325I	166 MHz	-	-	Microchip Technology	-	-	Yes	-	SMD/SMT	MSL 3 - 168 hours	-	180	2308 LAB	27696 LE	-	-	Tray	PLASTIC/EPOXY	TFBGA	FBGA-325	BGA325,21X21,20	SQUARE	GRID ARRAY, THIN PROFILE, FINE PITCH	Active	Active	30	5.84	N	No	This product may require additional documentation to export from the United States.	1.26 V	1.14 V	1.2 V	-	-	-	-40°C ~ 100°C (TJ)	Tray	SmartFusion2	e0	-	Tin/Lead (Sn/Pb)	LG-MIN, WD-MIN	8542.39.00.01	CMOS	BOTTOM	BALL	240	0.5 mm	not_compliant	-	-	S-PBGA-B325	180	Not Qualified	-	1.2 V	-	-	166MHz	64KB	ARM® Cortex®-M3	DDR, PCIe, SERDES	256 kB	CANbus, Ethernet, I²C, SPI, UART/USART, USB	MCU, FPGA	-	180	1.01 mm	FIELD PROGRAMMABLE GATE ARRAY	592Kbit	-	-	FPGA - 25K Logic Modules	27696	1 Core	256KB	-	11 mm	11 mm	-
M2S025T-FCS325I Microchip Technology RoHS : Инкапсуляция : - Есть складские запасы : - 1 : -
	Mfr. Тип M2S050-FCSG325I Anlielectronics Тип	Microchip Technology	SoC FPGA M2S050-FCSG325I Сборник данных Сравнение	Min.:1 Mult.:1	Production (Last Updated: 2 months ago)	FCBGA-325	YES	325-FCBGA (11x11)	325	M2S050	ARM Cortex M3	64 kB	176	-	MICROSEMI CORP	-	-	-	-	M2S050-FCSG325I	166 MHz	-	-	Microchip Technology	-	-	Yes	3	SMD/SMT	-	-	200	4695 LAB	56340 LE	-	-	Tray	PLASTIC/EPOXY	TFBGA	FBGA-325	BGA325,21X21,20	SQUARE	GRID ARRAY, THIN PROFILE, FINE PITCH	Active	Active	40	5.76	Details	Yes	This product may require additional documentation to export from the United States.	1.26 V	1.14 V	1.2 V	-	1.2000 V	-	-40 to 100 °C	Tray	SmartFusion2	e1	-	Tin/Silver/Copper (Sn/Ag/Cu)	LG-MIN, WD-MIN	8542.39.00.01	CMOS	BOTTOM	BALL	250	0.5 mm	compliant	-	-	S-PBGA-B325	200	Not Qualified	-	1.2 V	-	-	166MHz	64KB	ARM® Cortex®-M3	DDR, PCIe, SERDES	256 kB	CANbus, Ethernet, I²C, SPI, UART/USART, USB	MCU, FPGA	-	200	1.01 mm	FIELD PROGRAMMABLE GATE ARRAY	-	-	STD	FPGA - 50K Logic Modules	56340	1 Core	256KB	-	11 mm	11 mm	-
M2S050-FCSG325I Microchip Technology RoHS : Инкапсуляция : - Есть складские запасы : - 1 : -
	Mfr. Тип M2S005-1VFG400 Anlielectronics Тип	Microchip Technology	SoC FPGA M2S005-1VFG400 Сборник данных Сравнение	Min.:1 Mult.:1	-	VFPBGA-400	-	400-VFBGA (17x17)	-	M2S005	ARM Cortex M3	64 kB	90	-	-	-	-	-	-	-	166 MHz	-	-	Microchip Technology	-	-	Yes	-	SMD/SMT	-	-	169	505 LAB	6060 LE	-	-	Tray	-	-	-	-	-	-	-	Active	-	-	Details	-	This product may require additional documentation to export from the United States.	-	-	-	-	-	-	0°C ~ 85°C (TJ)	Tray	SmartFusion2	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	166MHz	64KB	ARM® Cortex®-M3	DDR	128 kB	CANbus, Ethernet, I²C, SPI, UART/USART, USB	MCU, FPGA	-	-	-	-	-	-	-	FPGA - 5K Logic Modules	-	1 Core	128KB	-	-	-	-
M2S005-1VFG400 Microchip Technology RoHS : Инкапсуляция : - Есть складские запасы : - 1 : -
	Mfr. Тип M2S050TS-1VFG400I Anlielectronics Тип	Microchip Technology	SoC FPGA M2S050TS-1VFG400I Сборник данных Сравнение	Min.:1 Mult.:1	-	VFPBGA-400	YES	400-VFBGA (17x17)	400	M2S050	ARM Cortex M3	64 kB	90	-	MICROSEMI CORP	-	-	-	-	M2S050TS-1VFG400I	166 MHz	-	-	Microchip Technology	-	-	Yes	3	SMD/SMT	-	-	207	4695 LAB	56340 LE	-	-	Tray	PLASTIC/EPOXY	LFBGA	VFBGA-400	BGA400,20X20,32	SQUARE	GRID ARRAY, LOW PROFILE, FINE PITCH	Active	Active	40	5.76	Details	Yes	This product may require additional documentation to export from the United States.	1.26 V	1.14 V	1.2 V	-	-	-	-40°C ~ 100°C (TJ)	Tray	SmartFusion2	e1	-	Tin/Silver/Copper (Sn/Ag/Cu)	-	8542.39.00.01	CMOS	BOTTOM	BALL	250	0.8 mm	compliant	-	-	S-PBGA-B400	207	Not Qualified	-	1.2 V	-	-	166MHz	64KB	ARM® Cortex®-M3	DDR, PCIe, SERDES	256 kB	CANbus, Ethernet, I²C, SPI, UART/USART, USB	MCU, FPGA	-	207	1.51 mm	FIELD PROGRAMMABLE GATE ARRAY	-	-	1	FPGA - 50K Logic Modules	56340	1 Core	256KB	-	17 mm	17 mm	-
M2S050TS-1VFG400I Microchip Technology RoHS : Инкапсуляция : - Есть складские запасы : - 1 : -
	Mfr. Тип M2S150TS-FCSG536I Anlielectronics Тип	Microchip Technology	SoC FPGA M2S150TS-FCSG536I Сборник данных Сравнение	Min.:1 Mult.:1	-	536-LFBGA, CSPBGA	YES	536-CSPBGA (16x16)	536	M2S150	ARM Cortex M3	64 kB	90	1.2, 1.5, 1.8, 2.5, 3.3 V	MICROSEMI CORP	RISC	Yes	-	-	M2S150TS-FCSG536I	166 MHz	-	-	Microchip Technology	-	-	Yes	3	-	-	1	293	12177 LAB	146124 LE	100 °C	-40 °C	Tray	PLASTIC/EPOXY	BGA	FBGA-536	-	SQUARE	GRID ARRAY	Active	Active	40	5.81	Details	Yes	This product may require additional documentation to export from the United States.	1.26 V	1.14 V	1.2 V	-	-	Industrial grade	-40 to 100 °C	Tray	SmartFusion2	e1	Yes	Tin/Silver/Copper (Sn/Ag/Cu)	-	8542.39.00.01	-	BOTTOM	BALL	250	-	compliant	-	536	S-PBGA-B536	-	-	1.2 V	-	INDUSTRIAL	CAN/Ethernet/Serial	166MHz	64 KB	ARM® Cortex®-M3	DDR, PCIe, SERDES	512 kB	CANbus, Ethernet, I²C, SPI, UART/USART, USB	MCU, FPGA	32 Bit	-	-	FIELD PROGRAMMABLE GATE ARRAY	-	Industrial	-	FPGA - 150K Logic Modules	-	1 Core	512KB	ARM Cortex-M3	-	-	-
M2S150TS-FCSG536I Microchip Technology RoHS : Инкапсуляция : - Есть складские запасы : - 1 : -
	Mfr. Тип M2S050T-1VF400 Anlielectronics Тип	Microchip Technology	SoC FPGA M2S050T-1VF400 Сборник данных Сравнение	Min.:1 Mult.:1	-	VFPBGA-400	-	400-VFBGA (17x17)	-	M2S050	ARM Cortex M3	64 kB	90	-	-	-	-	-	-	-	166 MHz	1.26 V	-	Microchip Technology	1.14 V	-	Yes	-	SMD/SMT	-	-	207	4695 LAB	56340 LE	-	-	Tray	-	-	-	-	-	-	-	Active	-	-	N	-	This product may require additional documentation to export from the United States.	-	-	-	-	1.2000 V	-	0 to 85 °C	Tray	SmartFusion2	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	166MHz	64KB	ARM® Cortex®-M3	DDR, PCIe, SERDES	256 kB	CANbus, Ethernet, I²C, SPI, UART/USART, USB	MCU, FPGA	-	-	-	-	-	-	1	FPGA - 50K Logic Modules	-	1 Core	256KB	-	-	-	-
M2S050T-1VF400 Microchip Technology RoHS : Инкапсуляция : - Есть складские запасы : - 1 : -

Integrated Circuits (ICs)

Embedded - System On Chip (SoC) definition: A System On Chip (SoC) combines the required electronic circuits of various computer components onto a single, integrated chip (IC). SoC is ... Embedded - System On Chip (SoC) Product Listing: MPFS025TS-FCVG484I,MPFS025TLS-FCSG325I,MPFS025TL-FCVG484I,MPFS025T-FCSG325E,M2S005S-1FG484I.Integrated Circuits (ICs) type:Embedded - Microcontrollers(129432),Memory(111901),PMIC - Supervisors(101743),PMIC - Voltage Regulators - Linear(101187),PMIC - Voltage Regulators - DC DC Switching Regulators(62822) .Embedded - System On Chip (SoC) has 873 pieces of spot stock price information, you can click the "RFQ" button to confirm the inventory and price with the Anli.

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Integrated Circuits (ICs)