Embedded - System On Chip (SoC) Products For Sale - PDF - Integrated Circuits (ICs) -Page27

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Embedded - System On Chip (SoC)

Изображение	Тип	Марка	Объяснение	Установленная цена	Количество	RoHS	Lifecycle Status	Package / Case	Surface Mount	Number of Pins	Supplier Device Package	Number of Terminals	Base Product Number	Clock Frequency-Max	Core	Data RAM Size	Device Logic Gates	Factory Pack QuantityFactory Pack Quantity	Ihs Manufacturer	L1 Cache Data Memory	L1 Cache Instruction Memory	Manufacturer Part Number	Maximum Clock Frequency	Maximum Operating Supply Voltage	Mfr	Minimum Operating Supply Voltage	Moisture Sensitive	Moisture Sensitivity Levels	Mounting Styles	Number of I/Os	Number of Logic Array Blocks - LABs	Number of Logic Elements	Operating Temperature-Max	Package	Package Body Material	Package Code	Package Description	Package Equivalence Code	Package Shape	Package Style	Part Life Cycle Code	Product Status	Reflow Temperature-Max (s)	Risk Rank	RoHS	Rohs Code	Schedule B	Shipping Restrictions	Supply Voltage-Max	Supply Voltage-Min	Supply Voltage-Nom	Tradename	Typical Operating Supply Voltage	Unit Weight	Operating Temperature	Packaging	Series	JESD-609 Code	Terminal Finish	Max Operating Temperature	Min Operating Temperature	Additional Feature	HTS Code	Technology	Terminal Position	Terminal Form	Peak Reflow Temperature (Cel)	Terminal Pitch	Reach Compliance Code	Frequency	JESD-30 Code	Number of Outputs	Qualification Status	Power Supplies	Temperature Grade	Interface	Speed	RAM Size	Core Processor	Peripherals	Program Memory Size	Connectivity	Architecture	Number of Inputs	Organization	Seated Height-Max	Programmable Logic Type	Core Architecture	Speed Grade	Primary Attributes	Number of CLBs	Number of Logic Cells	Number of Cores	Flash Size	Length	Width	Lead Free

Изображение	Тип	Марка	Объяснение	Количество	Lifecycle Status	Package / Case	Surface Mount	Number of Pins	Supplier Device Package	Number of Terminals	Base Product Number	Clock Frequency-Max	Core	Data RAM Size	Device Logic Gates	Factory Pack QuantityFactory Pack Quantity	Ihs Manufacturer	L1 Cache Data Memory	L1 Cache Instruction Memory	Manufacturer Part Number	Maximum Clock Frequency	Maximum Operating Supply Voltage	Mfr	Minimum Operating Supply Voltage	Moisture Sensitive	Moisture Sensitivity Levels	Mounting Styles	Number of I/Os	Number of Logic Array Blocks - LABs	Number of Logic Elements	Operating Temperature-Max	Package	Package Body Material	Package Code	Package Description	Package Equivalence Code	Package Shape	Package Style	Part Life Cycle Code	Product Status	Reflow Temperature-Max (s)	Risk Rank	RoHS	Rohs Code	Schedule B	Shipping Restrictions	Supply Voltage-Max	Supply Voltage-Min	Supply Voltage-Nom	Tradename	Typical Operating Supply Voltage	Unit Weight	Operating Temperature	Packaging	Series	JESD-609 Code	Terminal Finish	Max Operating Temperature	Min Operating Temperature	Additional Feature	HTS Code	Technology	Terminal Position	Terminal Form	Peak Reflow Temperature (Cel)	Terminal Pitch	Reach Compliance Code	Frequency	JESD-30 Code	Number of Outputs	Qualification Status	Power Supplies	Temperature Grade	Interface	Speed	RAM Size	Core Processor	Peripherals	Program Memory Size	Connectivity	Architecture	Number of Inputs	Organization	Seated Height-Max	Programmable Logic Type	Core Architecture	Speed Grade	Primary Attributes	Number of CLBs	Number of Logic Cells	Number of Cores	Flash Size	Length	Width	Lead Free
	Mfr. Тип M2S050T-FCS325I Anlielectronics Тип	Microchip Technology	SoC FPGA M2S050T-FCS325I Сборник данных Сравнение	Min.:1 Mult.:1	Production (Last Updated: 2 months ago)	FCBGA-325	YES	-	325-FCBGA (11x11)	325	M2S050	-	ARM Cortex M3	64 kB	-	176	MICROSEMI CORP	-	-	M2S050T-FCS325I	166 MHz	-	Microchip Technology	-	Yes	-	SMD/SMT	200	4695 LAB	56340 LE	-	Tray	PLASTIC/EPOXY	TFBGA	TFBGA, BGA325,21X21,20	BGA325,21X21,20	SQUARE	GRID ARRAY, THIN PROFILE, FINE PITCH	Active	Active	30	5.81	N	No	-	This product may require additional documentation to export from the United States.	1.26 V	1.14 V	1.2 V	-	-	-	-40°C ~ 100°C (TJ)	Tray	SmartFusion2	e0	Tin/Lead (Sn/Pb)	-	-	LG-MIN, WD-MIN	8542.39.00.01	CMOS	BOTTOM	BALL	240	0.5 mm	not_compliant	-	S-PBGA-B325	200	Not Qualified	1.2 V	-	-	166MHz	64KB	ARM® Cortex®-M3	DDR, PCIe, SERDES	256 kB	CANbus, Ethernet, I²C, SPI, UART/USART, USB	MCU, FPGA	200	-	1.01 mm	FIELD PROGRAMMABLE GATE ARRAY	-	-	FPGA - 50K Logic Modules	-	56340	1 Core	256KB	11 mm	11 mm	-
M2S050T-FCS325I Microchip Technology RoHS : Инкапсуляция : - Есть складские запасы : - 1 : -
	Mfr. Тип M2S050TS-FGG896 Anlielectronics Тип	Microchip Technology	SoC FPGA M2S050TS-FGG896 Сборник данных Сравнение	Min.:1 Mult.:1	Production (Last Updated: 2 months ago)	896-BGA	-	-	896-FBGA (31x31)	-	M2S050	-	ARM Cortex M3	64 kB	-	27	-	-	-	-	166 MHz	-	Microchip Technology	-	Yes	-	-	377	4695 LAB	56340 LE	-	Tray	-	-	-	-	-	-	-	Active	-	-	Details	-	-	This product may require additional documentation to export from the United States.	-	-	-	-	-	-	0°C ~ 85°C (TJ)	Tray	SmartFusion2	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	166MHz	64KB	ARM® Cortex®-M3	DDR, PCIe, SERDES	256 kB	CANbus, Ethernet, I²C, SPI, UART/USART, USB	MCU, FPGA	-	-	-	-	-	-	FPGA - 50K Logic Modules	-	-	1 Core	256KB	-	-	-
M2S050TS-FGG896 Microchip Technology RoHS : Инкапсуляция : - Есть складские запасы : - 1 : -
	Mfr. Тип M2S005S-FGG484I Anlielectronics Тип	Microchip Technology	SoC FPGA M2S005S-FGG484I Сборник данных Сравнение	Min.:1 Mult.:1	-	FPBGA-484	-	-	484-FPBGA (23x23)	-	M2S005	-	ARM Cortex M3	64 kB	-	60	-	-	-	-	166 MHz	-	Microchip Technology	-	Yes	-	SMD/SMT	209	505 LAB	6060 LE	-	Tray	-	-	-	-	-	-	-	Active	-	-	Details	-	-	This product may require additional documentation to export from the United States.	-	-	-	-	-	-	-40°C ~ 100°C (TJ)	Tray	SmartFusion2	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	166MHz	64KB	ARM® Cortex®-M3	DDR	128 kB	CANbus, Ethernet, I²C, SPI, UART/USART, USB	MCU, FPGA	-	-	-	-	-	-	FPGA - 5K Logic Modules	-	-	1 Core	128KB	-	-	-
M2S005S-FGG484I Microchip Technology RoHS : Инкапсуляция : - Есть складские запасы : - 1 : -
	Mfr. Тип M2S050-FG896I Anlielectronics Тип	Microchip Technology	SoC FPGA M2S050-FG896I Сборник данных Сравнение	Min.:1 Mult.:1	Production (Last Updated: 2 months ago)	FPBGA-896	YES	-	896-FBGA (31x31)	896	M2S050	50 MHz	ARM Cortex M3	64 kB	-	27	MICROSEMI CORP	-	-	M2S050-FG896I	166 MHz	-	Microchip Technology	-	Yes	3	SMD/SMT	377	4695 LAB	56340 LE	-	Tray	PLASTIC/EPOXY	BGA	FBGA-896	BGA896,30X30,40	SQUARE	GRID ARRAY	Active	Active	30	5.26	N	No	-	This product may require additional documentation to export from the United States.	1.26 V	1.14 V	1.2 V	-	-	-	-40°C ~ 100°C (TJ)	Tray	SmartFusion2	e0	Tin/Lead (Sn/Pb)	-	-	-	8542.39.00.01	CMOS	BOTTOM	BALL	240	1 mm	not_compliant	-	S-PBGA-B896	377	Not Qualified	1.2 V	-	-	166MHz	64KB	ARM® Cortex®-M3	DDR, PCIe, SERDES	256 kB	CANbus, Ethernet, I²C, SPI, UART/USART, USB	MCU, FPGA	377	48672 CLBS	2.44 mm	FIELD PROGRAMMABLE GATE ARRAY	-	-	FPGA - 50K Logic Modules	48672	56340	1 Core	256KB	31 mm	31 mm	-
M2S050-FG896I Microchip Technology RoHS : Инкапсуляция : - Есть складские запасы : - 1 : -
	Mfr. Тип M2S060TS-1FCS325 Anlielectronics Тип	Microchip Technology	SoC FPGA M2S060TS-1FCS325 Сборник данных Сравнение	Min.:1 Mult.:1	Production (Last Updated: 2 months ago)	325-TFBGA, FCBGA	YES	-	325-FCBGA (11x11)	325	M2S060	-	ARM Cortex M3	64 kB	-	176	MICROSEMI CORP	-	-	M2S060TS-1FCS325	166 MHz	-	Microchip Technology	-	Yes	-	-	200	4710 LAB	56520 LE	85 °C	Tray	PLASTIC/EPOXY	TFBGA	FBGA-325	BGA325,21X21,20	SQUARE	GRID ARRAY, THIN PROFILE, FINE PITCH	Active	Active	30	5.88	N	No	-	This product may require additional documentation to export from the United States.	1.26 V	1.14 V	1.2 V	SmartFusion2	-	-	0°C ~ 85°C (TJ)	Tray	SmartFusion2	e0	Tin/Lead (Sn/Pb)	-	-	LG-MIN, WD-MIN	8542.39.00.01	CMOS	BOTTOM	BALL	240	0.5 mm	not_compliant	-	S-PBGA-B325	200	Not Qualified	1.2 V	OTHER	-	166MHz	64KB	ARM® Cortex®-M3	DDR, PCIe, SERDES	256 kB	CANbus, Ethernet, I²C, SPI, UART/USART, USB	MCU, FPGA	200	-	1.01 mm	FIELD PROGRAMMABLE GATE ARRAY	-	-	FPGA - 60K Logic Modules	-	56520	1 Core	256KB	11 mm	11 mm	-
M2S060TS-1FCS325 Microchip Technology RoHS : Инкапсуляция : - Есть складские запасы : - 1 : -
	Mfr. Тип M2S090TS-1FGG484 Anlielectronics Тип	Microchip Technology	SoC FPGA M2S090TS-1FGG484 Сборник данных Сравнение	Min.:1 Mult.:1	-	FPBGA-484	-	-	484-FPBGA (23x23)	-	M2S090	-	ARM Cortex M3	64 kB	-	60	-	-	-	-	166 MHz	1.26 V	Microchip Technology	1.14 V	Yes	-	SMD/SMT	267	7193 LAB	86316 LE	-	Tray	-	-	-	-	-	-	-	Active	-	-	Details	-	-	This product may require additional documentation to export from the United States.	-	-	-	-	1.2 V	-	0 to 85 °C	Tray	SmartFusion2	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	166MHz	64KB	ARM® Cortex®-M3	DDR, PCIe, SERDES	512 kB	CANbus, Ethernet, I²C, SPI, UART/USART, USB	MCU, FPGA	-	-	-	-	-	1	FPGA - 90K Logic Modules	-	-	1 Core	512KB	-	-	-
M2S090TS-1FGG484 Microchip Technology RoHS : Инкапсуляция : - Есть складские запасы : - 1 : -
	Mfr. Тип M2S150-1FCVG484I Anlielectronics Тип	Microchip Technology	SoC FPGA M2S150-1FCVG484I Сборник данных Сравнение	Min.:1 Mult.:1	-	484-BFBGA	YES	-	484-FBGA (19x19)	484	M2S150	-	ARM Cortex M3	64 kB	-	84	MICROSEMI CORP	-	-	M2S150-1FCVG484I	166 MHz	-	Microchip Technology	-	Yes	4	-	273	12177 LAB	146124 LE	-	Tray	PLASTIC/EPOXY	FBGA	VFBGA-484	BGA484,22X22,32	SQUARE	GRID ARRAY, FINE PITCH	Active	Active	40	5.77	Details	Yes	-	This product may require additional documentation to export from the United States.	1.26 V	1.14 V	1.2 V	-	-	-	-40°C ~ 100°C (TJ)	Tray	SmartFusion2	e1	Tin/Silver/Copper (Sn/Ag/Cu)	-	-	LG-MIN, WD-MIN	8542.39.00.01	CMOS	BOTTOM	BALL	250	0.8 mm	compliant	-	S-PBGA-B484	273	Not Qualified	1.2 V	-	-	166MHz	64KB	ARM® Cortex®-M3	DDR, PCIe, SERDES	512 kB	CANbus, Ethernet, I²C, SPI, UART/USART, USB	MCU, FPGA	273	-	3.15 mm	FIELD PROGRAMMABLE GATE ARRAY	-	-	FPGA - 150K Logic Modules	-	146124	1 Core	512KB	19 mm	19 mm	-
M2S150-1FCVG484I Microchip Technology RoHS : Инкапсуляция : - Есть складские запасы : - 1 : -
	Mfr. Тип M2S090-1FGG676I Anlielectronics Тип	Microchip Technology	SoC FPGA M2S090-1FGG676I Сборник данных Сравнение	Min.:1 Mult.:1	-	BGA-676	-	-	676-FBGA (27x27)	-	M2S090	-	ARM Cortex M3	64 kB	-	40	-	-	-	-	166 MHz	-	Microchip Technology	-	Yes	-	SMD/SMT	425	7193 LAB	86316 LE	-	Tray	-	-	-	-	-	-	-	Active	-	-	N	-	-	This product may require additional documentation to export from the United States.	-	-	-	-	-	-	-40°C ~ 100°C (TJ)	Tray	SmartFusion2	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	166MHz	64KB	ARM® Cortex®-M3	DDR, PCIe, SERDES	512 kB	CANbus, Ethernet, I²C, SPI, UART/USART, USB	MCU, FPGA	-	-	-	-	-	-	FPGA - 90K Logic Modules	-	-	1 Core	512KB	-	-	-
M2S090-1FGG676I Microchip Technology RoHS : Инкапсуляция : - Есть складские запасы : - 1 : -
	Mfr. Тип M2S050T-VF400 Anlielectronics Тип	Microchip Technology	SoC FPGA M2S050T-VF400 Сборник данных Сравнение	Min.:1 Mult.:1	-	VFPBGA-400	YES	-	400-VFBGA (17x17)	400	M2S050	-	ARM Cortex M3	64 kB	-	90	MICROSEMI CORP	-	-	M2S050T-VF400	166 MHz	-	Microchip Technology	-	Yes	-	SMD/SMT	207	4695 LAB	56340 LE	85 °C	Tray	PLASTIC/EPOXY	LFBGA	VFBGA-400	BGA400,20X20,32	SQUARE	GRID ARRAY, LOW PROFILE, FINE PITCH	Active	Active	30	5.3	N	No	-	This product may require additional documentation to export from the United States.	1.26 V	1.14 V	1.2 V	-	-	-	0°C ~ 85°C (TJ)	Tray	SmartFusion2	e0	Tin/Lead (Sn/Pb)	-	-	-	8542.39.00.01	CMOS	BOTTOM	BALL	240	0.8 mm	not_compliant	-	S-PBGA-B400	160	Not Qualified	1.2 V	OTHER	-	166MHz	64KB	ARM® Cortex®-M3	DDR, PCIe, SERDES	256 kB	CANbus, Ethernet, I²C, SPI, UART/USART, USB	MCU, FPGA	160	-	1.51 mm	FIELD PROGRAMMABLE GATE ARRAY	-	STD	FPGA - 50K Logic Modules	-	48672	1 Core	256KB	17 mm	17 mm	-
M2S050T-VF400 Microchip Technology RoHS : Инкапсуляция : - Есть складские запасы : - 1 : -
	Mfr. Тип M2S025TS-1FG484M Anlielectronics Тип	Microchip Technology	SoC FPGA M2S025TS-1FG484M Сборник данных Сравнение	Min.:1 Mult.:1	Production (Last Updated: 2 months ago)	FPBGA-484	YES	-	484-FPBGA (23x23)	484	M2S025	-	ARM Cortex M3	64 kB	-	60	MICROSEMI CORP	-	-	M2S025TS-1FG484M	166 MHz	-	Microchip Technology	-	Yes	3	SMD/SMT	267	2308 LAB	27696 LE	85 °C	Tray	PLASTIC/EPOXY	BGA	BGA, BGA484,22X22,40	BGA484,22X22,40	SQUARE	GRID ARRAY	Active	Active	30	5.84	N	No	-	This product may require additional documentation to export from the United States.	1.26 V	1.14 V	1.2 V	-	-	-	-55°C ~ 125°C (TJ)	Tray	SmartFusion2	e0	Tin/Lead (Sn/Pb)	-	-	-	8542.39.00.01	CMOS	BOTTOM	BALL	240	1 mm	not_compliant	-	S-PBGA-B484	267	Not Qualified	1.2 V	OTHER	-	166MHz	64KB	ARM® Cortex®-M3	DDR, PCIe, SERDES	256 kB	CANbus, Ethernet, I²C, SPI, UART/USART, USB	MCU, FPGA	267	-	2.44 mm	FIELD PROGRAMMABLE GATE ARRAY	-	-	FPGA - 25K Logic Modules	-	27696	1 Core	256KB	23 mm	23 mm	-
M2S025TS-1FG484M Microchip Technology RoHS : Инкапсуляция : - Есть складские запасы : - 1 : -
	Mfr. Тип M2S005-FG484I Anlielectronics Тип	Microchip Technology	SoC FPGA M2S005-FG484I Сборник данных Сравнение	Min.:1 Mult.:1	-	FPBGA-484	-	-	484-FPBGA (23x23)	-	M2S005	-	ARM Cortex M3	64 kB	-	60	-	-	-	-	166 MHz	-	Microchip Technology	-	Yes	-	SMD/SMT	209	505 LAB	6060 LE	-	Tray	-	-	-	-	-	-	-	Active	-	-	N	-	-	This product may require additional documentation to export from the United States.	-	-	-	-	-	-	-40°C ~ 100°C (TJ)	Tray	SmartFusion2	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	166MHz	64KB	ARM® Cortex®-M3	DDR	128 kB	CANbus, Ethernet, I²C, SPI, UART/USART, USB	MCU, FPGA	-	-	-	-	-	-	FPGA - 5K Logic Modules	-	-	1 Core	128KB	-	-	-
M2S005-FG484I Microchip Technology RoHS : Инкапсуляция : - Есть складские запасы : - 1 : -
	Mfr. Тип M2S060TS-1FG484I Anlielectronics Тип	Microchip Technology	SoC FPGA M2S060TS-1FG484I Сборник данных Сравнение	Min.:1 Mult.:1	Production (Last Updated: 2 months ago)	484-BGA	-	-	484-FPBGA (23x23)	-	M2S060	-	ARM Cortex M3	64 kB	-	60	-	-	-	-	166 MHz	-	Microchip Technology	-	Yes	-	-	267	4710 LAB	56520 LE	-	Tray	-	-	-	-	-	-	-	Active	-	-	N	-	8542390000, 8542390000/8542390000, 8542390000/8542390000/8542390000, 8542390000/8542390000/8542390000/8542390000	This product may require additional documentation to export from the United States.	-	-	-	SmartFusion2	-	0.710494 oz	-40°C ~ 100°C (TJ)	Tray	SmartFusion2	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	166MHz	64KB	ARM® Cortex®-M3	DDR, PCIe, SERDES	256 kB	CANbus, Ethernet, I²C, SPI, UART/USART, USB	MCU, FPGA	-	-	-	-	-	-	FPGA - 60K Logic Modules	-	-	1 Core	256KB	-	-	Contains Lead
M2S060TS-1FG484I Microchip Technology RoHS : Инкапсуляция : - Есть складские запасы : - 1 : -
	Mfr. Тип M2S025TS-1FCSG325I Anlielectronics Тип	Microchip Technology	SoC FPGA M2S025TS-1FCSG325I Сборник данных Сравнение	Min.:1 Mult.:1	Production (Last Updated: 2 months ago)	FCBGA-325	YES	-	325-FCBGA (11x11)	325	M2S025	-	ARM Cortex M3	64 kB	-	176	MICROSEMI CORP	-	-	M2S025TS-1FCSG325I	166 MHz	-	Microchip Technology	-	Yes	3	SMD/SMT	180	2308 LAB	27696 LE	-	Tray	PLASTIC/EPOXY	TFBGA	FBGA-325	BGA325,21X21,20	SQUARE	GRID ARRAY, THIN PROFILE, FINE PITCH	Active	Active	40	5.81	Details	Yes	-	This product may require additional documentation to export from the United States.	1.26 V	1.14 V	1.2 V	-	-	-	-40°C ~ 100°C (TJ)	Tray	SmartFusion2	e1	Tin/Silver/Copper (Sn/Ag/Cu)	-	-	LG-MIN, WD-MIN	-	CMOS	BOTTOM	BALL	250	0.5 mm	compliant	-	S-PBGA-B325	180	Not Qualified	1.2 V	-	-	166MHz	64KB	ARM® Cortex®-M3	DDR, PCIe, SERDES	256 kB	CANbus, Ethernet, I²C, SPI, UART/USART, USB	MCU, FPGA	180	-	1.01 mm	FIELD PROGRAMMABLE GATE ARRAY	-	-	FPGA - 25K Logic Modules	-	27696	1 Core	256KB	11 mm	11 mm	-
M2S025TS-1FCSG325I Microchip Technology RoHS : Инкапсуляция : - Есть складские запасы : - 1 : -
	Mfr. Тип M2S090TS-FG676 Anlielectronics Тип	Microchip Technology	SoC FPGA M2S090TS-FG676 Сборник данных Сравнение	Min.:1 Mult.:1	-	676-BGA	YES	-	676-FBGA (27x27)	676	M2S090	-	ARM Cortex M3	64 kB	-	40	MICROSEMI CORP	-	-	M2S090TS-FG676	166 MHz	-	Microchip Technology	-	Yes	3	-	425	7193 LAB	86316 LE	85 °C	Tray	PLASTIC/EPOXY	BGA	FBGA-676	BGA676,26X26,40	SQUARE	GRID ARRAY	Active	Active	30	5.84	N	No	-	This product may require additional documentation to export from the United States.	1.26 V	1.14 V	1.2 V	-	-	-	0°C ~ 85°C (TJ)	Tray	SmartFusion2	e0	Tin/Lead (Sn/Pb)	-	-	-	8542.39.00.01	CMOS	BOTTOM	BALL	240	1 mm	not_compliant	-	S-PBGA-B676	425	Not Qualified	1.2 V	OTHER	-	166MHz	64KB	ARM® Cortex®-M3	DDR, PCIe, SERDES	512 kB	CANbus, Ethernet, I²C, SPI, UART/USART, USB	MCU, FPGA	425	-	2.44 mm	FIELD PROGRAMMABLE GATE ARRAY	-	-	FPGA - 90K Logic Modules	-	86316	1 Core	512KB	27 mm	27 mm	-
M2S090TS-FG676 Microchip Technology RoHS : Инкапсуляция : - Есть складские запасы : - 1 : -
	Mfr. Тип M2S090TS-1FG676 Anlielectronics Тип	Microchip Technology	SoC FPGA M2S090TS-1FG676 Сборник данных Сравнение	Min.:1 Mult.:1	-	BGA-676	YES	-	676-FBGA (27x27)	676	M2S090	-	ARM Cortex M3	64 kB	-	40	MICROSEMI CORP	-	-	M2S090TS-1FG676	166 MHz	-	Microchip Technology	-	Yes	3	SMD/SMT	425	7193 LAB	86316 LE	85 °C	Tray	PLASTIC/EPOXY	BGA	FBGA-676	BGA676,26X26,40	SQUARE	GRID ARRAY	Active	Active	30	5.84	N	No	-	This product may require additional documentation to export from the United States.	1.26 V	1.14 V	1.2 V	-	-	-	0°C ~ 85°C (TJ)	Tray	SmartFusion2	e0	Tin/Lead (Sn/Pb)	-	-	-	8542.39.00.01	CMOS	BOTTOM	BALL	240	1 mm	not_compliant	-	S-PBGA-B676	425	Not Qualified	1.2 V	OTHER	-	166MHz	64KB	ARM® Cortex®-M3	DDR, PCIe, SERDES	512 kB	CANbus, Ethernet, I²C, SPI, UART/USART, USB	MCU, FPGA	425	-	2.44 mm	FIELD PROGRAMMABLE GATE ARRAY	-	-	FPGA - 90K Logic Modules	-	86316	1 Core	512KB	27 mm	27 mm	-
M2S090TS-1FG676 Microchip Technology RoHS : Инкапсуляция : - Есть складские запасы : - 1 : -
	Mfr. Тип M2S050-1FGG896I Anlielectronics Тип	Microchip Technology	SoC FPGA M2S050-1FGG896I Сборник данных Сравнение	Min.:1 Mult.:1	-	FPBGA-896	YES	-	896-FBGA (31x31)	896	M2S050	-	ARM Cortex M3	64 kB	-	27	MICROSEMI CORP	-	-	M2S050-1FGG896I	166 MHz	-	Microchip Technology	-	Yes	-	SMD/SMT	377	4695 LAB	56340 LE	-	Tray	PLASTIC/EPOXY	BGA	BGA, BGA896,30X30,40	BGA896,30X30,40	SQUARE	GRID ARRAY	Active	Active	40	5.76	Details	Yes	-	This product may require additional documentation to export from the United States.	1.26 V	1.14 V	1.2 V	-	1.2000 V	-	-40 to 100 °C	Tray	SmartFusion2	e1	Tin/Silver/Copper (Sn/Ag/Cu)	-	-	-	8542.39.00.01	CMOS	BOTTOM	BALL	250	1 mm	compliant	-	S-PBGA-B896	377	Not Qualified	1.2 V	-	-	166MHz	64KB	ARM® Cortex®-M3	DDR, PCIe, SERDES	256 kB	CANbus, Ethernet, I²C, SPI, UART/USART, USB	MCU, FPGA	377	-	2.44 mm	FIELD PROGRAMMABLE GATE ARRAY	-	1	FPGA - 50K Logic Modules	-	56340	1 Core	256KB	31 mm	31 mm	-
M2S050-1FGG896I Microchip Technology RoHS : Инкапсуляция : - Есть складские запасы : - 1 : -
	Mfr. Тип M2S090-FGG676I Anlielectronics Тип	Microchip Technology	SoC FPGA M2S090-FGG676I Сборник данных Сравнение	Min.:1 Mult.:1	-	BGA-676	YES	-	676-FBGA (27x27)	676	M2S090	-	ARM Cortex M3	64 kB	-	40	MICROSEMI CORP	-	-	M2S090-FGG676I	166 MHz	-	Microchip Technology	-	Yes	3	SMD/SMT	425	7193 LAB	86316 LE	-	Tray	PLASTIC/EPOXY	BGA	BGA, BGA676,26X26,40	BGA676,26X26,40	SQUARE	GRID ARRAY	Active	Active	40	5.78	Details	Yes	-	This product may require additional documentation to export from the United States.	1.26 V	1.14 V	1.2 V	-	-	-	-40°C ~ 100°C (TJ)	Tray	SmartFusion2	e1	Tin/Silver/Copper (Sn/Ag/Cu)	-	-	-	8542.39.00.01	CMOS	BOTTOM	BALL	250	1 mm	compliant	-	S-PBGA-B676	425	Not Qualified	1.2 V	-	-	166MHz	64KB	ARM® Cortex®-M3	DDR, PCIe, SERDES	512 kB	CANbus, Ethernet, I²C, SPI, UART/USART, USB	MCU, FPGA	425	-	2.44 mm	FIELD PROGRAMMABLE GATE ARRAY	-	-	FPGA - 90K Logic Modules	-	86316	1 Core	512KB	27 mm	27 mm	-
M2S090-FGG676I Microchip Technology RoHS : Инкапсуляция : - Есть складские запасы : - 1 : -
	Mfr. Тип M2S010TS-1FG484I Anlielectronics Тип	Microchip Technology	SoC FPGA M2S010TS-1FG484I Сборник данных Сравнение	Min.:1 Mult.:1	-	FPBGA-484	YES	-	484-FPBGA (23x23)	484	M2S010	-	ARM Cortex M3	64 kB	-	60	MICROSEMI CORP	-	-	M2S010TS-1FG484I	166 MHz	1.26 V	Microchip Technology	1.14 V	Yes	3	SMD/SMT	233	1007 LAB	12084 LE	-	Tray	PLASTIC/EPOXY	BGA	FBGA-484	-	SQUARE	GRID ARRAY	Active	Active	30	5.8	N	No	-	This product may require additional documentation to export from the United States.	1.26 V	1.14 V	1.2 V	-	1.2000 V	-	-40 to 100 °C	Tray	SmartFusion2	e0	Tin/Lead (Sn/Pb)	-	-	-	8542.39.00.01	-	BOTTOM	BALL	240	1 mm	not_compliant	-	S-PBGA-B484	-	-	-	-	-	166MHz	64KB	ARM® Cortex®-M3	DDR, PCIe, SERDES	256 kB	CANbus, Ethernet, I²C, SPI, UART/USART, USB	MCU, FPGA	-	-	2.44 mm	FIELD PROGRAMMABLE GATE ARRAY	-	1	FPGA - 10K Logic Modules	-	-	1 Core	256KB	23 mm	23 mm	-
M2S010TS-1FG484I Microchip Technology RoHS : Инкапсуляция : - Есть складские запасы : - 1 : -
	Mfr. Тип M2S060T-1FCS325I Anlielectronics Тип	Microchip Technology	SoC FPGA M2S060T-1FCS325I Сборник данных Сравнение	Min.:1 Mult.:1	Production (Last Updated: 2 months ago)	325-TFBGA, FCBGA	YES	-	325-FCBGA (11x11)	325	M2S060	-	ARM Cortex M3	64 kB	-	176	MICROSEMI CORP	-	-	M2S060T-1FCS325I	166 MHz	-	Microchip Technology	-	Yes	-	-	200	4710 LAB	56520 LE	-	Tray	PLASTIC/EPOXY	TFBGA	FBGA-325	BGA325,21X21,20	SQUARE	GRID ARRAY, THIN PROFILE, FINE PITCH	Active	Active	30	5.87	N	No	-	This product may require additional documentation to export from the United States.	1.26 V	1.14 V	1.2 V	SmartFusion2	-	-	-40°C ~ 100°C (TJ)	Tray	SmartFusion2	e0	Tin/Lead (Sn/Pb)	-	-	LG-MIN, WD-MIN	8542.39.00.01	CMOS	BOTTOM	BALL	240	0.5 mm	not_compliant	-	S-PBGA-B325	200	Not Qualified	1.2 V	-	-	166MHz	64KB	ARM® Cortex®-M3	DDR, PCIe, SERDES	256 kB	CANbus, Ethernet, I²C, SPI, UART/USART, USB	MCU, FPGA	200	-	1.01 mm	FIELD PROGRAMMABLE GATE ARRAY	-	-	FPGA - 60K Logic Modules	-	56520	1 Core	256KB	11 mm	11 mm	-
M2S060T-1FCS325I Microchip Technology RoHS : Инкапсуляция : - Есть складские запасы : - 1 : -
	Mfr. Тип A2F500M3G-1FGG256M Anlielectronics Тип	Microchip Technology	SoC FPGA A2F500M3G-1FGG256M Сборник данных Сравнение	Min.:1 Mult.:1	-	256-LBGA	-	256	256-FPBGA (17x17)	-	A2F500	-	ARM Cortex M3	64 kB	500000	90	MICROSEMI CORP	-	-	A2F500M3G-1FGG256M	100 MHz	1.575 V	Microchip Technology	1.425 V	Yes	3	-	MCU - 25, FPGA - 66	-	6000 LE	-	Tray	-	-	-	-	-	-	Active	Active	-	5.79	Details	Yes	-	This product may require additional documentation to export from the United States.	-	-	-	SmartFusion	1.5000 V	-	0 to 85 °C	Tray	A2F500	-	-	125 °C	-55 °C	-	8542.39.00.01	-	-	-	-	-	compliant	100 MHz	-	-	-	-	-	EBI/EMI, Ethernet, I2C, SPI, UART, USART	100MHz	64KB	ARM® Cortex®-M3	DMA, POR, WDT	512 kB	EBI/EMI, Ethernet, I²C, SPI, UART/USART	MCU, FPGA	-	-	-	-	ARM	1	ProASIC®3 FPGA, 500K Gates, 11520 D-Flip-Flops	-	-	1 Core	512KB	-	-	-
A2F500M3G-1FGG256M Microchip Technology RoHS : Инкапсуляция : - Есть складские запасы : - 1 : -

Integrated Circuits (ICs)

Embedded - System On Chip (SoC) definition: A System On Chip (SoC) combines the required electronic circuits of various computer components onto a single, integrated chip (IC). SoC is ... Embedded - System On Chip (SoC) Product Listing: M2S050T-FCS325I,M2S050TS-FGG896,M2S005S-FGG484I,M2S050-FG896I,M2S060TS-1FCS325.Integrated Circuits (ICs) type:Embedded - Microcontrollers(129432),Memory(111901),PMIC - Supervisors(101743),PMIC - Voltage Regulators - Linear(101187),PMIC - Voltage Regulators - DC DC Switching Regulators(62822) .Embedded - System On Chip (SoC) has 873 pieces of spot stock price information, you can click the "RFQ" button to confirm the inventory and price with the Anli.

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Integrated Circuits (ICs)