Embedded - System On Chip (SoC) Products For Sale - PDF - Integrated Circuits (ICs) -Page28

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Изображение	Тип	Марка	Объяснение	Установленная цена	Количество	RoHS	Lifecycle Status	Package / Case	Surface Mount	Number of Pins	Supplier Device Package	Number of Terminals	Base Product Number	Core	Data RAM Size	Distributed RAM	Factory Pack QuantityFactory Pack Quantity	Ihs Manufacturer	L1 Cache Data Memory	L1 Cache Instruction Memory	Manufacturer Part Number	Maximum Clock Frequency	Maximum Operating Supply Voltage	Maximum Operating Temperature	Mfr	Minimum Operating Supply Voltage	Minimum Operating Temperature	Moisture Sensitive	Moisture Sensitivity Levels	Mounting Styles	Number of I/Os	Number of Logic Array Blocks - LABs	Number of Logic Elements	Operating Temperature-Max	Operating Temperature-Min	Package	Package Body Material	Package Code	Package Description	Package Equivalence Code	Package Shape	Package Style	Part Life Cycle Code	Product Status	Reflow Temperature-Max (s)	Risk Rank	RoHS	Rohs Code	Shipping Restrictions	Supply Voltage-Max	Supply Voltage-Min	Supply Voltage-Nom	Tradename	Typical Operating Supply Voltage	Unit Weight	Operating Temperature	Packaging	Series	JESD-609 Code	Pbfree Code	ECCN Code	Terminal Finish	Max Operating Temperature	Min Operating Temperature	Additional Feature	HTS Code	Technology	Terminal Position	Terminal Form	Peak Reflow Temperature (Cel)	Terminal Pitch	Reach Compliance Code	Time@Peak Reflow Temperature-Max (s)	JESD-30 Code	Number of Outputs	Qualification Status	Operating Supply Voltage	Power Supplies	Temperature Grade	Speed	RAM Size	Core Processor	Peripherals	Program Memory Size	Connectivity	Architecture	Number of Inputs	Seated Height-Max	Programmable Logic Type	Speed Grade	Primary Attributes	Number of Logic Cells	Number of Cores	Flash Size	Length	Width

Изображение	Тип	Марка	Объяснение	Количество	Lifecycle Status	Package / Case	Surface Mount	Number of Pins	Supplier Device Package	Number of Terminals	Base Product Number	Core	Data RAM Size	Distributed RAM	Factory Pack QuantityFactory Pack Quantity	Ihs Manufacturer	L1 Cache Data Memory	L1 Cache Instruction Memory	Manufacturer Part Number	Maximum Clock Frequency	Maximum Operating Supply Voltage	Maximum Operating Temperature	Mfr	Minimum Operating Supply Voltage	Minimum Operating Temperature	Moisture Sensitive	Moisture Sensitivity Levels	Mounting Styles	Number of I/Os	Number of Logic Array Blocks - LABs	Number of Logic Elements	Operating Temperature-Max	Operating Temperature-Min	Package	Package Body Material	Package Code	Package Description	Package Equivalence Code	Package Shape	Package Style	Part Life Cycle Code	Product Status	Reflow Temperature-Max (s)	Risk Rank	RoHS	Rohs Code	Shipping Restrictions	Supply Voltage-Max	Supply Voltage-Min	Supply Voltage-Nom	Tradename	Typical Operating Supply Voltage	Unit Weight	Operating Temperature	Packaging	Series	JESD-609 Code	Pbfree Code	ECCN Code	Terminal Finish	Max Operating Temperature	Min Operating Temperature	Additional Feature	HTS Code	Technology	Terminal Position	Terminal Form	Peak Reflow Temperature (Cel)	Terminal Pitch	Reach Compliance Code	Time@Peak Reflow Temperature-Max (s)	JESD-30 Code	Number of Outputs	Qualification Status	Operating Supply Voltage	Power Supplies	Temperature Grade	Speed	RAM Size	Core Processor	Peripherals	Program Memory Size	Connectivity	Architecture	Number of Inputs	Seated Height-Max	Programmable Logic Type	Speed Grade	Primary Attributes	Number of Logic Cells	Number of Cores	Flash Size	Length	Width
	Mfr. Тип M2S005S-VFG400 Anlielectronics Тип	Microchip Technology	SoC FPGA M2S005S-VFG400 Сборник данных Сравнение	Min.:1 Mult.:1	-	400-LFBGA	YES	-	400-VFBGA (17x17)	400	M2S005	ARM Cortex M3	64 kB	-	90	MICROSEMI CORP	-	-	M2S005S-VFG400	166 MHz	-	-	Microchip Technology	-	-	Yes	3	-	169	505 LAB	6060 LE	85 °C	-	Tray	PLASTIC/EPOXY	LFBGA	LFBGA, BGA400,20X20,32	BGA400,20X20,32	SQUARE	GRID ARRAY, LOW PROFILE, FINE PITCH	Active	Active	40	5.82	Details	Yes	This product may require additional documentation to export from the United States.	1.26 V	1.14 V	1.2 V	-	-	-	0°C ~ 85°C (TJ)	Tray	SmartFusion2	e1	-	-	Tin/Silver/Copper (Sn/Ag/Cu)	-	-	-	8542.39.00.01	CMOS	BOTTOM	BALL	250	0.8 mm	compliant	-	S-PBGA-B400	171	Not Qualified	-	1.2 V	OTHER	166MHz	64KB	ARM® Cortex®-M3	DDR	128 kB	CANbus, Ethernet, I²C, SPI, UART/USART, USB	MCU, FPGA	171	1.51 mm	FIELD PROGRAMMABLE GATE ARRAY	-	FPGA - 5K Logic Modules	6060	1 Core	128KB	17 mm	17 mm
M2S005S-VFG400 Microchip Technology RoHS : Инкапсуляция : - Есть складские запасы : - 1 : -
	Mfr. Тип M2S010TS-1FGG484M Anlielectronics Тип	Microchip Technology	SoC FPGA M2S010TS-1FGG484M Сборник данных Сравнение	Min.:1 Mult.:1	Production (Last Updated: 1 month ago)	FPBGA-484	YES	-	484-FPBGA (23x23)	484	M2S010	ARM Cortex M3	64 kB	-	60	MICROSEMI CORP	-	-	M2S010TS-1FGG484M	166 MHz	-	-	Microchip Technology	-	-	Yes	3	SMD/SMT	233	1007 LAB	12084 LE	125 °C	-55 °C	Tray	PLASTIC/EPOXY	BGA	FBGA-484	BGA484,22X22,40	SQUARE	GRID ARRAY	Active	Active	40	5.82	Details	Yes	This product may require additional documentation to export from the United States.	1.26 V	1.14 V	1.2 V	-	-	-	-55°C ~ 125°C (TJ)	Tray	SmartFusion2	e1	-	3A001.A.2.C	Tin/Silver/Copper (Sn/Ag/Cu)	-	-	-	8542.39.00.01	CMOS	BOTTOM	BALL	250	1 mm	compliant	-	S-PBGA-B484	233	Not Qualified	-	1.2 V	MILITARY	166MHz	64KB	ARM® Cortex®-M3	DDR, PCIe, SERDES	256 kB	CANbus, Ethernet, I²C, SPI, UART/USART, USB	MCU, FPGA	233	2.44 mm	FIELD PROGRAMMABLE GATE ARRAY	-	FPGA - 10K Logic Modules	12084	1 Core	256KB	23 mm	23 mm
M2S010TS-1FGG484M Microchip Technology RoHS : Инкапсуляция : - Есть складские запасы : - 1 : -
	Mfr. Тип M2S090TS-1FCSG325I Anlielectronics Тип	Microchip Technology	SoC FPGA M2S090TS-1FCSG325I Сборник данных Сравнение	Min.:1 Mult.:1	-	FCBGA-325	YES	-	325-FCBGA (11x13.5)	325	M2S090	ARM Cortex M3	64 kB	-	176	MICROSEMI CORP	-	-	M2S090TS-1FCSG325I	166 MHz	-	-	Microchip Technology	-	-	Yes	3	SMD/SMT	180	7193 LAB	86316 LE	-	-	Tray	PLASTIC/EPOXY	TFBGA	FBGA-325	BGA325,21X21,20	RECTANGULAR	GRID ARRAY, THIN PROFILE, FINE PITCH	Active	Active	40	5.81	Details	Yes	This product may require additional documentation to export from the United States.	1.26 V	1.14 V	1.2 V	-	-	-	-40°C ~ 100°C (TJ)	Tray	SmartFusion2	e1	-	-	Tin/Silver/Copper (Sn/Ag/Cu)	-	-	LG-MIN, WD-MIN	8542.39.00.01	CMOS	BOTTOM	BALL	250	0.5 mm	compliant	-	R-PBGA-B325	180	Not Qualified	-	1.2 V	-	166MHz	64KB	ARM® Cortex®-M3	DDR, PCIe, SERDES	512 kB	CANbus, Ethernet, I²C, SPI, UART/USART, USB	MCU, FPGA	180	1.16 mm	FIELD PROGRAMMABLE GATE ARRAY	-	FPGA - 90K Logic Modules	86316	1 Core	512KB	13.5 mm	11 mm
M2S090TS-1FCSG325I Microchip Technology RoHS : Инкапсуляция : - Есть складские запасы : - 1 : -
	Mfr. Тип M2S005S-1VFG400I Anlielectronics Тип	Microchip Technology	SoC FPGA M2S005S-1VFG400I Сборник данных Сравнение	Min.:1 Mult.:1	-	VFPBGA-400	-	-	400-VFBGA (17x17)	-	M2S005	ARM Cortex M3	64 kB	-	90	-	-	-	-	166 MHz	-	-	Microchip Technology	-	-	Yes	-	SMD/SMT	169	505 LAB	6060 LE	-	-	Tray	-	-	-	-	-	-	-	Active	-	-	Details	-	This product may require additional documentation to export from the United States.	-	-	-	-	-	-	-40°C ~ 100°C (TJ)	Tray	SmartFusion2	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	166MHz	64KB	ARM® Cortex®-M3	DDR	128 kB	CANbus, Ethernet, I²C, SPI, UART/USART, USB	MCU, FPGA	-	-	-	-	FPGA - 5K Logic Modules	-	1 Core	128KB	-	-
M2S005S-1VFG400I Microchip Technology RoHS : Инкапсуляция : - Есть складские запасы : - 1 : -
	Mfr. Тип M2S060-FCS325I Anlielectronics Тип	Microchip Technology	SoC FPGA M2S060-FCS325I Сборник данных Сравнение	Min.:1 Mult.:1	Production (Last Updated: 2 months ago)	325-TFBGA, FCBGA	YES	325	325-FCBGA (11x11)	325	M2S060	ARM Cortex M3	64 kB	-	176	MICROSEMI CORP	-	-	M2S060-FCS325I	166 MHz	1.26 V	-	Microchip Technology	1.14 V	-	Yes	-	-	200	4710 LAB	56520 LE	-	-	Tray	PLASTIC/EPOXY	TFBGA	FBGA-325	BGA325,21X21,20	SQUARE	GRID ARRAY, THIN PROFILE, FINE PITCH	Active	Active	30	5.84	N	No	This product may require additional documentation to export from the United States.	1.26 V	1.14 V	1.2 V	SmartFusion2	1.2000 V	-	-40 to 100 °C	Tray	SmartFusion2	e0	-	-	Tin/Lead (Sn/Pb)	100 °C	-40 °C	LG-MIN, WD-MIN	8542.39.00.01	CMOS	BOTTOM	BALL	240	0.5 mm	not_compliant	-	S-PBGA-B325	200	Not Qualified	1.2 V	1.2 V	-	166MHz	164.3 kB	ARM® Cortex®-M3	DDR, PCIe, SERDES	256 kB	CANbus, Ethernet, I²C, SPI, UART/USART, USB	MCU, FPGA	200	1.01 mm	FIELD PROGRAMMABLE GATE ARRAY	STD	FPGA - 60K Logic Modules	56520	1 Core	256KB	11 mm	11 mm
M2S060-FCS325I Microchip Technology RoHS : Инкапсуляция : - Есть складские запасы : - 1 : -
	Mfr. Тип M2S050-FCS325I Anlielectronics Тип	Microchip Technology	SoC FPGA M2S050-FCS325I Сборник данных Сравнение	Min.:1 Mult.:1	Production (Last Updated: 2 months ago)	FCBGA-325	-	-	325-FCBGA (11x11)	-	M2S050	ARM Cortex M3	64 kB	-	176	-	-	-	-	166 MHz	-	-	Microchip Technology	-	-	Yes	-	SMD/SMT	200	4695 LAB	56340 LE	-	-	Tray	-	-	-	-	-	-	-	Active	-	-	N	-	This product may require additional documentation to export from the United States.	-	-	-	-	-	-	-40°C ~ 100°C (TJ)	Tray	SmartFusion2	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	166MHz	64KB	ARM® Cortex®-M3	DDR, PCIe, SERDES	256 kB	CANbus, Ethernet, I²C, SPI, UART/USART, USB	MCU, FPGA	-	-	-	-	FPGA - 50K Logic Modules	-	1 Core	256KB	-	-
M2S050-FCS325I Microchip Technology RoHS : Инкапсуляция : - Есть складские запасы : - 1 : -
	Mfr. Тип M2S025TS-VF256I Anlielectronics Тип	Microchip Technology	SoC FPGA M2S025TS-VF256I Сборник данных Сравнение	Min.:1 Mult.:1	Production (Last Updated: 2 months ago)	256-LFBGA	YES	-	256-FPBGA (14x14)	256	M2S025	ARM Cortex M3	64 kB	-	119	MICROSEMI CORP	-	-	M2S025TS-VF256I	166 MHz	-	-	Microchip Technology	-	-	Yes	-	-	138	2308 LAB	27696 LE	-	-	Tray	PLASTIC/EPOXY	LFBGA	VFBGA-256	-	SQUARE	GRID ARRAY, LOW PROFILE, FINE PITCH	Active	Active	30	5.87	N	No	This product may require additional documentation to export from the United States.	1.26 V	1.14 V	1.2 V	-	-	-	-40°C ~ 100°C (TJ)	Tray	SmartFusion2	e0	No	-	Tin/Lead (Sn/Pb)	-	-	LG-MIN, WD-MIN	8542.39.00.01	-	BOTTOM	BALL	240	0.8 mm	not_compliant	-	S-PBGA-B256	-	-	-	-	-	166MHz	64KB	ARM® Cortex®-M3	DDR, PCIe, SERDES	256 kB	CANbus, Ethernet, I²C, SPI, UART/USART, USB	MCU, FPGA	-	1.56 mm	FIELD PROGRAMMABLE GATE ARRAY	-	FPGA - 25K Logic Modules	-	1 Core	256KB	14 mm	14 mm
M2S025TS-VF256I Microchip Technology RoHS : Инкапсуляция : - Есть складские запасы : - 1 : -
	Mfr. Тип M2S150T-FC1152 Anlielectronics Тип	Microchip Technology	SoC FPGA M2S150T-FC1152 Сборник данных Сравнение	Min.:1 Mult.:1	-	1152-BBGA, FCBGA	-	-	1152-FCBGA (35x35)	-	M2S150	ARM Cortex M3	64 kB	-	24	-	-	-	-	166 MHz	-	-	Microchip Technology	-	-	Yes	-	-	574	12177 LAB	146124 LE	-	-	Tray	-	-	-	-	-	-	-	Active	-	-	N	-	This product may require additional documentation to export from the United States.	-	-	-	-	-	-	0°C ~ 85°C (TJ)	Tray	SmartFusion2	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	166MHz	64KB	ARM® Cortex®-M3	DDR, PCIe, SERDES	512 kB	CANbus, Ethernet, I²C, SPI, UART/USART, USB	MCU, FPGA	-	-	-	STD	FPGA - 150K Logic Modules	-	1 Core	512KB	-	-
M2S150T-FC1152 Microchip Technology RoHS : Инкапсуляция : - Есть складские запасы : - 1 : -
	Mfr. Тип M2S150T-FC1152I Anlielectronics Тип	Microchip Technology	SoC FPGA M2S150T-FC1152I Сборник данных Сравнение	Min.:1 Mult.:1	-	FCBGA-1152	-	-	1152-FCBGA (35x35)	-	M2S150	ARM Cortex M3	64 kB	-	24	-	-	-	-	166 MHz	-	-	Microchip Technology	-	-	Yes	-	SMD/SMT	574	12177 LAB	146124 LE	-	-	Tray	-	-	-	-	-	-	-	Active	-	-	N	-	This product may require additional documentation to export from the United States.	-	-	-	-	-	-	-40°C ~ 100°C (TJ)	Tray	SmartFusion2	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	166MHz	64KB	ARM® Cortex®-M3	DDR, PCIe, SERDES	512 kB	CANbus, Ethernet, I²C, SPI, UART/USART, USB	MCU, FPGA	-	-	-	-	FPGA - 150K Logic Modules	-	1 Core	512KB	-	-
M2S150T-FC1152I Microchip Technology RoHS : Инкапсуляция : - Есть складские запасы : - 1 : -
	Mfr. Тип M2S010TS-1FGG484I Anlielectronics Тип	Microchip Technology	SoC FPGA M2S010TS-1FGG484I Сборник данных Сравнение	Min.:1 Mult.:1	-	FPBGA-484	-	-	484-FPBGA (23x23)	-	M2S010	ARM Cortex M3	64 kB	-	60	-	-	-	-	166 MHz	-	-	Microchip Technology	-	-	Yes	-	SMD/SMT	233	1007 LAB	12084 LE	-	-	Tray	-	-	-	-	-	-	-	Active	-	-	Details	-	This product may require additional documentation to export from the United States.	-	-	-	-	-	-	-40°C ~ 100°C (TJ)	Tray	SmartFusion2	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	166MHz	64KB	ARM® Cortex®-M3	DDR, PCIe, SERDES	256 kB	CANbus, Ethernet, I²C, SPI, UART/USART, USB	MCU, FPGA	-	-	-	-	FPGA - 10K Logic Modules	-	1 Core	256KB	-	-
M2S010TS-1FGG484I Microchip Technology RoHS : Инкапсуляция : - Есть складские запасы : - 1 : -
	Mfr. Тип M2S060-1FG484 Anlielectronics Тип	Microchip Technology	SoC FPGA M2S060-1FG484 Сборник данных Сравнение	Min.:1 Mult.:1	Production (Last Updated: 2 months ago)	484-BGA	-	-	484-FPBGA (23x23)	-	M2S060	ARM Cortex M3	64 kB	-	60	-	-	-	-	166 MHz	-	-	Microchip Technology	-	-	Yes	-	-	267	4710 LAB	56520 LE	-	-	Tray	-	-	-	-	-	-	-	Active	-	-	N	-	This product may require additional documentation to export from the United States.	-	-	-	SmartFusion2	-	-	0°C ~ 85°C (TJ)	Tray	SmartFusion2	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	166MHz	64KB	ARM® Cortex®-M3	DDR, PCIe, SERDES	256 kB	CANbus, Ethernet, I²C, SPI, UART/USART, USB	MCU, FPGA	-	-	-	-	FPGA - 60K Logic Modules	-	1 Core	256KB	-	-
M2S060-1FG484 Microchip Technology RoHS : Инкапсуляция : - Есть складские запасы : - 1 : -
	Mfr. Тип M2S090TS-1FG484I Anlielectronics Тип	Microchip Technology	SoC FPGA M2S090TS-1FG484I Сборник данных Сравнение	Min.:1 Mult.:1	-	FPBGA-484	YES	-	484-FPBGA (23x23)	484	M2S090	ARM Cortex M3	64 kB	-	60	MICROSEMI CORP	-	-	M2S090TS-1FG484I	166 MHz	-	-	Microchip Technology	-	-	Yes	3	SMD/SMT	267	7193 LAB	86316 LE	-	-	Tray	PLASTIC/EPOXY	BGA	FBGA-484	BGA484,22X22,40	SQUARE	GRID ARRAY	Active	Active	30	5.78	N	No	This product may require additional documentation to export from the United States.	1.26 V	1.14 V	1.2 V	-	1.2000 V	-	-40 to 100 °C	Tray	SmartFusion2	e0	-	-	Tin/Lead (Sn/Pb)	-	-	-	8542.39.00.01	CMOS	BOTTOM	BALL	240	1 mm	not_compliant	-	S-PBGA-B484	267	Not Qualified	-	1.2 V	-	166MHz	64KB	ARM® Cortex®-M3	DDR, PCIe, SERDES	512 kB	CANbus, Ethernet, I²C, SPI, UART/USART, USB	MCU, FPGA	267	2.44 mm	FIELD PROGRAMMABLE GATE ARRAY	1	FPGA - 90K Logic Modules	86316	1 Core	512KB	23 mm	23 mm
M2S090TS-1FG484I Microchip Technology RoHS : Инкапсуляция : - Есть складские запасы : - 1 : -
	Mfr. Тип M2S090TS-1FG484M Anlielectronics Тип	Microchip Technology	SoC FPGA M2S090TS-1FG484M Сборник данных Сравнение	Min.:1 Mult.:1	-	FPBGA-484	YES	-	484-FPBGA (23x23)	484	M2S090	ARM Cortex M3	64 kB	-	60	MICROSEMI CORP	-	-	M2S090TS-1FG484M	166 MHz	-	-	Microchip Technology	-	-	Yes	3	SMD/SMT	267	7193 LAB	86316 LE	125 °C	-55 °C	Tray	PLASTIC/EPOXY	BGA	FBGA-484	BGA484,22X22,40	SQUARE	GRID ARRAY	Active	Active	30	5.87	N	No	This product may require additional documentation to export from the United States.	1.26 V	1.14 V	1.2 V	-	-	0.892167 oz	-55°C ~ 125°C (TJ)	Tray	SmartFusion2	e0	-	3A001.A.2.C	Tin/Lead (Sn/Pb)	-	-	-	8542.39.00.01	CMOS	BOTTOM	BALL	240	1 mm	not_compliant	-	S-PBGA-B484	267	Not Qualified	-	1.2 V	MILITARY	166MHz	64KB	ARM® Cortex®-M3	DDR, PCIe, SERDES	512 kB	CANbus, Ethernet, I²C, SPI, UART/USART, USB	MCU, FPGA	267	2.44 mm	FIELD PROGRAMMABLE GATE ARRAY	-	FPGA - 90K Logic Modules	86316	1 Core	512KB	23 mm	23 mm
M2S090TS-1FG484M Microchip Technology RoHS : Инкапсуляция : - Есть складские запасы : - 1 : -
	Mfr. Тип M2S060-VF400I Anlielectronics Тип	Microchip Technology	SoC FPGA M2S060-VF400I Сборник данных Сравнение	Min.:1 Mult.:1	Production (Last Updated: 2 months ago)	400-LFBGA	YES	-	400-VFBGA (17x17)	400	M2S060	ARM Cortex M3	64 kB	-	90	MICROSEMI CORP	-	-	M2S060-VF400I	166 MHz	-	-	Microchip Technology	-	-	Yes	-	-	207	4710 LAB	56520 LE	-	-	Tray	PLASTIC/EPOXY	LFBGA	VFBGA-400	BGA400,20X20,32	SQUARE	GRID ARRAY, LOW PROFILE, FINE PITCH	Active	Active	30	5.87	N	No	This product may require additional documentation to export from the United States.	1.26 V	1.14 V	1.2 V	SmartFusion2	-	-	-40°C ~ 100°C (TJ)	Tray	SmartFusion2	e0	-	-	Tin/Lead (Sn/Pb)	-	-	-	8542.39.00.01	CMOS	BOTTOM	BALL	240	0.8 mm	not_compliant	-	S-PBGA-B400	207	Not Qualified	-	1.2 V	-	166MHz	64KB	ARM® Cortex®-M3	DDR, PCIe, SERDES	256 kB	CANbus, Ethernet, I²C, SPI, UART/USART, USB	MCU, FPGA	207	1.51 mm	FIELD PROGRAMMABLE GATE ARRAY	-	FPGA - 60K Logic Modules	56520	1 Core	256KB	17 mm	17 mm
M2S060-VF400I Microchip Technology RoHS : Инкапсуляция : - Есть складские запасы : - 1 : -
	Mfr. Тип M2S005-TQG144I Anlielectronics Тип	Microchip Technology	SoC FPGA M2S005-TQG144I Сборник данных Сравнение	Min.:1 Mult.:1	-	TQFP-144	-	-	144-TQFP (20x20)	-	M2S005	ARM Cortex M3	64 kB	191 kbit	60	-	-	-	-	166 MHz	1.26 V	+ 100 C	Microchip Technology	1.14 V	- 40 C	Yes	-	SMD/SMT	84 I/O	505 LAB	6060 LE	-	-	Tray	-	-	-	-	-	-	-	Active	-	-	Details	-	-	-	-	-	-	1.2000 V	0.046530 oz	-40 to 100 °C	Tray	SmartFusion2	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	1.2 V	-	-	166MHz	64KB	ARM® Cortex®-M3	-	128 kB	CANbus, Ethernet, I²C, SPI, UART/USART, USB	MCU, FPGA	-	-	-	STD	FPGA - 5K Logic Modules	-	1 Core	128KB	-	-
M2S005-TQG144I Microchip Technology RoHS : Инкапсуляция : - Есть складские запасы : - 1 : -
	Mfr. Тип M2S025TS-VFG256I Anlielectronics Тип	Microchip Technology	SoC FPGA M2S025TS-VFG256I Сборник данных Сравнение	Min.:1 Mult.:1	Production (Last Updated: 2 months ago)	256-LBGA	-	-	256-FPBGA (17x17)	-	M2S025	ARM Cortex M3	64 kB	-	119	-	-	-	-	166 MHz	-	-	Microchip Technology	-	-	Yes	-	-	138	2308 LAB	27696 LE	-	-	Tray	-	-	-	-	-	-	-	Active	-	-	Details	-	This product may require additional documentation to export from the United States.	-	-	-	-	-	-	-40°C ~ 100°C (TJ)	Tray	SmartFusion2	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	166MHz	64KB	ARM® Cortex®-M3	DDR, PCIe, SERDES	256 kB	CANbus, Ethernet, I²C, SPI, UART/USART, USB	MCU, FPGA	-	-	-	-	FPGA - 25K Logic Modules	-	1 Core	256KB	-	-
M2S025TS-VFG256I Microchip Technology RoHS : Инкапсуляция : - Есть складские запасы : - 1 : -
	Mfr. Тип M2S010T-1VFG400 Anlielectronics Тип	Microchip Technology	SoC FPGA M2S010T-1VFG400 Сборник данных Сравнение	Min.:1 Mult.:1	-	VFPBGA-400	YES	-	400-VFBGA (17x17)	400	M2S010	ARM Cortex M3	64 kB	-	90	MICROSEMI CORP	-	-	M2S010T-1VFG400	166 MHz	1.26 V	-	Microchip Technology	1.14 V	-	Yes	3	SMD/SMT	195	1007 LAB	12084 LE	85 °C	-	Tray	PLASTIC/EPOXY	LFBGA	VFBGA-400	BGA400,20X20,32	SQUARE	GRID ARRAY, LOW PROFILE, FINE PITCH	Active	Active	-	5.77	Details	Yes	This product may require additional documentation to export from the United States.	1.26 V	1.14 V	1.2 V	-	2.5, 3.3 V	-	0 to 85 °C	Tray	SmartFusion2	e1	-	-	Tin/Silver/Copper (Sn/Ag/Cu)	-	-	-	8542.39.00.01	CMOS	BOTTOM	BALL	250	0.8 mm	compliant	40	S-PBGA-B400	195	Not Qualified	-	1.2 V	OTHER	166MHz	64KB	ARM® Cortex®-M3	DDR, PCIe, SERDES	256 kB	CANbus, Ethernet, I²C, SPI, UART/USART, USB	MCU, FPGA	195	1.51 mm	FIELD PROGRAMMABLE GATE ARRAY	1	FPGA - 10K Logic Modules	12084	1 Core	256KB	17 mm	17 mm
M2S010T-1VFG400 Microchip Technology RoHS : Инкапсуляция : - Есть складские запасы : - 1 : -
	Mfr. Тип M2S060T-FGG484I Anlielectronics Тип	Microchip Technology	SoC FPGA M2S060T-FGG484I Сборник данных Сравнение	Min.:1 Mult.:1	Production (Last Updated: 2 months ago)	484-BGA	YES	-	484-FPBGA (23x23)	484	M2S060	ARM Cortex M3	64 kB	-	60	MICROSEMI CORP	-	-	M2S060T-FGG484I	166 MHz	1.26 V	-	Microchip Technology	1.14 V	-	Yes	3	-	267	4710 LAB	56520 LE	-	-	Tray	PLASTIC/EPOXY	BGA	FBGA-484	BGA484,22X22,40	SQUARE	GRID ARRAY	Active	Active	40	5.8	Details	Yes	This product may require additional documentation to export from the United States.	1.26 V	1.14 V	1.2 V	SmartFusion2	1.2000 V	-	-40 to 100 °C	Tray	SmartFusion2	e1	-	-	Tin/Silver/Copper (Sn/Ag/Cu)	-	-	-	8542.39.00.01	CMOS	BOTTOM	BALL	250	1 mm	compliant	-	S-PBGA-B484	267	Not Qualified	-	1.2 V	-	166MHz	64KB	ARM® Cortex®-M3	DDR, PCIe, SERDES	256 kB	CANbus, Ethernet, I²C, SPI, UART/USART, USB	MCU, FPGA	267	2.44 mm	FIELD PROGRAMMABLE GATE ARRAY	STD	FPGA - 60K Logic Modules	56520	1 Core	256KB	23 mm	23 mm
M2S060T-FGG484I Microchip Technology RoHS : Инкапсуляция : - Есть складские запасы : - 1 : -
	Mfr. Тип M2S005S-VF400 Anlielectronics Тип	Microchip Technology	SoC FPGA M2S005S-VF400 Сборник данных Сравнение	Min.:1 Mult.:1	-	400-LFBGA	-	-	400-VFBGA (17x17)	-	M2S005	ARM Cortex M3	64 kB	-	90	-	-	-	-	166 MHz	-	-	Microchip Technology	-	-	Yes	-	-	169	505 LAB	6060 LE	-	-	Tray	-	-	-	-	-	-	-	Active	-	-	N	-	This product may require additional documentation to export from the United States.	-	-	-	-	-	-	0°C ~ 85°C (TJ)	Tray	SmartFusion2	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	166MHz	64KB	ARM® Cortex®-M3	DDR	128 kB	CANbus, Ethernet, I²C, SPI, UART/USART, USB	MCU, FPGA	-	-	-	-	FPGA - 5K Logic Modules	-	1 Core	128KB	-	-
M2S005S-VF400 Microchip Technology RoHS : Инкапсуляция : - Есть складские запасы : - 1 : -
	Mfr. Тип M2S090TS-FGG676 Anlielectronics Тип	Microchip Technology	SoC FPGA M2S090TS-FGG676 Сборник данных Сравнение	Min.:1 Mult.:1	-	676-BGA	YES	-	676-FBGA (27x27)	676	M2S090	ARM Cortex M3	64 kB	-	40	MICROSEMI CORP	-	-	M2S090TS-FGG676	166 MHz	-	-	Microchip Technology	-	-	Yes	3	-	425	7193 LAB	86316 LE	85 °C	-	Tray	PLASTIC/EPOXY	BGA	FBGA-676	BGA676,26X26,40	SQUARE	GRID ARRAY	Active	Active	40	5.81	Details	Yes	This product may require additional documentation to export from the United States.	1.26 V	1.14 V	1.2 V	-	-	-	0°C ~ 85°C (TJ)	Tray	SmartFusion2	e1	-	-	Tin/Silver/Copper (Sn/Ag/Cu)	-	-	-	8542.39.00.01	CMOS	BOTTOM	BALL	250	1 mm	compliant	-	S-PBGA-B676	425	Not Qualified	-	1.2 V	OTHER	166MHz	64KB	ARM® Cortex®-M3	DDR, PCIe, SERDES	512 kB	CANbus, Ethernet, I²C, SPI, UART/USART, USB	MCU, FPGA	425	2.44 mm	FIELD PROGRAMMABLE GATE ARRAY	-	FPGA - 90K Logic Modules	86316	1 Core	512KB	27 mm	27 mm
M2S090TS-FGG676 Microchip Technology RoHS : Инкапсуляция : - Есть складские запасы : - 1 : -

Integrated Circuits (ICs)

Embedded - System On Chip (SoC) definition: A System On Chip (SoC) combines the required electronic circuits of various computer components onto a single, integrated chip (IC). SoC is ... Embedded - System On Chip (SoC) Product Listing: M2S005S-VFG400,M2S010TS-1FGG484M,M2S090TS-1FCSG325I,M2S005S-1VFG400I,M2S060-FCS325I.Integrated Circuits (ICs) type:Embedded - Microcontrollers(129432),Memory(111901),PMIC - Supervisors(101743),PMIC - Voltage Regulators - Linear(101187),PMIC - Voltage Regulators - DC DC Switching Regulators(62822) .Embedded - System On Chip (SoC) has 873 pieces of spot stock price information, you can click the "RFQ" button to confirm the inventory and price with the Anli.

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Integrated Circuits (ICs)