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| Изображение | Тип | Марка | Объяснение | Установленная цена | Количество | RoHS | Lifecycle Status | Package / Case | Surface Mount | Number of Pins | Supplier Device Package | Number of Terminals | Base Product Number | Core | Data RAM Size | Factory Pack QuantityFactory Pack Quantity | I/O Voltage | Ihs Manufacturer | Instruction Set Architecture | Interface Type | JTAG Support | L1 Cache Data Memory | L1 Cache Instruction Memory | Manufacturer Part Number | Maximum Clock Frequency | Maximum Operating Supply Voltage | Mfr | Minimum Operating Supply Voltage | Moisture Sensitive | Moisture Sensitivity Levels | Mounting | Mounting Styles | Number of CPU Cores | Number of I/Os | Number of Logic Array Blocks - LABs | Number of Logic Elements | Operating Temperature-Max | Package | Package Body Material | Package Code | Package Description | Package Equivalence Code | Package Shape | Package Style | Part Life Cycle Code | Product Status | Reflow Temperature-Max (s) | Risk Rank | RoHS | Rohs Code | Shipping Restrictions | Supply Voltage-Max | Supply Voltage-Min | Supply Voltage-Nom | Typical Operating Supply Voltage | Usage Level | Operating Temperature | Packaging | Series | JESD-609 Code | Terminal Finish | Max Operating Temperature | Min Operating Temperature | Additional Feature | HTS Code | Technology | Terminal Position | Terminal Form | Peak Reflow Temperature (Cel) | Terminal Pitch | Reach Compliance Code | Time@Peak Reflow Temperature-Max (s) | Pin Count | JESD-30 Code | Number of Outputs | Qualification Status | Operating Supply Voltage | Power Supplies | Temperature Grade | Interface | Speed | RAM Size | Core Processor | Peripherals | Program Memory Size | Connectivity | Architecture | Data Bus Width | Number of Inputs | Seated Height-Max | Programmable Logic Type | Screening Level | Speed Grade | Primary Attributes | Number of Logic Cells | Number of Cores | Flash Size | Device Core | Length | Width | Lead Free |
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![]() | Mfr. ТипM2S090-FCS325Anlielectronics Тип | Microchip Technology |
SoC FPGA M2S090-FCS325
Сборник данных
Сравнение
| Min.:1 Mult.:1 | - | 325-TFBGA, FCBGA | - | - | 325-FCBGA (11x13.5) | - | M2S090 | ARM Cortex M3 | 64 kB | 176 | 1.2, 1.5, 1.8, 2.5, 3.3 V | - | RISC | CAN/Ethernet/Serial I2C/SPI/UART/USB | Yes | - | - | - | 166 MHz | - | Microchip Technology | - | Yes | - | Surface Mount | - | 1 | 180 | 7193 LAB | 86316 LE | - | Tray | - | - | - | - | - | - | - | Active | - | - | N | - | This product may require additional documentation to export from the United States. | - | - | - | - | Commercial grade | 0 to 85 °C | Tray | SmartFusion2 | - | - | - | - | - | - | - | - | - | - | - | - | - | 325 | - | - | - | 0.95, 1.05 V | - | - | CAN/Ethernet/Serial | 166MHz | 64 KB | ARM® Cortex®-M3 | DDR, PCIe, SERDES | 512 kB | CANbus, Ethernet, I²C, SPI, UART/USART, USB | MCU, FPGA | 32 Bit | - | - | - | Commercial | - | FPGA - 90K Logic Modules | - | 1 Core | 512KB | ARM Cortex-M3 | - | - | - | ||
| M2S090-FCS325 | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | Mfr. ТипM2S150-FC1152IAnlielectronics Тип | Microchip Technology |
SoC FPGA M2S150-FC1152I
Сборник данных
Сравнение
| Min.:1 Mult.:1 | - | FCBGA-1152 | YES | - | 1152-FCBGA (35x35) | 1152 | M2S150 | ARM Cortex M3 | 64 kB | 24 | - | MICROSEMI CORP | - | - | - | - | - | M2S150-FC1152I | 166 MHz | - | Microchip Technology | - | Yes | - | - | SMD/SMT | - | 574 | 12177 LAB | 146124 LE | - | Tray | PLASTIC/EPOXY | BGA | BGA, BGA1152,34X34,40 | BGA1152,34X34,40 | SQUARE | GRID ARRAY | Active | Active | 30 | 5.81 | N | No | This product may require additional documentation to export from the United States. | 1.26 V | 1.14 V | 1.2 V | - | - | -40°C ~ 100°C (TJ) | Tray | SmartFusion2 | e0 | Tin/Lead (Sn/Pb) | - | - | - | 8542.39.00.01 | CMOS | BOTTOM | BALL | 240 | 1 mm | not_compliant | - | - | S-PBGA-B1152 | 574 | Not Qualified | - | 1.2 V | - | - | 166MHz | 64KB | ARM® Cortex®-M3 | DDR, PCIe, SERDES | 512 kB | CANbus, Ethernet, I²C, SPI, UART/USART, USB | MCU, FPGA | - | 574 | 2.9 mm | FIELD PROGRAMMABLE GATE ARRAY | - | - | FPGA - 150K Logic Modules | 146124 | 1 Core | 512KB | - | 35 mm | 35 mm | - | ||
| M2S150-FC1152I | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | Mfr. ТипM2S150T-1FCSG536Anlielectronics Тип | Microchip Technology |
SoC FPGA M2S150T-1FCSG536
Сборник данных
Сравнение
| Min.:1 Mult.:1 | - | 536-LFBGA, CSPBGA | - | - | 536-CSPBGA (16x16) | - | M2S150 | ARM Cortex M3 | 64 kB | 90 | - | - | - | - | - | - | - | - | 166 MHz | - | Microchip Technology | - | Yes | - | - | - | - | 293 | 12177 LAB | 146124 LE | - | Tray | - | - | - | - | - | - | - | Active | - | - | Details | - | This product may require additional documentation to export from the United States. | - | - | - | - | - | 0°C ~ 85°C (TJ) | Tray | SmartFusion2 | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | 166MHz | 64KB | ARM® Cortex®-M3 | DDR, PCIe, SERDES | 512 kB | CANbus, Ethernet, I²C, SPI, UART/USART, USB | MCU, FPGA | - | - | - | - | - | - | FPGA - 150K Logic Modules | - | 1 Core | 512KB | - | - | - | - | ||
| M2S150T-1FCSG536 | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | Mfr. ТипM2S090T-1FGG676Anlielectronics Тип | Microchip Technology |
SoC FPGA M2S090T-1FGG676
Сборник данных
Сравнение
| Min.:1 Mult.:1 | - | BGA-676 | YES | - | 676-FBGA (27x27) | 676 | M2S090 | ARM Cortex M3 | 64 kB | 40 | - | MICROSEMI CORP | - | - | - | - | - | M2S090T-1FGG676 | 166 MHz | - | Microchip Technology | - | Yes | 3 | - | SMD/SMT | - | 425 | 7193 LAB | 86316 LE | 85 °C | Tray | PLASTIC/EPOXY | BGA | BGA, BGA676,26X26,40 | BGA676,26X26,40 | SQUARE | GRID ARRAY | Active | Active | 40 | 5.27 | Details | Yes | This product may require additional documentation to export from the United States. | 1.26 V | 1.14 V | 1.2 V | - | - | 0°C ~ 85°C (TJ) | Tray | SmartFusion2 | e1 | Tin/Silver/Copper (Sn/Ag/Cu) | - | - | - | 8542.39.00.01 | CMOS | BOTTOM | BALL | 250 | 1 mm | compliant | - | - | S-PBGA-B676 | 425 | Not Qualified | - | 1.2 V | OTHER | - | 166MHz | 64KB | ARM® Cortex®-M3 | DDR, PCIe, SERDES | 512 kB | CANbus, Ethernet, I²C, SPI, UART/USART, USB | MCU, FPGA | - | 425 | 2.44 mm | FIELD PROGRAMMABLE GATE ARRAY | - | - | FPGA - 90K Logic Modules | 86316 | 1 Core | 512KB | - | 27 mm | 27 mm | - | ||
| M2S090T-1FGG676 | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | Mfr. ТипM2S050TS-1FCSG325IAnlielectronics Тип | Microchip Technology |
SoC FPGA M2S050TS-1FCSG325I
Сборник данных
Сравнение
| Min.:1 Mult.:1 | Production (Last Updated: 2 months ago) | FCBGA-325 | YES | - | 325-FCBGA (11x11) | 325 | M2S050 | ARM Cortex M3 | 64 kB | 176 | - | MICROSEMI CORP | - | - | - | - | - | M2S050TS-1FCSG325I | 166 MHz | - | Microchip Technology | - | Yes | 3 | - | SMD/SMT | - | 200 | 4695 LAB | 56340 LE | - | Tray | PLASTIC/EPOXY | TFBGA | FBGA-325 | BGA325,21X21,20 | SQUARE | GRID ARRAY, THIN PROFILE, FINE PITCH | Active | Active | - | 5.82 | Details | Yes | This product may require additional documentation to export from the United States. | 1.26 V | 1.14 V | 1.2 V | - | - | -40°C ~ 100°C (TJ) | Tray | SmartFusion2 | e1 | Tin/Silver/Copper (Sn/Ag/Cu) | - | - | LG-MIN, WD-MIN | 8542.39.00.01 | CMOS | BOTTOM | BALL | 250 | 0.5 mm | compliant | 40 | - | S-PBGA-B325 | 200 | Not Qualified | - | 1.2 V | - | - | 166MHz | 64KB | ARM® Cortex®-M3 | DDR, PCIe, SERDES | 256 kB | CANbus, Ethernet, I²C, SPI, UART/USART, USB | MCU, FPGA | - | 200 | 1.01 mm | FIELD PROGRAMMABLE GATE ARRAY | - | - | FPGA - 50K Logic Modules | 56340 | 1 Core | 256KB | - | 11 mm | 11 mm | - | ||
| M2S050TS-1FCSG325I | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | Mfr. ТипM2S025T-1FG484MAnlielectronics Тип | Microchip Technology |
SoC FPGA M2S025T-1FG484M
Сборник данных
Сравнение
| Min.:1 Mult.:1 | Production (Last Updated: 2 months ago) | FPBGA-484 | - | - | 484-FPBGA (23x23) | - | M2S025 | ARM Cortex M3 | 64 kB | 60 | - | - | - | - | - | - | - | - | 166 MHz | - | Microchip Technology | - | Yes | - | - | SMD/SMT | - | 267 | 2308 LAB | 27696 LE | - | Tray | - | - | - | - | - | - | - | Active | - | - | N | - | This product may require additional documentation to export from the United States. | - | - | - | - | - | -55°C ~ 125°C (TJ) | Tray | SmartFusion2 | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | 166MHz | 64KB | ARM® Cortex®-M3 | DDR, PCIe, SERDES | 256 kB | CANbus, Ethernet, I²C, SPI, UART/USART, USB | MCU, FPGA | - | - | - | - | - | - | FPGA - 25K Logic Modules | - | 1 Core | 256KB | - | - | - | Contains Lead | ||
| M2S025T-1FG484M | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | Mfr. ТипM2S025-1VF256IAnlielectronics Тип | Microchip Technology |
SoC FPGA M2S025-1VF256I
Сборник данных
Сравнение
| Min.:1 Mult.:1 | Production (Last Updated: 2 months ago) | 256-LFBGA | - | - | 256-FPBGA (14x14) | - | M2S025 | ARM Cortex M3 | 64 kB | 119 | - | - | - | - | - | - | - | - | 166 MHz | - | Microchip Technology | - | Yes | - | - | - | - | 138 | 2308 LAB | 27696 LE | - | Tray | - | - | - | - | - | - | - | Active | - | - | N | - | This product may require additional documentation to export from the United States. | - | - | - | - | - | -40°C ~ 100°C (TJ) | Tray | SmartFusion2 | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | 166MHz | 64KB | ARM® Cortex®-M3 | DDR, PCIe, SERDES | 256 kB | CANbus, Ethernet, I²C, SPI, UART/USART, USB | MCU, FPGA | - | - | - | - | - | - | FPGA - 25K Logic Modules | - | 1 Core | 256KB | - | - | - | - | ||
| M2S025-1VF256I | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | Mfr. ТипM2S010TS-FG484IAnlielectronics Тип | Microchip Technology |
SoC FPGA M2S010TS-FG484I
Сборник данных
Сравнение
| Min.:1 Mult.:1 | Production (Last Updated: 1 month ago) | FPBGA-484 | YES | - | 484-FPBGA (23x23) | 484 | M2S010 | ARM Cortex M3 | 64 kB | 60 | - | MICROSEMI CORP | - | - | - | - | - | M2S010TS-FG484I | 166 MHz | - | Microchip Technology | - | Yes | 3 | - | SMD/SMT | - | 233 | 1007 LAB | 12084 LE | - | Tray | PLASTIC/EPOXY | BGA | BGA, BGA484,22X22,40 | BGA484,22X22,40 | SQUARE | GRID ARRAY | Active | Active | 30 | 5.88 | N | No | This product may require additional documentation to export from the United States. | 1.26 V | 1.14 V | 1.2 V | - | - | -40°C ~ 100°C (TJ) | Tray | SmartFusion2 | e0 | Tin/Lead (Sn/Pb) | - | - | - | 8542.39.00.01 | CMOS | BOTTOM | BALL | 240 | 1 mm | not_compliant | - | - | S-PBGA-B484 | 233 | Not Qualified | - | 1.2 V | - | - | 166MHz | 64KB | ARM® Cortex®-M3 | DDR, PCIe, SERDES | 256 kB | CANbus, Ethernet, I²C, SPI, UART/USART, USB | MCU, FPGA | - | 233 | 2.44 mm | FIELD PROGRAMMABLE GATE ARRAY | - | - | FPGA - 10K Logic Modules | 12084 | 1 Core | 256KB | - | 23 mm | 23 mm | - | ||
| M2S010TS-FG484I | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | Mfr. ТипM2S010-1VF400Anlielectronics Тип | Microchip Technology |
SoC FPGA M2S010-1VF400
Сборник данных
Сравнение
| Min.:1 Mult.:1 | - | VFPBGA-400 | YES | - | 400-VFBGA (17x17) | 400 | M2S010 | ARM Cortex M3 | 64 kB | 90 | - | MICROSEMI CORP | - | - | - | - | - | M2S010-1VF400 | 166 MHz | 1.26 V | Microchip Technology | 1.14 V | Yes | - | - | SMD/SMT | - | 195 | 1007 LAB | 12084 LE | 85 °C | Tray | PLASTIC/EPOXY | LFBGA | LFBGA, BGA400,20X20,32 | BGA400,20X20,32 | SQUARE | GRID ARRAY, LOW PROFILE, FINE PITCH | Active | Active | 30 | 5.84 | N | No | This product may require additional documentation to export from the United States. | 1.26 V | 1.14 V | 1.2 V | 1.2000 V | - | 0 to 85 °C | Tray | SmartFusion2 | e0 | Tin/Lead (Sn/Pb) | - | - | - | 8542.39.00.01 | CMOS | BOTTOM | BALL | 240 | 0.8 mm | not_compliant | - | - | S-PBGA-B400 | 160 | Not Qualified | - | 1.2 V | OTHER | - | 166MHz | 64KB | ARM® Cortex®-M3 | DDR, PCIe, SERDES | 256 kB | CANbus, Ethernet, I²C, SPI, UART/USART, USB | MCU, FPGA | - | 160 | 1.51 mm | FIELD PROGRAMMABLE GATE ARRAY | - | 1 | FPGA - 10K Logic Modules | 9744 | 1 Core | 256KB | - | 17 mm | 17 mm | - | ||
| M2S010-1VF400 | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | Mfr. ТипM2S050TS-1VF400Anlielectronics Тип | Microchip Technology |
SoC FPGA M2S050TS-1VF400
Сборник данных
Сравнение
| Min.:1 Mult.:1 | Production (Last Updated: 2 months ago) | VFPBGA-400 | - | - | 400-VFBGA (17x17) | - | M2S050 | ARM Cortex M3 | 64 kB | 90 | - | - | - | - | - | - | - | - | 166 MHz | - | Microchip Technology | - | Yes | - | - | SMD/SMT | - | 207 | 4695 LAB | 56340 LE | - | Tray | - | - | - | - | - | - | - | Active | - | - | N | - | This product may require additional documentation to export from the United States. | - | - | - | - | - | 0°C ~ 85°C (TJ) | Tray | SmartFusion2 | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | 166MHz | 64KB | ARM® Cortex®-M3 | DDR, PCIe, SERDES | 256 kB | CANbus, Ethernet, I²C, SPI, UART/USART, USB | MCU, FPGA | - | - | - | - | - | - | FPGA - 50K Logic Modules | - | 1 Core | 256KB | - | - | - | - | ||
| M2S050TS-1VF400 | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | Mfr. ТипM2S090T-FGG676Anlielectronics Тип | Microchip Technology |
SoC FPGA M2S090T-FGG676
Сборник данных
Сравнение
| Min.:1 Mult.:1 | - | 676-BGA | - | - | 676-FBGA (27x27) | - | M2S090 | ARM Cortex M3 | 64 kB | 40 | - | - | - | - | - | - | - | - | 166 MHz | 1.26 V | Microchip Technology | 1.14 V | Yes | - | - | - | - | 425 | 7193 LAB | 86316 LE | - | Tray | - | - | - | - | - | - | - | Active | - | - | Details | - | This product may require additional documentation to export from the United States. | - | - | - | 1.2000 V | - | 0 to 85 °C | Tray | SmartFusion2 | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | 166MHz | 64KB | ARM® Cortex®-M3 | DDR, PCIe, SERDES | 512 kB | CANbus, Ethernet, I²C, SPI, UART/USART, USB | MCU, FPGA | - | - | - | - | - | STD | FPGA - 90K Logic Modules | - | 1 Core | 512KB | - | - | - | - | ||
| M2S090T-FGG676 | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | Mfr. ТипM2S090T-1FGG484Anlielectronics Тип | Microchip Technology |
SoC FPGA M2S090T-1FGG484
Сборник данных
Сравнение
| Min.:1 Mult.:1 | - | FPBGA-484 | - | - | 484-FPBGA (23x23) | - | M2S090 | ARM Cortex M3 | 64 kB | 60 | - | - | - | - | - | - | - | - | 166 MHz | - | Microchip Technology | - | Yes | - | - | SMD/SMT | - | 267 | 7193 LAB | 86316 LE | - | Tray | - | - | - | - | - | - | - | Active | - | - | Details | - | This product may require additional documentation to export from the United States. | - | - | - | 1.2000 V | - | 0 to 85 °C | Tray | SmartFusion2 | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | 166MHz | 64KB | ARM® Cortex®-M3 | DDR, PCIe, SERDES | 512 kB | CANbus, Ethernet, I²C, SPI, UART/USART, USB | MCU, FPGA | - | - | - | - | - | 1 | FPGA - 90K Logic Modules | - | 1 Core | 512KB | - | - | - | - | ||
| M2S090T-1FGG484 | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | Mfr. ТипM2S090T-1FCSG325Anlielectronics Тип | Microchip Technology |
SoC FPGA M2S090T-1FCSG325
Сборник данных
Сравнение
| Min.:1 Mult.:1 | - | FCBGA-325 | - | - | 325-FCBGA (11x13.5) | - | M2S090 | ARM Cortex M3 | 64 kB | 176 | - | - | - | - | - | - | - | - | 166 MHz | - | Microchip Technology | - | Yes | - | - | SMD/SMT | - | 180 | 7193 LAB | 86316 LE | - | Tray | - | - | - | - | - | - | - | Active | - | - | Details | - | This product may require additional documentation to export from the United States. | - | - | - | - | - | 0°C ~ 85°C (TJ) | Tray | SmartFusion2 | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | 166MHz | 64KB | ARM® Cortex®-M3 | DDR, PCIe, SERDES | 512 kB | CANbus, Ethernet, I²C, SPI, UART/USART, USB | MCU, FPGA | - | - | - | - | - | - | FPGA - 90K Logic Modules | - | 1 Core | 512KB | - | - | - | - | ||
| M2S090T-1FCSG325 | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | Mfr. ТипM2S050-1FCSG325Anlielectronics Тип | Microchip Technology |
SoC FPGA M2S050-1FCSG325
Сборник данных
Сравнение
| Min.:1 Mult.:1 | Production (Last Updated: 2 months ago) | FCBGA-325 | YES | 325 | 325-FCBGA (11x11) | 325 | M2S050 | ARM Cortex M3 | 64 kB | 176 | - | MICROSEMI CORP | - | - | - | - | - | M2S050-1FCSG325 | 166 MHz | 1.26 V | Microchip Technology | 1.14 V | Yes | 3 | - | SMD/SMT | - | 200 | 4695 LAB | 56340 LE | 85 °C | Tray | PLASTIC/EPOXY | TFBGA | FBGA-325 | BGA325,21X21,20 | SQUARE | GRID ARRAY, THIN PROFILE, FINE PITCH | Active | Active | - | 5.76 | Details | Yes | This product may require additional documentation to export from the United States. | 1.26 V | 1.14 V | 1.2 V | 1.2000 V | - | 0 to 85 °C | Tray | SmartFusion2 | e1 | Tin/Silver/Copper (Sn/Ag/Cu) | 85 °C | 0 °C | LG-MIN, WD-MIN | 8542.39.00.01 | CMOS | BOTTOM | BALL | 250 | 0.5 mm | compliant | 40 | - | S-PBGA-B325 | 200 | Not Qualified | 1.2 V | 1.2 V | OTHER | - | 166MHz | 64KB | ARM® Cortex®-M3 | DDR, PCIe, SERDES | 256 kB | CANbus, Ethernet, I²C, SPI, UART/USART, USB | MCU, FPGA | - | 200 | 1.01 mm | FIELD PROGRAMMABLE GATE ARRAY | - | 1 | FPGA - 50K Logic Modules | 56340 | 1 Core | 256KB | - | 11 mm | 11 mm | - | ||
| M2S050-1FCSG325 | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | Mfr. ТипM2S025T-1VF256Anlielectronics Тип | Microchip Technology |
SoC FPGA M2S025T-1VF256
Сборник данных
Сравнение
| Min.:1 Mult.:1 | Production (Last Updated: 2 months ago) | VFPBGA-256 | - | - | 256-FPBGA (14x14) | - | M2S025 | ARM Cortex M3 | 64 kB | 119 | - | - | - | - | - | - | - | - | 166 MHz | - | Microchip Technology | - | Yes | - | - | SMD/SMT | - | 138 | 2308 LAB | 27696 LE | - | Tray | - | - | - | - | - | - | - | Active | - | - | N | - | This product may require additional documentation to export from the United States. | - | - | - | - | - | 0°C ~ 85°C (TJ) | Tray | SmartFusion2 | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | 166MHz | 64KB | ARM® Cortex®-M3 | DDR, PCIe, SERDES | 256 kB | CANbus, Ethernet, I²C, SPI, UART/USART, USB | MCU, FPGA | - | - | - | - | - | - | FPGA - 25K Logic Modules | - | 1 Core | 256KB | - | - | - | - | ||
| M2S025T-1VF256 | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | Mfr. ТипM2S050TS-1FG484Anlielectronics Тип | Microchip Technology |
SoC FPGA M2S050TS-1FG484
Сборник данных
Сравнение
| Min.:1 Mult.:1 | Production (Last Updated: 2 months ago) | FPBGA-484 | YES | - | 484-FPBGA (23x23) | 484 | M2S050 | ARM Cortex M3 | 64 kB | 60 | - | MICROSEMI CORP | - | - | - | - | - | M2S050TS-1FG484 | 166 MHz | - | Microchip Technology | - | Yes | 3 | - | SMD/SMT | - | 267 | 4695 LAB | 56340 LE | 85 °C | Tray | PLASTIC/EPOXY | BGA | FBGA-484 | BGA484,22X22,40 | SQUARE | GRID ARRAY | Active | Active | 30 | 5.87 | N | No | This product may require additional documentation to export from the United States. | 1.26 V | 1.14 V | 1.2 V | - | - | 0°C ~ 85°C (TJ) | Tray | SmartFusion2 | e0 | Tin/Lead (Sn/Pb) | - | - | - | 8542.39.00.01 | CMOS | BOTTOM | BALL | 240 | 1 mm | not_compliant | - | - | S-PBGA-B484 | 267 | Not Qualified | - | 1.2 V | OTHER | - | 166MHz | 64KB | ARM® Cortex®-M3 | DDR, PCIe, SERDES | 256 kB | CANbus, Ethernet, I²C, SPI, UART/USART, USB | MCU, FPGA | - | 267 | 2.44 mm | FIELD PROGRAMMABLE GATE ARRAY | - | - | FPGA - 50K Logic Modules | 56340 | 1 Core | 256KB | - | 23 mm | 23 mm | - | ||
| M2S050TS-1FG484 | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | Mfr. ТипM2S050T-VF400IAnlielectronics Тип | Microchip Technology |
SoC FPGA M2S050T-VF400I
Сборник данных
Сравнение
| Min.:1 Mult.:1 | Production (Last Updated: 2 months ago) | VFPBGA-400 | YES | - | 400-VFBGA (17x17) | 400 | M2S050 | ARM Cortex M3 | 64 kB | 90 | - | MICROSEMI CORP | - | - | - | - | - | M2S050T-VF400I | 166 MHz | - | Microchip Technology | - | Yes | - | - | SMD/SMT | - | 207 | 4695 LAB | 56340 LE | - | Tray | PLASTIC/EPOXY | LFBGA | LFBGA, BGA400,20X20,32 | BGA400,20X20,32 | SQUARE | GRID ARRAY, LOW PROFILE, FINE PITCH | Active | Active | 30 | 5.81 | N | No | This product may require additional documentation to export from the United States. | 1.26 V | 1.14 V | 1.2 V | - | - | -40°C ~ 100°C (TJ) | Tray | SmartFusion2 | e0 | Tin/Lead (Sn/Pb) | - | - | - | 8542.39.00.01 | CMOS | BOTTOM | BALL | 240 | 0.8 mm | not_compliant | - | - | S-PBGA-B400 | 207 | Not Qualified | - | 1.2 V | - | - | 166MHz | 64KB | ARM® Cortex®-M3 | DDR, PCIe, SERDES | 256 kB | CANbus, Ethernet, I²C, SPI, UART/USART, USB | MCU, FPGA | - | 207 | 1.51 mm | FIELD PROGRAMMABLE GATE ARRAY | - | - | FPGA - 50K Logic Modules | 56340 | 1 Core | 256KB | - | 17 mm | 17 mm | - | ||
| M2S050T-VF400I | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | Mfr. ТипM2S010TS-1VF256Anlielectronics Тип | Microchip Technology |
SoC FPGA M2S010TS-1VF256
Сборник данных
Сравнение
| Min.:1 Mult.:1 | Production (Last Updated: 1 month ago) | VFPBGA-256 | YES | - | 256-FPBGA (14x14) | 256 | M2S010 | ARM Cortex M3 | 64 kB | 119 | - | MICROSEMI CORP | - | - | - | - | - | M2S010TS-1VF256 | 166 MHz | - | Microchip Technology | - | Yes | - | - | SMD/SMT | - | 138 | 1007 LAB | 12084 LE | 85 °C | Tray | PLASTIC/EPOXY | LFBGA | VFBGA-256 | BGA256,16X16,32 | SQUARE | GRID ARRAY, LOW PROFILE, FINE PITCH | Active | Active | 30 | 5.87 | N | No | This product may require additional documentation to export from the United States. | 1.26 V | 1.14 V | 1.2 V | - | - | 0°C ~ 85°C (TJ) | Tray | SmartFusion2 | e0 | Tin/Lead (Sn/Pb) | - | - | LG-MIN, WD-MIN | 8542.39.00.01 | CMOS | BOTTOM | BALL | 240 | 0.8 mm | not_compliant | - | - | S-PBGA-B256 | 138 | Not Qualified | - | 1.2 V | OTHER | - | 166MHz | 64KB | ARM® Cortex®-M3 | DDR, PCIe, SERDES | 256 kB | CANbus, Ethernet, I²C, SPI, UART/USART, USB | MCU, FPGA | - | 138 | 1.56 mm | FIELD PROGRAMMABLE GATE ARRAY | - | - | FPGA - 10K Logic Modules | 12084 | 1 Core | 256KB | - | 14 mm | 14 mm | - | ||
| M2S010TS-1VF256 | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | Mfr. ТипM2S050T-FGG484Anlielectronics Тип | Microchip Technology |
SoC FPGA M2S050T-FGG484
Сборник данных
Сравнение
| Min.:1 Mult.:1 | - | FPBGA-484 | YES | - | 484-FPBGA (23x23) | 484 | M2S050 | ARM Cortex M3 | 64 kB | 60 | - | MICROSEMI CORP | - | - | - | - | - | M2S050T-FGG484 | 166 MHz | - | Microchip Technology | - | Yes | 3 | - | SMD/SMT | - | 267 | 4695 LAB | 56340 LE | 85 °C | Tray | PLASTIC/EPOXY | BGA | FBGA-484 | BGA484,22X22,40 | SQUARE | GRID ARRAY | Active | Active | 40 | 5.76 | Details | Yes | This product may require additional documentation to export from the United States. | 1.26 V | 1.14 V | 1.2 V | 1.2000 V | - | 0 to 85 °C | Tray | SmartFusion2 | e1 | Tin/Silver/Copper (Sn/Ag/Cu) | - | - | - | 8542.39.00.01 | CMOS | BOTTOM | BALL | 250 | 1 mm | compliant | - | - | S-PBGA-B484 | 267 | Not Qualified | - | 1.2 V | OTHER | - | 166MHz | 64KB | ARM® Cortex®-M3 | DDR, PCIe, SERDES | 256 kB | CANbus, Ethernet, I²C, SPI, UART/USART, USB | MCU, FPGA | - | 267 | 2.44 mm | FIELD PROGRAMMABLE GATE ARRAY | - | STD | FPGA - 50K Logic Modules | 56340 | 1 Core | 256KB | - | 23 mm | 23 mm | - | ||
| M2S050T-FGG484 | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | Mfr. ТипM2S025TS-FGG484Anlielectronics Тип | Microchip Technology |
SoC FPGA M2S025TS-FGG484
Сборник данных
Сравнение
| Min.:1 Mult.:1 | Production (Last Updated: 2 months ago) | 484-BGA | - | - | 484-FPBGA (23x23) | - | M2S025 | ARM Cortex M3 | 64 kB | 60 | - | - | - | - | - | - | - | - | 166 MHz | 1.26 V | Microchip Technology | 1.14 V | Yes | - | - | - | - | 267 | 2308 LAB | 27696 LE | - | Tray | - | - | - | - | - | - | - | Active | - | - | Details | - | This product may require additional documentation to export from the United States. | - | - | - | 1.2000 V | - | 0 to 85 °C | Tray | SmartFusion2 | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | 166MHz | 64KB | ARM® Cortex®-M3 | DDR, PCIe, SERDES | 256 kB | CANbus, Ethernet, I²C, SPI, UART/USART, USB | MCU, FPGA | - | - | - | - | - | STD | FPGA - 25K Logic Modules | - | 1 Core | 256KB | - | - | - | - | ||
| M2S025TS-FGG484 |
Индекс :
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