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Изображение	Тип	Марка	Объяснение	Установленная цена	Количество	RoHS	Lifecycle Status	Package / Case	Surface Mount	Supplier Device Package	Number of Terminals	Base Product Number	Core	Data RAM Size	Development Kit	Distributed RAM	Factory Pack QuantityFactory Pack Quantity	Ihs Manufacturer	Interface Type	L1 Cache Data Memory	L1 Cache Instruction Memory	Manufacturer Part Number	Maximum Clock Frequency	Maximum Operating Supply Voltage	Maximum Operating Temperature	Mfr	Minimum Operating Supply Voltage	Minimum Operating Temperature	Moisture Sensitive	Moisture Sensitivity Levels	Mounting Styles	MSL	Number of I/Os	Number of Logic Array Blocks - LABs	Number of Logic Elements	Operating Temperature-Max	Operating Temperature-Min	Package	Package Body Material	Package Code	Package Description	Package Equivalence Code	Package Shape	Package Style	Part Life Cycle Code	Processor Series	Product Status	Reflow Temperature-Max (s)	Risk Rank	RoHS	Rohs Code	Shipping Restrictions	Supply Voltage-Max	Supply Voltage-Min	Supply Voltage-Nom	Tradename	Typical Operating Supply Voltage	Unit Weight	Operating Temperature	Packaging	Series	JESD-609 Code	ECCN Code	Terminal Finish	Max Operating Temperature	Min Operating Temperature	Additional Feature	HTS Code	Technology	Terminal Position	Terminal Form	Peak Reflow Temperature (Cel)	Terminal Pitch	Reach Compliance Code	Frequency	JESD-30 Code	Number of Outputs	Qualification Status	Operating Supply Voltage	Power Supplies	Temperature Grade	Interface	Speed	RAM Size	Core Processor	Peripherals	Program Memory Type	Program Memory Size	Connectivity	Architecture	Number of Inputs	Seated Height-Max	Programmable Logic Type	Operating Temperature Range	Core Architecture	Total RAM Bits	Speed Grade	Number of ADC Channels	Primary Attributes	Number of Logic Cells	Number of Cores	Flash Size	Length	Width

Изображение	Тип	Марка	Объяснение	Количество	Lifecycle Status	Package / Case	Surface Mount	Supplier Device Package	Number of Terminals	Base Product Number	Core	Data RAM Size	Development Kit	Distributed RAM	Factory Pack QuantityFactory Pack Quantity	Ihs Manufacturer	Interface Type	L1 Cache Data Memory	L1 Cache Instruction Memory	Manufacturer Part Number	Maximum Clock Frequency	Maximum Operating Supply Voltage	Maximum Operating Temperature	Mfr	Minimum Operating Supply Voltage	Minimum Operating Temperature	Moisture Sensitive	Moisture Sensitivity Levels	Mounting Styles	MSL	Number of I/Os	Number of Logic Array Blocks - LABs	Number of Logic Elements	Operating Temperature-Max	Operating Temperature-Min	Package	Package Body Material	Package Code	Package Description	Package Equivalence Code	Package Shape	Package Style	Part Life Cycle Code	Processor Series	Product Status	Reflow Temperature-Max (s)	Risk Rank	RoHS	Rohs Code	Shipping Restrictions	Supply Voltage-Max	Supply Voltage-Min	Supply Voltage-Nom	Tradename	Typical Operating Supply Voltage	Unit Weight	Operating Temperature	Packaging	Series	JESD-609 Code	ECCN Code	Terminal Finish	Max Operating Temperature	Min Operating Temperature	Additional Feature	HTS Code	Technology	Terminal Position	Terminal Form	Peak Reflow Temperature (Cel)	Terminal Pitch	Reach Compliance Code	Frequency	JESD-30 Code	Number of Outputs	Qualification Status	Operating Supply Voltage	Power Supplies	Temperature Grade	Interface	Speed	RAM Size	Core Processor	Peripherals	Program Memory Type	Program Memory Size	Connectivity	Architecture	Number of Inputs	Seated Height-Max	Programmable Logic Type	Operating Temperature Range	Core Architecture	Total RAM Bits	Speed Grade	Number of ADC Channels	Primary Attributes	Number of Logic Cells	Number of Cores	Flash Size	Length	Width
	Mfr. Тип M2S025T-FCSG325 Anlielectronics Тип	Microchip Technology	SoC FPGA M2S025T-FCSG325 Сборник данных Сравнение	Min.:1 Mult.:1	Production (Last Updated: 2 months ago)	325-TFBGA, FCBGA	YES	325-FCBGA (11x11)	325	M2S025	ARM Cortex M3	64 kB	-	-	176	MICROSEMI CORP	-	-	-	M2S025T-FCSG325	166 MHz	-	-	Microchip Technology	-	-	Yes	3	-	MSL 3 - 168 hours	180	2308 LAB	27696 LE	85 °C	-	Tray	PLASTIC/EPOXY	TFBGA	FBGA-325	BGA325,21X21,20	SQUARE	GRID ARRAY, THIN PROFILE, FINE PITCH	Active	-	Active	40	5.78	Details	Yes	This product may require additional documentation to export from the United States.	1.26 V	1.14 V	1.2 V	-	2.5, 3.3 V	0.111027 oz	0 to 85 °C	Tray	SmartFusion2	e1	-	Tin/Silver/Copper (Sn/Ag/Cu)	-	-	LG-MIN, WD-MIN	8542.39.00.01	CMOS	BOTTOM	BALL	250	0.5 mm	compliant	-	S-PBGA-B325	180	Not Qualified	-	1.2 V	OTHER	-	166MHz	64KB	ARM® Cortex®-M3	DDR, PCIe, SERDES	-	256 kB	CANbus, Ethernet, I²C, SPI, UART/USART, USB	MCU, FPGA	180	1.01 mm	FIELD PROGRAMMABLE GATE ARRAY	-	-	592Kbit	STD	-	FPGA - 25K Logic Modules	27696	1 Core	256KB	11 mm	11 mm
M2S025T-FCSG325 Microchip Technology RoHS : Инкапсуляция : - Есть складские запасы : - 1 : -
	Mfr. Тип M2S050TS-1FGG484I Anlielectronics Тип	Microchip Technology	SoC FPGA M2S050TS-1FGG484I Сборник данных Сравнение	Min.:1 Mult.:1	-	FPBGA-484	-	484-FPBGA (23x23)	-	M2S050	ARM Cortex M3	64 kB	-	-	60	-	-	-	-	-	166 MHz	-	-	Microchip Technology	-	-	Yes	-	SMD/SMT	-	267	4695 LAB	56340 LE	-	-	Tray	-	-	-	-	-	-	-	-	Active	-	-	Details	-	This product may require additional documentation to export from the United States.	-	-	-	-	-	-	-40°C ~ 100°C (TJ)	Tray	SmartFusion2	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	166MHz	64KB	ARM® Cortex®-M3	DDR, PCIe, SERDES	-	256 kB	CANbus, Ethernet, I²C, SPI, UART/USART, USB	MCU, FPGA	-	-	-	-	-	-	-	-	FPGA - 50K Logic Modules	-	1 Core	256KB	-	-
M2S050TS-1FGG484I Microchip Technology RoHS : Инкапсуляция : - Есть складские запасы : - 1 : -
	Mfr. Тип M2S005S-FG484I Anlielectronics Тип	Microchip Technology	SoC FPGA M2S005S-FG484I Сборник данных Сравнение	Min.:1 Mult.:1	-	FPBGA-484	-	484-FPBGA (23x23)	-	M2S005	ARM Cortex M3	64 kB	-	-	60	-	-	-	-	-	166 MHz	-	-	Microchip Technology	-	-	Yes	-	SMD/SMT	-	209	505 LAB	6060 LE	-	-	Tray	-	-	-	-	-	-	-	-	Active	-	-	N	-	This product may require additional documentation to export from the United States.	-	-	-	-	-	-	-40°C ~ 100°C (TJ)	Tray	SmartFusion2	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	166MHz	64KB	ARM® Cortex®-M3	DDR	-	128 kB	CANbus, Ethernet, I²C, SPI, UART/USART, USB	MCU, FPGA	-	-	-	-	-	-	-	-	FPGA - 5K Logic Modules	-	1 Core	128KB	-	-
M2S005S-FG484I Microchip Technology RoHS : Инкапсуляция : - Есть складские запасы : - 1 : -
	Mfr. Тип M2S150TS-FCVG484 Anlielectronics Тип	Microchip Technology	SoC FPGA M2S150TS-FCVG484 Сборник данных Сравнение	Min.:1 Mult.:1	-	484-BFBGA	-	484-FBGA (19x19)	-	M2S150	ARM Cortex M3	64 kB	-	-	84	-	-	-	-	-	166 MHz	-	-	Microchip Technology	-	-	Yes	-	-	-	273	12177 LAB	146124 LE	-	-	Tray	-	-	-	-	-	-	-	-	Active	-	-	Details	-	This product may require additional documentation to export from the United States.	-	-	-	-	-	-	0°C ~ 85°C (TJ)	Tray	SmartFusion2	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	166MHz	64KB	ARM® Cortex®-M3	DDR, PCIe, SERDES	-	512 kB	CANbus, Ethernet, I²C, SPI, UART/USART, USB	MCU, FPGA	-	-	-	-	-	-	-	-	FPGA - 150K Logic Modules	-	1 Core	512KB	-	-
M2S150TS-FCVG484 Microchip Technology RoHS : Инкапсуляция : - Есть складские запасы : - 1 : -
	Mfr. Тип M2S150T-FCS536 Anlielectronics Тип	Microchip Technology	SoC FPGA M2S150T-FCS536 Сборник данных Сравнение	Min.:1 Mult.:1	-	536-LFBGA, CSPBGA	-	536-CSPBGA (16x16)	-	M2S150	ARM Cortex M3	64 kB	-	-	90	-	-	-	-	-	166 MHz	-	-	Microchip Technology	-	-	Yes	-	-	-	293	12177 LAB	146124 LE	-	-	Tray	-	-	-	-	-	-	-	-	Active	-	-	N	-	This product may require additional documentation to export from the United States.	-	-	-	-	-	-	0°C ~ 85°C (TJ)	Tray	SmartFusion2	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	166MHz	64KB	ARM® Cortex®-M3	DDR, PCIe, SERDES	-	512 kB	CANbus, Ethernet, I²C, SPI, UART/USART, USB	MCU, FPGA	-	-	-	-	-	-	-	-	FPGA - 150K Logic Modules	-	1 Core	512KB	-	-
M2S150T-FCS536 Microchip Technology RoHS : Инкапсуляция : - Есть складские запасы : - 1 : -
	Mfr. Тип M2S150TS-1FCVG484I Anlielectronics Тип	Microchip Technology	SoC FPGA M2S150TS-1FCVG484I Сборник данных Сравнение	Min.:1 Mult.:1	-	484-BFBGA	-	484-FBGA (19x19)	-	M2S150	ARM Cortex M3	64 kB	-	-	84	-	-	-	-	-	166 MHz	-	-	Microchip Technology	-	-	Yes	-	-	-	273	12177 LAB	146124 LE	-	-	Tray	-	-	-	-	-	-	-	-	Active	-	-	Details	-	This product may require additional documentation to export from the United States.	-	-	-	-	-	-	-40°C ~ 100°C (TJ)	Tray	SmartFusion2	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	166MHz	64KB	ARM® Cortex®-M3	DDR, PCIe, SERDES	-	512 kB	CANbus, Ethernet, I²C, SPI, UART/USART, USB	MCU, FPGA	-	-	-	-	-	-	-	-	FPGA - 150K Logic Modules	-	1 Core	512KB	-	-
M2S150TS-1FCVG484I Microchip Technology RoHS : Инкапсуляция : - Есть складские запасы : - 1 : -
	Mfr. Тип M2S050TS-1FGG484M Anlielectronics Тип	Microchip Technology	SoC FPGA M2S050TS-1FGG484M Сборник данных Сравнение	Min.:1 Mult.:1	Production (Last Updated: 2 months ago)	FPBGA-484	YES	484-FPBGA (23x23)	484	M2S050	ARM Cortex M3	64 kB	-	-	60	MICROSEMI CORP	-	-	-	M2S050TS-1FGG484M	166 MHz	-	-	Microchip Technology	-	-	Yes	3	SMD/SMT	-	267	4695 LAB	56340 LE	125 °C	-55 °C	Tray	PLASTIC/EPOXY	BGA	FBGA-484	BGA484,22X22,40	SQUARE	GRID ARRAY	Active	-	Active	40	5.81	Details	Yes	This product may require additional documentation to export from the United States.	1.26 V	1.14 V	1.2 V	-	-	-	-55°C ~ 125°C (TJ)	Tray	SmartFusion2	e1	3A001.A.2.C	Tin/Silver/Copper (Sn/Ag/Cu)	-	-	-	8542.39.00.01	CMOS	BOTTOM	BALL	250	1 mm	compliant	-	S-PBGA-B484	267	Not Qualified	-	1.2 V	MILITARY	-	166MHz	64KB	ARM® Cortex®-M3	DDR, PCIe, SERDES	-	256 kB	CANbus, Ethernet, I²C, SPI, UART/USART, USB	MCU, FPGA	267	2.44 mm	FIELD PROGRAMMABLE GATE ARRAY	-	-	-	-	-	FPGA - 50K Logic Modules	56340	1 Core	256KB	23 mm	23 mm
M2S050TS-1FGG484M Microchip Technology RoHS : Инкапсуляция : - Есть складские запасы : - 1 : -
	Mfr. Тип M2S025T-1FGG484M Anlielectronics Тип	Microchip Technology	SoC FPGA M2S025T-1FGG484M Сборник данных Сравнение	Min.:1 Mult.:1	Production (Last Updated: 2 months ago)	FPBGA-484	-	484-FPBGA (23x23)	-	M2S025	ARM Cortex M3	64 kB	-	-	60	-	-	-	-	-	166 MHz	-	-	Microchip Technology	-	-	Yes	-	SMD/SMT	-	267	2308 LAB	27696 LE	-	-	Tray	-	-	-	-	-	-	-	-	Active	-	-	Details	-	This product may require additional documentation to export from the United States.	-	-	-	-	-	-	-55°C ~ 125°C (TJ)	Tray	SmartFusion2	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	166MHz	64KB	ARM® Cortex®-M3	DDR, PCIe, SERDES	-	256 kB	CANbus, Ethernet, I²C, SPI, UART/USART, USB	MCU, FPGA	-	-	-	-	-	-	-	-	FPGA - 25K Logic Modules	-	1 Core	256KB	-	-
M2S025T-1FGG484M Microchip Technology RoHS : Инкапсуляция : - Есть складские запасы : - 1 : -
	Mfr. Тип M2S090TS-1FGG484T2 Anlielectronics Тип	Microchip Technology	SoC FPGA M2S090TS-1FGG484T2 Сборник данных Сравнение	Min.:1 Mult.:1	-	BGA-484	-	484-FPBGA (23x23)	-	M2S090	ARM Cortex M3	64 kB	-	2074 kbit	60	-	-	-	-	-	166 MHz	-	+ 125 C	Microchip Technology	-	- 40 C	-	-	SMD/SMT	-	267 I/O	7193 LAB	86316 LE	-	-	Tray	-	-	-	-	-	-	-	-	Active	-	-	-	-	-	-	-	-	-	-	2.110353 oz	-40°C ~ 125°C (TJ)	Tray	SmartFusion2	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	1.2 V	-	-	-	166MHz	64KB	ARM® Cortex®-M3	DDR, PCIe, SERDES	-	512 kB	CANbus, Ethernet, I²C, SPI, UART/USART, USB	MCU, FPGA	-	-	-	-	-	-	1	-	FPGA - 90K Logic Modules	-	1 Core	512KB	-	-
M2S090TS-1FGG484T2 Microchip Technology RoHS : Инкапсуляция : - Есть складские запасы : - 1 : -
	Mfr. Тип A2F500M3G-CS288I Anlielectronics Тип	Microchip Technology	SoC FPGA A2F500M3G-CS288I Сборник данных Сравнение	Min.:1 Mult.:1	-	288-TFBGA, CSPBGA	-	288-CSP (11x11)	-	A2F500	ARM Cortex M3	64 kB	-	-	176	-	-	-	-	-	80 MHz	-	-	Microchip Technology	-	-	Yes	-	-	-	MCU - 31, FPGA - 78	-	6000 LE	-	-	Tray	-	-	-	-	-	-	-	-	Active	-	-	N	-	This product may require additional documentation to export from the United States.	-	-	-	SmartFusion	-	-	-40°C ~ 100°C (TJ)	Tray	A2F500	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	80MHz	64KB	ARM® Cortex®-M3	DMA, POR, WDT	-	512 kB	EBI/EMI, Ethernet, I²C, SPI, UART/USART	MCU, FPGA	-	-	-	-	-	-	-	-	ProASIC®3 FPGA, 500K Gates, 11520 D-Flip-Flops	-	1 Core	512KB	-	-
A2F500M3G-CS288I Microchip Technology RoHS : Инкапсуляция : - Есть складские запасы : - 1 : -
	Mfr. Тип M2S010S-1TQG144I Anlielectronics Тип	Microchip Technology	SoC FPGA M2S010S-1TQG144I Сборник данных Сравнение	Min.:1 Mult.:1	-	TQFP-144	-	144-TQFP (20x20)	-	M2S010	ARM Cortex M3	64 kB	-	400 kbit	60	-	-	-	-	-	166 MHz	1.26 V	+ 100 C	Microchip Technology	1.14 V	- 40 C	-	-	SMD/SMT	-	84 I/O	1007 LAB	12084 LE	-	-	Tray	-	-	-	-	-	-	-	-	Active	-	-	-	-	This product may require additional documentation to export from the United States.	-	-	-	-	1.2000 V	-	-40 to 100 °C	Tray	SmartFusion2	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	1.2 V	-	-	-	166MHz	64KB	ARM® Cortex®-M3	-	-	256 kB	CANbus, Ethernet, I²C, SPI, UART/USART, USB	MCU, FPGA	-	-	-	-	-	-	1	-	FPGA - 10K Logic Modules	-	1 Core	256KB	-	-
M2S010S-1TQG144I Microchip Technology RoHS : Инкапсуляция : - Есть складские запасы : - 1 : -
	Mfr. Тип M2S010S-TQG144I Anlielectronics Тип	Microchip Technology	SoC FPGA M2S010S-TQG144I Сборник данных Сравнение	Min.:1 Mult.:1	-	TQFP-144	-	144-TQFP (20x20)	-	M2S010	ARM Cortex M3	64 kB	-	400 kbit	60	-	-	-	-	-	166 MHz	-	+ 100 C	Microchip Technology	-	- 40 C	-	-	SMD/SMT	-	84 I/O	1007 LAB	12084 LE	-	-	Tray	-	-	-	-	-	-	-	-	Active	-	-	-	-	This product may require additional documentation to export from the United States.	-	-	-	-	-	-	-40°C ~ 100°C (TJ)	Tray	SmartFusion2	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	1.2 V	-	-	-	166MHz	64KB	ARM® Cortex®-M3	-	-	256 kB	CANbus, Ethernet, I²C, SPI, UART/USART, USB	MCU, FPGA	-	-	-	-	-	-	-	-	FPGA - 10K Logic Modules	-	1 Core	256KB	-	-
M2S010S-TQG144I Microchip Technology RoHS : Инкапсуляция : - Есть складские запасы : - 1 : -
	Mfr. Тип PIC32CX1025SG41100-I/E5X Anlielectronics Тип	Microchip Technology	RF System on a Chip - SoC CM4, TQFP 100, 1 MFlash, USB, Eth., CAN, Immutable Boot, I Temp, Tray Сборник данных Сравнение	Min.:1 Mult.:1	-	TQFP-100	-	-	-	-	-	-	EV06X38A	-	1000	-	CAN, Ethernet, USB	-	-	-	120 MHz	-	+ 85 C	Microchip Technology	-	- 40 C	-	-	SMD/SMT	-	81 I/O	-	-	-	-	Tray	-	-	-	-	-	-	-	PIC32CX	Active	-	-	Details	-	-	3.63 V	1.71 V	-	-	-	-	-	Tray	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	1.71 V to 3.63 V	-	-	-	-	-	-	-	Flash	1 MB	-	-	-	-	-	- 40 C to + 85 C	-	-	-	32 Channel	-	-	-	-	-	-
PIC32CX1025SG41100-I/E5X Microchip Technology RoHS : Инкапсуляция : - Есть складские запасы : - 1 : -
	Mfr. Тип MPFS025T-FCVG484I Anlielectronics Тип	Microchip Technology	SoC FPGA MPFS025T-FCVG484I Сборник данных Сравнение	Min.:1 Mult.:1	-	FCVG-484	-	484-FCBGA (19x19)	-	-	RV64GC, RV64IMAC	-	-	-	1	-	-	4 x 32 kB	16 kB, 4 x 32 kB	-	667 MHz, 667 MHz	-	+ 100 C	Microchip Technology	-	0 C	-	-	SMD/SMT	MSL 3 - 168 hours	108 I/O	-	23000 LE	-	-	Tray	-	-	-	-	-	-	-	-	Active	-	-	-	-	-	-	-	-	-	-	-	-40°C ~ 100°C	Tray	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	1 V	-	-	-	-	230.4KB	RISC-V	DMA, PCI, PWM	-	-	CAN, Ethernet, I²C, MMC, QSPI, SPI, UART/USART, USB OTG	MPU, FPGA	-	-	-	-	-	1843.2Kbit	-	-	FPGA - 23K Logic Modules	-	5 Core	128KB	-	-
MPFS025T-FCVG484I Microchip Technology RoHS : Инкапсуляция : - Есть складские запасы : - 1 : -
	Mfr. Тип A2F500M3G-FG484M Anlielectronics Тип	Microchip Technology	SoC FPGA A2F500M3G-FG484M Сборник данных Сравнение	Min.:1 Mult.:1	-	484-BGA	-	484-FPBGA (23x23)	-	A2F500	ARM Cortex M3	64 kB	-	-	60	-	-	-	-	-	80 MHz	-	-	Microchip Technology	-	-	Yes	-	-	-	MCU - 41, FPGA - 128	-	6000 LE	-	-	Tray	-	-	-	-	-	-	-	-	Active	-	-	N	-	This product may require additional documentation to export from the United States.	-	-	-	SmartFusion	-	-	-55°C ~ 125°C (TJ)	Tray	A2F500	-	-	-	125 °C	-55 °C	-	-	-	-	-	-	-	-	80 MHz	-	-	-	-	-	-	EBI/EMI, Ethernet, I2C, SPI, UART, USART	80MHz	64KB	ARM® Cortex®-M3	DMA, POR, WDT	-	512 kB	EBI/EMI, Ethernet, I²C, SPI, UART/USART	MCU, FPGA	-	-	-	-	ARM	-	-	-	ProASIC®3 FPGA, 500K Gates, 11520 D-Flip-Flops	-	1 Core	512KB	-	-
A2F500M3G-FG484M Microchip Technology RoHS : Инкапсуляция : - Есть складские запасы : - 1 : -
	Mfr. Тип M2S025-FCS325I Anlielectronics Тип	Microchip Technology	SoC FPGA M2S025-FCS325I Сборник данных Сравнение	Min.:1 Mult.:1	Production (Last Updated: 2 months ago)	FCBGA-325	-	325-FCBGA (11x11)	-	M2S025	ARM Cortex M3	64 kB	-	-	176	-	-	-	-	-	166 MHz	-	-	Microchip Technology	-	-	Yes	-	SMD/SMT	-	180	2308 LAB	27696 LE	-	-	Tray	-	-	-	-	-	-	-	-	Active	-	-	N	-	This product may require additional documentation to export from the United States.	-	-	-	-	-	-	-40°C ~ 100°C (TJ)	Tray	SmartFusion2	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	166MHz	64KB	ARM® Cortex®-M3	DDR, PCIe, SERDES	-	256 kB	CANbus, Ethernet, I²C, SPI, UART/USART, USB	MCU, FPGA	-	-	-	-	-	-	-	-	FPGA - 25K Logic Modules	-	1 Core	256KB	-	-
M2S025-FCS325I Microchip Technology RoHS : Инкапсуляция : - Есть складские запасы : - 1 : -
	Mfr. Тип M2S005-VFG400I Anlielectronics Тип	Microchip Technology	SoC FPGA M2S005-VFG400I Сборник данных Сравнение	Min.:1 Mult.:1	-	400-LFBGA	YES	400-VFBGA (17x17)	400	M2S005	ARM Cortex M3	64 kB	-	-	90	MICROSEMI CORP	-	-	-	M2S005-VFG400I	166 MHz	-	+ 100 C	Microchip Technology	-	- 40 C	Yes	3	SMD/SMT	-	169 I/O	505 LAB	6060 LE	-	-	Tray	PLASTIC/EPOXY	LFBGA	VFBGA-400	BGA400,20X20,32	SQUARE	GRID ARRAY, LOW PROFILE, FINE PITCH	Active	-	Active	40	5.78	Details	Yes	-	1.26 V	1.14 V	1.2 V	-	-	0.346560 oz	-40°C ~ 100°C (TJ)	Tray	SmartFusion2	e1	-	Tin/Silver/Copper (Sn/Ag/Cu)	-	-	-	8542.39.00.01	CMOS	BOTTOM	BALL	250	0.8 mm	compliant	-	S-PBGA-B400	171	Not Qualified	1.2 V	1.2 V	-	-	166MHz	64KB	ARM® Cortex®-M3	DDR	-	128 kB	CANbus, Ethernet, I²C, SPI, UART/USART, USB	MCU, FPGA	171	1.51 mm	FIELD PROGRAMMABLE GATE ARRAY	-	-	-	STD	-	FPGA - 5K Logic Modules	6060	1 Core	128KB	17 mm	17 mm
M2S005-VFG400I Microchip Technology RoHS : Инкапсуляция : - Есть складские запасы : - 1 : -
	Mfr. Тип M2S005-VF400I Anlielectronics Тип	Microchip Technology	SoC FPGA M2S005-VF400I Сборник данных Сравнение	Min.:1 Mult.:1	-	400-LFBGA	YES	400-VFBGA (17x17)	400	M2S005	ARM Cortex M3	64 kB	-	-	90	MICROSEMI CORP	-	-	-	M2S005-VF400I	166 MHz	-	-	Microchip Technology	-	-	Yes	-	-	-	169	505 LAB	6060 LE	-	-	Tray	PLASTIC/EPOXY	LFBGA	VFBGA-400	BGA400,20X20,32	SQUARE	GRID ARRAY, LOW PROFILE, FINE PITCH	Active	-	Active	30	5.84	N	No	-	1.26 V	1.14 V	1.2 V	-	-	0.356867 oz	-40°C ~ 100°C (TJ)	Tray	SmartFusion2	e0	-	Tin/Lead (Sn/Pb)	-	-	-	8542.39.00.01	CMOS	BOTTOM	BALL	240	0.8 mm	not_compliant	-	S-PBGA-B400	171	Not Qualified	-	1.2 V	-	-	166MHz	64KB	ARM® Cortex®-M3	DDR	-	128 kB	CANbus, Ethernet, I²C, SPI, UART/USART, USB	MCU, FPGA	171	1.51 mm	FIELD PROGRAMMABLE GATE ARRAY	-	-	-	-	-	FPGA - 5K Logic Modules	6060	1 Core	128KB	17 mm	17 mm
M2S005-VF400I Microchip Technology RoHS : Инкапсуляция : - Есть складские запасы : - 1 : -
	Mfr. Тип M2S005-1VFG256 Anlielectronics Тип	Microchip Technology	SoC FPGA M2S005-1VFG256 Сборник данных Сравнение	Min.:1 Mult.:1	-	VFPBGA-256	YES	256-FPBGA (17x17)	256	M2S005	ARM Cortex M3	64 kB	-	-	119	MICROSEMI CORP	-	-	-	M2S005-1VFG256	166 MHz	-	-	Microchip Technology	-	-	Yes	3	SMD/SMT	MSL 3 - 168 hours	161	505 LAB	6060 LE	85 °C	-	Tray	PLASTIC/EPOXY	LFBGA	VFBGA-256	BGA256,16X16,32	SQUARE	GRID ARRAY, LOW PROFILE, FINE PITCH	Active	-	Active	40	5.79	Details	Yes	This product may require additional documentation to export from the United States.	1.26 V	1.14 V	1.2 V	-	-	-	0°C ~ 85°C (TJ)	Tray	SmartFusion2	e1	-	Tin/Silver/Copper (Sn/Ag/Cu)	-	-	LG-MIN, WD-MIN	8542.39.00.01	CMOS	BOTTOM	BALL	250	0.8 mm	compliant	-	S-PBGA-B256	161	Not Qualified	-	1.2 V	OTHER	-	166MHz	64KB	ARM® Cortex®-M3	-	-	128 kB	CANbus, Ethernet, I²C, SPI, UART/USART, USB	MCU, FPGA	161	1.56 mm	FIELD PROGRAMMABLE GATE ARRAY	-	-	191Kbit	-	-	FPGA - 5K Logic Modules	6060	1 Core	128KB	14 mm	14 mm
M2S005-1VFG256 Microchip Technology RoHS : Инкапсуляция : - Есть складские запасы : - 1 : -
	Mfr. Тип A2F500M3G-FGG484M Anlielectronics Тип	Microchip Technology	SoC FPGA A2F500M3G-FGG484M Сборник данных Сравнение	Min.:1 Mult.:1	-	484-BGA	-	484-FPBGA (23x23)	-	A2F500	ARM Cortex M3	64 kB	-	-	60	-	-	-	-	-	80 MHz	-	-	Microchip Technology	-	-	Yes	-	-	-	MCU - 41, FPGA - 128	-	6000 LE	-	-	Tray	-	-	-	-	-	-	-	-	Active	-	-	Details	-	This product may require additional documentation to export from the United States.	-	-	-	SmartFusion	-	-	-55°C ~ 125°C (TJ)	Tray	A2F500	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	80MHz	64KB	ARM® Cortex®-M3	DMA, POR, WDT	-	512 kB	EBI/EMI, Ethernet, I²C, SPI, UART/USART	MCU, FPGA	-	-	-	-	-	-	-	-	ProASIC®3 FPGA, 500K Gates, 11520 D-Flip-Flops	-	1 Core	512KB	-	-
A2F500M3G-FGG484M Microchip Technology RoHS : Инкапсуляция : - Есть складские запасы : - 1 : -

Integrated Circuits (ICs)

Embedded - System On Chip (SoC) definition: A System On Chip (SoC) combines the required electronic circuits of various computer components onto a single, integrated chip (IC). SoC is ... Embedded - System On Chip (SoC) Product Listing: M2S025T-FCSG325,M2S050TS-1FGG484I,M2S005S-FG484I,M2S150TS-FCVG484,M2S150T-FCS536.Integrated Circuits (ICs) type:Embedded - Microcontrollers(129432),Memory(111901),PMIC - Supervisors(101743),PMIC - Voltage Regulators - Linear(101187),PMIC - Voltage Regulators - DC DC Switching Regulators(62822) .Embedded - System On Chip (SoC) has 873 pieces of spot stock price information, you can click the "RFQ" button to confirm the inventory and price with the Anli.

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Integrated Circuits (ICs)