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Изображение	Тип	Марка	Объяснение	Установленная цена	Количество	RoHS	Lifecycle Status	Package / Case	Surface Mount	Supplier Device Package	Number of Terminals	# I/Os (Max)	Base Product Number	Core	Data RAM Size	Distributed RAM	Factory Pack QuantityFactory Pack Quantity	Family Name	I/O Voltage	Ihs Manufacturer	Instruction Set Architecture	Interface Type	JTAG Support	L1 Cache Data Memory	L1 Cache Instruction Memory	Logic Cells	Manufacturer Part Number	Maximum Clock Frequency	Maximum Operating Supply Voltage	Maximum Operating Temperature	Mfr	Minimum Operating Supply Voltage	Minimum Operating Temperature	Moisture Sensitive	Moisture Sensitivity Levels	Mounting	Mounting Styles	Number of CPU Cores	Number of I/Os	Number of Logic Array Blocks - LABs	Number of Logic Blocks/Elements	Number of Logic Elements	Operating Supply Voltage (Max)	Operating Supply Voltage (Min)	Operating Supply Voltage (Typ)	Operating Temp Range	Operating Temperature (Max.)	Operating Temperature (Min.)	Operating Temperature Classification	Operating Temperature-Max	Package	Package Body Material	Package Code	Package Description	Package Equivalence Code	Package Shape	Package Style	Package Type	Part Life Cycle Code	Process Technology	Product Status	Programmable	Rad Hardened	Reflow Temperature-Max (s)	Risk Rank	RoHS	Rohs Code	Samacsys Description	Shipping Restrictions	Supply Voltage-Max	Supply Voltage-Min	Supply Voltage-Nom	Tradename	Typical Operating Supply Voltage	Unit Weight	Usage Level	Operating Temperature	Packaging	Series	JESD-609 Code	Terminal Finish	Additional Feature	HTS Code	Technology	Terminal Position	Terminal Form	Peak Reflow Temperature (Cel)	Terminal Pitch	Reach Compliance Code	Time@Peak Reflow Temperature-Max (s)	Pin Count	JESD-30 Code	Number of Outputs	Qualification Status	Operating Supply Voltage	Power Supplies	Temperature Grade	Interface	Speed	RAM Size	Core Processor	Peripherals	Program Memory Size	Connectivity	Architecture	Data Bus Width	Number of Inputs	Seated Height-Max	Programmable Logic Type	Screening Level	Speed Grade	Primary Attributes	Number of Logic Cells	Number of Cores	Flash Size	Length	Width

Изображение	Тип	Марка	Объяснение	Количество	Lifecycle Status	Package / Case	Surface Mount	Supplier Device Package	Number of Terminals	# I/Os (Max)	Base Product Number	Core	Data RAM Size	Distributed RAM	Factory Pack QuantityFactory Pack Quantity	Family Name	I/O Voltage	Ihs Manufacturer	Instruction Set Architecture	Interface Type	JTAG Support	L1 Cache Data Memory	L1 Cache Instruction Memory	Logic Cells	Manufacturer Part Number	Maximum Clock Frequency	Maximum Operating Supply Voltage	Maximum Operating Temperature	Mfr	Minimum Operating Supply Voltage	Minimum Operating Temperature	Moisture Sensitive	Moisture Sensitivity Levels	Mounting	Mounting Styles	Number of CPU Cores	Number of I/Os	Number of Logic Array Blocks - LABs	Number of Logic Blocks/Elements	Number of Logic Elements	Operating Supply Voltage (Max)	Operating Supply Voltage (Min)	Operating Supply Voltage (Typ)	Operating Temp Range	Operating Temperature (Max.)	Operating Temperature (Min.)	Operating Temperature Classification	Operating Temperature-Max	Package	Package Body Material	Package Code	Package Description	Package Equivalence Code	Package Shape	Package Style	Package Type	Part Life Cycle Code	Process Technology	Product Status	Programmable	Rad Hardened	Reflow Temperature-Max (s)	Risk Rank	RoHS	Rohs Code	Samacsys Description	Shipping Restrictions	Supply Voltage-Max	Supply Voltage-Min	Supply Voltage-Nom	Tradename	Typical Operating Supply Voltage	Unit Weight	Usage Level	Operating Temperature	Packaging	Series	JESD-609 Code	Terminal Finish	Additional Feature	HTS Code	Technology	Terminal Position	Terminal Form	Peak Reflow Temperature (Cel)	Terminal Pitch	Reach Compliance Code	Time@Peak Reflow Temperature-Max (s)	Pin Count	JESD-30 Code	Number of Outputs	Qualification Status	Operating Supply Voltage	Power Supplies	Temperature Grade	Interface	Speed	RAM Size	Core Processor	Peripherals	Program Memory Size	Connectivity	Architecture	Data Bus Width	Number of Inputs	Seated Height-Max	Programmable Logic Type	Screening Level	Speed Grade	Primary Attributes	Number of Logic Cells	Number of Cores	Flash Size	Length	Width
	Mfr. Тип M2S150T-1FCVG484I Anlielectronics Тип	Microchip Technology	SoC FPGA M2S150T-1FCVG484I Сборник данных Сравнение	Min.:1 Mult.:1	-	484-BFBGA	-	484-FBGA (19x19)	-	-	M2S150	ARM Cortex M3	64 kB	-	84	-	-	-	-	-	-	-	-	-	-	166 MHz	-	-	Microchip Technology	-	-	Yes	-	-	-	-	273	12177 LAB	-	146124 LE	-	-	-	-	-	-	-	-	Tray	-	-	-	-	-	-	-	-	-	Active	-	-	-	-	Details	-	-	This product may require additional documentation to export from the United States.	-	-	-	-	-	-	-	-40°C ~ 100°C (TJ)	Tray	SmartFusion2	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	166MHz	64KB	ARM® Cortex®-M3	DDR, PCIe, SERDES	512 kB	CANbus, Ethernet, I²C, SPI, UART/USART, USB	MCU, FPGA	-	-	-	-	-	-	FPGA - 150K Logic Modules	-	1 Core	512KB	-	-
M2S150T-1FCVG484I Microchip Technology RoHS : Инкапсуляция : - Есть складские запасы : - 1 : -
	Mfr. Тип M2S090TS-1FCS325I Anlielectronics Тип	Microchip Technology	SoC FPGA M2S090TS-1FCS325I Сборник данных Сравнение	Min.:1 Mult.:1	-	FCBGA-325	-	325-FCBGA (11x13.5)	-	180	M2S090	ARM Cortex M3	64 kB	-	176	SMARTFUSION2	-	-	-	-	-	-	-	86184	-	166 MHz	-	-	Microchip Technology	-	-	Yes	-	Surface Mount	SMD/SMT	-	180	7193 LAB	86184	86316 LE	1.26(V)	1.14(V)	1.2(V)	-40C to 100C	100C	-40C	INDUSTRIALC	-	Tray	-	-	-	-	-	-	FCBGA	-	65nm	Active	Yes	No	-	-	N	-	-	This product may require additional documentation to export from the United States.	-	-	-	-	-	-	-	-40°C ~ 100°C (TJ)	Tray	SmartFusion2	-	-	-	-	-	-	-	-	-	-	-	325	-	-	-	-	-	-	-	166MHz	64KB	ARM® Cortex®-M3	DDR, PCIe, SERDES	512 kB	CANbus, Ethernet, I²C, SPI, UART/USART, USB	MCU, FPGA	-	-	-	-	-	1	FPGA - 90K Logic Modules	-	1 Core	512KB	-	-
M2S090TS-1FCS325I Microchip Technology RoHS : Инкапсуляция : - Есть складские запасы : - 1 : -
	Mfr. Тип M2S150TS-1FC1152 Anlielectronics Тип	Microchip Technology	SoC FPGA M2S150TS-1FC1152 Сборник данных Сравнение	Min.:1 Mult.:1	-	FCBGA-1152	-	1152-FCBGA (35x35)	-	-	M2S150	ARM Cortex M3	64 kB	-	24	-	-	-	-	-	-	-	-	-	-	166 MHz	-	-	Microchip Technology	-	-	Yes	-	-	SMD/SMT	-	574	12177 LAB	-	146124 LE	-	-	-	-	-	-	-	-	Tray	-	-	-	-	-	-	-	-	-	Active	-	-	-	-	N	-	-	This product may require additional documentation to export from the United States.	-	-	-	-	-	-	-	0°C ~ 85°C (TJ)	Tray	SmartFusion2	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	166MHz	64KB	ARM® Cortex®-M3	DDR, PCIe, SERDES	512 kB	CANbus, Ethernet, I²C, SPI, UART/USART, USB	MCU, FPGA	-	-	-	-	-	-	FPGA - 150K Logic Modules	-	1 Core	512KB	-	-
M2S150TS-1FC1152 Microchip Technology RoHS : Инкапсуляция : - Есть складские запасы : - 1 : -
	Mfr. Тип M2S090TS-FCS325I Anlielectronics Тип	Microchip Technology	SoC FPGA M2S090TS-FCS325I Сборник данных Сравнение	Min.:1 Mult.:1	-	FCBGA-325	-	325-FCBGA (11x13.5)	-	-	M2S090	ARM Cortex M3	64 kB	-	176	-	-	-	-	-	-	-	-	-	-	166 MHz	-	-	Microchip Technology	-	-	Yes	-	-	SMD/SMT	-	180	7193 LAB	-	86316 LE	-	-	-	-	-	-	-	-	Tray	-	-	-	-	-	-	-	-	-	Active	-	-	-	-	N	-	-	This product may require additional documentation to export from the United States.	-	-	-	-	-	-	-	-40°C ~ 100°C (TJ)	Tray	SmartFusion2	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	166MHz	64KB	ARM® Cortex®-M3	DDR, PCIe, SERDES	512 kB	CANbus, Ethernet, I²C, SPI, UART/USART, USB	MCU, FPGA	-	-	-	-	-	-	FPGA - 90K Logic Modules	-	1 Core	512KB	-	-
M2S090TS-FCS325I Microchip Technology RoHS : Инкапсуляция : - Есть складские запасы : - 1 : -
	Mfr. Тип M2S090T-1FGG484I Anlielectronics Тип	Microchip Technology	SoC FPGA M2S090T-1FGG484I Сборник данных Сравнение	Min.:1 Mult.:1	-	FPBGA-484	YES	484-FPBGA (23x23)	484	-	M2S090	ARM Cortex M3	64 kB	-	60	-	-	MICROSEMI CORP	-	-	-	-	-	-	M2S090T-1FGG484I	166 MHz	1.26 V	-	Microchip Technology	1.14 V	-	Yes	3	-	SMD/SMT	-	267	7193 LAB	-	86316 LE	-	-	-	-	-	-	-	-	Tray	PLASTIC/EPOXY	BGA	BGA, BGA484,22X22,40	BGA484,22X22,40	SQUARE	GRID ARRAY	-	Active	-	Active	-	-	-	5.77	Details	Yes	FPGA - Field Programmable Gate Array M2S090T-1FGG484I	This product may require additional documentation to export from the United States.	1.26 V	1.14 V	1.2 V	-	1.2000 V	-	-	-40 to 100 °C	Tray	SmartFusion2	e1	Tin/Silver/Copper (Sn/Ag/Cu)	-	8542.39.00.01	CMOS	BOTTOM	BALL	250	1 mm	compliant	40	-	S-PBGA-B484	267	Not Qualified	-	1.2 V	-	-	166MHz	64KB	ARM® Cortex®-M3	DDR, PCIe, SERDES	512 kB	CANbus, Ethernet, I²C, SPI, UART/USART, USB	MCU, FPGA	-	267	2.44 mm	FIELD PROGRAMMABLE GATE ARRAY	-	1	FPGA - 90K Logic Modules	86316	1 Core	512KB	23 mm	23 mm
M2S090T-1FGG484I Microchip Technology RoHS : Инкапсуляция : - Есть складские запасы : - 1 : -
	Mfr. Тип M2S060T-1FG484 Anlielectronics Тип	Microchip Technology	SoC FPGA M2S060T-1FG484 Сборник данных Сравнение	Min.:1 Mult.:1	Production (Last Updated: 2 months ago)	484-BGA	YES	484-FPBGA (23x23)	484	-	M2S060	ARM Cortex M3	64 kB	-	60	-	-	MICROSEMI CORP	-	-	-	-	-	-	M2S060T-1FG484	166 MHz	-	-	Microchip Technology	-	-	Yes	3	-	-	-	267	4710 LAB	-	56520 LE	-	-	-	-	-	-	-	85 °C	Tray	PLASTIC/EPOXY	BGA	FBGA-484	BGA484,22X22,40	SQUARE	GRID ARRAY	-	Active	-	Active	-	-	30	5.88	N	No	-	This product may require additional documentation to export from the United States.	1.26 V	1.14 V	1.2 V	SmartFusion2	-	-	-	0°C ~ 85°C (TJ)	Tray	SmartFusion2	e0	Tin/Lead (Sn/Pb)	-	8542.39.00.01	CMOS	BOTTOM	BALL	240	1 mm	not_compliant	-	-	S-PBGA-B484	267	Not Qualified	-	1.2 V	OTHER	-	166MHz	64KB	ARM® Cortex®-M3	DDR, PCIe, SERDES	256 kB	CANbus, Ethernet, I²C, SPI, UART/USART, USB	MCU, FPGA	-	267	2.44 mm	FIELD PROGRAMMABLE GATE ARRAY	-	-	FPGA - 60K Logic Modules	56520	1 Core	256KB	23 mm	23 mm
M2S060T-1FG484 Microchip Technology RoHS : Инкапсуляция : - Есть складские запасы : - 1 : -
	Mfr. Тип M2S010TS-1FG484 Anlielectronics Тип	Microchip Technology	SoC FPGA M2S010TS-1FG484 Сборник данных Сравнение	Min.:1 Mult.:1	Production (Last Updated: 1 month ago)	FPBGA-484	-	484-FPBGA (23x23)	-	-	M2S010	ARM Cortex M3	64 kB	-	60	-	-	-	-	-	-	-	-	-	-	166 MHz	-	-	Microchip Technology	-	-	Yes	-	-	SMD/SMT	-	233	1007 LAB	-	12084 LE	-	-	-	-	-	-	-	-	Tray	-	-	-	-	-	-	-	-	-	Active	-	-	-	-	N	-	-	This product may require additional documentation to export from the United States.	-	-	-	-	-	-	-	0°C ~ 85°C (TJ)	Tray	SmartFusion2	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	166MHz	64KB	ARM® Cortex®-M3	DDR, PCIe, SERDES	256 kB	CANbus, Ethernet, I²C, SPI, UART/USART, USB	MCU, FPGA	-	-	-	-	-	-	FPGA - 10K Logic Modules	-	1 Core	256KB	-	-
M2S010TS-1FG484 Microchip Technology RoHS : Инкапсуляция : - Есть складские запасы : - 1 : -
	Mfr. Тип M2S050TS-1FGG896 Anlielectronics Тип	Microchip Technology	SoC FPGA M2S050TS-1FGG896 Сборник данных Сравнение	Min.:1 Mult.:1	Production (Last Updated: 2 months ago)	FPBGA-896	-	896-FBGA (31x31)	-	-	M2S050	ARM Cortex M3	64 kB	-	27	-	-	-	-	-	-	-	-	-	-	166 MHz	-	-	Microchip Technology	-	-	Yes	-	-	SMD/SMT	-	377	4695 LAB	-	56340 LE	-	-	-	-	-	-	-	-	Tray	-	-	-	-	-	-	-	-	-	Active	-	-	-	-	Details	-	-	This product may require additional documentation to export from the United States.	-	-	-	-	-	-	-	0°C ~ 85°C (TJ)	Tray	SmartFusion2	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	166MHz	64KB	ARM® Cortex®-M3	DDR, PCIe, SERDES	256 kB	CANbus, Ethernet, I²C, SPI, UART/USART, USB	MCU, FPGA	-	-	-	-	-	-	FPGA - 50K Logic Modules	-	1 Core	256KB	-	-
M2S050TS-1FGG896 Microchip Technology RoHS : Инкапсуляция : - Есть складские запасы : - 1 : -
	Mfr. Тип M2S060TS-1FCSG325I Anlielectronics Тип	Microchip Technology	SoC FPGA M2S060TS-1FCSG325I Сборник данных Сравнение	Min.:1 Mult.:1	Production (Last Updated: 2 months ago)	325-TFBGA, FCBGA	-	325-FCBGA (11x11)	-	-	M2S060	ARM Cortex M3	64 kB	-	176	-	1.2, 1.5, 1.8, 2.5, 3.3 V	-	RISC	CAN/Ethernet/Serial I2C/SPI/UART/USB	Yes	-	-	-	-	166 MHz	-	-	Microchip Technology	-	-	Yes	-	Surface Mount	-	1	200	4710 LAB	-	56520 LE	-	-	-	-	-	-	-	-	Tray	-	-	-	-	-	-	-	-	-	Active	-	-	-	-	Details	-	-	This product may require additional documentation to export from the United States.	-	-	-	SmartFusion2	-	-	Industrial grade	-40 to 100 °C	Tray	SmartFusion2	-	-	-	-	-	-	-	-	-	-	-	325	-	-	-	1.2 V	-	-	CAN/Ethernet/Serial	166MHz	64 KB	ARM® Cortex®-M3	DDR, PCIe, SERDES	256 kB	CANbus, Ethernet, I²C, SPI, UART/USART, USB	MCU, FPGA	32 Bit	-	-	-	Industrial	-	FPGA - 60K Logic Modules	-	1 Core	256KB	-	-
M2S060TS-1FCSG325I Microchip Technology RoHS : Инкапсуляция : - Есть складские запасы : - 1 : -
	Mfr. Тип M2S060-VFG400 Anlielectronics Тип	Microchip Technology	SoC FPGA M2S060-VFG400 Сборник данных Сравнение	Min.:1 Mult.:1	Production (Last Updated: 2 months ago)	400-LFBGA	-	400-VFBGA (17x17)	-	-	M2S060	ARM Cortex M3	64 kB	-	90	-	-	-	-	-	-	-	-	-	-	166 MHz	1.26 V	-	Microchip Technology	1.14 V	-	Yes	-	-	-	-	207	4710 LAB	-	56520 LE	-	-	-	-	-	-	-	-	Tray	-	-	-	-	-	-	-	-	-	Active	-	-	-	-	Details	-	-	This product may require additional documentation to export from the United States.	-	-	-	SmartFusion2	1.2000 V	-	-	-40 to 100 °C	Tray	SmartFusion2	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	166MHz	64KB	ARM® Cortex®-M3	DDR, PCIe, SERDES	256 kB	CANbus, Ethernet, I²C, SPI, UART/USART, USB	MCU, FPGA	-	-	-	-	-	STD	FPGA - 60K Logic Modules	-	1 Core	256KB	-	-
M2S060-VFG400 Microchip Technology RoHS : Инкапсуляция : - Есть складские запасы : - 1 : -
	Mfr. Тип M2S025-1FCS325I Anlielectronics Тип	Microchip Technology	SoC FPGA M2S025-1FCS325I Сборник данных Сравнение	Min.:1 Mult.:1	Production (Last Updated: 2 months ago)	FCBGA-325	YES	325-FCBGA (11x11)	325	-	M2S025	ARM Cortex M3	64 kB	-	176	-	-	MICROSEMI CORP	-	-	-	-	-	-	M2S025-1FCS325I	166 MHz	-	-	Microchip Technology	-	-	Yes	-	-	SMD/SMT	-	180	2308 LAB	-	27696 LE	-	-	-	-	-	-	-	-	Tray	PLASTIC/EPOXY	TFBGA	FBGA-325	BGA325,21X21,20	SQUARE	GRID ARRAY, THIN PROFILE, FINE PITCH	-	Active	-	Active	-	-	30	5.84	N	No	-	This product may require additional documentation to export from the United States.	1.26 V	1.14 V	1.2 V	-	-	-	-	-40°C ~ 100°C (TJ)	Tray	SmartFusion2	e0	Tin/Lead (Sn/Pb)	LG-MIN, WD-MIN	8542.39.00.01	CMOS	BOTTOM	BALL	240	0.5 mm	not_compliant	-	-	S-PBGA-B325	180	Not Qualified	-	1.2 V	-	-	166MHz	64KB	ARM® Cortex®-M3	DDR, PCIe, SERDES	256 kB	CANbus, Ethernet, I²C, SPI, UART/USART, USB	MCU, FPGA	-	180	1.01 mm	FIELD PROGRAMMABLE GATE ARRAY	-	-	FPGA - 25K Logic Modules	27696	1 Core	256KB	11 mm	11 mm
M2S025-1FCS325I Microchip Technology RoHS : Инкапсуляция : - Есть складские запасы : - 1 : -
	Mfr. Тип M2S010-VF400 Anlielectronics Тип	Microchip Technology	SoC FPGA M2S010-VF400 Сборник данных Сравнение	Min.:1 Mult.:1	-	VFPBGA-400	-	400-VFBGA (17x17)	-	-	M2S010	ARM Cortex M3	64 kB	-	90	-	-	-	-	-	-	-	-	-	-	166 MHz	1.26 V	-	Microchip Technology	1.14 V	-	Yes	-	-	SMD/SMT	-	195	1007 LAB	-	12084 LE	-	-	-	-	-	-	-	-	Tray	-	-	-	-	-	-	-	-	-	Active	-	-	-	-	N	-	-	This product may require additional documentation to export from the United States.	-	-	-	-	1.2000 V	-	-	0 to 85 °C	Tray	SmartFusion2	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	166MHz	64KB	ARM® Cortex®-M3	DDR, PCIe, SERDES	256 kB	CANbus, Ethernet, I²C, SPI, UART/USART, USB	MCU, FPGA	-	-	-	-	-	STD	FPGA - 10K Logic Modules	-	1 Core	256KB	-	-
M2S010-VF400 Microchip Technology RoHS : Инкапсуляция : - Есть складские запасы : - 1 : -
	Mfr. Тип M2S090-1FCSG325I Anlielectronics Тип	Microchip Technology	SoC FPGA M2S090-1FCSG325I Сборник данных Сравнение	Min.:1 Mult.:1	-	FCBGA-325	YES	325-FCBGA (11x13.5)	325	-	M2S090	ARM Cortex M3	64 kB	-	176	-	-	MICROSEMI CORP	-	-	-	-	-	-	M2S090-1FCSG325I	166 MHz	1.26 V	-	Microchip Technology	1.14 V	-	Yes	3	-	SMD/SMT	-	180	7193 LAB	-	86316 LE	-	-	-	-	-	-	-	-	Tray	PLASTIC/EPOXY	TFBGA	TFBGA, BGA325,21X21,20	BGA325,21X21,20	RECTANGULAR	GRID ARRAY, THIN PROFILE, FINE PITCH	-	Active	-	Active	-	-	40	5.78	Details	Yes	-	This product may require additional documentation to export from the United States.	1.26 V	1.14 V	1.2 V	-	1.2000 V	-	-	-40 to 100 °C	Tray	SmartFusion2	e1	Tin/Silver/Copper (Sn/Ag/Cu)	LG-MIN, WD-MIN	8542.39.00.01	CMOS	BOTTOM	BALL	250	0.5 mm	compliant	-	-	R-PBGA-B325	180	Not Qualified	-	1.2 V	-	-	166MHz	64KB	ARM® Cortex®-M3	DDR, PCIe, SERDES	512 kB	CANbus, Ethernet, I²C, SPI, UART/USART, USB	MCU, FPGA	-	180	1.16 mm	FIELD PROGRAMMABLE GATE ARRAY	-	1	FPGA - 90K Logic Modules	86316	1 Core	512KB	13.5 mm	11 mm
M2S090-1FCSG325I Microchip Technology RoHS : Инкапсуляция : - Есть складские запасы : - 1 : -
	Mfr. Тип M2S050T-FCSG325 Anlielectronics Тип	Microchip Technology	SoC FPGA M2S050T-FCSG325 Сборник данных Сравнение	Min.:1 Mult.:1	Production (Last Updated: 2 months ago)	325-TFBGA, FCBGA	YES	325-FCBGA (11x11)	325	-	M2S050	ARM Cortex M3	64 kB	-	176	-	-	MICROSEMI CORP	-	-	-	-	-	-	M2S050T-FCSG325	166 MHz	1.26 V	-	Microchip Technology	1.14 V	-	Yes	3	-	-	-	200	4695 LAB	-	56340 LE	-	-	-	-	-	-	-	85 °C	Tray	PLASTIC/EPOXY	TFBGA	TFBGA, BGA325,21X21,20	BGA325,21X21,20	SQUARE	GRID ARRAY, THIN PROFILE, FINE PITCH	-	Active	-	Active	-	-	40	5.76	Details	Yes	-	This product may require additional documentation to export from the United States.	1.26 V	1.14 V	1.2 V	-	2.5, 3.3 V	-	-	0 to 85 °C	Tray	SmartFusion2	e1	Tin/Silver/Copper (Sn/Ag/Cu)	LG-MIN, WD-MIN	8542.39.00.01	CMOS	BOTTOM	BALL	250	0.5 mm	compliant	-	-	S-PBGA-B325	200	Not Qualified	-	1.2 V	OTHER	-	166MHz	64KB	ARM® Cortex®-M3	DDR, PCIe, SERDES	256 kB	CANbus, Ethernet, I²C, SPI, UART/USART, USB	MCU, FPGA	-	200	1.01 mm	FIELD PROGRAMMABLE GATE ARRAY	-	STD	FPGA - 50K Logic Modules	56340	1 Core	256KB	11 mm	11 mm
M2S050T-FCSG325 Microchip Technology RoHS : Инкапсуляция : - Есть складские запасы : - 1 : -
	Mfr. Тип M2S005S-1TQG144I Anlielectronics Тип	Microchip Technology	SoC FPGA M2S005S-1TQG144I Сборник данных Сравнение	Min.:1 Mult.:1	-	TQFP-144	-	144-TQFP (20x20)	-	-	M2S005	ARM Cortex M3	64 kB	-	60	-	-	-	-	-	-	-	-	-	-	166 MHz	-	-	Microchip Technology	-	-	Yes	-	-	SMD/SMT	-	84	505 LAB	-	6060 LE	-	-	-	-	-	-	-	-	Tray	-	-	-	-	-	-	-	-	-	Active	-	-	-	-	Details	-	-	This product may require additional documentation to export from the United States.	-	-	-	-	-	0.046530 oz	-	-40°C ~ 100°C (TJ)	Tray	SmartFusion2	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	166MHz	64KB	ARM® Cortex®-M3	-	128 kB	CANbus, Ethernet, I²C, SPI, UART/USART, USB	MCU, FPGA	-	-	-	-	-	-	FPGA - 5K Logic Modules	-	1 Core	128KB	-	-
M2S005S-1TQG144I Microchip Technology RoHS : Инкапсуляция : - Есть складские запасы : - 1 : -
	Mfr. Тип M2S090-1FG484 Anlielectronics Тип	Microchip Technology	SoC FPGA M2S090-1FG484 Сборник данных Сравнение	Min.:1 Mult.:1	-	FPBGA-484	YES	484-FPBGA (23x23)	484	-	M2S090	ARM Cortex M3	64 kB	-	60	-	-	MICROSEMI CORP	-	-	-	-	-	-	M2S090-1FG484	166 MHz	-	-	Microchip Technology	-	-	Yes	3	-	SMD/SMT	-	267	7193 LAB	-	86316 LE	-	-	-	-	-	-	-	85 °C	Tray	PLASTIC/EPOXY	BGA	FBGA-484	BGA484,22X22,40	SQUARE	GRID ARRAY	-	Active	-	Active	-	-	30	5.83	N	No	-	This product may require additional documentation to export from the United States.	1.26 V	1.14 V	1.2 V	-	-	-	-	0°C ~ 85°C (TJ)	Tray	SmartFusion2	e0	Tin/Lead (Sn/Pb)	-	8542.39.00.01	CMOS	BOTTOM	BALL	240	1 mm	not_compliant	-	-	S-PBGA-B484	267	Not Qualified	-	1.2 V	OTHER	-	166MHz	64KB	ARM® Cortex®-M3	DDR, PCIe, SERDES	512 kB	CANbus, Ethernet, I²C, SPI, UART/USART, USB	MCU, FPGA	-	267	2.44 mm	FIELD PROGRAMMABLE GATE ARRAY	-	-	FPGA - 90K Logic Modules	86316	1 Core	512KB	23 mm	23 mm
M2S090-1FG484 Microchip Technology RoHS : Инкапсуляция : - Есть складские запасы : - 1 : -
	Mfr. Тип M2S005-VFG256 Anlielectronics Тип	Microchip Technology	SoC FPGA M2S005-VFG256 Сборник данных Сравнение	Min.:1 Mult.:1	-	BGA-256	YES	256-FPBGA (14x14)	256	-	M2S005	ARM Cortex M3	64 kB	191 kbit	119	-	-	MICROSEMI CORP	-	-	-	-	-	-	M2S005-VFG256	166 MHz	-	+ 85 C	Microchip Technology	-	0 C	Yes	3	-	SMD/SMT	-	161 I/O	505 LAB	-	6060 LE	-	-	-	-	-	-	-	85 °C	Tray	PLASTIC/EPOXY	LFBGA	LFBGA, BGA256,16X16,32	BGA256,16X16,32	SQUARE	GRID ARRAY, LOW PROFILE, FINE PITCH	-	Active	-	Active	-	-	40	5.77	Details	Yes	-	-	1.26 V	1.14 V	1.2 V	-	-	0.167354 oz	-	0°C ~ 85°C (TJ)	Tray	SmartFusion2	e1	Tin/Silver/Copper (Sn/Ag/Cu)	LG-MIN, WD-MIN	8542.39.00.01	CMOS	BOTTOM	BALL	250	0.8 mm	compliant	-	-	S-PBGA-B256	161	Not Qualified	1.2 V	1.2 V	OTHER	-	166MHz	64KB	ARM® Cortex®-M3	-	128 kB	CANbus, Ethernet, I²C, SPI, UART/USART, USB	MCU, FPGA	-	161	1.56 mm	FIELD PROGRAMMABLE GATE ARRAY	-	STD	FPGA - 5K Logic Modules	6060	1 Core	128KB	14 mm	14 mm
M2S005-VFG256 Microchip Technology RoHS : Инкапсуляция : - Есть складские запасы : - 1 : -
	Mfr. Тип M2S005S-1VF400 Anlielectronics Тип	Microchip Technology	SoC FPGA M2S005S-1VF400 Сборник данных Сравнение	Min.:1 Mult.:1	-	VFPBGA-400	YES	400-VFBGA (17x17)	400	-	M2S005	ARM Cortex M3	64 kB	-	90	-	-	MICROSEMI CORP	-	-	-	-	-	-	M2S005S-1VF400	166 MHz	-	-	Microchip Technology	-	-	Yes	-	-	SMD/SMT	-	169	505 LAB	-	6060 LE	-	-	-	-	-	-	-	85 °C	Tray	PLASTIC/EPOXY	LFBGA	VFBGA-400	BGA400,20X20,32	SQUARE	GRID ARRAY, LOW PROFILE, FINE PITCH	-	Active	-	Active	-	-	30	5.88	N	No	-	This product may require additional documentation to export from the United States.	1.26 V	1.14 V	1.2 V	-	-	-	-	0°C ~ 85°C (TJ)	Tray	SmartFusion2	e0	Tin/Lead (Sn/Pb)	-	8542.39.00.01	CMOS	BOTTOM	BALL	240	0.8 mm	not_compliant	-	-	S-PBGA-B400	171	Not Qualified	-	1.2 V	OTHER	-	166MHz	64KB	ARM® Cortex®-M3	DDR	128 kB	CANbus, Ethernet, I²C, SPI, UART/USART, USB	MCU, FPGA	-	171	1.51 mm	FIELD PROGRAMMABLE GATE ARRAY	-	-	FPGA - 5K Logic Modules	6060	1 Core	128KB	17 mm	17 mm
M2S005S-1VF400 Microchip Technology RoHS : Инкапсуляция : - Есть складские запасы : - 1 : -
	Mfr. Тип M2S050TS-1FCSG325 Anlielectronics Тип	Microchip Technology	SoC FPGA M2S050TS-1FCSG325 Сборник данных Сравнение	Min.:1 Mult.:1	Production (Last Updated: 2 months ago)	FCBGA-325	YES	325-FCBGA (11x11)	325	-	M2S050	ARM Cortex M3	64 kB	-	176	-	-	MICROSEMI CORP	-	-	-	-	-	-	M2S050TS-1FCSG325	166 MHz	-	-	Microchip Technology	-	-	Yes	3	-	SMD/SMT	-	200	4695 LAB	-	56340 LE	-	-	-	-	-	-	-	85 °C	Tray	PLASTIC/EPOXY	TFBGA	FBGA-325	BGA325,21X21,20	SQUARE	GRID ARRAY, THIN PROFILE, FINE PITCH	-	Active	-	Active	-	-	40	5.82	Details	Yes	-	This product may require additional documentation to export from the United States.	1.26 V	1.14 V	1.2 V	-	-	-	-	0°C ~ 85°C (TJ)	Tray	SmartFusion2	e1	Tin/Silver/Copper (Sn/Ag/Cu)	LG-MIN, WD-MIN	8542.39.00.01	CMOS	BOTTOM	BALL	250	0.5 mm	compliant	-	-	S-PBGA-B325	200	Not Qualified	-	1.2 V	OTHER	-	166MHz	64KB	ARM® Cortex®-M3	DDR, PCIe, SERDES	256 kB	CANbus, Ethernet, I²C, SPI, UART/USART, USB	MCU, FPGA	-	200	1.01 mm	FIELD PROGRAMMABLE GATE ARRAY	-	-	FPGA - 50K Logic Modules	56340	1 Core	256KB	11 mm	11 mm
M2S050TS-1FCSG325 Microchip Technology RoHS : Инкапсуляция : - Есть складские запасы : - 1 : -
	Mfr. Тип M2S005S-1FGG484 Anlielectronics Тип	Microchip Technology	SoC FPGA M2S005S-1FGG484 Сборник данных Сравнение	Min.:1 Mult.:1	-	FPBGA-484	-	484-FPBGA (23x23)	-	-	M2S005	ARM Cortex M3	64 kB	-	60	-	-	-	-	-	-	-	-	-	-	166 MHz	-	-	Microchip Technology	-	-	Yes	-	-	SMD/SMT	-	209	505 LAB	-	6060 LE	-	-	-	-	-	-	-	-	Tray	-	-	-	-	-	-	-	-	-	Active	-	-	-	-	Details	-	-	This product may require additional documentation to export from the United States.	-	-	-	-	-	-	-	0°C ~ 85°C (TJ)	Tray	SmartFusion2	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	166MHz	64KB	ARM® Cortex®-M3	DDR	128 kB	CANbus, Ethernet, I²C, SPI, UART/USART, USB	MCU, FPGA	-	-	-	-	-	-	FPGA - 5K Logic Modules	-	1 Core	128KB	-	-
M2S005S-1FGG484 Microchip Technology RoHS : Инкапсуляция : - Есть складские запасы : - 1 : -

Integrated Circuits (ICs)

Embedded - System On Chip (SoC) definition: A System On Chip (SoC) combines the required electronic circuits of various computer components onto a single, integrated chip (IC). SoC is ... Embedded - System On Chip (SoC) Product Listing: M2S150T-1FCVG484I,M2S090TS-1FCS325I,M2S150TS-1FC1152,M2S090TS-FCS325I,M2S090T-1FGG484I.Integrated Circuits (ICs) type:Embedded - Microcontrollers(129432),Memory(111901),PMIC - Supervisors(101743),PMIC - Voltage Regulators - Linear(101187),PMIC - Voltage Regulators - DC DC Switching Regulators(62822) .Embedded - System On Chip (SoC) has 873 pieces of spot stock price information, you can click the "RFQ" button to confirm the inventory and price with the Anli.

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Integrated Circuits (ICs)