Embedded - System On Chip (SoC) Products For Sale - PDF - Integrated Circuits (ICs) -Page5

Все продукты
/
Integrated Circuits (ICs)
/
Embedded - System On Chip (SoC)

Изображение	Тип	Марка	Объяснение	Установленная цена	Количество	RoHS	Lifecycle Status	Package / Case	Surface Mount	Number of Pins	Supplier Device Package	Number of Terminals	Base Product Number	Core	Data RAM Size	Factory Pack QuantityFactory Pack Quantity	Ihs Manufacturer	L1 Cache Data Memory	L1 Cache Instruction Memory	Manufacturer Part Number	Maximum Clock Frequency	Maximum Operating Supply Voltage	Mfr	Minimum Operating Supply Voltage	Moisture Sensitive	Moisture Sensitivity Levels	Mounting Styles	Number of I/Os	Number of Logic Array Blocks - LABs	Number of Logic Elements	Operating Temperature-Max	Operating Temperature-Min	Package	Package Body Material	Package Code	Package Description	Package Equivalence Code	Package Shape	Package Style	Part Life Cycle Code	Product Status	Reflow Temperature-Max (s)	Risk Rank	RoHS	Rohs Code	Shipping Restrictions	Supply Voltage-Max	Supply Voltage-Min	Supply Voltage-Nom	Tradename	Typical Operating Supply Voltage	Operating Temperature	Packaging	Series	JESD-609 Code	Pbfree Code	ECCN Code	Terminal Finish	Max Operating Temperature	Min Operating Temperature	Additional Feature	HTS Code	Technology	Terminal Position	Terminal Form	Peak Reflow Temperature (Cel)	Terminal Pitch	Reach Compliance Code	Pin Count	JESD-30 Code	Number of Outputs	Qualification Status	Operating Supply Voltage	Power Supplies	Temperature Grade	Speed	RAM Size	Core Processor	Peripherals	Program Memory Size	Connectivity	Architecture	Number of Inputs	Seated Height-Max	Programmable Logic Type	Speed Grade	Primary Attributes	Number of Logic Cells	Number of Cores	Flash Size	Length	Width	Lead Free

Изображение	Тип	Марка	Объяснение	Количество	Lifecycle Status	Package / Case	Surface Mount	Number of Pins	Supplier Device Package	Number of Terminals	Base Product Number	Core	Data RAM Size	Factory Pack QuantityFactory Pack Quantity	Ihs Manufacturer	L1 Cache Data Memory	L1 Cache Instruction Memory	Manufacturer Part Number	Maximum Clock Frequency	Maximum Operating Supply Voltage	Mfr	Minimum Operating Supply Voltage	Moisture Sensitive	Moisture Sensitivity Levels	Mounting Styles	Number of I/Os	Number of Logic Array Blocks - LABs	Number of Logic Elements	Operating Temperature-Max	Operating Temperature-Min	Package	Package Body Material	Package Code	Package Description	Package Equivalence Code	Package Shape	Package Style	Part Life Cycle Code	Product Status	Reflow Temperature-Max (s)	Risk Rank	RoHS	Rohs Code	Shipping Restrictions	Supply Voltage-Max	Supply Voltage-Min	Supply Voltage-Nom	Tradename	Typical Operating Supply Voltage	Operating Temperature	Packaging	Series	JESD-609 Code	Pbfree Code	ECCN Code	Terminal Finish	Max Operating Temperature	Min Operating Temperature	Additional Feature	HTS Code	Technology	Terminal Position	Terminal Form	Peak Reflow Temperature (Cel)	Terminal Pitch	Reach Compliance Code	Pin Count	JESD-30 Code	Number of Outputs	Qualification Status	Operating Supply Voltage	Power Supplies	Temperature Grade	Speed	RAM Size	Core Processor	Peripherals	Program Memory Size	Connectivity	Architecture	Number of Inputs	Seated Height-Max	Programmable Logic Type	Speed Grade	Primary Attributes	Number of Logic Cells	Number of Cores	Flash Size	Length	Width	Lead Free
	Mfr. Тип M2S005-1VF400 Anlielectronics Тип	Microchip Technology	SoC FPGA M2S005-1VF400 Сборник данных Сравнение	Min.:1 Mult.:1	-	VFPBGA-400	YES	-	400-VFBGA (17x17)	400	M2S005	ARM Cortex M3	64 kB	90	MICROSEMI CORP	-	-	M2S005-1VF400	166 MHz	1.26 V	Microchip Technology	1.14 V	Yes	-	SMD/SMT	169	505 LAB	6060 LE	85 °C	-	Tray	PLASTIC/EPOXY	LFBGA	LFBGA, BGA400,20X20,32	BGA400,20X20,32	SQUARE	GRID ARRAY, LOW PROFILE, FINE PITCH	Active	Active	30	5.86	N	No	This product may require additional documentation to export from the United States.	1.26 V	1.14 V	1.2 V	-	1.2000 V	0 to 85 °C	Tray	SmartFusion2	e0	-	-	Tin/Lead (Sn/Pb)	-	-	-	8542.39.00.01	CMOS	BOTTOM	BALL	240	0.8 mm	not_compliant	-	S-PBGA-B400	160	Not Qualified	-	1.2 V	OTHER	166MHz	64KB	ARM® Cortex®-M3	DDR	128 kB	CANbus, Ethernet, I²C, SPI, UART/USART, USB	MCU, FPGA	160	1.51 mm	FIELD PROGRAMMABLE GATE ARRAY	1	FPGA - 5K Logic Modules	4956	1 Core	128KB	17 mm	17 mm	-
M2S005-1VF400 Microchip Technology RoHS : Инкапсуляция : - Есть складские запасы : - 1 : -
	Mfr. Тип M2S025T-1FGG484 Anlielectronics Тип	Microchip Technology	SoC FPGA M2S025T-1FGG484 Сборник данных Сравнение	Min.:1 Mult.:1	-	FPBGA-484	-	-	484-FPBGA (23x23)	-	M2S025	ARM Cortex M3	64 kB	60	-	-	-	-	166 MHz	-	Microchip Technology	-	Yes	-	SMD/SMT	267	2308 LAB	27696 LE	-	-	Tray	-	-	-	-	-	-	-	Active	-	-	Details	-	This product may require additional documentation to export from the United States.	-	-	-	-	-	0°C ~ 85°C (TJ)	Tray	SmartFusion2	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	166MHz	64KB	ARM® Cortex®-M3	DDR, PCIe, SERDES	256 kB	CANbus, Ethernet, I²C, SPI, UART/USART, USB	MCU, FPGA	-	-	-	-	FPGA - 25K Logic Modules	-	1 Core	256KB	-	-	-
M2S025T-1FGG484 Microchip Technology RoHS : Инкапсуляция : - Есть складские запасы : - 1 : -
	Mfr. Тип M2S060-1FGG484 Anlielectronics Тип	Microchip Technology	SoC FPGA M2S060-1FGG484 Сборник данных Сравнение	Min.:1 Mult.:1	Production (Last Updated: 2 months ago)	484-BGA	-	484	484-FPBGA (23x23)	-	M2S060	ARM Cortex M3	64 kB	60	-	-	-	-	166 MHz	-	Microchip Technology	-	Yes	-	-	267	4710 LAB	56520 LE	-	-	Tray	-	-	-	-	-	-	-	Active	-	-	Details	-	This product may require additional documentation to export from the United States.	-	-	-	SmartFusion2	-	0°C ~ 85°C (TJ)	Tray	SmartFusion2	-	-	-	-	85 °C	0 °C	-	-	-	-	-	-	-	-	-	-	-	-	1.2 V	-	-	166MHz	164.3 kB	ARM® Cortex®-M3	DDR, PCIe, SERDES	256 kB	CANbus, Ethernet, I²C, SPI, UART/USART, USB	MCU, FPGA	-	-	-	1	FPGA - 60K Logic Modules	-	1 Core	256KB	-	-	-
M2S060-1FGG484 Microchip Technology RoHS : Инкапсуляция : - Есть складские запасы : - 1 : -
	Mfr. Тип M2S050T-1FG484M Anlielectronics Тип	Microchip Technology	SoC FPGA M2S050T-1FG484M Сборник данных Сравнение	Min.:1 Mult.:1	-	FPBGA-484	YES	-	484-FPBGA (23x23)	484	M2S050	ARM Cortex M3	64 kB	60	MICROSEMI CORP	-	-	M2S050T-1FG484M	166 MHz	-	Microchip Technology	-	Yes	3	SMD/SMT	267	4695 LAB	56340 LE	125 °C	-55 °C	Tray	PLASTIC/EPOXY	BGA	BGA, BGA484,22X22,40	BGA484,22X22,40	SQUARE	GRID ARRAY	Active	Active	30	5.81	N	No	This product may require additional documentation to export from the United States.	1.26 V	1.14 V	1.2 V	-	-	-55°C ~ 125°C (TJ)	Tray	SmartFusion2	e0	-	3A001.A.2.C	Tin/Lead (Sn/Pb)	-	-	-	8542.39.00.01	CMOS	BOTTOM	BALL	240	1 mm	not_compliant	-	S-PBGA-B484	267	Not Qualified	-	1.2 V	MILITARY	166MHz	64KB	ARM® Cortex®-M3	DDR, PCIe, SERDES	256 kB	CANbus, Ethernet, I²C, SPI, UART/USART, USB	MCU, FPGA	267	2.44 mm	FIELD PROGRAMMABLE GATE ARRAY	-	FPGA - 50K Logic Modules	56340	1 Core	256KB	23 mm	23 mm	-
M2S050T-1FG484M Microchip Technology RoHS : Инкапсуляция : - Есть складские запасы : - 1 : -
	Mfr. Тип M2S090T-1FCSG325I Anlielectronics Тип	Microchip Technology	SoC FPGA M2S090T-1FCSG325I Сборник данных Сравнение	Min.:1 Mult.:1	-	FCBGA-325	YES	-	325-FCBGA (11x13.5)	325	M2S090	ARM Cortex M3	64 kB	176	MICROSEMI CORP	-	-	M2S090T-1FCSG325I	166 MHz	-	Microchip Technology	-	Yes	3	SMD/SMT	180	7193 LAB	86316 LE	-	-	Tray	PLASTIC/EPOXY	TFBGA	FBGA-325	BGA325,21X21,20	RECTANGULAR	GRID ARRAY, THIN PROFILE, FINE PITCH	Active	Active	40	5.78	Details	Yes	This product may require additional documentation to export from the United States.	1.26 V	1.14 V	1.2 V	-	-	-40°C ~ 100°C (TJ)	Tray	SmartFusion2	e1	-	-	Tin/Silver/Copper (Sn/Ag/Cu)	-	-	LG-MIN, WD-MIN	8542.39.00.01	CMOS	BOTTOM	BALL	250	0.5 mm	compliant	-	R-PBGA-B325	180	Not Qualified	-	1.2 V	-	166MHz	64KB	ARM® Cortex®-M3	DDR, PCIe, SERDES	512 kB	CANbus, Ethernet, I²C, SPI, UART/USART, USB	MCU, FPGA	180	1.16 mm	FIELD PROGRAMMABLE GATE ARRAY	-	FPGA - 90K Logic Modules	86316	1 Core	512KB	13.5 mm	11 mm	-
M2S090T-1FCSG325I Microchip Technology RoHS : Инкапсуляция : - Есть складские запасы : - 1 : -
	Mfr. Тип M2S150TS-FCVG484I Anlielectronics Тип	Microchip Technology	SoC FPGA M2S150TS-FCVG484I Сборник данных Сравнение	Min.:1 Mult.:1	-	484-BFBGA	YES	-	484-FBGA (19x19)	484	M2S150	ARM Cortex M3	64 kB	84	MICROSEMI CORP	-	-	M2S150TS-FCVG484I	166 MHz	-	Microchip Technology	-	Yes	4	-	273	12177 LAB	146124 LE	-	-	Tray	PLASTIC/EPOXY	FBGA	VFBGA-484	-	SQUARE	GRID ARRAY, FINE PITCH	Active	Active	40	5.82	Details	Yes	This product may require additional documentation to export from the United States.	1.26 V	1.14 V	1.2 V	-	-	-40°C ~ 100°C (TJ)	Tray	SmartFusion2	e1	Yes	-	Tin/Silver/Copper (Sn/Ag/Cu)	-	-	LG-MIN, WD-MIN	8542.39.00.01	-	BOTTOM	BALL	250	0.8 mm	compliant	-	S-PBGA-B484	-	-	-	-	-	166MHz	64KB	ARM® Cortex®-M3	DDR, PCIe, SERDES	512 kB	CANbus, Ethernet, I²C, SPI, UART/USART, USB	MCU, FPGA	-	3.15 mm	FIELD PROGRAMMABLE GATE ARRAY	-	FPGA - 150K Logic Modules	-	1 Core	512KB	19 mm	19 mm	-
M2S150TS-FCVG484I Microchip Technology RoHS : Инкапсуляция : - Есть складские запасы : - 1 : -
	Mfr. Тип M2S010-VF400I Anlielectronics Тип	Microchip Technology	SoC FPGA M2S010-VF400I Сборник данных Сравнение	Min.:1 Mult.:1	-	VFPBGA-400	-	-	400-VFBGA (17x17)	-	M2S010	ARM Cortex M3	64 kB	90	-	-	-	-	166 MHz	-	Microchip Technology	-	Yes	-	SMD/SMT	195	1007 LAB	12084 LE	-	-	Tray	-	-	-	-	-	-	-	Active	-	-	N	-	This product may require additional documentation to export from the United States.	-	-	-	-	-	-40°C ~ 100°C (TJ)	Tray	SmartFusion2	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	166MHz	64KB	ARM® Cortex®-M3	DDR, PCIe, SERDES	256 kB	CANbus, Ethernet, I²C, SPI, UART/USART, USB	MCU, FPGA	-	-	-	-	FPGA - 10K Logic Modules	-	1 Core	256KB	-	-	-
M2S010-VF400I Microchip Technology RoHS : Инкапсуляция : - Есть складские запасы : - 1 : -
	Mfr. Тип M2S050TS-FCSG325 Anlielectronics Тип	Microchip Technology	SoC FPGA M2S050TS-FCSG325 Сборник данных Сравнение	Min.:1 Mult.:1	Production (Last Updated: 2 months ago)	325-TFBGA, FCBGA	-	-	325-FCBGA (11x11)	-	M2S050	ARM Cortex M3	64 kB	176	-	-	-	-	166 MHz	-	Microchip Technology	-	Yes	-	-	200	4695 LAB	56340 LE	-	-	Tray	-	-	-	-	-	-	-	Active	-	-	Details	-	This product may require additional documentation to export from the United States.	-	-	-	-	-	0°C ~ 85°C (TJ)	Tray	SmartFusion2	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	166MHz	64KB	ARM® Cortex®-M3	DDR, PCIe, SERDES	256 kB	CANbus, Ethernet, I²C, SPI, UART/USART, USB	MCU, FPGA	-	-	-	-	FPGA - 50K Logic Modules	-	1 Core	256KB	-	-	-
M2S050TS-FCSG325 Microchip Technology RoHS : Инкапсуляция : - Есть складские запасы : - 1 : -
	Mfr. Тип M2S010T-1FGG484 Anlielectronics Тип	Microchip Technology	SoC FPGA M2S010T-1FGG484 Сборник данных Сравнение	Min.:1 Mult.:1	-	FPBGA-484	-	-	484-FPBGA (23x23)	-	M2S010	ARM Cortex M3	64 kB	60	-	-	-	-	166 MHz	-	Microchip Technology	-	Yes	-	SMD/SMT	233	1007 LAB	12084 LE	-	-	Tray	-	-	-	-	-	-	-	Active	-	-	Details	-	-	-	-	-	-	1.2000 V	0 to 85 °C	Tray	SmartFusion2	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	166MHz	64KB	ARM® Cortex®-M3	DDR, PCIe, SERDES	256 kB	CANbus, Ethernet, I²C, SPI, UART/USART, USB	MCU, FPGA	-	-	-	1	FPGA - 10K Logic Modules	-	1 Core	256KB	-	-	-
M2S010T-1FGG484 Microchip Technology RoHS : Инкапсуляция : - Есть складские запасы : - 1 : -
	Mfr. Тип M2S025-FCS325 Anlielectronics Тип	Microchip Technology	SoC FPGA M2S025-FCS325 Сборник данных Сравнение	Min.:1 Mult.:1	Production (Last Updated: 2 months ago)	325-TFBGA, FCBGA	-	-	325-FCBGA (11x11)	-	M2S025	ARM Cortex M3	64 kB	176	-	-	-	-	166 MHz	-	Microchip Technology	-	Yes	-	-	180	2308 LAB	27696 LE	-	-	Tray	-	-	-	-	-	-	-	Active	-	-	N	-	This product may require additional documentation to export from the United States.	-	-	-	-	-	0°C ~ 85°C (TJ)	Tray	SmartFusion2	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	166MHz	64KB	ARM® Cortex®-M3	DDR, PCIe, SERDES	256 kB	CANbus, Ethernet, I²C, SPI, UART/USART, USB	MCU, FPGA	-	-	-	-	FPGA - 25K Logic Modules	-	1 Core	256KB	-	-	-
M2S025-FCS325 Microchip Technology RoHS : Инкапсуляция : - Есть складские запасы : - 1 : -
	Mfr. Тип M2S060T-FCS325 Anlielectronics Тип	Microchip Technology	SoC FPGA M2S060T-FCS325 Сборник данных Сравнение	Min.:1 Mult.:1	Production (Last Updated: 2 months ago)	325-TFBGA, FCBGA	YES	-	325-FCBGA (11x11)	325	M2S060	ARM Cortex M3	64 kB	176	MICROSEMI CORP	-	-	M2S060T-FCS325	166 MHz	-	Microchip Technology	-	Yes	-	-	200	4710 LAB	56520 LE	85 °C	-	Tray	PLASTIC/EPOXY	TFBGA	FBGA-325	BGA325,21X21,20	SQUARE	GRID ARRAY, THIN PROFILE, FINE PITCH	Active	Active	30	5.87	N	No	This product may require additional documentation to export from the United States.	1.26 V	1.14 V	1.2 V	SmartFusion2	-	0°C ~ 85°C (TJ)	Tray	SmartFusion2	e0	-	-	Tin/Lead (Sn/Pb)	-	-	LG-MIN, WD-MIN	8542.39.00.01	CMOS	BOTTOM	BALL	240	0.5 mm	not_compliant	-	S-PBGA-B325	200	Not Qualified	-	1.2 V	OTHER	166MHz	64KB	ARM® Cortex®-M3	DDR, PCIe, SERDES	256 kB	CANbus, Ethernet, I²C, SPI, UART/USART, USB	MCU, FPGA	200	1.01 mm	FIELD PROGRAMMABLE GATE ARRAY	-	FPGA - 60K Logic Modules	56520	1 Core	256KB	11 mm	11 mm	-
M2S060T-FCS325 Microchip Technology RoHS : Инкапсуляция : - Есть складские запасы : - 1 : -
	Mfr. Тип M2S025T-VF400 Anlielectronics Тип	Microchip Technology	SoC FPGA M2S025T-VF400 Сборник данных Сравнение	Min.:1 Mult.:1	-	400-LFBGA	YES	-	400-VFBGA (17x17)	400	M2S025	ARM Cortex M3	64 kB	90	MICROSEMI CORP	-	-	M2S025T-VF400	166 MHz	1.26 V	Microchip Technology	1.14 V	Yes	-	-	207	2308 LAB	27696 LE	85 °C	-	Tray	PLASTIC/EPOXY	LFBGA	LFBGA, BGA400,20X20,32	BGA400,20X20,32	SQUARE	GRID ARRAY, LOW PROFILE, FINE PITCH	Active	Active	30	5.3	N	No	This product may require additional documentation to export from the United States.	1.26 V	1.14 V	1.2 V	-	1.2000 V	0 to 85 °C	Tray	SmartFusion2	e0	-	-	Tin/Lead (Sn/Pb)	-	-	-	8542.39.00.01	CMOS	BOTTOM	BALL	240	0.8 mm	not_compliant	-	S-PBGA-B400	160	Not Qualified	-	1.2 V	OTHER	166MHz	64KB	ARM® Cortex®-M3	DDR, PCIe, SERDES	256 kB	CANbus, Ethernet, I²C, SPI, UART/USART, USB	MCU, FPGA	160	1.51 mm	FIELD PROGRAMMABLE GATE ARRAY	STD	FPGA - 25K Logic Modules	23988	1 Core	256KB	17 mm	17 mm	-
M2S025T-VF400 Microchip Technology RoHS : Инкапсуляция : - Есть складские запасы : - 1 : -
	Mfr. Тип M2S010-VF256I Anlielectronics Тип	Microchip Technology	SoC FPGA M2S010-VF256I Сборник данных Сравнение	Min.:1 Mult.:1	-	VFPBGA-256	YES	-	256-FPBGA (14x14)	256	M2S010	ARM Cortex M3	64 kB	119	MICROSEMI CORP	-	-	M2S010-VF256I	166 MHz	-	Microchip Technology	-	Yes	-	SMD/SMT	138	1007 LAB	12084 LE	-	-	Tray	PLASTIC/EPOXY	LFBGA	LFBGA, BGA256,16X16,32	BGA256,16X16,32	SQUARE	GRID ARRAY, LOW PROFILE, FINE PITCH	Active	Active	30	5.81	N	No	This product may require additional documentation to export from the United States.	1.26 V	1.14 V	1.2 V	-	-	-40°C ~ 100°C (TJ)	Tray	SmartFusion2	e0	-	-	Tin/Lead (Sn/Pb)	-	-	LG-MIN, WD-MIN	8542.39.00.01	CMOS	BOTTOM	BALL	240	0.8 mm	not_compliant	-	S-PBGA-B256	138	Not Qualified	-	1.2 V	-	166MHz	64KB	ARM® Cortex®-M3	DDR, PCIe, SERDES	256 kB	CANbus, Ethernet, I²C, SPI, UART/USART, USB	MCU, FPGA	138	1.56 mm	FIELD PROGRAMMABLE GATE ARRAY	-	FPGA - 10K Logic Modules	12084	1 Core	256KB	14 mm	14 mm	-
M2S010-VF256I Microchip Technology RoHS : Инкапсуляция : - Есть складские запасы : - 1 : -
	Mfr. Тип M2S150-FCSG536I Anlielectronics Тип	Microchip Technology	SoC FPGA M2S150-FCSG536I Сборник данных Сравнение	Min.:1 Mult.:1	-	536-LFBGA, CSPBGA	-	-	536-CSPBGA (16x16)	-	M2S150	ARM Cortex M3	64 kB	90	-	-	-	-	166 MHz	-	Microchip Technology	-	Yes	-	-	293	12177 LAB	146124 LE	-	-	Tray	-	-	-	-	-	-	-	Active	-	-	Details	-	This product may require additional documentation to export from the United States.	-	-	-	-	-	-40°C ~ 100°C (TJ)	Tray	SmartFusion2	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	166MHz	64KB	ARM® Cortex®-M3	DDR, PCIe, SERDES	512 kB	CANbus, Ethernet, I²C, SPI, UART/USART, USB	MCU, FPGA	-	-	-	-	FPGA - 150K Logic Modules	-	1 Core	512KB	-	-	-
M2S150-FCSG536I Microchip Technology RoHS : Инкапсуляция : - Есть складские запасы : - 1 : -
	Mfr. Тип M2S060-VFG400I Anlielectronics Тип	Microchip Technology	SoC FPGA M2S060-VFG400I Сборник данных Сравнение	Min.:1 Mult.:1	Production (Last Updated: 2 months ago)	400-LFBGA	YES	-	400-VFBGA (17x17)	400	M2S060	ARM Cortex M3	64 kB	90	MICROSEMI CORP	-	-	M2S060-VFG400I	166 MHz	-	Microchip Technology	-	Yes	3	-	207	4710 LAB	56520 LE	-	-	Tray	PLASTIC/EPOXY	LFBGA	VFBGA-400	BGA400,20X20,32	SQUARE	GRID ARRAY, LOW PROFILE, FINE PITCH	Active	Active	40	5.81	Details	Yes	This product may require additional documentation to export from the United States.	1.26 V	1.14 V	1.2 V	SmartFusion2	1.2000 V	-40 to 100 °C	Tray	SmartFusion2	e1	-	-	Tin/Silver/Copper (Sn/Ag/Cu)	-	-	-	8542.39.00.01	CMOS	BOTTOM	BALL	250	0.8 mm	compliant	-	S-PBGA-B400	207	Not Qualified	-	1.2 V	-	166MHz	64KB	ARM® Cortex®-M3	DDR, PCIe, SERDES	256 kB	CANbus, Ethernet, I²C, SPI, UART/USART, USB	MCU, FPGA	207	1.51 mm	FIELD PROGRAMMABLE GATE ARRAY	STD	FPGA - 60K Logic Modules	56520	1 Core	256KB	17 mm	17 mm	-
M2S060-VFG400I Microchip Technology RoHS : Инкапсуляция : - Есть складские запасы : - 1 : -
	Mfr. Тип M2S050T-FCS325 Anlielectronics Тип	Microchip Technology	SoC FPGA M2S050T-FCS325 Сборник данных Сравнение	Min.:1 Mult.:1	Production (Last Updated: 2 months ago)	325-TFBGA, FCBGA	YES	-	325-FCBGA (11x11)	325	M2S050	ARM Cortex M3	64 kB	176	MICROSEMI CORP	-	-	M2S050T-FCS325	166 MHz	-	Microchip Technology	-	Yes	-	-	200	4695 LAB	56340 LE	85 °C	-	Tray	PLASTIC/EPOXY	TFBGA	FBGA-325	BGA325,21X21,20	SQUARE	GRID ARRAY, THIN PROFILE, FINE PITCH	Active	Active	30	5.81	N	No	This product may require additional documentation to export from the United States.	1.26 V	1.14 V	1.2 V	-	-	0°C ~ 85°C (TJ)	Tray	SmartFusion2	e0	-	-	Tin/Lead (Sn/Pb)	-	-	LG-MIN, WD-MIN	-	CMOS	BOTTOM	BALL	240	0.5 mm	not_compliant	-	S-PBGA-B325	200	Not Qualified	-	1.2 V	OTHER	166MHz	64KB	ARM® Cortex®-M3	DDR, PCIe, SERDES	256 kB	CANbus, Ethernet, I²C, SPI, UART/USART, USB	MCU, FPGA	200	1.01 mm	FIELD PROGRAMMABLE GATE ARRAY	-	FPGA - 50K Logic Modules	56340	1 Core	256KB	11 mm	11 mm	-
M2S050T-FCS325 Microchip Technology RoHS : Инкапсуляция : - Есть складские запасы : - 1 : -
	Mfr. Тип M2S050-1FCSG325I Anlielectronics Тип	Microchip Technology	SoC FPGA M2S050-1FCSG325I Сборник данных Сравнение	Min.:1 Mult.:1	Production (Last Updated: 2 months ago)	FCBGA-325	YES	-	325-FCBGA (11x11)	325	M2S050	ARM Cortex M3	64 kB	176	MICROSEMI CORP	-	-	M2S050-1FCSG325I	166 MHz	-	Microchip Technology	-	Yes	3	SMD/SMT	200	4695 LAB	56340 LE	-	-	Tray	PLASTIC/EPOXY	TFBGA	TFBGA, BGA325,21X21,20	BGA325,21X21,20	SQUARE	GRID ARRAY, THIN PROFILE, FINE PITCH	Active	Active	40	5.76	Details	Yes	This product may require additional documentation to export from the United States.	1.26 V	1.14 V	1.2 V	-	1.2000 V	-40 to 100 °C	Tray	SmartFusion2	e1	-	3A991.D	Tin/Silver/Copper (Sn/Ag/Cu)	-	-	LG-MIN, WD-MIN	8542.39.00.01	CMOS	BOTTOM	BALL	250	0.5 mm	compliant	-	S-PBGA-B325	200	Not Qualified	-	1.2 V	-	166MHz	64KB	ARM® Cortex®-M3	DDR, PCIe, SERDES	256 kB	CANbus, Ethernet, I²C, SPI, UART/USART, USB	MCU, FPGA	200	1.01 mm	FIELD PROGRAMMABLE GATE ARRAY	1	FPGA - 50K Logic Modules	56340	1 Core	256KB	11 mm	11 mm	Lead Free
M2S050-1FCSG325I Microchip Technology RoHS : Инкапсуляция : - Есть складские запасы : - 1 : -
	Mfr. Тип M2S050T-1FG896 Anlielectronics Тип	Microchip Technology	SoC FPGA M2S050T-1FG896 Сборник данных Сравнение	Min.:1 Mult.:1	-	FPBGA-896	-	-	896-FBGA (31x31)	-	M2S050	ARM Cortex M3	64 kB	27	-	-	-	-	166 MHz	1.26 V	Microchip Technology	1.14 V	Yes	-	SMD/SMT	377	4695 LAB	56340 LE	-	-	Tray	-	-	-	-	-	-	-	Active	-	-	N	-	This product may require additional documentation to export from the United States.	-	-	-	-	1.2000 V	0 to 85 °C	Tray	SmartFusion2	-	-	-	-	-	-	-	-	-	-	-	-	-	-	896	-	-	-	-	-	-	166MHz	64KB	ARM® Cortex®-M3	DDR, PCIe, SERDES	256 kB	CANbus, Ethernet, I²C, SPI, UART/USART, USB	MCU, FPGA	-	-	-	1	FPGA - 50K Logic Modules	-	1 Core	256KB	-	-	-
M2S050T-1FG896 Microchip Technology RoHS : Инкапсуляция : - Есть складские запасы : - 1 : -
	Mfr. Тип M2S060TS-1VF400 Anlielectronics Тип	Microchip Technology	SoC FPGA M2S060TS-1VF400 Сборник данных Сравнение	Min.:1 Mult.:1	Production (Last Updated: 2 months ago)	400-LFBGA	-	-	400-VFBGA (17x17)	-	M2S060	ARM Cortex M3	64 kB	90	-	-	-	-	166 MHz	1.26 V	Microchip Technology	1.14 V	Yes	-	-	207	4710 LAB	56520 LE	-	-	Tray	-	-	-	-	-	-	-	Active	-	-	N	-	This product may require additional documentation to export from the United States.	-	-	-	SmartFusion2	1.2 V	0 to 85 °C	Tray	SmartFusion2	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	166MHz	64KB	ARM® Cortex®-M3	DDR, PCIe, SERDES	256 kB	CANbus, Ethernet, I²C, SPI, UART/USART, USB	MCU, FPGA	-	-	-	1	FPGA - 60K Logic Modules	-	1 Core	256KB	-	-	-
M2S060TS-1VF400 Microchip Technology RoHS : Инкапсуляция : - Есть складские запасы : - 1 : -
	Mfr. Тип M2S090-1FG676 Anlielectronics Тип	Microchip Technology	SoC FPGA M2S090-1FG676 Сборник данных Сравнение	Min.:1 Mult.:1	-	BGA-676	YES	-	676-FBGA (27x27)	676	M2S090	ARM Cortex M3	64 kB	40	MICROSEMI CORP	-	-	M2S090-1FG676	166 MHz	-	Microchip Technology	-	Yes	3	SMD/SMT	425	7193 LAB	86316 LE	85 °C	-	Tray	PLASTIC/EPOXY	BGA	FBGA-676	BGA676,26X26,40	SQUARE	GRID ARRAY	Active	Active	30	5.27	N	No	This product may require additional documentation to export from the United States.	1.26 V	1.14 V	1.2 V	-	-	0°C ~ 85°C (TJ)	Tray	SmartFusion2	e0	-	-	Tin/Lead (Sn/Pb)	-	-	-	8542.39.00.01	CMOS	BOTTOM	BALL	240	1 mm	not_compliant	-	S-PBGA-B676	425	Not Qualified	-	1.2 V	OTHER	166MHz	64KB	ARM® Cortex®-M3	DDR, PCIe, SERDES	512 kB	CANbus, Ethernet, I²C, SPI, UART/USART, USB	MCU, FPGA	425	2.44 mm	FIELD PROGRAMMABLE GATE ARRAY	-	FPGA - 90K Logic Modules	86316	1 Core	512KB	27 mm	27 mm	-
M2S090-1FG676 Microchip Technology RoHS : Инкапсуляция : - Есть складские запасы : - 1 : -

Integrated Circuits (ICs)

Embedded - System On Chip (SoC) definition: A System On Chip (SoC) combines the required electronic circuits of various computer components onto a single, integrated chip (IC). SoC is ... Embedded - System On Chip (SoC) Product Listing: M2S005-1VF400,M2S025T-1FGG484,M2S060-1FGG484,M2S050T-1FG484M,M2S090T-1FCSG325I.Integrated Circuits (ICs) type:Embedded - Microcontrollers(129432),Memory(111901),PMIC - Supervisors(101743),PMIC - Voltage Regulators - Linear(101187),PMIC - Voltage Regulators - DC DC Switching Regulators(62822) .Embedded - System On Chip (SoC) has 873 pieces of spot stock price information, you can click the "RFQ" button to confirm the inventory and price with the Anli.

Индекс :

0 1 2 3 4 5 6 7 8 9 A B C D E F G H I J K L M N O P Q R S T U V W X Y Z

Локаль

Язык

Валюта

Здравствуйте, добро пожаловать в ANLI

Anlielectronics

Локаль

Язык

Валюта

Mfr. Тип

Anlielectronics Тип

Mfr. Тип

Anlielectronics Тип

Mfr. Тип

Anlielectronics Тип

Mfr. Тип

Anlielectronics Тип

Mfr. Тип

Anlielectronics Тип

Mfr. Тип

Anlielectronics Тип

Mfr. Тип

Anlielectronics Тип

Mfr. Тип

Anlielectronics Тип

Mfr. Тип

Anlielectronics Тип

Mfr. Тип

Anlielectronics Тип

Mfr. Тип

Anlielectronics Тип

Mfr. Тип

Anlielectronics Тип

Mfr. Тип

Anlielectronics Тип

Mfr. Тип

Anlielectronics Тип

Mfr. Тип

Anlielectronics Тип

Mfr. Тип

Anlielectronics Тип

Mfr. Тип

Anlielectronics Тип

Mfr. Тип

Anlielectronics Тип

Mfr. Тип

Anlielectronics Тип

Mfr. Тип

Anlielectronics Тип

Integrated Circuits (ICs)