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Изображение	Тип	Марка	Объяснение	Установленная цена	Количество	RoHS	Lifecycle Status	Package / Case	Surface Mount	Supplier Device Package	Number of Terminals	Base Product Number	Core	Data RAM Size	Factory Pack QuantityFactory Pack Quantity	Ihs Manufacturer	L1 Cache Data Memory	L1 Cache Instruction Memory	Manufacturer Part Number	Maximum Clock Frequency	Maximum Operating Supply Voltage	Maximum Operating Temperature	Mfr	Minimum Operating Supply Voltage	Minimum Operating Temperature	Moisture Sensitive	Moisture Sensitivity Levels	Mounting Styles	Number of I/Os	Number of Logic Array Blocks - LABs	Number of Logic Elements	Operating Temperature-Max	Package	Package Body Material	Package Code	Package Description	Package Equivalence Code	Package Shape	Package Style	Part Life Cycle Code	Product Status	Reflow Temperature-Max (s)	Risk Rank	RoHS	Rohs Code	Schedule B	Shipping Restrictions	Supply Voltage-Max	Supply Voltage-Min	Supply Voltage-Nom	Tradename	Typical Operating Supply Voltage	Unit Weight	Operating Temperature	Packaging	Series	JESD-609 Code	Pbfree Code	Terminal Finish	Additional Feature	HTS Code	Technology	Terminal Position	Terminal Form	Peak Reflow Temperature (Cel)	Terminal Pitch	Reach Compliance Code	Time@Peak Reflow Temperature-Max (s)	Pin Count	JESD-30 Code	Number of Outputs	Qualification Status	Operating Supply Voltage	Power Supplies	Temperature Grade	Speed	RAM Size	Core Processor	Peripherals	Program Memory Size	Connectivity	Architecture	Number of Inputs	Seated Height-Max	Programmable Logic Type	Speed Grade	Primary Attributes	Number of Logic Cells	Number of Cores	Flash Size	Length	Width

Изображение	Тип	Марка	Объяснение	Количество	Lifecycle Status	Package / Case	Surface Mount	Supplier Device Package	Number of Terminals	Base Product Number	Core	Data RAM Size	Factory Pack QuantityFactory Pack Quantity	Ihs Manufacturer	L1 Cache Data Memory	L1 Cache Instruction Memory	Manufacturer Part Number	Maximum Clock Frequency	Maximum Operating Supply Voltage	Maximum Operating Temperature	Mfr	Minimum Operating Supply Voltage	Minimum Operating Temperature	Moisture Sensitive	Moisture Sensitivity Levels	Mounting Styles	Number of I/Os	Number of Logic Array Blocks - LABs	Number of Logic Elements	Operating Temperature-Max	Package	Package Body Material	Package Code	Package Description	Package Equivalence Code	Package Shape	Package Style	Part Life Cycle Code	Product Status	Reflow Temperature-Max (s)	Risk Rank	RoHS	Rohs Code	Schedule B	Shipping Restrictions	Supply Voltage-Max	Supply Voltage-Min	Supply Voltage-Nom	Tradename	Typical Operating Supply Voltage	Unit Weight	Operating Temperature	Packaging	Series	JESD-609 Code	Pbfree Code	Terminal Finish	Additional Feature	HTS Code	Technology	Terminal Position	Terminal Form	Peak Reflow Temperature (Cel)	Terminal Pitch	Reach Compliance Code	Time@Peak Reflow Temperature-Max (s)	Pin Count	JESD-30 Code	Number of Outputs	Qualification Status	Operating Supply Voltage	Power Supplies	Temperature Grade	Speed	RAM Size	Core Processor	Peripherals	Program Memory Size	Connectivity	Architecture	Number of Inputs	Seated Height-Max	Programmable Logic Type	Speed Grade	Primary Attributes	Number of Logic Cells	Number of Cores	Flash Size	Length	Width
	Mfr. Тип M2S010-VFG256 Anlielectronics Тип	Microchip Technology	SoC FPGA M2S010-VFG256 Сборник данных Сравнение	Min.:1 Mult.:1	-	256-LBGA	YES	256-FPBGA (17x17)	256	M2S010	ARM Cortex M3	64 kB	119	MICROSEMI CORP	-	-	M2S010-VFG256	166 MHz	-	+ 85 C	Microchip Technology	-	0 C	Yes	3	SMD/SMT	138 I/O	1007 LAB	12084 LE	85 °C	Tray	PLASTIC/EPOXY	LFBGA	VFBGA-256	BGA256,16X16,32	SQUARE	GRID ARRAY, LOW PROFILE, FINE PITCH	Active	Active	40	5.77	Details	Yes	-	This product may require additional documentation to export from the United States.	1.26 V	1.14 V	1.2 V	-	1.2000 V	0.406091 oz	0 to 85 °C	Tray	SmartFusion2	e1	-	Tin/Silver/Copper (Sn/Ag/Cu)	LG-MIN, WD-MIN	8542.39.00.01	CMOS	BOTTOM	BALL	250	0.8 mm	compliant	-	-	S-PBGA-B256	138	Not Qualified	1.2 V	1.2 V	OTHER	166MHz	64KB	ARM® Cortex®-M3	DDR, PCIe, SERDES	256 kB	CANbus, Ethernet, I²C, SPI, UART/USART, USB	MCU, FPGA	138	1.56 mm	FIELD PROGRAMMABLE GATE ARRAY	STD	FPGA - 10K Logic Modules	12084	1 Core	256KB	14 mm	14 mm
M2S010-VFG256 Microchip Technology RoHS : Инкапсуляция : - Есть складские запасы : - 1 : -
	Mfr. Тип M2S005-VF400 Anlielectronics Тип	Microchip Technology	SoC FPGA M2S005-VF400 Сборник данных Сравнение	Min.:1 Mult.:1	-	400-LFBGA	YES	400-VFBGA (17x17)	400	M2S005	ARM Cortex M3	64 kB	90	MICROSEMI CORP	-	-	M2S005-VF400	166 MHz	1.26 V	-	Microchip Technology	1.14 V	-	Yes	-	-	169	505 LAB	6060 LE	85 °C	Tray	PLASTIC/EPOXY	LFBGA	VFBGA-400	BGA400,20X20,32	SQUARE	GRID ARRAY, LOW PROFILE, FINE PITCH	Active	Active	30	5.3	N	No	-	This product may require additional documentation to export from the United States.	1.26 V	1.14 V	1.2 V	-	1.2000 V	-	0 to 85 °C	Tray	SmartFusion2	e0	-	Tin/Lead (Sn/Pb)	-	8542.39.00.01	CMOS	BOTTOM	BALL	240	0.8 mm	not_compliant	-	-	S-PBGA-B400	160	Not Qualified	-	1.2 V	OTHER	166MHz	64KB	ARM® Cortex®-M3	DDR	128 kB	CANbus, Ethernet, I²C, SPI, UART/USART, USB	MCU, FPGA	160	1.51 mm	FIELD PROGRAMMABLE GATE ARRAY	STD	FPGA - 5K Logic Modules	4956	1 Core	128KB	17 mm	17 mm
M2S005-VF400 Microchip Technology RoHS : Инкапсуляция : - Есть складские запасы : - 1 : -
	Mfr. Тип M2S060-FCS325 Anlielectronics Тип	Microchip Technology	SoC FPGA M2S060-FCS325 Сборник данных Сравнение	Min.:1 Mult.:1	Production (Last Updated: 2 months ago)	325-TFBGA, FCBGA	YES	325-FCBGA (11x11)	325	M2S060	ARM Cortex M3	64 kB	176	MICROSEMI CORP	-	-	M2S060-FCS325	166 MHz	-	-	Microchip Technology	-	-	Yes	-	-	200	4710 LAB	56520 LE	85 °C	Tray	PLASTIC/EPOXY	TFBGA	FBGA-325	BGA325,21X21,20	SQUARE	GRID ARRAY, THIN PROFILE, FINE PITCH	Active	Active	30	5.84	N	No	-	This product may require additional documentation to export from the United States.	1.26 V	1.14 V	1.2 V	SmartFusion2	-	-	0°C ~ 85°C (TJ)	Tray	SmartFusion2	e0	-	Tin/Lead (Sn/Pb)	LG-MIN, WD-MIN	8542.39.00.01	CMOS	BOTTOM	BALL	240	0.5 mm	not_compliant	-	-	S-PBGA-B325	200	Not Qualified	-	1.2 V	OTHER	166MHz	64KB	ARM® Cortex®-M3	DDR, PCIe, SERDES	256 kB	CANbus, Ethernet, I²C, SPI, UART/USART, USB	MCU, FPGA	200	1.01 mm	FIELD PROGRAMMABLE GATE ARRAY	-	FPGA - 60K Logic Modules	56520	1 Core	256KB	11 mm	11 mm
M2S060-FCS325 Microchip Technology RoHS : Инкапсуляция : - Есть складские запасы : - 1 : -
	Mfr. Тип M2S025-1FCSG325I Anlielectronics Тип	Microchip Technology	SoC FPGA M2S025-1FCSG325I Сборник данных Сравнение	Min.:1 Mult.:1	Production (Last Updated: 2 months ago)	FCBGA-325	YES	325-FCBGA (11x11)	325	M2S025	ARM Cortex M3	64 kB	176	MICROSEMI CORP	-	-	M2S025-1FCSG325I	166 MHz	-	-	Microchip Technology	-	-	Yes	3	SMD/SMT	180	2308 LAB	27696 LE	-	Tray	PLASTIC/EPOXY	TFBGA	FBGA-325	BGA325,21X21,20	SQUARE	GRID ARRAY, THIN PROFILE, FINE PITCH	Active	Active	40	5.78	Details	Yes	8542390000/8542390000/8542390000/8542390000/8542390000/8542390000/8542390000/8542390000/8542390000/8542390000/8542390000/8542390000/8542390000/8542390000/8542390000/8542390000/8542390000/8542390000/8542390000/8542390000/8542390000/8542390000/8542390000/85	This product may require additional documentation to export from the United States.	1.26 V	1.14 V	1.2 V	-	-	-	-40°C ~ 100°C (TJ)	Tray	SmartFusion2	e1	-	Tin/Silver/Copper (Sn/Ag/Cu)	LG-MIN, WD-MIN	8542.39.00.01	CMOS	BOTTOM	BALL	250	0.5 mm	compliant	-	-	S-PBGA-B325	180	Not Qualified	-	1.2 V	-	166MHz	64KB	ARM® Cortex®-M3	DDR, PCIe, SERDES	256 kB	CANbus, Ethernet, I²C, SPI, UART/USART, USB	MCU, FPGA	180	1.01 mm	FIELD PROGRAMMABLE GATE ARRAY	-	FPGA - 25K Logic Modules	27696	1 Core	256KB	11 mm	11 mm
M2S025-1FCSG325I Microchip Technology RoHS : Инкапсуляция : - Есть складские запасы : - 1 : -
	Mfr. Тип M2S005-1TQG144 Anlielectronics Тип	Microchip Technology	SoC FPGA M2S005-1TQG144 Сборник данных Сравнение	Min.:1 Mult.:1	-	TQFP-144	-	144-TQFP (20x20)	-	M2S005	ARM Cortex M3	64 kB	60	-	-	-	-	166 MHz	-	-	Microchip Technology	-	-	Yes	-	SMD/SMT	84	505 LAB	6060 LE	-	Tray	-	-	-	-	-	-	-	Active	-	-	Details	-	-	This product may require additional documentation to export from the United States.	-	-	-	-	-	0.046530 oz	0°C ~ 85°C (TJ)	Tray	SmartFusion2	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	166MHz	64KB	ARM® Cortex®-M3	-	128 kB	CANbus, Ethernet, I²C, SPI, UART/USART, USB	MCU, FPGA	-	-	-	-	FPGA - 5K Logic Modules	-	1 Core	128KB	-	-
M2S005-1TQG144 Microchip Technology RoHS : Инкапсуляция : - Есть складские запасы : - 1 : -
	Mfr. Тип M2S005-1VF400I Anlielectronics Тип	Microchip Technology	SoC FPGA M2S005-1VF400I Сборник данных Сравнение	Min.:1 Mult.:1	-	VFPBGA-400	YES	400-VFBGA (17x17)	400	M2S005	ARM Cortex M3	64 kB	90	MICROSEMI CORP	-	-	M2S005-1VF400I	166 MHz	1.26 V	-	Microchip Technology	1.14 V	-	Yes	-	SMD/SMT	169	505 LAB	6060 LE	-	Tray	PLASTIC/EPOXY	LFBGA	LFBGA, BGA400,20X20,32	BGA400,20X20,32	SQUARE	GRID ARRAY, LOW PROFILE, FINE PITCH	Active	Active	30	5.86	N	No	-	This product may require additional documentation to export from the United States.	1.26 V	1.14 V	1.2 V	-	-	-	-40°C ~ 100°C (TJ)	Tray	SmartFusion2	e0	-	Tin/Lead (Sn/Pb)	-	8542.39.00.01	CMOS	BOTTOM	BALL	240	0.8 mm	not_compliant	-	-	S-PBGA-B400	160	Not Qualified	-	1.2 V	-	166MHz	64KB	ARM® Cortex®-M3	DDR	128 kB	CANbus, Ethernet, I²C, SPI, UART/USART, USB	MCU, FPGA	160	1.51 mm	FIELD PROGRAMMABLE GATE ARRAY	1	FPGA - 5K Logic Modules	4956	1 Core	128KB	17 mm	17 mm
M2S005-1VF400I Microchip Technology RoHS : Инкапсуляция : - Есть складские запасы : - 1 : -
	Mfr. Тип M2S060TS-FGG676 Anlielectronics Тип	Microchip Technology	SoC FPGA M2S060TS-FGG676 Сборник данных Сравнение	Min.:1 Mult.:1	-	676-BGA	-	676-FBGA (27x27)	-	M2S060	ARM Cortex M3	64 kB	40	-	-	-	-	166 MHz	-	-	Microchip Technology	-	-	Yes	-	-	387	4710 LAB	56520 LE	-	Tray	-	-	-	-	-	-	-	Active	-	-	Details	-	-	This product may require additional documentation to export from the United States.	-	-	-	SmartFusion2	-	-	0°C ~ 85°C (TJ)	Tray	SmartFusion2	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	166MHz	64KB	ARM® Cortex®-M3	DDR, PCIe, SERDES	256 kB	CANbus, Ethernet, I²C, SPI, UART/USART, USB	MCU, FPGA	-	-	-	-	FPGA - 60K Logic Modules	-	1 Core	256KB	-	-
M2S060TS-FGG676 Microchip Technology RoHS : Инкапсуляция : - Есть складские запасы : - 1 : -
	Mfr. Тип M2S060T-FG484I Anlielectronics Тип	Microchip Technology	SoC FPGA M2S060T-FG484I Сборник данных Сравнение	Min.:1 Mult.:1	Production (Last Updated: 2 months ago)	484-BGA	-	484-FPBGA (23x23)	-	M2S060	ARM Cortex M3	64 kB	60	-	-	-	-	166 MHz	-	-	Microchip Technology	-	-	Yes	-	-	267	4710 LAB	56520 LE	-	Tray	-	-	-	-	-	-	-	Active	-	-	N	-	-	This product may require additional documentation to export from the United States.	-	-	-	SmartFusion2	-	-	-40°C ~ 100°C (TJ)	Tray	SmartFusion2	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	166MHz	64KB	ARM® Cortex®-M3	DDR, PCIe, SERDES	256 kB	CANbus, Ethernet, I²C, SPI, UART/USART, USB	MCU, FPGA	-	-	-	-	FPGA - 60K Logic Modules	-	1 Core	256KB	-	-
M2S060T-FG484I Microchip Technology RoHS : Инкапсуляция : - Есть складские запасы : - 1 : -
	Mfr. Тип M2S025T-1FCSG325I Anlielectronics Тип	Microchip Technology	SoC FPGA M2S025T-1FCSG325I Сборник данных Сравнение	Min.:1 Mult.:1	Production (Last Updated: 2 months ago)	FCBGA-325	-	325-FCBGA (11x11)	-	M2S025	ARM Cortex M3	64 kB	176	-	-	-	-	166 MHz	-	-	Microchip Technology	-	-	Yes	-	SMD/SMT	180	2308 LAB	27696 LE	-	Tray	-	-	-	-	-	-	-	Active	-	-	Details	-	-	This product may require additional documentation to export from the United States.	-	-	-	-	-	-	-40°C ~ 100°C (TJ)	Tray	SmartFusion2	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	166MHz	64KB	ARM® Cortex®-M3	DDR, PCIe, SERDES	256 kB	CANbus, Ethernet, I²C, SPI, UART/USART, USB	MCU, FPGA	-	-	-	-	FPGA - 25K Logic Modules	-	1 Core	256KB	-	-
M2S025T-1FCSG325I Microchip Technology RoHS : Инкапсуляция : - Есть складские запасы : - 1 : -
	Mfr. Тип M2S150TS-1FCVG484 Anlielectronics Тип	Microchip Technology	SoC FPGA M2S150TS-1FCVG484 Сборник данных Сравнение	Min.:1 Mult.:1	-	484-BFBGA	YES	484-FBGA (19x19)	484	M2S150	ARM Cortex M3	64 kB	84	MICROSEMI CORP	-	-	M2S150TS-1FCVG484	166 MHz	-	-	Microchip Technology	-	-	Yes	4	-	273	12177 LAB	146124 LE	85 °C	Tray	PLASTIC/EPOXY	FBGA	VFBGA-484	-	SQUARE	GRID ARRAY, FINE PITCH	Active	Active	40	5.81	N	Yes	-	This product may require additional documentation to export from the United States.	1.26 V	1.14 V	1.2 V	-	-	-	0°C ~ 85°C (TJ)	Tray	SmartFusion2	e1	No	Tin/Silver/Copper (Sn/Ag/Cu)	LG-MIN, WD-MIN	8542.39.00.01	-	BOTTOM	BALL	250	0.8 mm	compliant	-	-	S-PBGA-B484	-	-	-	-	OTHER	166MHz	64KB	ARM® Cortex®-M3	DDR, PCIe, SERDES	512 kB	CANbus, Ethernet, I²C, SPI, UART/USART, USB	MCU, FPGA	-	3.15 mm	FIELD PROGRAMMABLE GATE ARRAY	-	FPGA - 150K Logic Modules	-	1 Core	512KB	19 mm	19 mm
M2S150TS-1FCVG484 Microchip Technology RoHS : Инкапсуляция : - Есть складские запасы : - 1 : -
	Mfr. Тип M2S150-FCVG484 Anlielectronics Тип	Microchip Technology	SoC FPGA M2S150-FCVG484 Сборник данных Сравнение	Min.:1 Mult.:1	-	484-BFBGA	-	484-FBGA (19x19)	-	M2S150	ARM Cortex M3	64 kB	84	-	-	-	-	166 MHz	1.26 V	-	Microchip Technology	1.14 V	-	Yes	-	-	273	12177 LAB	146124 LE	-	Tray	-	-	-	-	-	-	-	Active	-	-	Details	-	-	This product may require additional documentation to export from the United States.	-	-	-	-	1.2000 V	-	0 to 85 °C	Tray	SmartFusion2	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	166MHz	64KB	ARM® Cortex®-M3	DDR, PCIe, SERDES	512 kB	CANbus, Ethernet, I²C, SPI, UART/USART, USB	MCU, FPGA	-	-	-	STD	FPGA - 150K Logic Modules	-	1 Core	512KB	-	-
M2S150-FCVG484 Microchip Technology RoHS : Инкапсуляция : - Есть складские запасы : - 1 : -
	Mfr. Тип M2S060T-1FGG484 Anlielectronics Тип	Microchip Technology	SoC FPGA M2S060T-1FGG484 Сборник данных Сравнение	Min.:1 Mult.:1	Production (Last Updated: 2 months ago)	484-BGA	-	484-FPBGA (23x23)	-	M2S060	ARM Cortex M3	64 kB	60	-	-	-	-	166 MHz	-	-	Microchip Technology	-	-	Yes	-	-	267	4710 LAB	56520 LE	-	Tray	-	-	-	-	-	-	-	Active	-	-	Details	-	-	This product may require additional documentation to export from the United States.	-	-	-	SmartFusion2	-	-	0°C ~ 85°C (TJ)	Tray	SmartFusion2	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	166MHz	64KB	ARM® Cortex®-M3	DDR, PCIe, SERDES	256 kB	CANbus, Ethernet, I²C, SPI, UART/USART, USB	MCU, FPGA	-	-	-	-	FPGA - 60K Logic Modules	-	1 Core	256KB	-	-
M2S060T-1FGG484 Microchip Technology RoHS : Инкапсуляция : - Есть складские запасы : - 1 : -
	Mfr. Тип M2S025TS-1FCS325 Anlielectronics Тип	Microchip Technology	SoC FPGA M2S025TS-1FCS325 Сборник данных Сравнение	Min.:1 Mult.:1	Production (Last Updated: 2 months ago)	FCBGA-325	YES	325-FCBGA (11x11)	325	M2S025	ARM Cortex M3	64 kB	176	MICROSEMI CORP	-	-	M2S025TS-1FCS325	166 MHz	-	-	Microchip Technology	-	-	Yes	-	SMD/SMT	180	2308 LAB	27696 LE	85 °C	Tray	PLASTIC/EPOXY	TFBGA	TFBGA, BGA325,21X21,20	BGA325,21X21,20	SQUARE	GRID ARRAY, THIN PROFILE, FINE PITCH	Active	Active	30	5.88	N	No	-	This product may require additional documentation to export from the United States.	1.26 V	1.14 V	1.2 V	-	-	-	0°C ~ 85°C (TJ)	Tray	SmartFusion2	e0	-	Tin/Lead (Sn/Pb)	LG-MIN, WD-MIN	8542.39.00.01	CMOS	BOTTOM	BALL	240	0.5 mm	not_compliant	-	-	S-PBGA-B325	180	Not Qualified	-	1.2 V	OTHER	166MHz	64KB	ARM® Cortex®-M3	DDR, PCIe, SERDES	256 kB	CANbus, Ethernet, I²C, SPI, UART/USART, USB	MCU, FPGA	180	1.01 mm	FIELD PROGRAMMABLE GATE ARRAY	-	FPGA - 25K Logic Modules	27696	1 Core	256KB	11 mm	11 mm
M2S025TS-1FCS325 Microchip Technology RoHS : Инкапсуляция : - Есть складские запасы : - 1 : -
	Mfr. Тип M2S060TS-1VFG400 Anlielectronics Тип	Microchip Technology	SoC FPGA M2S060TS-1VFG400 Сборник данных Сравнение	Min.:1 Mult.:1	-	400-LFBGA	YES	400-VFBGA (17x17)	400	M2S060	ARM Cortex M3	64 kB	90	MICROSEMI CORP	-	-	M2S060TS-1VFG400	166 MHz	-	-	Microchip Technology	-	-	Yes	3	-	207	4710 LAB	56520 LE	85 °C	Tray	PLASTIC/EPOXY	LFBGA	LFBGA, BGA400,20X20,32	BGA400,20X20,32	SQUARE	GRID ARRAY, LOW PROFILE, FINE PITCH	Active	Active	-	5.81	Details	Yes	-	This product may require additional documentation to export from the United States.	1.26 V	1.14 V	1.2 V	SmartFusion2	-	-	0°C ~ 85°C (TJ)	Tray	SmartFusion2	e1	-	Tin/Silver/Copper (Sn/Ag/Cu)	-	8542.39.00.01	CMOS	BOTTOM	BALL	250	0.8 mm	compliant	40	-	S-PBGA-B400	207	Not Qualified	-	1.2 V	OTHER	166MHz	64KB	ARM® Cortex®-M3	DDR, PCIe, SERDES	256 kB	CANbus, Ethernet, I²C, SPI, UART/USART, USB	MCU, FPGA	207	1.51 mm	FIELD PROGRAMMABLE GATE ARRAY	-	FPGA - 60K Logic Modules	56520	1 Core	256KB	17 mm	17 mm
M2S060TS-1VFG400 Microchip Technology RoHS : Инкапсуляция : - Есть складские запасы : - 1 : -
	Mfr. Тип M2S010TS-VF400I Anlielectronics Тип	Microchip Technology	SoC FPGA M2S010TS-VF400I Сборник данных Сравнение	Min.:1 Mult.:1	Production (Last Updated: 1 month ago)	VFPBGA-400	YES	400-VFBGA (17x17)	400	M2S010	ARM Cortex M3	64 kB	90	MICROSEMI CORP	-	-	M2S010TS-VF400I	166 MHz	-	-	Microchip Technology	-	-	Yes	-	SMD/SMT	195	1007 LAB	12084 LE	-	Tray	PLASTIC/EPOXY	LFBGA	VFBGA-400	BGA400,20X20,32	SQUARE	GRID ARRAY, LOW PROFILE, FINE PITCH	Active	Active	30	5.88	N	No	-	This product may require additional documentation to export from the United States.	1.26 V	1.14 V	1.2 V	-	-	-	-40°C ~ 100°C (TJ)	Tray	SmartFusion2	e0	-	Tin/Lead (Sn/Pb)	-	8542.39.00.01	CMOS	BOTTOM	BALL	240	0.8 mm	not_compliant	-	-	S-PBGA-B400	195	Not Qualified	-	1.2 V	-	166MHz	64KB	ARM® Cortex®-M3	DDR, PCIe, SERDES	256 kB	CANbus, Ethernet, I²C, SPI, UART/USART, USB	MCU, FPGA	195	1.51 mm	FIELD PROGRAMMABLE GATE ARRAY	-	FPGA - 10K Logic Modules	12084	1 Core	256KB	17 mm	17 mm
M2S010TS-VF400I Microchip Technology RoHS : Инкапсуляция : - Есть складские запасы : - 1 : -
	Mfr. Тип M2S060-1FGG676I Anlielectronics Тип	Microchip Technology	SoC FPGA M2S060-1FGG676I Сборник данных Сравнение	Min.:1 Mult.:1	Production (Last Updated: 2 months ago)	676-BGA	-	676-FBGA (27x27)	-	M2S060	ARM Cortex M3	64 kB	40	-	-	-	-	166 MHz	-	-	Microchip Technology	-	-	Yes	-	-	387	4710 LAB	56520 LE	-	Tray	-	-	-	-	-	-	-	Active	-	-	Details	-	-	This product may require additional documentation to export from the United States.	-	-	-	SmartFusion2	-	-	-40°C ~ 100°C (TJ)	Tray	SmartFusion2	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	166MHz	64KB	ARM® Cortex®-M3	DDR, PCIe, SERDES	256 kB	CANbus, Ethernet, I²C, SPI, UART/USART, USB	MCU, FPGA	-	-	-	-	FPGA - 60K Logic Modules	-	1 Core	256KB	-	-
M2S060-1FGG676I Microchip Technology RoHS : Инкапсуляция : - Есть складские запасы : - 1 : -
	Mfr. Тип M2S090-FGG484 Anlielectronics Тип	Microchip Technology	SoC FPGA M2S090-FGG484 Сборник данных Сравнение	Min.:1 Mult.:1	-	484-BGA	-	484-FPBGA (23x23)	-	M2S090	ARM Cortex M3	64 kB	60	-	-	-	-	166 MHz	-	-	Microchip Technology	-	-	Yes	-	-	267	7193 LAB	86316 LE	-	Tray	-	-	-	-	-	-	-	Active	-	-	Details	-	-	This product may require additional documentation to export from the United States.	-	-	-	-	1.2000 V	-	0 to 85 °C	Tray	SmartFusion2	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	166MHz	64KB	ARM® Cortex®-M3	DDR, PCIe, SERDES	512 kB	CANbus, Ethernet, I²C, SPI, UART/USART, USB	MCU, FPGA	-	-	-	STD	FPGA - 90K Logic Modules	-	1 Core	512KB	-	-
M2S090-FGG484 Microchip Technology RoHS : Инкапсуляция : - Есть складские запасы : - 1 : -
	Mfr. Тип M2S050-1FG896 Anlielectronics Тип	Microchip Technology	SoC FPGA M2S050-1FG896 Сборник данных Сравнение	Min.:1 Mult.:1	-	FPBGA-896	YES	896-FBGA (31x31)	896	M2S050	ARM Cortex M3	64 kB	27	MICROSEMI CORP	-	-	M2S050-1FG896	166 MHz	-	-	Microchip Technology	-	-	Yes	3	SMD/SMT	377	4695 LAB	56340 LE	85 °C	Tray	PLASTIC/EPOXY	BGA	FBGA-896	BGA896,30X30,40	SQUARE	GRID ARRAY	Active	Active	30	5.3	N	No	-	This product may require additional documentation to export from the United States.	1.26 V	1.14 V	1.2 V	-	1.2000 V	-	0 to 85 °C	Tray	SmartFusion2	e0	-	Tin/Lead (Sn/Pb)	-	8542.39.00.01	CMOS	BOTTOM	BALL	240	1 mm	not_compliant	-	896	S-PBGA-B896	377	Not Qualified	-	1.2 V	OTHER	166MHz	64KB	ARM® Cortex®-M3	DDR, PCIe, SERDES	256 kB	CANbus, Ethernet, I²C, SPI, UART/USART, USB	MCU, FPGA	377	2.44 mm	FIELD PROGRAMMABLE GATE ARRAY	1	FPGA - 50K Logic Modules	48672	1 Core	256KB	31 mm	31 mm
M2S050-1FG896 Microchip Technology RoHS : Инкапсуляция : - Есть складские запасы : - 1 : -
	Mfr. Тип M2S090T-FG484 Anlielectronics Тип	Microchip Technology	SoC FPGA M2S090T-FG484 Сборник данных Сравнение	Min.:1 Mult.:1	-	484-BGA	-	484-FPBGA (23x23)	-	M2S090	ARM Cortex M3	64 kB	60	-	-	-	-	166 MHz	-	-	Microchip Technology	-	-	Yes	-	-	267	7193 LAB	86316 LE	-	Tray	-	-	-	-	-	-	-	Active	-	-	N	-	-	This product may require additional documentation to export from the United States.	-	-	-	-	1.2000 V	-	0 to 85 °C	Tray	SmartFusion2	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	166MHz	64KB	ARM® Cortex®-M3	DDR, PCIe, SERDES	512 kB	CANbus, Ethernet, I²C, SPI, UART/USART, USB	MCU, FPGA	-	-	-	STD	FPGA - 90K Logic Modules	-	1 Core	512KB	-	-
M2S090T-FG484 Microchip Technology RoHS : Инкапсуляция : - Есть складские запасы : - 1 : -
	Mfr. Тип M2S010TS-VF256 Anlielectronics Тип	Microchip Technology	SoC FPGA M2S010TS-VF256 Сборник данных Сравнение	Min.:1 Mult.:1	Production (Last Updated: 1 month ago)	256-LFBGA	YES	256-FPBGA (14x14)	256	M2S010	ARM Cortex M3	64 kB	119	MICROSEMI CORP	-	-	M2S010TS-VF256	166 MHz	-	-	Microchip Technology	-	-	Yes	-	-	138	1007 LAB	12084 LE	85 °C	Tray	PLASTIC/EPOXY	LFBGA	LFBGA, BGA256,16X16,32	BGA256,16X16,32	SQUARE	GRID ARRAY, LOW PROFILE, FINE PITCH	Active	Active	30	5.87	N	No	-	This product may require additional documentation to export from the United States.	1.26 V	1.14 V	1.2 V	-	-	-	0°C ~ 85°C (TJ)	Tray	SmartFusion2	e0	-	Tin/Lead (Sn/Pb)	LG-MIN, WD-MIN	8542.39.00.01	CMOS	BOTTOM	BALL	240	0.8 mm	not_compliant	-	-	S-PBGA-B256	138	Not Qualified	-	1.2 V	OTHER	166MHz	64KB	ARM® Cortex®-M3	DDR, PCIe, SERDES	256 kB	CANbus, Ethernet, I²C, SPI, UART/USART, USB	MCU, FPGA	138	1.56 mm	FIELD PROGRAMMABLE GATE ARRAY	-	FPGA - 10K Logic Modules	12084	1 Core	256KB	14 mm	14 mm
M2S010TS-VF256 Microchip Technology RoHS : Инкапсуляция : - Есть складские запасы : - 1 : -

Integrated Circuits (ICs)

Embedded - System On Chip (SoC) definition: A System On Chip (SoC) combines the required electronic circuits of various computer components onto a single, integrated chip (IC). SoC is ... Embedded - System On Chip (SoC) Product Listing: M2S010-VFG256,M2S005-VF400,M2S060-FCS325,M2S025-1FCSG325I,M2S005-1TQG144.Integrated Circuits (ICs) type:Embedded - Microcontrollers(129432),Memory(111901),PMIC - Supervisors(101743),PMIC - Voltage Regulators - Linear(101187),PMIC - Voltage Regulators - DC DC Switching Regulators(62822) .Embedded - System On Chip (SoC) has 873 pieces of spot stock price information, you can click the "RFQ" button to confirm the inventory and price with the Anli.

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Integrated Circuits (ICs)