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Изображение	Тип	Марка	Объяснение	Установленная цена	Количество	RoHS	Lifecycle Status	Package / Case	Surface Mount	Supplier Device Package	Number of Terminals	Base Product Number	Clock Frequency-Max	Core	Data RAM Size	Device Logic Gates	Device System Gates	Distributed RAM	Factory Pack QuantityFactory Pack Quantity	Ihs Manufacturer	L1 Cache Data Memory	L1 Cache Instruction Memory	Manufacturer Part Number	Maximum Clock Frequency	Maximum Operating Supply Voltage	Maximum Operating Temperature	Mfr	Minimum Operating Supply Voltage	Minimum Operating Temperature	Moisture Sensitive	Moisture Sensitivity Levels	Mounting Styles	Number of I/Os	Number of Logic Array Blocks - LABs	Number of Logic Elements	Operating Temperature-Max	Operating Temperature-Min	Package	Package Body Material	Package Code	Package Description	Package Equivalence Code	Package Shape	Package Style	Part Life Cycle Code	Product Status	Reflow Temperature-Max (s)	Risk Rank	RoHS	Rohs Code	Shipping Restrictions	Supply Voltage-Max	Supply Voltage-Min	Supply Voltage-Nom	Tradename	Typical Operating Supply Voltage	Operating Temperature	Packaging	Series	JESD-609 Code	Pbfree Code	ECCN Code	Terminal Finish	Max Operating Temperature	Min Operating Temperature	Additional Feature	HTS Code	Technology	Terminal Position	Terminal Form	Peak Reflow Temperature (Cel)	Terminal Pitch	Reach Compliance Code	Frequency	JESD-30 Code	Number of Outputs	Qualification Status	Operating Supply Voltage	Power Supplies	Temperature Grade	Interface	Operating Supply Current	Speed	RAM Size	Core Processor	Peripherals	Program Memory Size	Connectivity	Architecture	Number of Inputs	Organization	Seated Height-Max	Programmable Logic Type	Core Architecture	Number of Gates	Speed Grade	Primary Attributes	Number of CLBs	Number of Logic Cells	Number of Cores	Number of Equivalent Gates	Flash Size	Length	Width

Изображение	Тип	Марка	Объяснение	Количество	Lifecycle Status	Package / Case	Surface Mount	Supplier Device Package	Number of Terminals	Base Product Number	Clock Frequency-Max	Core	Data RAM Size	Device Logic Gates	Device System Gates	Distributed RAM	Factory Pack QuantityFactory Pack Quantity	Ihs Manufacturer	L1 Cache Data Memory	L1 Cache Instruction Memory	Manufacturer Part Number	Maximum Clock Frequency	Maximum Operating Supply Voltage	Maximum Operating Temperature	Mfr	Minimum Operating Supply Voltage	Minimum Operating Temperature	Moisture Sensitive	Moisture Sensitivity Levels	Mounting Styles	Number of I/Os	Number of Logic Array Blocks - LABs	Number of Logic Elements	Operating Temperature-Max	Operating Temperature-Min	Package	Package Body Material	Package Code	Package Description	Package Equivalence Code	Package Shape	Package Style	Part Life Cycle Code	Product Status	Reflow Temperature-Max (s)	Risk Rank	RoHS	Rohs Code	Shipping Restrictions	Supply Voltage-Max	Supply Voltage-Min	Supply Voltage-Nom	Tradename	Typical Operating Supply Voltage	Operating Temperature	Packaging	Series	JESD-609 Code	Pbfree Code	ECCN Code	Terminal Finish	Max Operating Temperature	Min Operating Temperature	Additional Feature	HTS Code	Technology	Terminal Position	Terminal Form	Peak Reflow Temperature (Cel)	Terminal Pitch	Reach Compliance Code	Frequency	JESD-30 Code	Number of Outputs	Qualification Status	Operating Supply Voltage	Power Supplies	Temperature Grade	Interface	Operating Supply Current	Speed	RAM Size	Core Processor	Peripherals	Program Memory Size	Connectivity	Architecture	Number of Inputs	Organization	Seated Height-Max	Programmable Logic Type	Core Architecture	Number of Gates	Speed Grade	Primary Attributes	Number of CLBs	Number of Logic Cells	Number of Cores	Number of Equivalent Gates	Flash Size	Length	Width
	Mfr. Тип A2F200M3F-FG484 Anlielectronics Тип	Microchip Technology	SoC FPGA A2F200M3F-FG484 Сборник данных Сравнение	Min.:1 Mult.:1	-	FPBGA-484	YES	484-FPBGA (23x23)	484	A2F200	80 MHz	ARM Cortex M3	64 kB	-	-	-	60	MICROSEMI CORP	-	-	A2F200M3F-FG484	80 MHz	-	+ 85 C	Microchip Technology	-	0 C	Yes	3	SMD/SMT	161 I/O	-	2000 LE	85 °C	-	Tray	PLASTIC/EPOXY	BGA	BGA, BGA484,26X26,40	BGA484,26X26,40	SQUARE	GRID ARRAY	Active	Active	30	5.24	N	No	-	1.575 V	1.425 V	1.5 V	SmartFusion	-	0°C ~ 85°C (TJ)	Tray	A2F200	e0	-	-	Tin/Lead (Sn/Pb)	-	-	-	8542.39.00.01	CMOS	BOTTOM	BALL	225	1 mm	compliant	-	S-PBGA-B484	94	Not Qualified	-	1.5,1.8,2.5,3.3 V	OTHER	-	2 mA	80MHz	64KB	ARM® Cortex®-M3	DMA, POR, WDT	256 kB	EBI/EMI, Ethernet, I²C, SPI, UART/USART	MCU, FPGA	94	4608 CLBS, 200000 GATES	2.44 mm	FIELD PROGRAMMABLE GATE ARRAY	-	200000	STD	ProASIC®3 FPGA, 200K Gates, 4608 D-Flip-Flops	4608	4608	1 Core	200000	256KB	23 mm	23 mm
A2F200M3F-FG484 Microchip Technology RoHS : Инкапсуляция : - Есть складские запасы : - 1 : -
	Mfr. Тип A2F500M3G-1FG484 Anlielectronics Тип	Microchip Technology	SoC FPGA A2F500M3G-1FG484 Сборник данных Сравнение	Min.:1 Mult.:1	-	FPBGA-484	-	484-FPBGA (23x23)	-	A2F500	-	ARM Cortex M3	64 kB	-	-	-	60	-	-	-	-	100 MHz	1.575 V	+ 85 C	Microchip Technology	1.425 V	0 C	Yes	-	SMD/SMT	204 I/O	-	6000 LE	-	-	Tray	-	-	-	-	-	-	-	Active	-	-	N	-	This product may require additional documentation to export from the United States.	-	-	-	SmartFusion	1.5000 V	0 to 85 °C	Tray	A2F500	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	1 mA	100MHz	64KB	ARM® Cortex®-M3	DMA, POR, WDT	512 kB	EBI/EMI, Ethernet, I²C, SPI, UART/USART	MCU, FPGA	-	-	-	-	-	500000	1	ProASIC®3 FPGA, 500K Gates, 11520 D-Flip-Flops	-	-	1 Core	-	512KB	-	-
A2F500M3G-1FG484 Microchip Technology RoHS : Инкапсуляция : - Есть складские запасы : - 1 : -
	Mfr. Тип A2F500M3G-1FGG484I Anlielectronics Тип	Microchip Technology	SoC FPGA A2F500M3G-1FGG484I Сборник данных Сравнение	Min.:1 Mult.:1	-	FPBGA-484	YES	484-FPBGA (23x23)	484	A2F500	100 MHz	ARM Cortex M3	64 kB	500000	500000	-	60	MICROSEMI CORP	-	-	A2F500M3G-1FGG484I	100 MHz	1.575 V	+ 100 C	Microchip Technology	1.425 V	- 40 C	Yes	3	SMD/SMT	204 I/O	-	6000 LE	100 °C	-40 °C	Tray	PLASTIC/EPOXY	BGA	BGA, BGA484,26X26,40	BGA484,26X26,40	SQUARE	GRID ARRAY	Active	Active	30	5.24	Details	Yes	-	1.575 V	1.425 V	1.5 V	SmartFusion	1.5000 V	-40 to 100 °C	Tray	A2F500	e1	-	-	Tin/Silver/Copper (Sn/Ag/Cu)	-	-	-	8542.39.00.01	CMOS	BOTTOM	BALL	250	1 mm	compliant	-	S-PBGA-B484	128	Not Qualified	1.5 V	1.5,1.8,2.5,3.3 V	INDUSTRIAL	-	16.5 mA	100MHz	64KB	ARM® Cortex®-M3	DMA, POR, WDT	512 kB	EBI/EMI, Ethernet, I²C, SPI, UART/USART	MCU, FPGA	128	11520 CLBS, 500000 GATES	2.44 mm	FIELD PROGRAMMABLE GATE ARRAY	-	500000	1	ProASIC®3 FPGA, 500K Gates, 11520 D-Flip-Flops	11520	11520	1 Core	500000	512KB	23 mm	23 mm
A2F500M3G-1FGG484I Microchip Technology RoHS : Инкапсуляция : - Есть складские запасы : - 1 : -
	Mfr. Тип A2F200M3F-1FGG484I Anlielectronics Тип	Microchip Technology	SoC FPGA A2F200M3F-1FGG484I Сборник данных Сравнение	Min.:1 Mult.:1	-	FPBGA-484	YES	484-FPBGA (23x23)	484	A2F200	100 MHz	ARM Cortex M3	64 kB	-	-	-	60	MICROSEMI CORP	-	-	A2F200M3F-1FGG484I	100 MHz	-	+ 100 C	Microchip Technology	-	- 40 C	Yes	3	SMD/SMT	161 I/O	-	2000 LE	100 °C	-40 °C	Tray	PLASTIC/EPOXY	BGA	BGA, BGA484,26X26,40	BGA484,26X26,40	SQUARE	GRID ARRAY	Active	Active	30	5.24	Details	Yes	-	1.575 V	1.425 V	1.5 V	SmartFusion	-	-40°C ~ 100°C (TJ)	Tray	A2F200	e1	-	-	Tin/Silver/Copper (Sn/Ag/Cu)	-	-	-	8542.39.00.01	CMOS	BOTTOM	BALL	250	1 mm	compliant	-	S-PBGA-B484	94	Not Qualified	-	1.5,1.8,2.5,3.3 V	INDUSTRIAL	-	1 mA	100MHz	64KB	ARM® Cortex®-M3	DMA, POR, WDT	256 kB	EBI/EMI, Ethernet, I²C, SPI, UART/USART	MCU, FPGA	94	4608 CLBS, 200000 GATES	2.44 mm	FIELD PROGRAMMABLE GATE ARRAY	-	200000	-	ProASIC®3 FPGA, 200K Gates, 4608 D-Flip-Flops	4608	4608	1 Core	200000	256KB	23 mm	23 mm
A2F200M3F-1FGG484I Microchip Technology RoHS : Инкапсуляция : - Есть складские запасы : - 1 : -
	Mfr. Тип A2F500M3G-FG484I Anlielectronics Тип	Microchip Technology	SoC FPGA A2F500M3G-FG484I Сборник данных Сравнение	Min.:1 Mult.:1	-	FPBGA-484	-	484-FPBGA (23x23)	-	A2F500	-	ARM Cortex M3	64 kB	-	-	-	60	-	-	-	-	80 MHz	-	+ 100 C	Microchip Technology	-	- 40 C	Yes	-	SMD/SMT	204 I/O	-	6000 LE	-	-	Tray	-	-	-	-	-	-	-	Active	-	-	N	-	This product may require additional documentation to export from the United States.	-	-	-	SmartFusion	-	-40°C ~ 100°C (TJ)	Tray	A2F500	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	2 mA	80MHz	64KB	ARM® Cortex®-M3	DMA, POR, WDT	512 kB	EBI/EMI, Ethernet, I²C, SPI, UART/USART	MCU, FPGA	-	-	-	-	-	500000	STD	ProASIC®3 FPGA, 500K Gates, 11520 D-Flip-Flops	-	-	1 Core	-	512KB	-	-
A2F500M3G-FG484I Microchip Technology RoHS : Инкапсуляция : - Есть складские запасы : - 1 : -
	Mfr. Тип M2S060TS-FG484 Anlielectronics Тип	Microchip Technology	SoC FPGA M2S060TS-FG484 Сборник данных Сравнение	Min.:1 Mult.:1	-	484-BGA	-	484-FPBGA (23x23)	-	M2S060	-	ARM Cortex M3	64 kB	-	-	-	60	-	-	-	-	166 MHz	-	-	Microchip Technology	-	-	Yes	-	-	267	4710 LAB	56520 LE	-	-	Tray	-	-	-	-	-	-	-	Active	-	-	N	-	This product may require additional documentation to export from the United States.	-	-	-	SmartFusion2	-	0°C ~ 85°C (TJ)	Tray	SmartFusion2	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	166MHz	64KB	ARM® Cortex®-M3	DDR, PCIe, SERDES	256 kB	CANbus, Ethernet, I²C, SPI, UART/USART, USB	MCU, FPGA	-	-	-	-	-	-	-	FPGA - 60K Logic Modules	-	-	1 Core	-	256KB	-	-
M2S060TS-FG484 Microchip Technology RoHS : Инкапсуляция : - Есть складские запасы : - 1 : -
	Mfr. Тип A2F500M3G-1FG484I Anlielectronics Тип	Microchip Technology	SoC FPGA A2F500M3G-1FG484I Сборник данных Сравнение	Min.:1 Mult.:1	-	FPBGA-484	YES	484-FPBGA (23x23)	484	A2F500	100 MHz	ARM Cortex M3	64 kB	-	-	-	60	MICROSEMI CORP	-	-	A2F500M3G-1FG484I	100 MHz	1.575 V	+ 100 C	Microchip Technology	1.425 V	- 40 C	Yes	3	SMD/SMT	204 I/O	-	6000 LE	100 °C	-40 °C	Tray	PLASTIC/EPOXY	BGA	BGA, BGA484,26X26,40	BGA484,26X26,40	SQUARE	GRID ARRAY	Active	Active	20	5.24	N	No	This product may require additional documentation to export from the United States.	1.575 V	1.425 V	1.5 V	SmartFusion	1.5000 V	-40 to 100 °C	Tray	A2F500	e0	-	-	Tin/Lead (Sn/Pb)	-	-	-	8542.39.00.01	CMOS	BOTTOM	BALL	225	1 mm	compliant	-	S-PBGA-B484	128	Not Qualified	-	1.5,1.8,2.5,3.3 V	INDUSTRIAL	-	1 mA	100MHz	64KB	ARM® Cortex®-M3	DMA, POR, WDT	512 kB	EBI/EMI, Ethernet, I²C, SPI, UART/USART	MCU, FPGA	128	11520 CLBS, 500000 GATES	2.44 mm	FIELD PROGRAMMABLE GATE ARRAY	-	500000	1	ProASIC®3 FPGA, 500K Gates, 11520 D-Flip-Flops	11520	11520	1 Core	500000	512KB	23 mm	23 mm
A2F500M3G-1FG484I Microchip Technology RoHS : Инкапсуляция : - Есть складские запасы : - 1 : -
	Mfr. Тип A2F500M3G-1FGG484M Anlielectronics Тип	Microchip Technology	SoC FPGA A2F500M3G-1FGG484M Сборник данных Сравнение	Min.:1 Mult.:1	-	484-BGA	-	484-FPBGA (23x23)	-	A2F500	-	ARM Cortex M3	64 kB	-	-	-	60	-	-	-	-	100 MHz	-	-	Microchip Technology	-	-	Yes	-	-	MCU - 41, FPGA - 128	-	6000 LE	-	-	Tray	-	-	-	-	-	-	-	Active	-	-	Details	-	This product may require additional documentation to export from the United States.	-	-	-	SmartFusion	-	-55°C ~ 125°C (TJ)	Tray	A2F500	-	-	-	-	125 °C	-55 °C	-	-	-	-	-	-	-	-	100 MHz	-	-	-	-	-	-	EBI/EMI, Ethernet, I2C, SPI, UART, USART	-	100MHz	64KB	ARM® Cortex®-M3	DMA, POR, WDT	512 kB	EBI/EMI, Ethernet, I²C, SPI, UART/USART	MCU, FPGA	-	-	-	-	ARM	-	-	ProASIC®3 FPGA, 500K Gates, 11520 D-Flip-Flops	-	-	1 Core	-	512KB	-	-
A2F500M3G-1FGG484M Microchip Technology RoHS : Инкапсуляция : - Есть складские запасы : - 1 : -
	Mfr. Тип M2S150T-1FCG1152 Anlielectronics Тип	Microchip Technology	SoC FPGA M2S150T-1FCG1152 Сборник данных Сравнение	Min.:1 Mult.:1	-	FCBGA-1152	-	1152-FCBGA (35x35)	-	M2S150	-	ARM Cortex M3	64 kB	-	-	-	24	-	-	-	-	166 MHz	-	-	Microchip Technology	-	-	Yes	-	SMD/SMT	574	12177 LAB	146124 LE	-	-	Tray	-	-	-	-	-	-	-	Active	-	-	Details	-	This product may require additional documentation to export from the United States.	-	-	-	-	1.2000 V	0 to 85 °C	Tray	SmartFusion2	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	166MHz	64KB	ARM® Cortex®-M3	DDR, PCIe, SERDES	512 kB	CANbus, Ethernet, I²C, SPI, UART/USART, USB	MCU, FPGA	-	-	-	-	-	-	1	FPGA - 150K Logic Modules	-	-	1 Core	-	512KB	-	-
M2S150T-1FCG1152 Microchip Technology RoHS : Инкапсуляция : - Есть складские запасы : - 1 : -
	Mfr. Тип M2S025-1VFG400 Anlielectronics Тип	Microchip Technology	SoC FPGA M2S025-1VFG400 Сборник данных Сравнение	Min.:1 Mult.:1	-	VFPBGA-400	-	400-VFBGA (17x17)	-	M2S025	-	ARM Cortex M3	64 kB	-	-	-	90	-	-	-	-	166 MHz	-	-	Microchip Technology	-	-	Yes	-	SMD/SMT	207	2308 LAB	27696 LE	-	-	Tray	-	-	-	-	-	-	-	Active	-	-	Details	-	This product may require additional documentation to export from the United States.	-	-	-	-	-	0°C ~ 85°C (TJ)	Tray	SmartFusion2	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	166MHz	64KB	ARM® Cortex®-M3	DDR, PCIe, SERDES	256 kB	CANbus, Ethernet, I²C, SPI, UART/USART, USB	MCU, FPGA	-	-	-	-	-	-	-	FPGA - 25K Logic Modules	-	-	1 Core	-	256KB	-	-
M2S025-1VFG400 Microchip Technology RoHS : Инкапсуляция : - Есть складские запасы : - 1 : -
	Mfr. Тип M2S090-FG484I Anlielectronics Тип	Microchip Technology	SoC FPGA M2S090-FG484I Сборник данных Сравнение	Min.:1 Mult.:1	Production (Last Updated: 2 months ago)	FPBGA-484	YES	484-FPBGA (23x23)	484	M2S090	-	ARM Cortex M3	64 kB	-	-	-	60	MICROSEMI CORP	-	-	M2S090-FG484I	166 MHz	-	-	Microchip Technology	-	-	Yes	3	SMD/SMT	267	7193 LAB	86316 LE	-	-	Tray	PLASTIC/EPOXY	BGA	BGA, BGA484,22X22,40	BGA484,22X22,40	SQUARE	GRID ARRAY	Active	Active	30	5.83	N	No	This product may require additional documentation to export from the United States.	1.26 V	1.14 V	1.2 V	-	-	-40°C ~ 100°C (TJ)	Tray	SmartFusion2	e0	-	-	Tin/Lead (Sn/Pb)	-	-	-	8542.39.00.01	CMOS	BOTTOM	BALL	240	1 mm	not_compliant	-	S-PBGA-B484	267	Not Qualified	-	1.2 V	-	-	-	166MHz	64KB	ARM® Cortex®-M3	DDR, PCIe, SERDES	512 kB	CANbus, Ethernet, I²C, SPI, UART/USART, USB	MCU, FPGA	267	-	2.44 mm	FIELD PROGRAMMABLE GATE ARRAY	-	-	-	FPGA - 90K Logic Modules	-	86316	1 Core	-	512KB	23 mm	23 mm
M2S090-FG484I Microchip Technology RoHS : Инкапсуляция : - Есть складские запасы : - 1 : -
	Mfr. Тип M2S025TS-1VF400 Anlielectronics Тип	Microchip Technology	SoC FPGA M2S025TS-1VF400 Сборник данных Сравнение	Min.:1 Mult.:1	Production (Last Updated: 2 months ago)	VFPBGA-400	YES	400-VFBGA (17x17)	400	M2S025	-	ARM Cortex M3	64 kB	-	-	-	90	MICROSEMI CORP	-	-	M2S025TS-1VF400	166 MHz	-	-	Microchip Technology	-	-	Yes	-	SMD/SMT	207	2308 LAB	27696 LE	85 °C	-	Tray	PLASTIC/EPOXY	LFBGA	VFBGA-400	BGA400,20X20,32	SQUARE	GRID ARRAY, LOW PROFILE, FINE PITCH	Active	Active	30	5.87	N	No	This product may require additional documentation to export from the United States.	1.26 V	1.14 V	1.2 V	-	-	0°C ~ 85°C (TJ)	Tray	SmartFusion2	e0	-	-	Tin/Lead (Sn/Pb)	-	-	-	8542.39.00.01	CMOS	BOTTOM	BALL	240	0.8 mm	not_compliant	-	S-PBGA-B400	207	Not Qualified	-	1.2 V	OTHER	-	-	166MHz	64KB	ARM® Cortex®-M3	DDR, PCIe, SERDES	256 kB	CANbus, Ethernet, I²C, SPI, UART/USART, USB	MCU, FPGA	207	-	1.51 mm	FIELD PROGRAMMABLE GATE ARRAY	-	-	-	FPGA - 25K Logic Modules	-	27696	1 Core	-	256KB	17 mm	17 mm
M2S025TS-1VF400 Microchip Technology RoHS : Инкапсуляция : - Есть складские запасы : - 1 : -
	Mfr. Тип M2S010T-1VF256 Anlielectronics Тип	Microchip Technology	SoC FPGA M2S010T-1VF256 Сборник данных Сравнение	Min.:1 Mult.:1	-	VFPBGA-256	YES	256-FPBGA (14x14)	256	M2S010	-	ARM Cortex M3	64 kB	-	-	-	119	MICROSEMI CORP	-	-	M2S010T-1VF256	166 MHz	-	-	Microchip Technology	-	-	Yes	-	SMD/SMT	138	1007 LAB	12084 LE	85 °C	-	Tray	PLASTIC/EPOXY	LFBGA	VFBGA-256	BGA256,16X16,32	SQUARE	GRID ARRAY, LOW PROFILE, FINE PITCH	Active	Active	30	5.81	N	No	This product may require additional documentation to export from the United States.	1.26 V	1.14 V	1.2 V	-	-	0°C ~ 85°C (TJ)	Tray	SmartFusion2	e0	-	-	Tin/Lead (Sn/Pb)	-	-	LG-MIN, WD-MIN	8542.39.00.01	CMOS	BOTTOM	BALL	240	0.8 mm	not_compliant	-	S-PBGA-B256	138	Not Qualified	-	1.2 V	OTHER	-	-	166MHz	64KB	ARM® Cortex®-M3	DDR, PCIe, SERDES	256 kB	CANbus, Ethernet, I²C, SPI, UART/USART, USB	MCU, FPGA	138	-	1.56 mm	FIELD PROGRAMMABLE GATE ARRAY	-	-	-	FPGA - 10K Logic Modules	-	12084	1 Core	-	256KB	14 mm	14 mm
M2S010T-1VF256 Microchip Technology RoHS : Инкапсуляция : - Есть складские запасы : - 1 : -
	Mfr. Тип M2S060TS-1FCS325I Anlielectronics Тип	Microchip Technology	SoC FPGA M2S060TS-1FCS325I Сборник данных Сравнение	Min.:1 Mult.:1	Production (Last Updated: 2 months ago)	325-TFBGA, FCBGA	YES	325-FCBGA (11x11)	325	M2S060	-	ARM Cortex M3	64 kB	-	-	-	176	MICROSEMI CORP	-	-	M2S060TS-1FCS325I	166 MHz	-	-	Microchip Technology	-	-	Yes	-	-	200	4710 LAB	56520 LE	-	-	Tray	PLASTIC/EPOXY	TFBGA	FBGA-325	-	SQUARE	GRID ARRAY, THIN PROFILE, FINE PITCH	Active	Active	30	5.88	N	No	This product may require additional documentation to export from the United States.	1.26 V	1.14 V	1.2 V	SmartFusion2	-	-40°C ~ 100°C (TJ)	Tray	SmartFusion2	e0	No	-	Tin/Lead (Sn/Pb)	-	-	LG-MIN, WD-MIN	8542.39.00.01	-	BOTTOM	BALL	240	0.5 mm	not_compliant	-	S-PBGA-B325	-	-	-	-	-	-	-	166MHz	64KB	ARM® Cortex®-M3	DDR, PCIe, SERDES	256 kB	CANbus, Ethernet, I²C, SPI, UART/USART, USB	MCU, FPGA	-	-	1.01 mm	FIELD PROGRAMMABLE GATE ARRAY	-	-	-	FPGA - 60K Logic Modules	-	-	1 Core	-	256KB	11 mm	11 mm
M2S060TS-1FCS325I Microchip Technology RoHS : Инкапсуляция : - Есть складские запасы : - 1 : -
	Mfr. Тип M2S090T-FG676 Anlielectronics Тип	Microchip Technology	SoC FPGA M2S090T-FG676 Сборник данных Сравнение	Min.:1 Mult.:1	-	676-BGA	YES	676-FBGA (27x27)	676	M2S090	-	ARM Cortex M3	64 kB	-	-	-	40	MICROSEMI CORP	-	-	M2S090T-FG676	166 MHz	-	-	Microchip Technology	-	-	Yes	3	-	425	7193 LAB	86316 LE	85 °C	-	Tray	PLASTIC/EPOXY	BGA	BGA, BGA676,26X26,40	BGA676,26X26,40	SQUARE	GRID ARRAY	Active	Active	30	5.83	N	No	This product may require additional documentation to export from the United States.	1.26 V	1.14 V	1.2 V	-	-	0°C ~ 85°C (TJ)	Tray	SmartFusion2	e0	-	-	Tin/Lead (Sn/Pb)	-	-	-	8542.39.00.01	CMOS	BOTTOM	BALL	240	1 mm	not_compliant	-	S-PBGA-B676	425	Not Qualified	-	1.2 V	OTHER	-	-	166MHz	64KB	ARM® Cortex®-M3	DDR, PCIe, SERDES	512 kB	CANbus, Ethernet, I²C, SPI, UART/USART, USB	MCU, FPGA	425	-	2.44 mm	FIELD PROGRAMMABLE GATE ARRAY	-	-	-	FPGA - 90K Logic Modules	-	86316	1 Core	-	512KB	27 mm	27 mm
M2S090T-FG676 Microchip Technology RoHS : Инкапсуляция : - Есть складские запасы : - 1 : -
	Mfr. Тип M2S010S-TQG144 Anlielectronics Тип	Microchip Technology	SoC FPGA M2S010S-TQG144 Сборник данных Сравнение	Min.:1 Mult.:1	-	TQFP-144	-	144-TQFP (20x20)	-	M2S010	-	ARM Cortex M3	64 kB	-	-	400 kbit	60	-	-	-	-	166 MHz	-	+ 85 C	Microchip Technology	-	0 C	-	-	SMD/SMT	84 I/O	1007 LAB	12084 LE	-	-	Tray	-	-	-	-	-	-	-	Active	-	-	Details	-	This product may require additional documentation to export from the United States.	-	-	-	-	1.2000 V	0 to 85 °C	Tray	SmartFusion2	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	1.2 V	-	-	-	-	166MHz	64KB	ARM® Cortex®-M3	-	256 kB	CANbus, Ethernet, I²C, SPI, UART/USART, USB	MCU, FPGA	-	-	-	-	-	-	STD	FPGA - 10K Logic Modules	-	-	1 Core	-	256KB	-	-
M2S010S-TQG144 Microchip Technology RoHS : Инкапсуляция : - Есть складские запасы : - 1 : -
	Mfr. Тип M2S060T-1FGG484M Anlielectronics Тип	Microchip Technology	SoC FPGA M2S060T-1FGG484M Сборник данных Сравнение	Min.:1 Mult.:1	-	BGA-484	YES	484-FPBGA (23x23)	484	M2S060	-	ARM Cortex M3	64 kB	-	-	1314 kbit	60	MICROSEMI CORP	-	-	M2S060T-1FGG484M	166 MHz	-	+ 125 C	Microchip Technology	-	- 55 C	-	3	SMD/SMT	267 I/O	4710 LAB	56520 LE	125 °C	-55 °C	Tray	PLASTIC/EPOXY	BGA	FBGA-484	-	SQUARE	GRID ARRAY	Active	Active	40	5.8	Details	Yes	This product may require additional documentation to export from the United States.	1.26 V	1.14 V	1.2 V	SmartFusion2	-	-55°C ~ 125°C (TJ)	Tray	SmartFusion2	e1	Yes	3A001.A.2.C	Tin/Silver/Copper (Sn/Ag/Cu)	-	-	-	8542.39.00.01	-	BOTTOM	BALL	250	1 mm	compliant	-	S-PBGA-B484	-	-	1.2 V	-	MILITARY	-	-	166MHz	64KB	ARM® Cortex®-M3	DDR, PCIe, SERDES	256 kB	CANbus, Ethernet, I²C, SPI, UART/USART, USB	MCU, FPGA	-	-	2.44 mm	FIELD PROGRAMMABLE GATE ARRAY	-	-	-	FPGA - 60K Logic Modules	-	-	1 Core	-	256KB	23 mm	23 mm
M2S060T-1FGG484M Microchip Technology RoHS : Инкапсуляция : - Есть складские запасы : - 1 : -
	Mfr. Тип M2S060TS-1FGG484M Anlielectronics Тип	Microchip Technology	SoC FPGA M2S060TS-1FGG484M Сборник данных Сравнение	Min.:1 Mult.:1	-	BGA-484	YES	484-FPBGA (23x23)	484	M2S060	-	ARM Cortex M3	64 kB	-	-	1314 kbit	60	MICROSEMI CORP	-	-	M2S060TS-1FGG484M	166 MHz	-	+ 125 C	Microchip Technology	-	- 55 C	-	3	SMD/SMT	267 I/O	4710 LAB	56520 LE	125 °C	-55 °C	Tray	PLASTIC/EPOXY	BGA	FBGA-484	-	SQUARE	GRID ARRAY	Active	Active	40	5.81	Details	Yes	This product may require additional documentation to export from the United States.	1.26 V	1.14 V	1.2 V	SmartFusion2	-	-55°C ~ 125°C (TJ)	Tray	SmartFusion2	e1	Yes	3A001.A.2.C	Tin/Silver/Copper (Sn/Ag/Cu)	-	-	-	8542.39.00.01	-	BOTTOM	BALL	250	1 mm	compliant	-	S-PBGA-B484	-	-	1.2 V	-	MILITARY	-	-	166MHz	64KB	ARM® Cortex®-M3	DDR, PCIe, SERDES	256 kB	CANbus, Ethernet, I²C, SPI, UART/USART, USB	MCU, FPGA	-	-	2.44 mm	FIELD PROGRAMMABLE GATE ARRAY	-	-	-	FPGA - 60K Logic Modules	-	-	1 Core	-	256KB	23 mm	23 mm
M2S060TS-1FGG484M Microchip Technology RoHS : Инкапсуляция : - Есть складские запасы : - 1 : -
	Mfr. Тип M2S010TS-1FG484M Anlielectronics Тип	Microchip Technology	SoC FPGA M2S010TS-1FG484M Сборник данных Сравнение	Min.:1 Mult.:1	Production (Last Updated: 1 month ago)	FPBGA-484	YES	484-FPBGA (23x23)	484	M2S010	-	ARM Cortex M3	64 kB	-	-	-	60	MICROSEMI CORP	-	-	M2S010TS-1FG484M	166 MHz	-	-	Microchip Technology	-	-	Yes	3	SMD/SMT	233	1007 LAB	12084 LE	125 °C	-55 °C	Tray	PLASTIC/EPOXY	BGA	FBGA-484	BGA484,22X22,40	SQUARE	GRID ARRAY	Active	Active	30	5.86	N	No	This product may require additional documentation to export from the United States.	1.26 V	1.14 V	1.2 V	-	-	-55°C ~ 125°C (TJ)	Tray	SmartFusion2	e0	-	3A001.A.2.C	Tin/Lead (Sn/Pb)	-	-	-	8542.39.00.01	CMOS	BOTTOM	BALL	240	1 mm	not_compliant	-	S-PBGA-B484	233	Not Qualified	-	1.2 V	MILITARY	-	-	166MHz	64KB	ARM® Cortex®-M3	DDR, PCIe, SERDES	256 kB	CANbus, Ethernet, I²C, SPI, UART/USART, USB	MCU, FPGA	233	-	2.44 mm	FIELD PROGRAMMABLE GATE ARRAY	-	-	-	FPGA - 10K Logic Modules	-	12084	1 Core	-	256KB	23 mm	23 mm
M2S010TS-1FG484M Microchip Technology RoHS : Инкапсуляция : - Есть складские запасы : - 1 : -
	Mfr. Тип M2S150T-1FCS536 Anlielectronics Тип	Microchip Technology	SoC FPGA M2S150T-1FCS536 Сборник данных Сравнение	Min.:1 Mult.:1	-	536-LFBGA, CSPBGA	YES	536-CSPBGA (16x16)	536	M2S150	-	ARM Cortex M3	64 kB	-	-	-	90	MICROSEMI CORP	-	-	M2S150T-1FCS536	166 MHz	-	-	Microchip Technology	-	-	Yes	-	-	293	12177 LAB	146124 LE	85 °C	-	Tray	PLASTIC/EPOXY	BGA	BGA, BGA536,30X30,20	BGA536,30X30,20	SQUARE	GRID ARRAY	Active	Active	30	5.81	N	No	This product may require additional documentation to export from the United States.	1.26 V	1.14 V	1.2 V	-	-	0°C ~ 85°C (TJ)	Tray	SmartFusion2	e0	-	-	Tin/Lead (Sn/Pb)	-	-	-	8542.39.00.01	CMOS	BOTTOM	BALL	240	-	not_compliant	-	S-PBGA-B536	293	Not Qualified	-	1.2 V	OTHER	-	-	166MHz	64KB	ARM® Cortex®-M3	DDR, PCIe, SERDES	512 kB	CANbus, Ethernet, I²C, SPI, UART/USART, USB	MCU, FPGA	293	-	-	FIELD PROGRAMMABLE GATE ARRAY	-	-	-	FPGA - 150K Logic Modules	-	146124	1 Core	-	512KB	-	-
M2S150T-1FCS536 Microchip Technology RoHS : Инкапсуляция : - Есть складские запасы : - 1 : -

Integrated Circuits (ICs)

Embedded - System On Chip (SoC) definition: A System On Chip (SoC) combines the required electronic circuits of various computer components onto a single, integrated chip (IC). SoC is ... Embedded - System On Chip (SoC) Product Listing: A2F200M3F-FG484,A2F500M3G-1FG484,A2F500M3G-1FGG484I,A2F200M3F-1FGG484I,A2F500M3G-FG484I.Integrated Circuits (ICs) type:Embedded - Microcontrollers(129432),Memory(111901),PMIC - Supervisors(101743),PMIC - Voltage Regulators - Linear(101187),PMIC - Voltage Regulators - DC DC Switching Regulators(62822) .Embedded - System On Chip (SoC) has 873 pieces of spot stock price information, you can click the "RFQ" button to confirm the inventory and price with the Anli.

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Integrated Circuits (ICs)