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Изображение	Тип	Марка	Объяснение	Установленная цена	Количество	RoHS	Lifecycle Status	Package / Case	Surface Mount	Supplier Device Package	Number of Terminals	Base Product Number	Core	Data RAM Size	Distributed RAM	Embedded Block RAM - EBR	Factory Pack QuantityFactory Pack Quantity	I/O Voltage	Ihs Manufacturer	Instruction Set Architecture	Interface Type	JTAG Support	L1 Cache Data Memory	L1 Cache Instruction Memory	Manufacturer Part Number	Maximum Clock Frequency	Maximum Operating Supply Voltage	Maximum Operating Temperature	Memory Types	Mfr	Minimum Operating Supply Voltage	Minimum Operating Temperature	Moisture Sensitive	Moisture Sensitivity Levels	Mounting	Mounting Styles	MSL	Number of CPU Cores	Number of I/Os	Number of Logic Array Blocks - LABs	Number of Logic Elements	Operating Temperature-Max	Package	Package Body Material	Package Code	Package Description	Package Equivalence Code	Package Shape	Package Style	Part Life Cycle Code	Product Status	Reflow Temperature-Max (s)	Risk Rank	RoHS	Rohs Code	Shipping Restrictions	Supplier Package	Supply Voltage-Max	Supply Voltage-Min	Supply Voltage-Nom	Tradename	Typical Operating Supply Voltage	Unit Weight	Usage Level	Operating Temperature	Packaging	Series	JESD-609 Code	Terminal Finish	Max Operating Temperature	Min Operating Temperature	Additional Feature	HTS Code	Technology	Terminal Position	Terminal Form	Peak Reflow Temperature (Cel)	Terminal Pitch	Reach Compliance Code	Frequency	Pin Count	JESD-30 Code	Number of Outputs	Qualification Status	Operating Supply Voltage	Power Supplies	Temperature Grade	Interface	Max Supply Voltage	Min Supply Voltage	Memory Size	Speed	RAM Size	Core Processor	Peripherals	Program Memory Size	Connectivity	Architecture	Data Bus Width	Number of Inputs	Seated Height-Max	Programmable Logic Type	Number of Logic Elements/Cells	Total RAM Bits	Screening Level	Speed Grade	Primary Attributes	Max Junction Temperature (Tj)	Number of Logic Cells	Number of Cores	Flash Size	Device Core	Height	Length	Width

Изображение	Тип	Марка	Объяснение	Количество	Lifecycle Status	Package / Case	Surface Mount	Supplier Device Package	Number of Terminals	Base Product Number	Core	Data RAM Size	Distributed RAM	Embedded Block RAM - EBR	Factory Pack QuantityFactory Pack Quantity	I/O Voltage	Ihs Manufacturer	Instruction Set Architecture	Interface Type	JTAG Support	L1 Cache Data Memory	L1 Cache Instruction Memory	Manufacturer Part Number	Maximum Clock Frequency	Maximum Operating Supply Voltage	Maximum Operating Temperature	Memory Types	Mfr	Minimum Operating Supply Voltage	Minimum Operating Temperature	Moisture Sensitive	Moisture Sensitivity Levels	Mounting	Mounting Styles	MSL	Number of CPU Cores	Number of I/Os	Number of Logic Array Blocks - LABs	Number of Logic Elements	Operating Temperature-Max	Package	Package Body Material	Package Code	Package Description	Package Equivalence Code	Package Shape	Package Style	Part Life Cycle Code	Product Status	Reflow Temperature-Max (s)	Risk Rank	RoHS	Rohs Code	Shipping Restrictions	Supplier Package	Supply Voltage-Max	Supply Voltage-Min	Supply Voltage-Nom	Tradename	Typical Operating Supply Voltage	Unit Weight	Usage Level	Operating Temperature	Packaging	Series	JESD-609 Code	Terminal Finish	Max Operating Temperature	Min Operating Temperature	Additional Feature	HTS Code	Technology	Terminal Position	Terminal Form	Peak Reflow Temperature (Cel)	Terminal Pitch	Reach Compliance Code	Frequency	Pin Count	JESD-30 Code	Number of Outputs	Qualification Status	Operating Supply Voltage	Power Supplies	Temperature Grade	Interface	Max Supply Voltage	Min Supply Voltage	Memory Size	Speed	RAM Size	Core Processor	Peripherals	Program Memory Size	Connectivity	Architecture	Data Bus Width	Number of Inputs	Seated Height-Max	Programmable Logic Type	Number of Logic Elements/Cells	Total RAM Bits	Screening Level	Speed Grade	Primary Attributes	Max Junction Temperature (Tj)	Number of Logic Cells	Number of Cores	Flash Size	Device Core	Height	Length	Width
	Mfr. Тип M2S060T-FG484 Anlielectronics Тип	Microchip Technology	SoC FPGA M2S060T-FG484 Сборник данных Сравнение	Min.:1 Mult.:1	Production (Last Updated: 2 months ago)	484-BGA	YES	484-FPBGA (23x23)	484	M2S060	ARM Cortex M3	64 kB	-	-	60	-	MICROSEMI CORP	-	-	-	-	-	M2S060T-FG484	166 MHz	-	-	-	Microchip Technology	-	-	Yes	3	-	-	-	-	267	4710 LAB	56520 LE	85 °C	Tray	PLASTIC/EPOXY	BGA	FBGA-484	BGA484,22X22,40	SQUARE	GRID ARRAY	Active	Active	30	5.88	N	No	This product may require additional documentation to export from the United States.	-	1.26 V	1.14 V	1.2 V	SmartFusion2	-	-	-	0°C ~ 85°C (TJ)	Tray	SmartFusion2	e0	Tin/Lead (Sn/Pb)	-	-	-	8542.39.00.01	CMOS	BOTTOM	BALL	240	1 mm	not_compliant	-	-	S-PBGA-B484	267	Not Qualified	-	1.2 V	OTHER	-	-	-	-	166MHz	64KB	ARM® Cortex®-M3	DDR, PCIe, SERDES	256 kB	CANbus, Ethernet, I²C, SPI, UART/USART, USB	MCU, FPGA	-	267	2.44 mm	FIELD PROGRAMMABLE GATE ARRAY	-	-	-	-	FPGA - 60K Logic Modules	-	56520	1 Core	256KB	-	-	23 mm	23 mm
M2S060T-FG484 Microchip Technology RoHS : Инкапсуляция : - Есть складские запасы : - 1 : -
	Mfr. Тип M2S010T-FGG484I Anlielectronics Тип	Microchip Technology	SoC FPGA M2S010T-FGG484I Сборник данных Сравнение	Min.:1 Mult.:1	-	FPBGA-484	YES	484-FPBGA (23x23)	484	M2S010	ARM Cortex M3	64 kB	-	-	60	-	MICROSEMI CORP	-	-	-	-	-	M2S010T-FGG484I	166 MHz	1.26 V	-	-	Microchip Technology	1.14 V	-	Yes	3	-	SMD/SMT	-	-	233	1007 LAB	12084 LE	-	Tray	PLASTIC/EPOXY	BGA	FBGA-484	BGA484,22X22,40	SQUARE	GRID ARRAY	Active	Active	40	2.32	Details	Yes	This product may require additional documentation to export from the United States.	-	1.26 V	1.14 V	1.2 V	-	1.2000 V	-	-	-40 to 100 °C	Tray	SmartFusion2	e1	Tin/Silver/Copper (Sn/Ag/Cu)	-	-	-	8542.39.00.01	CMOS	BOTTOM	BALL	250	1 mm	compliant	-	-	S-PBGA-B484	233	Not Qualified	-	1.2 V	-	-	-	-	-	166MHz	64KB	ARM® Cortex®-M3	DDR, PCIe, SERDES	256 kB	CANbus, Ethernet, I²C, SPI, UART/USART, USB	MCU, FPGA	-	233	2.44 mm	FIELD PROGRAMMABLE GATE ARRAY	-	-	-	STD	FPGA - 10K Logic Modules	-	12084	1 Core	256KB	-	-	23 mm	23 mm
M2S010T-FGG484I Microchip Technology RoHS : Инкапсуляция : - Есть складские запасы : - 1 : -
	Mfr. Тип M2S005S-1VFG400 Anlielectronics Тип	Microchip Technology	SoC FPGA M2S005S-1VFG400 Сборник данных Сравнение	Min.:1 Mult.:1	-	VFPBGA-400	YES	400-VFBGA (17x17)	400	M2S005	ARM Cortex M3	64 kB	-	-	90	-	MICROSEMI CORP	-	-	-	-	-	M2S005S-1VFG400	166 MHz	-	-	-	Microchip Technology	-	-	Yes	3	-	SMD/SMT	-	-	171	505 LAB	6060 LE	85 °C	Tray	PLASTIC/EPOXY	LFBGA	LFBGA, BGA400,20X20,32	BGA400,20X20,32	SQUARE	GRID ARRAY, LOW PROFILE, FINE PITCH	Active	Active	40	5.81	Details	Yes	This product may require additional documentation to export from the United States.	-	1.26 V	1.14 V	1.2 V	-	-	-	-	0°C ~ 85°C (TJ)	Tray	SmartFusion2	e1	Tin/Silver/Copper (Sn/Ag/Cu)	-	-	-	8542.39.00.01	CMOS	BOTTOM	BALL	250	0.8 mm	compliant	-	-	S-PBGA-B400	171	Not Qualified	-	1.2 V	OTHER	-	-	-	-	166MHz	64KB	ARM® Cortex®-M3	DDR	128 kB	CANbus, Ethernet, I²C, SPI, UART/USART, USB	MCU, FPGA	-	171	1.51 mm	FIELD PROGRAMMABLE GATE ARRAY	-	-	-	-	FPGA - 5K Logic Modules	-	6060	1 Core	128KB	-	-	17 mm	17 mm
M2S005S-1VFG400 Microchip Technology RoHS : Инкапсуляция : - Есть складские запасы : - 1 : -
	Mfr. Тип M2S010T-VF256 Anlielectronics Тип	Microchip Technology	SoC FPGA M2S010T-VF256 Сборник данных Сравнение	Min.:1 Mult.:1	Production (Last Updated: 1 month ago)	256-LFBGA	-	256-FPBGA (14x14)	-	M2S010	ARM Cortex M3	64 kB	-	-	119	-	-	-	-	-	-	-	-	166 MHz	-	-	-	Microchip Technology	-	-	Yes	-	-	-	-	-	138	1007 LAB	12084 LE	-	Tray	-	-	-	-	-	-	-	Active	-	-	N	-	This product may require additional documentation to export from the United States.	-	-	-	-	-	-	-	-	0°C ~ 85°C (TJ)	Tray	SmartFusion2	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	166MHz	64KB	ARM® Cortex®-M3	DDR, PCIe, SERDES	256 kB	CANbus, Ethernet, I²C, SPI, UART/USART, USB	MCU, FPGA	-	-	-	-	-	-	-	-	FPGA - 10K Logic Modules	-	-	1 Core	256KB	-	-	-	-
M2S010T-VF256 Microchip Technology RoHS : Инкапсуляция : - Есть складские запасы : - 1 : -
	Mfr. Тип M2S050TS-FGG484 Anlielectronics Тип	Microchip Technology	SoC FPGA M2S050TS-FGG484 Сборник данных Сравнение	Min.:1 Mult.:1	Production (Last Updated: 2 months ago)	484-BGA	-	484-FPBGA (23x23)	-	M2S050	ARM Cortex M3	64 kB	-	-	60	-	-	-	-	-	-	-	-	166 MHz	-	-	-	Microchip Technology	-	-	Yes	-	-	-	-	-	267	4695 LAB	56340 LE	-	Tray	-	-	-	-	-	-	-	Active	-	-	Details	-	This product may require additional documentation to export from the United States.	-	-	-	-	-	-	-	-	0°C ~ 85°C (TJ)	Tray	SmartFusion2	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	166MHz	64KB	ARM® Cortex®-M3	DDR, PCIe, SERDES	256 kB	CANbus, Ethernet, I²C, SPI, UART/USART, USB	MCU, FPGA	-	-	-	-	-	-	-	-	FPGA - 50K Logic Modules	-	-	1 Core	256KB	-	-	-	-
M2S050TS-FGG484 Microchip Technology RoHS : Инкапсуляция : - Есть складские запасы : - 1 : -
	Mfr. Тип M2S005S-FG484 Anlielectronics Тип	Microchip Technology	SoC FPGA M2S005S-FG484 Сборник данных Сравнение	Min.:1 Mult.:1	-	484-BGA	-	484-FPBGA (23x23)	-	M2S005	ARM Cortex M3	64 kB	-	-	60	-	-	-	-	-	-	-	-	166 MHz	-	-	-	Microchip Technology	-	-	Yes	-	-	-	-	-	209	505 LAB	6060 LE	-	Tray	-	-	-	-	-	-	-	Active	-	-	N	-	This product may require additional documentation to export from the United States.	-	-	-	-	-	-	-	-	0°C ~ 85°C (TJ)	Tray	SmartFusion2	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	166MHz	64KB	ARM® Cortex®-M3	DDR	128 kB	CANbus, Ethernet, I²C, SPI, UART/USART, USB	MCU, FPGA	-	-	-	-	-	-	-	-	FPGA - 5K Logic Modules	-	-	1 Core	128KB	-	-	-	-
M2S005S-FG484 Microchip Technology RoHS : Инкапсуляция : - Есть складские запасы : - 1 : -
	Mfr. Тип M2S005S-1FGG484I Anlielectronics Тип	Microchip Technology	SoC FPGA M2S005S-1FGG484I Сборник данных Сравнение	Min.:1 Mult.:1	-	FPBGA-484	-	484-FPBGA (23x23)	-	M2S005	ARM Cortex M3	64 kB	-	-	60	-	-	-	-	-	-	-	-	166 MHz	-	-	-	Microchip Technology	-	-	Yes	-	-	SMD/SMT	-	-	209	505 LAB	6060 LE	-	Tray	-	-	-	-	-	-	-	Active	-	-	Details	-	This product may require additional documentation to export from the United States.	-	-	-	-	-	-	-	-	-40°C ~ 100°C (TJ)	Tray	SmartFusion2	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	166MHz	64KB	ARM® Cortex®-M3	DDR	128 kB	CANbus, Ethernet, I²C, SPI, UART/USART, USB	MCU, FPGA	-	-	-	-	-	-	-	-	FPGA - 5K Logic Modules	-	-	1 Core	128KB	-	-	-	-
M2S005S-1FGG484I Microchip Technology RoHS : Инкапсуляция : - Есть складские запасы : - 1 : -
	Mfr. Тип M2S050-FGG896I Anlielectronics Тип	Microchip Technology	SoC FPGA M2S050-FGG896I Сборник данных Сравнение	Min.:1 Mult.:1	Production (Last Updated: 2 months ago)	FPBGA-896	YES	896-FBGA (31x31)	896	M2S050	ARM Cortex M3	64 kB	-	-	27	-	MICROSEMI CORP	-	-	-	-	-	M2S050-FGG896I	166 MHz	-	-	-	Microchip Technology	-	-	Yes	-	-	SMD/SMT	-	-	377	4695 LAB	56340 LE	-	Tray	PLASTIC/EPOXY	BGA	FBGA-896	BGA896,30X30,40	SQUARE	GRID ARRAY	Active	Active	40	5.26	Details	Yes	This product may require additional documentation to export from the United States.	-	1.26 V	1.14 V	1.2 V	-	1.2000 V	-	-	-40 to 100 °C	Tray	SmartFusion2	e1	Tin/Silver/Copper (Sn/Ag/Cu)	-	-	-	8542.39.00.01	CMOS	BOTTOM	BALL	250	1 mm	compliant	-	-	S-PBGA-B896	377	Not Qualified	-	1.2 V	-	-	-	-	-	166MHz	64KB	ARM® Cortex®-M3	DDR, PCIe, SERDES	256 kB	CANbus, Ethernet, I²C, SPI, UART/USART, USB	MCU, FPGA	-	377	2.44 mm	FIELD PROGRAMMABLE GATE ARRAY	-	-	-	STD	FPGA - 50K Logic Modules	-	56340	1 Core	256KB	-	-	31 mm	31 mm
M2S050-FGG896I Microchip Technology RoHS : Инкапсуляция : - Есть складские запасы : - 1 : -
	Mfr. Тип M2S005S-VF256 Anlielectronics Тип	Microchip Technology	SoC FPGA M2S005S-VF256 Сборник данных Сравнение	Min.:1 Mult.:1	-	256-LFBGA	-	256-FPBGA (14x14)	-	M2S005	ARM Cortex M3	64 kB	-	-	119	-	-	-	-	-	-	-	-	166 MHz	-	-	-	Microchip Technology	-	-	Yes	-	-	-	-	-	161	505 LAB	6060 LE	-	Tray	-	-	-	-	-	-	-	Active	-	-	N	-	This product may require additional documentation to export from the United States.	-	-	-	-	-	-	-	-	0°C ~ 85°C (TJ)	Tray	SmartFusion2	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	166MHz	64KB	ARM® Cortex®-M3	-	128 kB	CANbus, Ethernet, I²C, SPI, UART/USART, USB	MCU, FPGA	-	-	-	-	-	-	-	-	FPGA - 5K Logic Modules	-	-	1 Core	128KB	-	-	-	-
M2S005S-VF256 Microchip Technology RoHS : Инкапсуляция : - Есть складские запасы : - 1 : -
	Mfr. Тип M2S090-1FCSG325 Anlielectronics Тип	Microchip Technology	SoC FPGA M2S090-1FCSG325 Сборник данных Сравнение	Min.:1 Mult.:1	-	FCBGA-325	YES	325-FCBGA (11x13.5)	325	M2S090	ARM Cortex M3	64 kB	-	-	176	-	MICROSEMI CORP	-	-	-	-	-	M2S090-1FCSG325	166 MHz	-	-	-	Microchip Technology	-	-	Yes	3	-	SMD/SMT	-	-	180	7193 LAB	86316 LE	85 °C	Tray	PLASTIC/EPOXY	TFBGA	FBGA-325	BGA325,21X21,20	RECTANGULAR	GRID ARRAY, THIN PROFILE, FINE PITCH	Active	Active	40	5.78	Details	Yes	This product may require additional documentation to export from the United States.	-	1.26 V	1.14 V	1.2 V	-	-	-	-	0°C ~ 85°C (TJ)	Tray	SmartFusion2	e1	Tin/Silver/Copper (Sn/Ag/Cu)	-	-	LG-MIN, WD-MIN	8542.39.00.01	CMOS	BOTTOM	BALL	250	0.5 mm	compliant	-	-	R-PBGA-B325	180	Not Qualified	-	1.2 V	OTHER	-	-	-	-	166MHz	64KB	ARM® Cortex®-M3	DDR, PCIe, SERDES	512 kB	CANbus, Ethernet, I²C, SPI, UART/USART, USB	MCU, FPGA	-	180	1.16 mm	FIELD PROGRAMMABLE GATE ARRAY	-	-	-	-	FPGA - 90K Logic Modules	-	86316	1 Core	512KB	-	-	13.5 mm	11 mm
M2S090-1FCSG325 Microchip Technology RoHS : Инкапсуляция : - Есть складские запасы : - 1 : -
	Mfr. Тип M2S050TS-1FG896I Anlielectronics Тип	Microchip Technology	SoC FPGA M2S050TS-1FG896I Сборник данных Сравнение	Min.:1 Mult.:1	-	FPBGA-896	YES	896-FBGA (31x31)	896	M2S050	ARM Cortex M3	64 kB	-	-	27	-	MICROSEMI CORP	-	-	-	-	-	M2S050TS-1FG896I	166 MHz	-	-	-	Microchip Technology	-	-	Yes	3	-	SMD/SMT	-	-	377	4695 LAB	56340 LE	-	Tray	PLASTIC/EPOXY	BGA	FBGA-896	-	SQUARE	GRID ARRAY	Active	Active	30	5.84	N	No	This product may require additional documentation to export from the United States.	-	1.26 V	1.14 V	1.2 V	-	1.2000 V	-	-	-40 to 100 °C	Tray	SmartFusion2	e0	Tin/Lead (Sn/Pb)	-	-	-	8542.39.00.01	-	BOTTOM	BALL	240	1 mm	not_compliant	-	896	S-PBGA-B896	-	-	-	-	-	-	-	-	-	166MHz	64KB	ARM® Cortex®-M3	DDR, PCIe, SERDES	256 kB	CANbus, Ethernet, I²C, SPI, UART/USART, USB	MCU, FPGA	-	-	2.44 mm	FIELD PROGRAMMABLE GATE ARRAY	-	-	-	1	FPGA - 50K Logic Modules	-	-	1 Core	256KB	-	-	31 mm	31 mm
M2S050TS-1FG896I Microchip Technology RoHS : Инкапсуляция : - Есть складские запасы : - 1 : -
	Mfr. Тип M2S090-FCS325I Anlielectronics Тип	Microchip Technology	SoC FPGA M2S090-FCS325I Сборник данных Сравнение	Min.:1 Mult.:1	Production (Last Updated: 2 months ago)	FCBGA-325	YES	325-FCBGA (11x13.5)	325	M2S090	ARM Cortex M3	64 kB	-	-	176	-	MICROSEMI CORP	-	-	-	-	-	M2S090-FCS325I	166 MHz	1.26 V	-	-	Microchip Technology	1.14 V	-	Yes	-	-	SMD/SMT	-	-	180	7193 LAB	86316 LE	-	Tray	PLASTIC/EPOXY	TFBGA	TFBGA, BGA325,21X21,20	BGA325,21X21,20	RECTANGULAR	GRID ARRAY, THIN PROFILE, FINE PITCH	Active	Active	30	5.83	N	No	This product may require additional documentation to export from the United States.	-	1.26 V	1.14 V	1.2 V	-	-	-	-	-40°C ~ 100°C (TJ)	Tray	SmartFusion2	e0	Tin/Lead (Sn/Pb)	-	-	LG-MIN, WD-MIN	8542.39.00.01	CMOS	BOTTOM	BALL	240	0.5 mm	not_compliant	-	-	R-PBGA-B325	180	Not Qualified	-	1.2 V	-	-	-	-	-	166MHz	64KB	ARM® Cortex®-M3	DDR, PCIe, SERDES	512 kB	CANbus, Ethernet, I²C, SPI, UART/USART, USB	MCU, FPGA	-	180	1.16 mm	FIELD PROGRAMMABLE GATE ARRAY	-	-	-	-	FPGA - 90K Logic Modules	-	86316	1 Core	512KB	-	-	13.5 mm	11 mm
M2S090-FCS325I Microchip Technology RoHS : Инкапсуляция : - Есть складские запасы : - 1 : -
	Mfr. Тип M2S050TS-FCS325I Anlielectronics Тип	Microchip Technology	SoC FPGA M2S050TS-FCS325I Сборник данных Сравнение	Min.:1 Mult.:1	Production (Last Updated: 2 months ago)	FCBGA-325	YES	325-FCBGA (11x11)	325	M2S050	ARM Cortex M3	64 kB	-	-	176	-	MICROSEMI CORP	-	-	-	-	-	M2S050TS-FCS325I	166 MHz	-	-	FLASH	Microchip Technology	-	-	Yes	-	-	SMD/SMT	-	-	200	4695 LAB	56340 LE	-	Tray	PLASTIC/EPOXY	TFBGA	FBGA-325	BGA325,21X21,20	SQUARE	GRID ARRAY, THIN PROFILE, FINE PITCH	Active	Active	30	5.88	N	No	This product may require additional documentation to export from the United States.	-	1.26 V	1.14 V	1.2 V	-	-	-	-	-40°C ~ 100°C (TJ)	Tray	SmartFusion2	e0	Tin/Lead (Sn/Pb)	100 °C	-40 °C	LG-MIN, WD-MIN	8542.39.00.01	CMOS	BOTTOM	BALL	240	0.5 mm	not_compliant	166 MHz	-	S-PBGA-B325	200	Not Qualified	-	1.2 V	-	-	3.45 V	1.14 V	256 kB	166MHz	64 kB	ARM® Cortex®-M3	DDR, PCIe, SERDES	256 kB	CANbus, Ethernet, I²C, SPI, UART/USART, USB	MCU, FPGA	-	200	1.01 mm	FIELD PROGRAMMABLE GATE ARRAY	56340	-	-	-	FPGA - 50K Logic Modules	100 °C	56340	1 Core	256KB	-	1.01 mm	11 mm	11 mm
M2S050TS-FCS325I Microchip Technology RoHS : Инкапсуляция : - Есть складские запасы : - 1 : -
	Mfr. Тип M2S090-FG676I Anlielectronics Тип	Microchip Technology	SoC FPGA M2S090-FG676I Сборник данных Сравнение	Min.:1 Mult.:1	-	BGA-676	YES	676-FBGA (27x27)	676	M2S090	ARM Cortex M3	64 kB	-	-	40	-	MICROSEMI CORP	-	-	-	-	-	M2S090-FG676I	166 MHz	-	-	-	Microchip Technology	-	-	Yes	3	-	SMD/SMT	-	-	425	7193 LAB	86316 LE	-	Tray	PLASTIC/EPOXY	BGA	BGA, BGA676,26X26,40	BGA676,26X26,40	SQUARE	GRID ARRAY	Active	Active	30	5.83	N	No	This product may require additional documentation to export from the United States.	-	1.26 V	1.14 V	1.2 V	-	-	-	-	-40°C ~ 100°C (TJ)	Tray	SmartFusion2	e0	Tin/Lead (Sn/Pb)	-	-	-	8542.39.00.01	CMOS	BOTTOM	BALL	240	1 mm	not_compliant	-	-	S-PBGA-B676	425	Not Qualified	-	1.2 V	-	-	-	-	-	166MHz	64KB	ARM® Cortex®-M3	DDR, PCIe, SERDES	512 kB	CANbus, Ethernet, I²C, SPI, UART/USART, USB	MCU, FPGA	-	425	2.44 mm	FIELD PROGRAMMABLE GATE ARRAY	-	-	-	-	FPGA - 90K Logic Modules	-	86316	1 Core	512KB	-	-	27 mm	27 mm
M2S090-FG676I Microchip Technology RoHS : Инкапсуляция : - Есть складские запасы : - 1 : -
	Mfr. Тип M2S150-FCVG484I Anlielectronics Тип	Microchip Technology	SoC FPGA M2S150-FCVG484I Сборник данных Сравнение	Min.:1 Mult.:1	-	484-BFBGA	YES	484-FBGA (19x19)	484	M2S150	ARM Cortex M3	64 kB	-	-	84	1.2, 1.5, 1.8, 2.5, 3.3 V	MICROSEMI CORP	RISC	CAN/Ethernet/Serial I2C/SPI/UART/USB	Yes	-	-	M2S150-FCVG484I	166 MHz	-	+ 100 C	-	Microchip Technology	-	- 40 C	Yes	4	Surface Mount	SMD/SMT	-	1	273 I/O	12177 LAB	146124 LE	-	Tray	PLASTIC/EPOXY	FBGA	VFBGA-484	BGA484,22X22,32	SQUARE	GRID ARRAY, FINE PITCH	Active	Active	40	5.76	Details	Yes	-	VFBGA	1.26 V	1.14 V	1.2 V	-	-	-	Industrial grade	-40 to 100 °C	Tray	SmartFusion2	e1	Tin/Silver/Copper (Sn/Ag/Cu)	-	-	LG-MIN, WD-MIN	8542.39.00.01	CMOS	BOTTOM	BALL	250	0.8 mm	compliant	-	484	S-PBGA-B484	273	Not Qualified	1.2 V	1.2 V	-	CAN/Ethernet/Serial	-	-	-	166MHz	64 KB	ARM® Cortex®-M3	DDR, PCIe, SERDES	512 kB	CANbus, Ethernet, I²C, SPI, UART/USART, USB	MCU, FPGA	32 Bit	273	3.15 mm	FIELD PROGRAMMABLE GATE ARRAY	-	-	Industrial	-	FPGA - 150K Logic Modules	-	146124	1 Core	512KB	ARM Cortex-M3	-	19 mm	19 mm
M2S150-FCVG484I Microchip Technology RoHS : Инкапсуляция : - Есть складские запасы : - 1 : -
	Mfr. Тип M2S010-FGG484I Anlielectronics Тип	Microchip Technology	SoC FPGA M2S010-FGG484I Сборник данных Сравнение	Min.:1 Mult.:1	-	BGA-484	YES	484-FPBGA (23x23)	484	M2S010	ARM Cortex M3	64 kB	400 kbit	64 kB	60	-	MICROSEMI CORP	-	-	-	-	-	M2S010-FGG484I	166 MHz	1.26 V	+ 100 C	-	Microchip Technology	1.14 V	- 40 C	Yes	3	-	SMD/SMT	-	-	233 I/O	1007 LAB	12084 LE	-	Tray	PLASTIC/EPOXY	BGA	FBGA-484	BGA484,22X22,40	SQUARE	GRID ARRAY	Active	Active	40	5.76	Details	Yes	-	-	1.26 V	1.14 V	1.2 V	-	1.2000 V	0.404535 oz	-	-40 to 100 °C	Tray	SmartFusion2	e1	Tin/Silver/Copper (Sn/Ag/Cu)	-	-	-	8542.39.00.01	CMOS	BOTTOM	BALL	250	1 mm	compliant	-	-	S-PBGA-B484	233	Not Qualified	1.2 V	1.2 V	-	-	-	-	-	166MHz	64KB	ARM® Cortex®-M3	DDR, PCIe, SERDES	256 kB	CANbus, Ethernet, I²C, SPI, UART/USART, USB	MCU, FPGA	-	233	2.44 mm	FIELD PROGRAMMABLE GATE ARRAY	-	-	-	STD	FPGA - 10K Logic Modules	-	12084	1 Core	256KB	-	-	23 mm	23 mm
M2S010-FGG484I Microchip Technology RoHS : Инкапсуляция : - Есть складские запасы : - 1 : -
	Mfr. Тип M2S060-FG676 Anlielectronics Тип	Microchip Technology	SoC FPGA M2S060-FG676 Сборник данных Сравнение	Min.:1 Mult.:1	Production (Last Updated: 2 months ago)	676-BGA	-	676-FBGA (27x27)	-	M2S060	ARM Cortex M3	64 kB	-	-	40	-	-	-	-	-	-	-	-	166 MHz	-	-	-	Microchip Technology	-	-	Yes	-	-	-	-	-	387	4710 LAB	56520 LE	-	Tray	-	-	-	-	-	-	-	Active	-	-	N	-	This product may require additional documentation to export from the United States.	-	-	-	-	SmartFusion2	-	-	-	0°C ~ 85°C (TJ)	Tray	SmartFusion2	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	166MHz	64KB	ARM® Cortex®-M3	DDR, PCIe, SERDES	256 kB	CANbus, Ethernet, I²C, SPI, UART/USART, USB	MCU, FPGA	-	-	-	-	-	-	-	-	FPGA - 60K Logic Modules	-	-	1 Core	256KB	-	-	-	-
M2S060-FG676 Microchip Technology RoHS : Инкапсуляция : - Есть складские запасы : - 1 : -
	Mfr. Тип M2S150-1FCSG536I Anlielectronics Тип	Microchip Technology	SoC FPGA M2S150-1FCSG536I Сборник данных Сравнение	Min.:1 Mult.:1	-	536-LFBGA, CSPBGA	YES	536-CSPBGA (16x16)	536	M2S150	ARM Cortex M3	64 kB	-	-	90	-	MICROSEMI CORP	-	-	-	-	-	M2S150-1FCSG536I	166 MHz	-	-	-	Microchip Technology	-	-	Yes	3	-	-	-	-	293	12177 LAB	146124 LE	-	Tray	PLASTIC/EPOXY	BGA	FBGA-536	BGA536,30X30,20	SQUARE	GRID ARRAY	Active	Active	40	5.77	Details	Yes	This product may require additional documentation to export from the United States.	-	1.26 V	1.14 V	1.2 V	-	-	-	-	-40°C ~ 100°C (TJ)	Tray	SmartFusion2	e1	Tin/Silver/Copper (Sn/Ag/Cu)	-	-	-	8542.39.00.01	CMOS	BOTTOM	BALL	250	-	compliant	-	-	S-PBGA-B536	293	Not Qualified	-	1.2 V	-	-	-	-	-	166MHz	64KB	ARM® Cortex®-M3	DDR, PCIe, SERDES	512 kB	CANbus, Ethernet, I²C, SPI, UART/USART, USB	MCU, FPGA	-	293	-	FIELD PROGRAMMABLE GATE ARRAY	-	-	-	-	FPGA - 150K Logic Modules	-	146124	1 Core	512KB	-	-	-	-
M2S150-1FCSG536I Microchip Technology RoHS : Инкапсуляция : - Есть складские запасы : - 1 : -
	Mfr. Тип M2S010-FG484I Anlielectronics Тип	Microchip Technology	SoC FPGA M2S010-FG484I Сборник данных Сравнение	Min.:1 Mult.:1	-	FPBGA-484	YES	484-FPBGA (23x23)	484	M2S010	ARM Cortex M3	64 kB	-	-	60	-	MICROSEMI CORP	-	-	-	-	-	M2S010-FG484I	166 MHz	-	-	-	Microchip Technology	-	-	Yes	3	-	SMD/SMT	-	-	233	1007 LAB	12084 LE	-	Tray	PLASTIC/EPOXY	BGA	BGA, BGA484,22X22,40	BGA484,22X22,40	SQUARE	GRID ARRAY	Active	Active	30	5.81	N	No	This product may require additional documentation to export from the United States.	-	1.26 V	1.14 V	1.2 V	-	-	-	-	-40°C ~ 100°C (TJ)	Tray	SmartFusion2	e0	Tin/Lead (Sn/Pb)	-	-	-	8542.39.00.01	CMOS	BOTTOM	BALL	240	1 mm	not_compliant	-	-	S-PBGA-B484	233	Not Qualified	-	1.2 V	-	-	-	-	-	166MHz	64KB	ARM® Cortex®-M3	DDR, PCIe, SERDES	256 kB	CANbus, Ethernet, I²C, SPI, UART/USART, USB	MCU, FPGA	-	233	2.44 mm	FIELD PROGRAMMABLE GATE ARRAY	-	-	-	-	FPGA - 10K Logic Modules	-	12084	1 Core	256KB	-	-	23 mm	23 mm
M2S010-FG484I Microchip Technology RoHS : Инкапсуляция : - Есть складские запасы : - 1 : -
	Mfr. Тип M2S025T-FCSG325I Anlielectronics Тип	Microchip Technology	SoC FPGA M2S025T-FCSG325I Сборник данных Сравнение	Min.:1 Mult.:1	Production (Last Updated: 2 months ago)	FCBGA-325	YES	325-FCBGA (11x11)	325	M2S025	ARM Cortex M3	64 kB	-	-	176	-	MICROSEMI CORP	-	-	-	-	-	M2S025T-FCSG325I	166 MHz	-	-	-	Microchip Technology	-	-	Yes	3	-	SMD/SMT	-	-	180	2308 LAB	27696 LE	-	Tray	PLASTIC/EPOXY	TFBGA	FBGA-325	BGA325,21X21,20	SQUARE	GRID ARRAY, THIN PROFILE, FINE PITCH	Active	Active	40	5.78	Details	Yes	This product may require additional documentation to export from the United States.	-	1.26 V	1.14 V	1.2 V	-	-	-	-	-40°C ~ 100°C (TJ)	Tray	SmartFusion2	e1	Tin/Silver/Copper (Sn/Ag/Cu)	-	-	LG-MIN, WD-MIN	8542.39.00.01	CMOS	BOTTOM	BALL	250	0.5 mm	compliant	-	-	S-PBGA-B325	180	Not Qualified	-	1.2 V	-	-	-	-	-	166MHz	64KB	ARM® Cortex®-M3	DDR, PCIe, SERDES	256 kB	CANbus, Ethernet, I²C, SPI, UART/USART, USB	MCU, FPGA	-	180	1.01 mm	FIELD PROGRAMMABLE GATE ARRAY	-	592Kbit	-	-	FPGA - 25K Logic Modules	-	27696	1 Core	256KB	-	-	11 mm	11 mm
M2S025T-FCSG325I Microchip Technology RoHS : Инкапсуляция : - Есть складские запасы : - 1 : -

Integrated Circuits (ICs)

Embedded - System On Chip (SoC) definition: A System On Chip (SoC) combines the required electronic circuits of various computer components onto a single, integrated chip (IC). SoC is ... Embedded - System On Chip (SoC) Product Listing: M2S060T-FG484,M2S010T-FGG484I,M2S005S-1VFG400,M2S010T-VF256,M2S050TS-FGG484.Integrated Circuits (ICs) type:Embedded - Microcontrollers(129432),Memory(111901),PMIC - Supervisors(101743),PMIC - Voltage Regulators - Linear(101187),PMIC - Voltage Regulators - DC DC Switching Regulators(62822) .Embedded - System On Chip (SoC) has 873 pieces of spot stock price information, you can click the "RFQ" button to confirm the inventory and price with the Anli.

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Integrated Circuits (ICs)