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- Embedded - System On Chip (SoC)
| Изображение | Тип | Марка | Объяснение | Установленная цена | Количество | RoHS | Factory Lead Time | Package / Case | Surface Mount | Supplier Device Package | Number of I/Os | Operating Temperature | Packaging | Published | Series | Pbfree Code | Part Status | Moisture Sensitivity Level (MSL) | Number of Terminations | Additional Feature | HTS Code | Terminal Position | Terminal Form | Peak Reflow Temperature (Cel) | Supply Voltage | Time@Peak Reflow Temperature-Max (s) | JESD-30 Code | Supply Voltage-Max (Vsup) | Supply Voltage-Min (Vsup) | Speed | RAM Size | uPs/uCs/Peripheral ICs Type | Core Processor | Peripherals | Connectivity | Architecture | Primary Attributes | RoHS Status |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
![]() | Mfr. ТипXCZU4EG-2FBVB900IAnlielectronics Тип | Xilinx Inc. |
IC SOC CORTEX-A53 900FCBGA
Сборник данных
Сравнение
| Min.:1 Mult.:1 | 11 Weeks | 900-BBGA, FCBGA | - | - | 204 | -40°C~100°C TJ | Tray | 2016 | Zynq® UltraScale+™ MPSoC EG | - | Active | 4 (72 Hours) | - | - | 8542.31.00.01 | - | - | NOT SPECIFIED | - | NOT SPECIFIED | - | - | - | 533MHz, 600MHz, 1.3GHz | 256KB | - | Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2 | DMA, WDT | CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | MCU, FPGA | Zynq®UltraScale+™ FPGA, 192K+ Logic Cells | ROHS3 Compliant | ||
| XCZU4EG-2FBVB900I | ||||||||||||||||||||||||||||||||||||||
![]() | Mfr. ТипXCZU9EG-3FFVC900EAnlielectronics Тип | Xilinx Inc. |
IC SOC CORTEX-A53 900FCBGA
Сборник данных
Сравнение
| Min.:1 Mult.:1 | 11 Weeks | 900-BBGA, FCBGA | - | - | 204 | 0°C~100°C TJ | Tray | 2013 | Zynq® UltraScale+™ MPSoC EG | - | Active | 4 (72 Hours) | - | - | 8542.31.00.01 | - | - | NOT SPECIFIED | - | NOT SPECIFIED | - | - | - | 600MHz, 1.5GHz | 256KB | - | Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™ | DMA, WDT | CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | MCU, FPGA | Zynq®UltraScale+™ FPGA, 599K+ Logic Cells | ROHS3 Compliant | ||
| XCZU9EG-3FFVC900E | ||||||||||||||||||||||||||||||||||||||
![]() | Mfr. ТипXCZU4EV-L2SFVC784EAnlielectronics Тип | Xilinx Inc. |
IC SOC CORTEX-A53 784FCBGA
Сборник данных
Сравнение
| Min.:1 Mult.:1 | 11 Weeks | 784-BFBGA, FCBGA | - | 784-FCBGA (23x23) | 252 | 0°C~100°C TJ | Tray | 2016 | Zynq® UltraScale+™ MPSoC EV | - | Active | 4 (72 Hours) | - | - | - | - | - | - | - | - | - | - | - | 533MHz, 600MHz, 1.3GHz | 256KB | - | Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2 | DMA, WDT | CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | MCU, FPGA | Zynq®UltraScale+™ FPGA, 192K+ Logic Cells | ROHS3 Compliant | ||
| XCZU4EV-L2SFVC784E | ||||||||||||||||||||||||||||||||||||||
![]() | Mfr. ТипXCZU4EV-3SFVC784EAnlielectronics Тип | Xilinx Inc. |
IC SOC CORTEX-A53 784FCBGA
Сборник данных
Сравнение
| Min.:1 Mult.:1 | 11 Weeks | 784-BFBGA, FCBGA | - | - | 252 | 0°C~100°C TJ | Tray | 2016 | Zynq® UltraScale+™ MPSoC EV | - | Active | 4 (72 Hours) | - | - | 8542.31.00.01 | - | - | NOT SPECIFIED | - | NOT SPECIFIED | - | - | - | 600MHz, 1.5GHz | 256KB | - | Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™ | DMA, WDT | CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | MCU, FPGA | Zynq®UltraScale+™ FPGA, 192K+ Logic Cells | ROHS3 Compliant | ||
| XCZU4EV-3SFVC784E | ||||||||||||||||||||||||||||||||||||||
![]() | Mfr. ТипXCZU7EG-1FFVC1156EAnlielectronics Тип | Xilinx Inc. |
IC SOC CORTEX-A53 1156FCBGA
Сборник данных
Сравнение
| Min.:1 Mult.:1 | 11 Weeks | 1156-BBGA, FCBGA | - | - | 360 | 0°C~100°C TJ | Tray | 2016 | Zynq® UltraScale+™ MPSoC EG | - | Active | 4 (72 Hours) | - | - | 8542.31.00.01 | - | - | NOT SPECIFIED | - | NOT SPECIFIED | - | - | - | 500MHz, 600MHz, 1.2GHz | 256KB | - | Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2 | DMA, WDT | CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | MCU, FPGA | Zynq®UltraScale+™ FPGA, 504K+ Logic Cells | ROHS3 Compliant | ||
| XCZU7EG-1FFVC1156E | ||||||||||||||||||||||||||||||||||||||
![]() | Mfr. ТипXCZU11EG-L2FFVC1156EAnlielectronics Тип | Xilinx Inc. |
IC SOC CORTEX-A53 1156FCBGA
Сборник данных
Сравнение
| Min.:1 Mult.:1 | 11 Weeks | 1156-BBGA, FCBGA | YES | - | 360 | 0°C~100°C TJ | Tray | 2016 | Zynq® UltraScale+™ MPSoC EG | - | Active | 4 (72 Hours) | - | ALSO AVAILABLE WITH 0.85V NOMINAL SUPPLY | 8542.31.00.01 | BOTTOM | BALL | NOT SPECIFIED | 0.72V | NOT SPECIFIED | R-PBGA-B1156 | 0.742V | 0.698V | 533MHz, 600MHz, 1.3GHz | 256KB | MICROPROCESSOR CIRCUIT | Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2 | DMA, WDT | CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | MCU, FPGA | Zynq®UltraScale+™ FPGA, 653K+ Logic Cells | ROHS3 Compliant | ||
| XCZU11EG-L2FFVC1156E | ||||||||||||||||||||||||||||||||||||||
![]() | Mfr. ТипXCZU5CG-1SFVC784IAnlielectronics Тип | Xilinx Inc. |
IC SOC CORTEX-A53 784FCBGA
Сборник данных
Сравнение
| Min.:1 Mult.:1 | 11 Weeks | 784-BFBGA, FCBGA | - | - | 252 | -40°C~100°C TJ | Tray | 2016 | Zynq® UltraScale+™ MPSoC CG | - | Active | 4 (72 Hours) | - | - | 8542.31.00.01 | - | - | NOT SPECIFIED | - | NOT SPECIFIED | - | - | - | 500MHz, 1.2GHz | 256KB | - | Dual ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™ | DMA, WDT | CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | MCU, FPGA | Zynq®UltraScale+™ FPGA, 256K+ Logic Cells | ROHS3 Compliant | ||
| XCZU5CG-1SFVC784I | ||||||||||||||||||||||||||||||||||||||
![]() | Mfr. ТипXCZU6CG-2FFVB1156IAnlielectronics Тип | Xilinx Inc. |
IC SOC CORTEX-A53 1156FCBGA
Сборник данных
Сравнение
| Min.:1 Mult.:1 | 11 Weeks | 1156-BBGA, FCBGA | YES | - | 328 | -40°C~100°C TJ | Bulk | 2016 | Zynq® UltraScale+™ MPSoC CG | - | Active | 4 (72 Hours) | - | - | 8542.31.00.01 | BOTTOM | BALL | NOT SPECIFIED | 0.85V | NOT SPECIFIED | R-PBGA-B1156 | 0.876V | 0.825V | 533MHz, 1.3GHz | 256KB | MICROPROCESSOR CIRCUIT | Dual ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™ | DMA, WDT | CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | MCU, FPGA | Zynq®UltraScale+™ FPGA, 469K+ Logic Cells | ROHS3 Compliant | ||
| XCZU6CG-2FFVB1156I | ||||||||||||||||||||||||||||||||||||||
![]() | Mfr. ТипXCZU4EV-L2FBVB900EAnlielectronics Тип | Xilinx Inc. |
IC SOC CORTEX-A53 900FCBGA
Сборник данных
Сравнение
| Min.:1 Mult.:1 | 11 Weeks | 900-BBGA, FCBGA | YES | - | 204 | 0°C~100°C TJ | Tray | 2016 | Zynq® UltraScale+™ MPSoC EV | - | Active | 4 (72 Hours) | 900 | ALSO AVAILABLE WITH 0.85V NOMINAL SUPPLY | 8542.31.00.01 | BOTTOM | BALL | NOT SPECIFIED | 0.72V | NOT SPECIFIED | R-PBGA-B900 | 0.742V | 0.698V | 533MHz, 600MHz, 1.3GHz | 256KB | MICROPROCESSOR CIRCUIT | Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2 | DMA, WDT | CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | MCU, FPGA | Zynq®UltraScale+™ FPGA, 192K+ Logic Cells | ROHS3 Compliant | ||
| XCZU4EV-L2FBVB900E | ||||||||||||||||||||||||||||||||||||||
![]() | Mfr. ТипXCZU2EG-2SBVA484IAnlielectronics Тип | Xilinx Inc. |
IC SOC CORTEX-A53 484FCBGA
Сборник данных
Сравнение
| Min.:1 Mult.:1 | 11 Weeks | 484-BFBGA, FCBGA | YES | - | 82 | -40°C~100°C TJ | Tray | 2013 | Zynq® UltraScale+™ MPSoC EG | - | Active | 4 (72 Hours) | 484 | - | 8542.31.00.01 | BOTTOM | BALL | NOT SPECIFIED | 0.85V | NOT SPECIFIED | R-PBGA-B484 | 0.876V | - | 533MHz, 600MHz, 1.3GHz | 256KB | MICROPROCESSOR CIRCUIT | Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2 | DMA, WDT | CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | MCU, FPGA | Zynq®UltraScale+™ FPGA, 103K+ Logic Cells | ROHS3 Compliant | ||
| XCZU2EG-2SBVA484I | ||||||||||||||||||||||||||||||||||||||
![]() | Mfr. ТипXCZU3CG-2SBVA484IAnlielectronics Тип | Xilinx Inc. |
IC SOC CORTEX-A53 484FCBGA
Сборник данных
Сравнение
| Min.:1 Mult.:1 | 11 Weeks | 484-BFBGA, FCBGA | YES | - | 82 | -40°C~100°C TJ | Tray | 2016 | Zynq® UltraScale+™ MPSoC CG | - | Active | 4 (72 Hours) | 484 | - | 8542.31.00.01 | BOTTOM | BALL | NOT SPECIFIED | 0.85V | NOT SPECIFIED | R-PBGA-B484 | 0.876V | - | 533MHz, 1.3GHz | 256KB | MICROPROCESSOR CIRCUIT | Dual ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™ | DMA, WDT | CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | MCU, FPGA | Zynq®UltraScale+™ FPGA, 154K+ Logic Cells | ROHS3 Compliant | ||
| XCZU3CG-2SBVA484I | ||||||||||||||||||||||||||||||||||||||
![]() | Mfr. ТипXCZU11EG-L1FFVF1517IAnlielectronics Тип | Xilinx Inc. |
IC SOC CORTEX-A53 1517FCBGA
Сборник данных
Сравнение
| Min.:1 Mult.:1 | 11 Weeks | 1517-BBGA, FCBGA | YES | - | 464 | -40°C~100°C TJ | Tray | 2016 | Zynq® UltraScale+™ MPSoC EG | - | Active | 4 (72 Hours) | - | ALSO AVAILABLE WITH 0.85V NOMINAL SUPPLY | 8542.31.00.01 | BOTTOM | BALL | NOT SPECIFIED | 0.72V | NOT SPECIFIED | R-PBGA-B1517 | 0.742V | 0.698V | 500MHz, 600MHz, 1.2GHz | 256KB | MICROPROCESSOR CIRCUIT | Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2 | DMA, WDT | CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | MCU, FPGA | Zynq®UltraScale+™ FPGA, 653K+ Logic Cells | ROHS3 Compliant | ||
| XCZU11EG-L1FFVF1517I | ||||||||||||||||||||||||||||||||||||||
![]() | Mfr. ТипXCZU19EG-1FFVE1924EAnlielectronics Тип | Xilinx Inc. |
IC SOC CORTEX-A53 1924FCBGA
Сборник данных
Сравнение
| Min.:1 Mult.:1 | 11 Weeks | 1924-BBGA, FCBGA | - | - | 668 | 0°C~100°C TJ | Tray | 2016 | Zynq® UltraScale+™ MPSoC EG | - | Active | 4 (72 Hours) | - | - | 8542.31.00.01 | - | - | NOT SPECIFIED | - | NOT SPECIFIED | - | - | - | 500MHz, 600MHz, 1.2GHz | 256KB | - | Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2 | DMA, WDT | CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | MCU, FPGA | Zynq®UltraScale+™ FPGA, 1143K+ Logic Cells | ROHS3 Compliant | ||
| XCZU19EG-1FFVE1924E | ||||||||||||||||||||||||||||||||||||||
![]() | Mfr. ТипXCZU15EG-2FFVC900EAnlielectronics Тип | Xilinx Inc. |
IC SOC CORTEX-A53 900FCBGA
Сборник данных
Сравнение
| Min.:1 Mult.:1 | 11 Weeks | 900-BBGA, FCBGA | - | - | 204 | 0°C~100°C TJ | Tray | 2016 | Zynq® UltraScale+™ MPSoC EG | yes | Active | 4 (72 Hours) | - | - | 8542.31.00.01 | - | - | NOT SPECIFIED | - | NOT SPECIFIED | - | - | - | 533MHz, 600MHz, 1.3GHz | 256KB | - | Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2 | DMA, WDT | CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | MCU, FPGA | Zynq®UltraScale+™ FPGA, 747K+ Logic Cells | ROHS3 Compliant | ||
| XCZU15EG-2FFVC900E | ||||||||||||||||||||||||||||||||||||||
![]() | Mfr. ТипXCZU11EG-2FFVC1760EAnlielectronics Тип | Xilinx Inc. |
IC SOC CORTEX-A53 1760FCBGA
Сборник данных
Сравнение
| Min.:1 Mult.:1 | 11 Weeks | 1760-BBGA, FCBGA | - | - | 512 | 0°C~100°C TJ | Tray | 2016 | Zynq® UltraScale+™ MPSoC EG | yes | Active | 4 (72 Hours) | - | - | 8542.31.00.01 | - | - | NOT SPECIFIED | - | NOT SPECIFIED | - | - | - | 533MHz, 600MHz, 1.3GHz | 256KB | - | Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2 | DMA, WDT | CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | MCU, FPGA | Zynq®UltraScale+™ FPGA, 653K+ Logic Cells | ROHS3 Compliant | ||
| XCZU11EG-2FFVC1760E | ||||||||||||||||||||||||||||||||||||||
![]() | Mfr. ТипXCZU17EG-2FFVB1517IAnlielectronics Тип | Xilinx Inc. |
IC SOC CORTEX-A53 1517FCBGA
Сборник данных
Сравнение
| Min.:1 Mult.:1 | 11 Weeks | 1517-BBGA, FCBGA | - | - | 644 | -40°C~100°C TJ | Tray | 2016 | Zynq® UltraScale+™ MPSoC EG | - | Active | 4 (72 Hours) | - | - | 8542.31.00.01 | - | - | NOT SPECIFIED | - | NOT SPECIFIED | - | - | - | 533MHz, 600MHz, 1.3GHz | 256KB | - | Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2 | DMA, WDT | CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | MCU, FPGA | Zynq®UltraScale+™ FPGA, 926K+ Logic Cells | ROHS3 Compliant | ||
| XCZU17EG-2FFVB1517I | ||||||||||||||||||||||||||||||||||||||
![]() | Mfr. ТипXCZU11EG-1FFVF1517IAnlielectronics Тип | Xilinx Inc. |
IC SOC CORTEX-A53 1517FCBGA
Сборник данных
Сравнение
| Min.:1 Mult.:1 | 11 Weeks | 1517-BBGA, FCBGA | - | - | 464 | -40°C~100°C TJ | Tray | 2016 | Zynq® UltraScale+™ MPSoC EG | - | Active | 4 (72 Hours) | - | - | 8542.31.00.01 | - | - | NOT SPECIFIED | - | NOT SPECIFIED | - | - | - | 500MHz, 600MHz, 1.2GHz | 256KB | - | Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2 | DMA, WDT | CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | MCU, FPGA | Zynq®UltraScale+™ FPGA, 653K+ Logic Cells | ROHS3 Compliant | ||
| XCZU11EG-1FFVF1517I | ||||||||||||||||||||||||||||||||||||||
![]() | Mfr. ТипXCZU6EG-1FFVC900EAnlielectronics Тип | Xilinx Inc. |
IC SOC CORTEX-A53 900FCBGA
Сборник данных
Сравнение
| Min.:1 Mult.:1 | 11 Weeks | 900-BBGA, FCBGA | - | - | 204 | 0°C~100°C TJ | Tray | 2016 | Zynq® UltraScale+™ MPSoC EG | - | Active | 4 (72 Hours) | - | - | 8542.31.00.01 | - | - | NOT SPECIFIED | - | NOT SPECIFIED | - | - | - | 500MHz, 600MHz, 1.2GHz | 256KB | - | Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2 | DMA, WDT | CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | MCU, FPGA | Zynq®UltraScale+™ FPGA, 469K+ Logic Cells | ROHS3 Compliant | ||
| XCZU6EG-1FFVC900E | ||||||||||||||||||||||||||||||||||||||
![]() | Mfr. ТипXCZU17EG-1FFVC1760EAnlielectronics Тип | Xilinx Inc. |
IC SOC CORTEX-A53 1760FCBGA
Сборник данных
Сравнение
| Min.:1 Mult.:1 | 11 Weeks | 1760-BBGA, FCBGA | - | - | 512 | 0°C~100°C TJ | Tray | 2016 | Zynq® UltraScale+™ MPSoC EG | - | Active | 4 (72 Hours) | - | - | 8542.31.00.01 | - | - | NOT SPECIFIED | - | NOT SPECIFIED | - | - | - | 500MHz, 600MHz, 1.2GHz | 256KB | - | Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2 | DMA, WDT | CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | MCU, FPGA | Zynq®UltraScale+™ FPGA, 926K+ Logic Cells | ROHS3 Compliant | ||
| XCZU17EG-1FFVC1760E | ||||||||||||||||||||||||||||||||||||||
![]() | Mfr. ТипXCZU6CG-L2FFVC900EAnlielectronics Тип | Xilinx Inc. |
IC SOC CORTEX-A53 900FCBGA
Сборник данных
Сравнение
| Min.:1 Mult.:1 | 11 Weeks | 900-BBGA, FCBGA | YES | - | 204 | 0°C~100°C TJ | Tray | 2016 | Zynq® UltraScale+™ MPSoC CG | - | Active | 4 (72 Hours) | 900 | ALSO AVAILABLE WITH 0.85V NOMINAL SUPPLY | 8542.31.00.01 | BOTTOM | BALL | NOT SPECIFIED | 0.72V | NOT SPECIFIED | R-PBGA-B900 | 0.742V | 0.698V | 533MHz, 1.3GHz | 256KB | MICROPROCESSOR CIRCUIT | Dual ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™ | DMA, WDT | CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | MCU, FPGA | Zynq®UltraScale+™ FPGA, 469K+ Logic Cells | ROHS3 Compliant | ||
| XCZU6CG-L2FFVC900E |
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