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- Integrated Circuits (ICs)
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- Embedded - System On Chip (SoC)
| Изображение | Тип | Марка | Объяснение | Установленная цена | Количество | RoHS | Factory Lead Time | Package / Case | Surface Mount | Number of I/Os | Operating Temperature | Packaging | Published | Series | JESD-609 Code | Pbfree Code | Part Status | Moisture Sensitivity Level (MSL) | Number of Terminations | Terminal Finish | Additional Feature | HTS Code | Terminal Position | Terminal Form | Peak Reflow Temperature (Cel) | Supply Voltage | Terminal Pitch | Frequency | Time@Peak Reflow Temperature-Max (s) | JESD-30 Code | Supply Voltage-Max (Vsup) | Supply Voltage-Min (Vsup) | Interface | Speed | RAM Size | uPs/uCs/Peripheral ICs Type | Core Processor | Peripherals | Connectivity | Architecture | Core Architecture | Boundary Scan | RAM (words) | Primary Attributes | Bus Compatibility | Height Seated (Max) | Length | Width | RoHS Status |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
![]() | Mfr. ТипXCZU7CG-2FFVC1156IAnlielectronics Тип | Xilinx Inc. |
IC SOC CORTEX-A53 1156FCBGA
Сборник данных
Сравнение
| Min.:1 Mult.:1 | 11 Weeks | 1156-BBGA, FCBGA | YES | 360 | -40°C~100°C TJ | Tray | 2016 | Zynq® UltraScale+™ MPSoC CG | - | - | Active | 4 (72 Hours) | - | - | - | 8542.31.00.01 | BOTTOM | BALL | NOT SPECIFIED | 0.85V | - | - | NOT SPECIFIED | R-PBGA-B1156 | 0.876V | 0.825V | - | 533MHz, 1.3GHz | 256KB | MICROPROCESSOR CIRCUIT | Dual ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™ | DMA, WDT | CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | MCU, FPGA | - | - | - | Zynq®UltraScale+™ FPGA, 504K+ Logic Cells | - | - | - | - | ROHS3 Compliant | ||
| XCZU7CG-2FFVC1156I | |||||||||||||||||||||||||||||||||||||||||||||||||
![]() | Mfr. ТипXCZU9CG-L2FFVC900EAnlielectronics Тип | Xilinx Inc. |
IC SOC CORTEX-A53 900FCBGA
Сборник данных
Сравнение
| Min.:1 Mult.:1 | 11 Weeks | 900-BBGA, FCBGA | YES | 204 | 0°C~100°C TJ | Bulk | 2016 | Zynq® UltraScale+™ MPSoC CG | - | - | Active | 4 (72 Hours) | 900 | - | ALSO AVAILABLE WITH 0.85V NOMINAL SUPPLY | 8542.31.00.01 | BOTTOM | BALL | NOT SPECIFIED | 0.72V | - | - | NOT SPECIFIED | R-PBGA-B900 | 0.742V | 0.698V | - | 533MHz, 1.3GHz | 256KB | MICROPROCESSOR CIRCUIT | Dual ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™ | DMA, WDT | CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | MCU, FPGA | - | - | - | Zynq®UltraScale+™ FPGA, 599K+ Logic Cells | - | - | - | - | ROHS3 Compliant | ||
| XCZU9CG-L2FFVC900E | |||||||||||||||||||||||||||||||||||||||||||||||||
![]() | Mfr. ТипXCZU4EG-1FBVB900IAnlielectronics Тип | Xilinx Inc. |
IC SOC CORTEX-A53 900FCBGA
Сборник данных
Сравнение
| Min.:1 Mult.:1 | 11 Weeks | 900-BBGA, FCBGA | - | 204 | -40°C~100°C TJ | Tray | 2016 | Zynq® UltraScale+™ MPSoC EG | - | - | Active | 4 (72 Hours) | - | - | - | 8542.31.00.01 | - | - | NOT SPECIFIED | - | - | - | NOT SPECIFIED | - | - | - | - | 500MHz, 600MHz, 1.2GHz | 256KB | - | Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2 | DMA, WDT | CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | MCU, FPGA | - | - | - | Zynq®UltraScale+™ FPGA, 192K+ Logic Cells | - | - | - | - | ROHS3 Compliant | ||
| XCZU4EG-1FBVB900I | |||||||||||||||||||||||||||||||||||||||||||||||||
![]() | Mfr. ТипXCZU4EG-3FBVB900EAnlielectronics Тип | Xilinx Inc. |
IC SOC CORTEX-A53 900FCBGA
Сборник данных
Сравнение
| Min.:1 Mult.:1 | 11 Weeks | 900-BBGA, FCBGA | - | 204 | 0°C~100°C TJ | Tray | 2016 | Zynq® UltraScale+™ MPSoC EG | - | - | Active | 4 (72 Hours) | - | - | - | 8542.31.00.01 | - | - | NOT SPECIFIED | - | - | - | NOT SPECIFIED | - | - | - | - | 600MHz, 1.5GHz | 256KB | - | Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™ | DMA, WDT | CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | MCU, FPGA | - | - | - | Zynq®UltraScale+™ FPGA, 192K+ Logic Cells | - | - | - | - | ROHS3 Compliant | ||
| XCZU4EG-3FBVB900E | |||||||||||||||||||||||||||||||||||||||||||||||||
![]() | Mfr. ТипXCZU7CG-2FBVB900IAnlielectronics Тип | Xilinx Inc. |
IC SOC CORTEX-A53 900FCBGA
Сборник данных
Сравнение
| Min.:1 Mult.:1 | 11 Weeks | 900-BBGA, FCBGA | YES | 204 | -40°C~100°C TJ | Tray | 2016 | Zynq® UltraScale+™ MPSoC CG | - | - | Active | 4 (72 Hours) | 900 | - | - | 8542.31.00.01 | BOTTOM | BALL | NOT SPECIFIED | 0.85V | - | - | NOT SPECIFIED | R-PBGA-B900 | 0.876V | 0.825V | - | 533MHz, 1.3GHz | 256KB | MICROPROCESSOR CIRCUIT | Dual ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™ | DMA, WDT | CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | MCU, FPGA | - | - | - | Zynq®UltraScale+™ FPGA, 504K+ Logic Cells | - | - | - | - | ROHS3 Compliant | ||
| XCZU7CG-2FBVB900I | |||||||||||||||||||||||||||||||||||||||||||||||||
![]() | Mfr. ТипXCZU11EG-L1FFVC1156IAnlielectronics Тип | Xilinx Inc. |
IC SOC CORTEX-A53 1156FCBGA
Сборник данных
Сравнение
| Min.:1 Mult.:1 | 11 Weeks | 1156-BBGA, FCBGA | YES | 360 | -40°C~100°C TJ | Tray | 2016 | Zynq® UltraScale+™ MPSoC EG | - | - | Active | 4 (72 Hours) | - | - | ALSO AVAILABLE WITH 0.85V NOMINAL SUPPLY | 8542.31.00.01 | BOTTOM | BALL | NOT SPECIFIED | 0.72V | - | - | NOT SPECIFIED | R-PBGA-B1156 | 0.742V | 0.698V | - | 500MHz, 600MHz, 1.2GHz | 256KB | MICROPROCESSOR CIRCUIT | Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2 | DMA, WDT | CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | MCU, FPGA | - | - | - | Zynq®UltraScale+™ FPGA, 653K+ Logic Cells | - | - | - | - | ROHS3 Compliant | ||
| XCZU11EG-L1FFVC1156I | |||||||||||||||||||||||||||||||||||||||||||||||||
![]() | Mfr. ТипXCZU11EG-2FFVC1156EAnlielectronics Тип | Xilinx Inc. |
IC SOC CORTEX-A53 1156FCBGA
Сборник данных
Сравнение
| Min.:1 Mult.:1 | 11 Weeks | 1156-BBGA, FCBGA | - | 360 | 0°C~100°C TJ | Tray | 2016 | Zynq® UltraScale+™ MPSoC EG | - | yes | Active | 4 (72 Hours) | - | - | - | 8542.31.00.01 | - | - | NOT SPECIFIED | - | - | - | NOT SPECIFIED | - | - | - | - | 533MHz, 600MHz, 1.3GHz | 256KB | - | Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2 | DMA, WDT | CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | MCU, FPGA | - | - | - | Zynq®UltraScale+™ FPGA, 653K+ Logic Cells | - | - | - | - | ROHS3 Compliant | ||
| XCZU11EG-2FFVC1156E | |||||||||||||||||||||||||||||||||||||||||||||||||
![]() | Mfr. ТипXCZU2CG-2SFVC784IAnlielectronics Тип | Xilinx Inc. |
IC SOC CORTEX-A53 784FCBGA
Сборник данных
Сравнение
| Min.:1 Mult.:1 | 11 Weeks | 784-BFBGA, FCBGA | YES | 252 | -40°C~100°C TJ | Tray | 2016 | Zynq® UltraScale+™ MPSoC CG | - | - | Active | 4 (72 Hours) | 784 | - | - | 8542.31.00.01 | BOTTOM | BALL | NOT SPECIFIED | 0.85V | - | - | NOT SPECIFIED | S-PBGA-B784 | - | - | - | 533MHz, 1.3GHz | 256KB | MICROPROCESSOR CIRCUIT | Dual ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™ | DMA, WDT | CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | MCU, FPGA | - | - | - | Zynq®UltraScale+™ FPGA, 103K+ Logic Cells | - | - | - | - | ROHS3 Compliant | ||
| XCZU2CG-2SFVC784I | |||||||||||||||||||||||||||||||||||||||||||||||||
![]() | Mfr. ТипXC7Z045-2FF900EAnlielectronics Тип | Xilinx Inc. |
IC SOC CORTEX-A9 800MHZ 900FCBGA
Сборник данных
Сравнение
| Min.:1 Mult.:1 | 10 Weeks | 900-BBGA, FCBGA | YES | 130 | 0°C~100°C TJ | Tray | 2010 | Zynq®-7000 | - | no | Active | 4 (72 Hours) | 900 | - | GPIO WITH FOUR 32-BIT BANKS | 8542.39.00.01 | BOTTOM | BALL | - | - | - | 800MHz | - | S-PBGA-B900 | - | - | CAN, EBI/EMI, Ethernet, I2C, MMC, SD, SDIO, SPI, UART, USART, USB | - | 256KB | - | Dual ARM® Cortex®-A9 MPCore™ with CoreSight™ | DMA | CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | MCU, FPGA | ARM | YES | 256000 | Kintex™-7 FPGA, 350K Logic Cells | CAN, ETHERNET, I2C, PCI, SPI, UART, USB | - | - | - | Non-RoHS Compliant | ||
| XC7Z045-2FF900E | |||||||||||||||||||||||||||||||||||||||||||||||||
![]() | Mfr. ТипXCZU9EG-1FFVC900EAnlielectronics Тип | Xilinx Inc. |
IC SOC CORTEX-A53 900FCBGA
Сборник данных
Сравнение
| Min.:1 Mult.:1 | 11 Weeks | 900-BBGA, FCBGA | - | 204 | 0°C~100°C TJ | Tray | - | Zynq® UltraScale+™ MPSoC EG | - | - | Active | 4 (72 Hours) | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | 500MHz, 600MHz, 1.2GHz | 256KB | - | Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2 | DMA, WDT | CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | MCU, FPGA | - | - | - | Zynq®UltraScale+™ FPGA, 599K+ Logic Cells | - | - | - | - | ROHS3 Compliant | ||
| XCZU9EG-1FFVC900E | |||||||||||||||||||||||||||||||||||||||||||||||||
![]() | Mfr. ТипXCZU15EG-L2FFVB1156EAnlielectronics Тип | Xilinx Inc. |
IC SOC CORTEX-A53 1156FCBGA
Сборник данных
Сравнение
| Min.:1 Mult.:1 | 11 Weeks | 1156-BBGA, FCBGA | YES | 328 | 0°C~100°C TJ | Tray | 2016 | Zynq® UltraScale+™ MPSoC EG | - | - | Active | 4 (72 Hours) | - | - | ALSO AVAILABLE WITH 0.85V NOMINAL SUPPLY | 8542.31.00.01 | BOTTOM | BALL | NOT SPECIFIED | 0.72V | - | - | NOT SPECIFIED | R-PBGA-B1156 | 0.742V | 0.698V | - | 533MHz, 600MHz, 1.3GHz | 256KB | MICROPROCESSOR CIRCUIT | Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2 | DMA, WDT | CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | MCU, FPGA | - | - | - | Zynq®UltraScale+™ FPGA, 747K+ Logic Cells | - | - | - | - | ROHS3 Compliant | ||
| XCZU15EG-L2FFVB1156E | |||||||||||||||||||||||||||||||||||||||||||||||||
![]() | Mfr. ТипXCZU7EV-L2FBVB900EAnlielectronics Тип | Xilinx Inc. |
IC SOC CORTEX-A53 900FCBGA
Сборник данных
Сравнение
| Min.:1 Mult.:1 | 11 Weeks | 900-BBGA, FCBGA | YES | 204 | 0°C~100°C TJ | Tray | 2016 | Zynq® UltraScale+™ MPSoC EV | - | - | Active | 4 (72 Hours) | 900 | - | ALSO AVAILABLE WITH 0.85V NOMINAL SUPPLY | 8542.31.00.01 | BOTTOM | BALL | NOT SPECIFIED | 0.72V | - | - | NOT SPECIFIED | R-PBGA-B900 | 0.742V | 0.698V | - | 533MHz, 600MHz, 1.3GHz | 256KB | MICROPROCESSOR CIRCUIT | Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2 | DMA, WDT | CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | MCU, FPGA | - | - | - | Zynq®UltraScale+™ FPGA, 504K+ Logic Cells | - | - | - | - | ROHS3 Compliant | ||
| XCZU7EV-L2FBVB900E | |||||||||||||||||||||||||||||||||||||||||||||||||
![]() | Mfr. ТипXCZU3CG-2SFVA625IAnlielectronics Тип | Xilinx Inc. |
IC SOC CORTEX-A53 625FCBGA
Сборник данных
Сравнение
| Min.:1 Mult.:1 | 11 Weeks | 625-BFBGA, FCBGA | YES | 180 | -40°C~100°C TJ | Bulk | 2016 | Zynq® UltraScale+™ MPSoC CG | - | - | Active | 4 (72 Hours) | 625 | - | - | 8542.31.00.01 | BOTTOM | BALL | NOT SPECIFIED | 0.85V | - | - | NOT SPECIFIED | R-PBGA-B625 | 0.876V | 0.825V | - | 533MHz, 1.3GHz | 256KB | MICROPROCESSOR CIRCUIT | Dual ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™ | DMA, WDT | CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | MCU, FPGA | - | - | - | Zynq®UltraScale+™ FPGA, 154K+ Logic Cells | - | - | - | - | ROHS3 Compliant | ||
| XCZU3CG-2SFVA625I | |||||||||||||||||||||||||||||||||||||||||||||||||
![]() | Mfr. ТипXCZU7CG-2FFVC1156EAnlielectronics Тип | Xilinx Inc. |
IC SOC CORTEX-A53 1156FCBGA
Сборник данных
Сравнение
| Min.:1 Mult.:1 | 11 Weeks | 1156-BBGA, FCBGA | - | 360 | 0°C~100°C TJ | Tray | 2016 | Zynq® UltraScale+™ MPSoC CG | - | yes | Active | 4 (72 Hours) | - | - | - | 8542.31.00.01 | - | - | NOT SPECIFIED | - | - | - | NOT SPECIFIED | - | - | - | - | 533MHz, 1.3GHz | 256KB | - | Dual ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™ | DMA, WDT | CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | MCU, FPGA | - | - | - | Zynq®UltraScale+™ FPGA, 504K+ Logic Cells | - | - | - | - | ROHS3 Compliant | ||
| XCZU7CG-2FFVC1156E | |||||||||||||||||||||||||||||||||||||||||||||||||
![]() | Mfr. ТипXAZU2EG-L1SFVA625IAnlielectronics Тип | Xilinx Inc. |
IC SOC CORTEX-A53 625FCBGA
Сборник данных
Сравнение
| Min.:1 Mult.:1 | 11 Weeks | 625-BFBGA, FCBGA | YES | 128 | -40°C~100°C TJ | Tray | - | Zynq® UltraScale+™ MPSoC EG | - | - | Active | 3 (168 Hours) | 625 | - | - | 8542.31.00.01 | BOTTOM | BALL | NOT SPECIFIED | 0.72V | 0.8mm | - | NOT SPECIFIED | S-PBGA-B625 | - | - | - | 500MHz, 1.2GHz | 1.2MB | MICROPROCESSOR CIRCUIT | Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2 | DMA, WDT | CANbus, I2C, SPI, UART/USART, USB | MPU, FPGA | - | - | - | Zynq®UltraScale+™ FPGA, 103K+ Logic Cells | - | 3.43mm | 21mm | 21mm | ROHS3 Compliant | ||
| XAZU2EG-L1SFVA625I | |||||||||||||||||||||||||||||||||||||||||||||||||
![]() | Mfr. ТипXCZU2CG-2SFVA625IAnlielectronics Тип | Xilinx Inc. |
IC SOC CORTEX-A53 625FCBGA
Сборник данных
Сравнение
| Min.:1 Mult.:1 | 11 Weeks | 625-BFBGA, FCBGA | YES | 180 | -40°C~100°C TJ | Tray | 2016 | Zynq® UltraScale+™ MPSoC CG | e1 | - | Active | 4 (72 Hours) | 625 | Tin/Silver/Copper (Sn96.5Ag3.0Cu0.5) | - | 8542.31.00.01 | BOTTOM | BALL | NOT SPECIFIED | 0.85V | - | - | NOT SPECIFIED | R-PBGA-B625 | 0.876V | 0.825V | - | 533MHz, 1.3GHz | 256KB | MICROPROCESSOR CIRCUIT | Dual ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™ | DMA, WDT | CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | MCU, FPGA | - | - | - | Zynq®UltraScale+™ FPGA, 103K+ Logic Cells | - | - | - | - | ROHS3 Compliant | ||
| XCZU2CG-2SFVA625I | |||||||||||||||||||||||||||||||||||||||||||||||||
![]() | Mfr. ТипXCZU5EG-1FBVB900IAnlielectronics Тип | Xilinx Inc. |
FPGA Zynq UltraScale Family 256200 Cells 20nm Technology 0.85V 900-Pin FCBGA Tray
Сборник данных
Сравнение
| Min.:1 Mult.:1 | 11 Weeks | 900-BBGA, FCBGA | - | 204 | -40°C~100°C TJ | Tray | 2016 | Zynq® UltraScale+™ MPSoC EG | - | - | Active | 4 (72 Hours) | - | - | - | 8542.31.00.01 | - | - | NOT SPECIFIED | - | - | - | NOT SPECIFIED | - | - | - | - | 500MHz, 600MHz, 1.2GHz | 256KB | - | Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2 | DMA, WDT | CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | MCU, FPGA | - | - | - | Zynq®UltraScale+™ FPGA, 256K+ Logic Cells | - | - | - | - | ROHS3 Compliant | ||
| XCZU5EG-1FBVB900I | |||||||||||||||||||||||||||||||||||||||||||||||||
![]() | Mfr. ТипXCZU4EV-2FBVB900IAnlielectronics Тип | Xilinx Inc. |
IC SOC CORTEX-A53 900FCBGA
Сборник данных
Сравнение
| Min.:1 Mult.:1 | 11 Weeks | 900-BBGA, FCBGA | - | 204 | -40°C~100°C TJ | Tray | 2016 | Zynq® UltraScale+™ MPSoC EV | - | - | Active | 4 (72 Hours) | - | - | - | 8542.31.00.01 | - | - | NOT SPECIFIED | - | - | - | NOT SPECIFIED | - | - | - | - | 533MHz, 600MHz, 1.3GHz | 256KB | - | Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2 | DMA, WDT | CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | MCU, FPGA | - | - | - | Zynq®UltraScale+™ FPGA, 192K+ Logic Cells | - | - | - | - | ROHS3 Compliant | ||
| XCZU4EV-2FBVB900I | |||||||||||||||||||||||||||||||||||||||||||||||||
![]() | Mfr. ТипXCZU7EG-1FFVC1156IAnlielectronics Тип | Xilinx Inc. |
IC SOC CORTEX-A53 1156FCBGA
Сборник данных
Сравнение
| Min.:1 Mult.:1 | 11 Weeks | 1156-BBGA, FCBGA | - | 360 | -40°C~100°C TJ | Tray | 2016 | Zynq® UltraScale+™ MPSoC EG | - | - | Active | 4 (72 Hours) | - | - | - | 8542.31.00.01 | - | - | NOT SPECIFIED | - | - | - | NOT SPECIFIED | - | - | - | - | 500MHz, 600MHz, 1.2GHz | 256KB | - | Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2 | DMA, WDT | CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | MCU, FPGA | - | - | - | Zynq®UltraScale+™ FPGA, 504K+ Logic Cells | - | - | - | - | ROHS3 Compliant | ||
| XCZU7EG-1FFVC1156I | |||||||||||||||||||||||||||||||||||||||||||||||||
![]() | Mfr. ТипXAZU2EG-1SFVC784IAnlielectronics Тип | Xilinx Inc. |
IC SOC CORTEX-A53 784FCBGA
Сборник данных
Сравнение
| Min.:1 Mult.:1 | 11 Weeks | 784-BFBGA, FCBGA | YES | 128 | -40°C~100°C TJ | Tray | - | Zynq® UltraScale+™ MPSoC EG | - | - | Active | 3 (168 Hours) | 784 | - | - | 8542.31.00.01 | BOTTOM | BALL | NOT SPECIFIED | 0.85V | 0.8mm | - | NOT SPECIFIED | S-PBGA-B784 | - | - | - | 500MHz, 1.2GHz | 1.2MB | MICROPROCESSOR CIRCUIT | Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2 | DMA, WDT | CANbus, I2C, SPI, UART/USART, USB | MPU, FPGA | - | - | - | Zynq®UltraScale+™ FPGA, 103K+ Logic Cells | - | 3.32mm | 23mm | 23mm | ROHS3 Compliant | ||
| XAZU2EG-1SFVC784I |
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