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- Embedded - System On Chip (SoC)
| Изображение | Тип | Марка | Объяснение | Установленная цена | Количество | RoHS | Factory Lead Time | Package / Case | Surface Mount | Number of I/Os | Usage Level | Operating Temperature | Packaging | Published | Series | Pbfree Code | Part Status | Moisture Sensitivity Level (MSL) | Number of Terminations | ECCN Code | Additional Feature | HTS Code | Terminal Position | Terminal Form | Peak Reflow Temperature (Cel) | Supply Voltage | Terminal Pitch | Time@Peak Reflow Temperature-Max (s) | JESD-30 Code | Supply Voltage-Max (Vsup) | Supply Voltage-Min (Vsup) | Speed | RAM Size | uPs/uCs/Peripheral ICs Type | Core Processor | Peripherals | Connectivity | Architecture | Primary Attributes | Height Seated (Max) | Length | Width | RoHS Status |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
![]() | Mfr. ТипXCZU2CG-L1SFVC784IAnlielectronics Тип | Xilinx Inc. |
IC SOC CORTEX-A53 784FCBGA
Сборник данных
Сравнение
| Min.:1 Mult.:1 | 11 Weeks | 784-BFBGA, FCBGA | YES | 252 | - | -40°C~100°C TJ | Tray | - | Zynq® UltraScale+™ MPSoC CG | - | Active | 4 (72 Hours) | 784 | - | IT ALSO OPERATES AT 0.85V NOMINAL SUPPLY(PROCESSING SYSTEM) | 8542.31.00.01 | BOTTOM | BALL | NOT SPECIFIED | 0.72V | - | NOT SPECIFIED | S-PBGA-B784 | - | - | 500MHz, 1.2GHz | 256KB | MICROPROCESSOR CIRCUIT | Dual ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™ | DMA, WDT | CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | MCU, FPGA | Zynq®UltraScale+™ FPGA, 103K+ Logic Cells | - | - | - | ROHS3 Compliant | ||
| XCZU2CG-L1SFVC784I | |||||||||||||||||||||||||||||||||||||||||||
![]() | Mfr. ТипXCZU2CG-L1SFVA625IAnlielectronics Тип | Xilinx Inc. |
IC SOC CORTEX-A53 625FCBGA
Сборник данных
Сравнение
| Min.:1 Mult.:1 | 11 Weeks | 625-BFBGA, FCBGA | YES | 180 | - | -40°C~100°C TJ | Tray | - | Zynq® UltraScale+™ MPSoC CG | - | Active | 4 (72 Hours) | 625 | - | ALSO AVAILABLE WITH 0.85V NOMINAL SUPPLY | 8542.31.00.01 | BOTTOM | BALL | NOT SPECIFIED | 0.72V | - | NOT SPECIFIED | R-PBGA-B625 | 0.742V | 0.698V | 500MHz, 1.2GHz | 256KB | MICROPROCESSOR CIRCUIT | Dual ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™ | DMA, WDT | CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | MCU, FPGA | Zynq®UltraScale+™ FPGA, 103K+ Logic Cells | - | - | - | ROHS3 Compliant | ||
| XCZU2CG-L1SFVA625I | |||||||||||||||||||||||||||||||||||||||||||
![]() | Mfr. ТипXCZU9CG-L1FFVB1156IAnlielectronics Тип | Xilinx Inc. |
IC SOC CORTEX-A53 1156FCBGA
Сборник данных
Сравнение
| Min.:1 Mult.:1 | 11 Weeks | 1156-BBGA, FCBGA | YES | 328 | - | -40°C~100°C TJ | Bulk | 2016 | Zynq® UltraScale+™ MPSoC CG | - | Active | 4 (72 Hours) | - | - | ALSO AVAILABLE WITH 0.85V NOMINAL SUPPLY | 8542.31.00.01 | BOTTOM | BALL | NOT SPECIFIED | 0.72V | - | NOT SPECIFIED | R-PBGA-B1156 | 0.742V | 0.698V | 500MHz, 1.2GHz | 256KB | MICROPROCESSOR CIRCUIT | Dual ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™ | DMA, WDT | CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | MCU, FPGA | Zynq®UltraScale+™ FPGA, 599K+ Logic Cells | - | - | - | ROHS3 Compliant | ||
| XCZU9CG-L1FFVB1156I | |||||||||||||||||||||||||||||||||||||||||||
![]() | Mfr. ТипXCZU5EV-1FBVB900IAnlielectronics Тип | Xilinx Inc. |
IC SOC CORTEX-A53 900FCBGA
Сборник данных
Сравнение
| Min.:1 Mult.:1 | 11 Weeks | 900-BBGA, FCBGA | - | 204 | - | -40°C~100°C TJ | Tray | 2016 | Zynq® UltraScale+™ MPSoC EV | - | Active | 4 (72 Hours) | - | - | - | 8542.31.00.01 | - | - | NOT SPECIFIED | - | - | NOT SPECIFIED | - | - | - | 500MHz, 600MHz, 1.2GHz | 256KB | - | Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2 | DMA, WDT | CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | MCU, FPGA | Zynq®UltraScale+™ FPGA, 256K+ Logic Cells | - | - | - | ROHS3 Compliant | ||
| XCZU5EV-1FBVB900I | |||||||||||||||||||||||||||||||||||||||||||
![]() | Mfr. ТипXCZU4CG-2FBVB900IAnlielectronics Тип | Xilinx Inc. |
FPGA Zynq UltraScale Family 192150 Cells 20nm Technology 0.85V 900-Pin FCBGA Tray
Сборник данных
Сравнение
| Min.:1 Mult.:1 | 11 Weeks | 900-BBGA, FCBGA | YES | 204 | - | -40°C~100°C TJ | Tray | 2016 | Zynq® UltraScale+™ MPSoC CG | - | Active | 4 (72 Hours) | 900 | - | - | 8542.31.00.01 | BOTTOM | BALL | NOT SPECIFIED | 0.85V | - | NOT SPECIFIED | R-PBGA-B900 | 0.876V | 0.825V | 533MHz, 1.3GHz | 256KB | MICROPROCESSOR CIRCUIT | Dual ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™ | DMA, WDT | CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | MCU, FPGA | Zynq®UltraScale+™ FPGA, 192K+ Logic Cells | - | - | - | ROHS3 Compliant | ||
| XCZU4CG-2FBVB900I | |||||||||||||||||||||||||||||||||||||||||||
![]() | Mfr. ТипXAZU3EG-1SFVA625QAnlielectronics Тип | Xilinx Inc. |
IC SOC CORTEX-A53 625FCBGA
Сборник данных
Сравнение
| Min.:1 Mult.:1 | 11 Weeks | 625-BFBGA, FCBGA | YES | 128 | - | -40°C~125°C TJ | Tray | - | Zynq® UltraScale+™ MPSoC EG | - | Active | 4 (72 Hours) | 625 | - | - | 8542.31.00.01 | BOTTOM | BALL | NOT SPECIFIED | 0.85V | 0.8mm | NOT SPECIFIED | S-PBGA-B625 | - | - | 500MHz, 1.2GHz | 1.8MB | MICROPROCESSOR CIRCUIT | Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2 | DMA, WDT | CANbus, I2C, SPI, UART/USART, USB | MPU, FPGA | Zynq®UltraScale+™ FPGA, 154K+ Logic Cells | 3.43mm | 21mm | 21mm | ROHS3 Compliant | ||
| XAZU3EG-1SFVA625Q | |||||||||||||||||||||||||||||||||||||||||||
![]() | Mfr. ТипXCZU11EG-1FFVC1760IAnlielectronics Тип | Xilinx Inc. |
FPGA Zynq UltraScale Family 653100 Cells 20nm Technology 0.85V 1760-Pin FCBGA Tray
Сборник данных
Сравнение
| Min.:1 Mult.:1 | 11 Weeks | 1760-BBGA, FCBGA | - | 512 | - | -40°C~100°C TJ | Tray | 2016 | Zynq® UltraScale+™ MPSoC EG | - | Active | 4 (72 Hours) | - | - | - | 8542.31.00.01 | - | - | NOT SPECIFIED | - | - | NOT SPECIFIED | - | - | - | 500MHz, 600MHz, 1.2GHz | 256KB | - | Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2 | DMA, WDT | CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | MCU, FPGA | Zynq®UltraScale+™ FPGA, 653K+ Logic Cells | - | - | - | ROHS3 Compliant | ||
| XCZU11EG-1FFVC1760I | |||||||||||||||||||||||||||||||||||||||||||
![]() | Mfr. ТипXCZU19EG-L2FFVB1517EAnlielectronics Тип | Xilinx Inc. |
IC SOC CORTEX-A53 1517FCBGA
Сборник данных
Сравнение
| Min.:1 Mult.:1 | 11 Weeks | 1517-BBGA, FCBGA | YES | 644 | - | 0°C~100°C TJ | Tray | 2016 | Zynq® UltraScale+™ MPSoC EG | - | Active | 4 (72 Hours) | - | - | ALSO AVAILABLE WITH 0.85V NOMINAL SUPPLY | 8542.31.00.01 | BOTTOM | BALL | NOT SPECIFIED | 0.72V | - | NOT SPECIFIED | R-PBGA-B1517 | 0.742V | 0.698V | 533MHz, 600MHz, 1.3GHz | 256KB | MICROPROCESSOR CIRCUIT | Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2 | DMA, WDT | CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | MCU, FPGA | Zynq®UltraScale+™ FPGA, 1143K+ Logic Cells | - | - | - | ROHS3 Compliant | ||
| XCZU19EG-L2FFVB1517E | |||||||||||||||||||||||||||||||||||||||||||
![]() | Mfr. ТипXCZU19EG-1FFVD1760IAnlielectronics Тип | Xilinx Inc. |
IC SOC CORTEX-A53 1760FCBGA
Сборник данных
Сравнение
| Min.:1 Mult.:1 | 11 Weeks | 1760-BBGA, FCBGA | - | 308 | - | -40°C~100°C TJ | Tray | 2016 | Zynq® UltraScale+™ MPSoC EG | - | Active | 4 (72 Hours) | - | - | - | 8542.31.00.01 | - | - | NOT SPECIFIED | - | - | NOT SPECIFIED | - | - | - | 500MHz, 600MHz, 1.2GHz | 256KB | - | Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2 | DMA, WDT | CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | MCU, FPGA | Zynq®UltraScale+™ FPGA, 1143K+ Logic Cells | - | - | - | ROHS3 Compliant | ||
| XCZU19EG-1FFVD1760I | |||||||||||||||||||||||||||||||||||||||||||
![]() | Mfr. ТипXCZU3CG-1SFVA625IAnlielectronics Тип | Xilinx Inc. |
IC SOC CORTEX-A53 625FCBGA
Сборник данных
Сравнение
| Min.:1 Mult.:1 | 11 Weeks | 625-BFBGA, FCBGA | - | 180 | - | -40°C~100°C TJ | Bulk | 2016 | Zynq® UltraScale+™ MPSoC CG | - | Active | 4 (72 Hours) | - | - | - | 8542.31.00.01 | - | - | NOT SPECIFIED | - | - | NOT SPECIFIED | - | - | - | 500MHz, 1.2GHz | 256KB | - | Dual ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™ | DMA, WDT | CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | MCU, FPGA | Zynq®UltraScale+™ FPGA, 154K+ Logic Cells | - | - | - | ROHS3 Compliant | ||
| XCZU3CG-1SFVA625I | |||||||||||||||||||||||||||||||||||||||||||
![]() | Mfr. ТипXCZU6EG-L2FFVC900EAnlielectronics Тип | Xilinx Inc. |
IC SOC CORTEX-A53 900FCBGA
Сборник данных
Сравнение
| Min.:1 Mult.:1 | 11 Weeks | 900-BBGA, FCBGA | YES | 204 | - | 0°C~100°C TJ | Tray | 2016 | Zynq® UltraScale+™ MPSoC EG | - | Active | 4 (72 Hours) | 900 | - | ALSO AVAILABLE WITH 0.85V NOMINAL SUPPLY | 8542.31.00.01 | BOTTOM | BALL | NOT SPECIFIED | 0.72V | - | NOT SPECIFIED | R-PBGA-B900 | 0.742V | 0.698V | 533MHz, 600MHz, 1.3GHz | 256KB | MICROPROCESSOR CIRCUIT | Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2 | DMA, WDT | CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | MCU, FPGA | Zynq®UltraScale+™ FPGA, 469K+ Logic Cells | - | - | - | ROHS3 Compliant | ||
| XCZU6EG-L2FFVC900E | |||||||||||||||||||||||||||||||||||||||||||
![]() | Mfr. ТипXCZU6EG-3FFVC900EAnlielectronics Тип | Xilinx Inc. |
IC SOC CORTEX-A53 900FCBGA
Сборник данных
Сравнение
| Min.:1 Mult.:1 | 11 Weeks | 900-BBGA, FCBGA | - | 204 | - | 0°C~100°C TJ | Tray | 2016 | Zynq® UltraScale+™ MPSoC EG | - | Active | 4 (72 Hours) | - | - | - | 8542.31.00.01 | - | - | NOT SPECIFIED | - | - | NOT SPECIFIED | - | - | - | 600MHz, 1.5GHz | 256KB | - | Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™ | DMA, WDT | CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | MCU, FPGA | Zynq®UltraScale+™ FPGA, 469K+ Logic Cells | - | - | - | ROHS3 Compliant | ||
| XCZU6EG-3FFVC900E | |||||||||||||||||||||||||||||||||||||||||||
![]() | Mfr. ТипXCZU7CG-L1FFVC1156IAnlielectronics Тип | Xilinx Inc. |
IC SOC CORTEX-A53 1156FCBGA
Сборник данных
Сравнение
| Min.:1 Mult.:1 | 11 Weeks | 1156-BBGA, FCBGA | YES | 360 | - | -40°C~100°C TJ | Tray | 2016 | Zynq® UltraScale+™ MPSoC CG | - | Active | 4 (72 Hours) | - | - | ALSO AVAILABLE WITH 0.85V NOMINAL SUPPLY | 8542.31.00.01 | BOTTOM | BALL | NOT SPECIFIED | 0.72V | - | NOT SPECIFIED | R-PBGA-B1156 | 0.742V | 0.698V | 500MHz, 1.2GHz | 256KB | MICROPROCESSOR CIRCUIT | Dual ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™ | DMA, WDT | CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | MCU, FPGA | Zynq®UltraScale+™ FPGA, 504K+ Logic Cells | - | - | - | ROHS3 Compliant | ||
| XCZU7CG-L1FFVC1156I | |||||||||||||||||||||||||||||||||||||||||||
![]() | Mfr. ТипXCZU3CG-L1SFVA625IAnlielectronics Тип | Xilinx Inc. |
IC SOC CORTEX-A53 625FCBGA
Сборник данных
Сравнение
| Min.:1 Mult.:1 | 11 Weeks | 625-BFBGA, FCBGA | YES | 180 | - | -40°C~100°C TJ | Tray | 2016 | Zynq® UltraScale+™ MPSoC CG | - | Active | 4 (72 Hours) | 625 | - | ALSO AVAILABLE WITH 0.85V NOMINAL SUPPLY | 8542.31.00.01 | BOTTOM | BALL | NOT SPECIFIED | 0.72V | - | NOT SPECIFIED | R-PBGA-B625 | 0.742V | 0.698V | 500MHz, 1.2GHz | 256KB | MICROPROCESSOR CIRCUIT | Dual ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™ | DMA, WDT | CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | MCU, FPGA | Zynq®UltraScale+™ FPGA, 154K+ Logic Cells | - | - | - | ROHS3 Compliant | ||
| XCZU3CG-L1SFVA625I | |||||||||||||||||||||||||||||||||||||||||||
![]() | Mfr. ТипXCZU19EG-2FFVB1517EAnlielectronics Тип | Xilinx Inc. |
IC SOC CORTEX-A53 1517FCBGA
Сборник данных
Сравнение
| Min.:1 Mult.:1 | 11 Weeks | 1517-BBGA, FCBGA | - | 644 | - | 0°C~100°C TJ | Tray | 2016 | Zynq® UltraScale+™ MPSoC EG | yes | Active | 4 (72 Hours) | - | - | - | 8542.31.00.01 | - | - | NOT SPECIFIED | - | - | NOT SPECIFIED | - | - | - | 533MHz, 600MHz, 1.3GHz | 256KB | - | Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2 | DMA, WDT | CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | MCU, FPGA | Zynq®UltraScale+™ FPGA, 1143K+ Logic Cells | - | - | - | ROHS3 Compliant | ||
| XCZU19EG-2FFVB1517E | |||||||||||||||||||||||||||||||||||||||||||
![]() | Mfr. ТипXCZU9CG-L1FFVC900IAnlielectronics Тип | Xilinx Inc. |
IC SOC CORTEX-A53 900FCBGA
Сборник данных
Сравнение
| Min.:1 Mult.:1 | 11 Weeks | 900-BBGA, FCBGA | YES | 204 | - | -40°C~100°C TJ | Bulk | 2016 | Zynq® UltraScale+™ MPSoC CG | - | Active | 4 (72 Hours) | 900 | - | ALSO AVAILABLE WITH 0.85V NOMINAL SUPPLY | 8542.31.00.01 | BOTTOM | BALL | NOT SPECIFIED | 0.72V | - | NOT SPECIFIED | R-PBGA-B900 | 0.742V | 0.698V | 500MHz, 1.2GHz | 256KB | MICROPROCESSOR CIRCUIT | Dual ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™ | DMA, WDT | CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | MCU, FPGA | Zynq®UltraScale+™ FPGA, 599K+ Logic Cells | - | - | - | ROHS3 Compliant | ||
| XCZU9CG-L1FFVC900I | |||||||||||||||||||||||||||||||||||||||||||
![]() | Mfr. ТипXCZU15EG-L1FFVC900IAnlielectronics Тип | Xilinx Inc. |
IC SOC CORTEX-A53 900FCBGA
Сборник данных
Сравнение
| Min.:1 Mult.:1 | 11 Weeks | 900-BBGA, FCBGA | YES | 204 | - | -40°C~100°C TJ | Tray | - | Zynq® UltraScale+™ MPSoC EG | - | Active | 4 (72 Hours) | 900 | - | ALSO AVAILABLE WITH 0.85V NOMINAL SUPPLY | 8542.31.00.01 | BOTTOM | BALL | NOT SPECIFIED | 0.72V | - | NOT SPECIFIED | R-PBGA-B900 | 0.742V | 0.698V | 500MHz, 600MHz, 1.2GHz | 256KB | MICROPROCESSOR CIRCUIT | Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2 | DMA, WDT | CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | MCU, FPGA | Zynq®UltraScale+™ FPGA, 747K+ Logic Cells | - | - | - | ROHS3 Compliant | ||
| XCZU15EG-L1FFVC900I | |||||||||||||||||||||||||||||||||||||||||||
![]() | Mfr. ТипXA7Z030-1FBV484QAnlielectronics Тип | Xilinx Inc. |
IC SOC CORTEX-A9 667MHZ 484FCBGA
Сборник данных
Сравнение
| Min.:1 Mult.:1 | 10 Weeks | 484-BBGA, FCBGA | YES | 130 | Automotive grade | -40°C~125°C TJ | Tray | 2010 | Automotive, AEC-Q100, Zynq®-7000 XA | - | Active | 4 (72 Hours) | 484 | EAR99 | - | 8542.39.00.01 | BOTTOM | BALL | - | - | - | - | S-PBGA-B484 | - | - | 667MHz | 256KB | MICROPROCESSOR CIRCUIT | Dual ARM® Cortex®-A9 MPCore™ with CoreSight™ | DMA | CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | MCU, FPGA | Kintex™-7 FPGA, 125K Logic Cells | - | - | - | ROHS3 Compliant | ||
| XA7Z030-1FBV484Q | |||||||||||||||||||||||||||||||||||||||||||
![]() | Mfr. ТипXCZU3CG-L2SFVA625EAnlielectronics Тип | Xilinx Inc. |
IC SOC CORTEX-A53 625FCBGA
Сборник данных
Сравнение
| Min.:1 Mult.:1 | 11 Weeks | 625-BFBGA, FCBGA | YES | 180 | - | 0°C~100°C TJ | Tray | 2016 | Zynq® UltraScale+™ MPSoC CG | - | Active | 4 (72 Hours) | 625 | - | ALSO AVAILABLE WITH 0.85V NOMINAL SUPPLY | 8542.31.00.01 | BOTTOM | BALL | NOT SPECIFIED | 0.72V | - | NOT SPECIFIED | R-PBGA-B625 | 0.742V | 0.698V | 533MHz, 1.3GHz | 256KB | MICROPROCESSOR CIRCUIT | Dual ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™ | DMA, WDT | CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | MCU, FPGA | Zynq®UltraScale+™ FPGA, 154K+ Logic Cells | - | - | - | ROHS3 Compliant | ||
| XCZU3CG-L2SFVA625E | |||||||||||||||||||||||||||||||||||||||||||
![]() | Mfr. ТипXCZU6CG-L1FFVB1156IAnlielectronics Тип | Xilinx Inc. |
IC SOC CORTEX-A53 1156FCBGA
Сборник данных
Сравнение
| Min.:1 Mult.:1 | 11 Weeks | 1156-BBGA, FCBGA | YES | 328 | - | -40°C~100°C TJ | Tray | 2016 | Zynq® UltraScale+™ MPSoC CG | - | Active | 4 (72 Hours) | - | - | ALSO AVAILABLE WITH 0.85V NOMINAL SUPPLY | 8542.31.00.01 | BOTTOM | BALL | NOT SPECIFIED | 0.72V | - | NOT SPECIFIED | R-PBGA-B1156 | 0.742V | 0.698V | 500MHz, 1.2GHz | 256KB | MICROPROCESSOR CIRCUIT | Dual ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™ | DMA, WDT | CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | MCU, FPGA | Zynq®UltraScale+™ FPGA, 469K+ Logic Cells | - | - | - | ROHS3 Compliant | ||
| XCZU6CG-L1FFVB1156I |
Индекс :
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