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- Embedded - System On Chip (SoC)
| Изображение | Тип | Марка | Объяснение | Установленная цена | Количество | RoHS | Factory Lead Time | Package / Case | Surface Mount | Supplier Device Package | Number of I/Os | Operating Temperature (Max.) | Operating Temperature (Min.) | Operating Temperature | Packaging | Published | Series | Part Status | Moisture Sensitivity Level (MSL) | Number of Terminations | Max Operating Temperature | Min Operating Temperature | Additional Feature | HTS Code | Terminal Position | Terminal Form | Peak Reflow Temperature (Cel) | Supply Voltage | Terminal Pitch | Frequency | Time@Peak Reflow Temperature-Max (s) | Base Part Number | JESD-30 Code | Supply Voltage-Max (Vsup) | Temperature Grade | Supply Voltage-Min (Vsup) | Interface | Speed | RAM Size | uPs/uCs/Peripheral ICs Type | Core Processor | Peripherals | Connectivity | Architecture | Core Architecture | Primary Attributes | Height Seated (Max) | Length | Width | RoHS Status |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
![]() | Mfr. ТипXAZU4EV-1SFVC784QAnlielectronics Тип | Xilinx Inc. |
IC FPGA SOC ZUP Q100 784SBGA
Сборник данных
Сравнение
| Min.:1 Mult.:1 | 11 Weeks | - | YES | - | - | 125°C | -40°C | - | - | - | - | Active | 3 (168 Hours) | 784 | - | - | - | 8542.31.00.01 | BOTTOM | BALL | NOT SPECIFIED | 0.85V | 0.8mm | - | NOT SPECIFIED | - | S-PBGA-B784 | - | AUTOMOTIVE | - | - | - | - | MICROPROCESSOR CIRCUIT | - | - | - | - | - | - | 3.32mm | 23mm | 23mm | ROHS3 Compliant | ||
| XAZU4EV-1SFVC784Q | ||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | Mfr. ТипXAZU2EG-1SFVA625IAnlielectronics Тип | Xilinx Inc. |
IC SOC CORTEX-A53 625FCBGA
Сборник данных
Сравнение
| Min.:1 Mult.:1 | 11 Weeks | 625-BFBGA, FCBGA | YES | - | 128 | - | - | -40°C~100°C TJ | Tray | - | Zynq® UltraScale+™ MPSoC EG | Active | 4 (72 Hours) | 625 | - | - | - | 8542.31.00.01 | BOTTOM | BALL | NOT SPECIFIED | 0.85V | 0.8mm | - | NOT SPECIFIED | - | S-PBGA-B625 | - | - | - | - | 500MHz, 1.2GHz | 1.2MB | MICROPROCESSOR CIRCUIT | Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2 | DMA, WDT | CANbus, I2C, SPI, UART/USART, USB | MPU, FPGA | - | Zynq®UltraScale+™ FPGA, 103K+ Logic Cells | 3.43mm | 21mm | 21mm | ROHS3 Compliant | ||
| XAZU2EG-1SFVA625I | ||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | Mfr. ТипXCZU19EG-1FFVE1924IAnlielectronics Тип | Xilinx Inc. |
IC SOC CORTEX-A53 1924FCBGA
Сборник данных
Сравнение
| Min.:1 Mult.:1 | 11 Weeks | 1924-BBGA, FCBGA | - | - | 668 | - | - | -40°C~100°C TJ | Tray | 2016 | Zynq® UltraScale+™ MPSoC EG | Active | 4 (72 Hours) | - | - | - | - | 8542.31.00.01 | - | - | NOT SPECIFIED | - | - | - | NOT SPECIFIED | - | - | - | - | - | - | 500MHz, 600MHz, 1.2GHz | 256KB | - | Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2 | DMA, WDT | CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | MCU, FPGA | - | Zynq®UltraScale+™ FPGA, 1143K+ Logic Cells | - | - | - | ROHS3 Compliant | ||
| XCZU19EG-1FFVE1924I | ||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | Mfr. ТипXCZU3EG-3SFVC784EAnlielectronics Тип | Xilinx Inc. |
IC SOC CORTEX-A53 784FCBGA
Сборник данных
Сравнение
| Min.:1 Mult.:1 | - | 784-BFBGA, FCBGA | YES | - | 252 | - | - | 0°C~100°C TJ | Tray | 2016 | Zynq® UltraScale+™ MPSoC EG | Obsolete | 4 (72 Hours) | 784 | - | - | - | 8542.31.00.01 | BOTTOM | BALL | NOT SPECIFIED | 0.9V | - | - | NOT SPECIFIED | - | S-PBGA-B784 | - | - | - | - | 600MHz, 667MHz, 1.5GHz | 256KB | MICROPROCESSOR CIRCUIT | Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2 | DMA, WDT | CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | MCU, FPGA | - | Zynq®UltraScale+™ FPGA, 154K+ Logic Cells | - | - | - | Non-RoHS Compliant | ||
| XCZU3EG-3SFVC784E | ||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | Mfr. ТипXAZU4EV-L1SFVC784IAnlielectronics Тип | Xilinx Inc. |
IC FPGA SOC ZUP Q100 784SBGA
Сборник данных
Сравнение
| Min.:1 Mult.:1 | 11 Weeks | - | YES | - | - | 100°C | -40°C | - | - | - | - | Active | 3 (168 Hours) | 784 | - | - | - | 8542.31.00.01 | BOTTOM | BALL | NOT SPECIFIED | 0.72V | 0.8mm | - | NOT SPECIFIED | - | S-PBGA-B784 | - | INDUSTRIAL | - | - | - | - | MICROPROCESSOR CIRCUIT | - | - | - | - | - | - | 3.32mm | 23mm | 23mm | ROHS3 Compliant | ||
| XAZU4EV-L1SFVC784I | ||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | Mfr. ТипXCZU7CG-L2FBVB900EAnlielectronics Тип | Xilinx Inc. |
IC SOC CORTEX-A53 900FCBGA
Сборник данных
Сравнение
| Min.:1 Mult.:1 | 11 Weeks | 900-BBGA, FCBGA | YES | - | 204 | - | - | 0°C~100°C TJ | Tray | 2016 | Zynq® UltraScale+™ MPSoC CG | Active | 4 (72 Hours) | 900 | - | - | ALSO AVAILABLE WITH 0.85V NOMINAL SUPPLY | 8542.31.00.01 | BOTTOM | BALL | NOT SPECIFIED | 0.72V | - | - | NOT SPECIFIED | - | R-PBGA-B900 | 0.742V | - | 0.698V | - | 533MHz, 1.3GHz | 256KB | MICROPROCESSOR CIRCUIT | Dual ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™ | DMA, WDT | CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | MCU, FPGA | - | Zynq®UltraScale+™ FPGA, 504K+ Logic Cells | - | - | - | ROHS3 Compliant | ||
| XCZU7CG-L2FBVB900E | ||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | Mfr. ТипXCZU7CG-L1FFVF1517IAnlielectronics Тип | Xilinx Inc. |
IC SOC CORTEX-A53 1517FCBGA
Сборник данных
Сравнение
| Min.:1 Mult.:1 | 11 Weeks | 1517-BBGA, FCBGA | YES | - | 464 | - | - | -40°C~100°C TJ | Tray | 2016 | Zynq® UltraScale+™ MPSoC CG | Active | 4 (72 Hours) | - | - | - | ALSO AVAILABLE WITH 0.85V NOMINAL SUPPLY | 8542.31.00.01 | BOTTOM | BALL | NOT SPECIFIED | 0.72V | - | - | NOT SPECIFIED | - | R-PBGA-B1517 | 0.742V | - | 0.698V | - | 500MHz, 1.2GHz | 256KB | MICROPROCESSOR CIRCUIT | Dual ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™ | DMA, WDT | CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | MCU, FPGA | - | Zynq®UltraScale+™ FPGA, 504K+ Logic Cells | - | - | - | ROHS3 Compliant | ||
| XCZU7CG-L1FFVF1517I | ||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | Mfr. ТипXCZU17EG-L2FFVB1517EAnlielectronics Тип | Xilinx Inc. |
IC SOC CORTEX-A53 1517FCBGA
Сборник данных
Сравнение
| Min.:1 Mult.:1 | 11 Weeks | 1517-BBGA, FCBGA | YES | - | 644 | - | - | 0°C~100°C TJ | Tray | 2016 | Zynq® UltraScale+™ MPSoC EG | Active | 4 (72 Hours) | - | - | - | ALSO AVAILABLE WITH 0.85V NOMINAL SUPPLY | 8542.31.00.01 | BOTTOM | BALL | NOT SPECIFIED | 0.72V | - | - | NOT SPECIFIED | - | R-PBGA-B1517 | 0.742V | - | 0.698V | - | 533MHz, 600MHz, 1.3GHz | 256KB | MICROPROCESSOR CIRCUIT | Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2 | DMA, WDT | CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | MCU, FPGA | - | Zynq®UltraScale+™ FPGA, 926K+ Logic Cells | - | - | - | ROHS3 Compliant | ||
| XCZU17EG-L2FFVB1517E | ||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | Mfr. ТипXCZU17EG-L1FFVC1760IAnlielectronics Тип | Xilinx Inc. |
IC SOC CORTEX-A53 1760FCBGA
Сборник данных
Сравнение
| Min.:1 Mult.:1 | 11 Weeks | 1760-BBGA, FCBGA | YES | - | 512 | - | - | -40°C~100°C TJ | Tray | 2016 | Zynq® UltraScale+™ MPSoC EG | Active | 4 (72 Hours) | - | - | - | ALSO AVAILABLE WITH 0.85V NOMINAL SUPPLY | 8542.31.00.01 | BOTTOM | BALL | NOT SPECIFIED | 0.72V | - | - | NOT SPECIFIED | - | R-PBGA-B1760 | 0.742V | - | 0.698V | - | 500MHz, 600MHz, 1.2GHz | 256KB | MICROPROCESSOR CIRCUIT | Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2 | DMA, WDT | CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | MCU, FPGA | - | Zynq®UltraScale+™ FPGA, 926K+ Logic Cells | - | - | - | ROHS3 Compliant | ||
| XCZU17EG-L1FFVC1760I | ||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | Mfr. ТипXCZU19EG-L1FFVD1760IAnlielectronics Тип | Xilinx Inc. |
IC SOC CORTEX-A53 1760FCBGA
Сборник данных
Сравнение
| Min.:1 Mult.:1 | 11 Weeks | 1760-BBGA, FCBGA | YES | - | 308 | - | - | -40°C~100°C TJ | Tray | 2016 | Zynq® UltraScale+™ MPSoC EG | Active | 4 (72 Hours) | - | - | - | ALSO AVAILABLE WITH 0.85V NOMINAL SUPPLY | 8542.31.00.01 | BOTTOM | BALL | NOT SPECIFIED | 0.72V | - | - | NOT SPECIFIED | - | R-PBGA-B1760 | 0.742V | - | 0.698V | - | 500MHz, 600MHz, 1.2GHz | 256KB | MICROPROCESSOR CIRCUIT | Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2 | DMA, WDT | CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | MCU, FPGA | - | Zynq®UltraScale+™ FPGA, 1143K+ Logic Cells | - | - | - | ROHS3 Compliant | ||
| XCZU19EG-L1FFVD1760I | ||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | Mfr. ТипXCZU19EG-L2FFVE1924EAnlielectronics Тип | Xilinx Inc. |
IC SOC CORTEX-A53 1924FCBGA
Сборник данных
Сравнение
| Min.:1 Mult.:1 | 11 Weeks | 1924-BBGA, FCBGA | YES | - | 668 | - | - | 0°C~100°C TJ | Tray | 2016 | Zynq® UltraScale+™ MPSoC EG | Active | 4 (72 Hours) | - | - | - | ALSO AVAILABLE WITH 0.85V NOMINAL SUPPLY | 8542.31.00.01 | BOTTOM | BALL | NOT SPECIFIED | 0.72V | - | - | NOT SPECIFIED | - | R-PBGA-B1924 | 0.742V | - | 0.698V | - | 533MHz, 600MHz, 1.3GHz | 256KB | MICROPROCESSOR CIRCUIT | Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2 | DMA, WDT | CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | MCU, FPGA | - | Zynq®UltraScale+™ FPGA, 1143K+ Logic Cells | - | - | - | ROHS3 Compliant | ||
| XCZU19EG-L2FFVE1924E | ||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | Mfr. ТипXCZU4CG-L1FBVB900IAnlielectronics Тип | Xilinx Inc. |
IC SOC CORTEX-A53 900FCBGA
Сборник данных
Сравнение
| Min.:1 Mult.:1 | 11 Weeks | 900-BBGA, FCBGA | YES | - | 204 | - | - | -40°C~100°C TJ | Tray | 2016 | Zynq® UltraScale+™ MPSoC CG | Active | 4 (72 Hours) | 900 | - | - | ALSO AVAILABLE WITH 0.85V NOMINAL SUPPLY | 8542.31.00.01 | BOTTOM | BALL | NOT SPECIFIED | 0.72V | - | - | NOT SPECIFIED | - | R-PBGA-B900 | 0.742V | - | 0.698V | - | 500MHz, 1.2GHz | 256KB | MICROPROCESSOR CIRCUIT | Dual ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™ | DMA, WDT | CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | MCU, FPGA | - | Zynq®UltraScale+™ FPGA, 192K+ Logic Cells | - | - | - | ROHS3 Compliant | ||
| XCZU4CG-L1FBVB900I | ||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | Mfr. ТипXCZU17EG-1FFVE1924IAnlielectronics Тип | Xilinx Inc. |
IC SOC CORTEX-A53 1924FCBGA
Сборник данных
Сравнение
| Min.:1 Mult.:1 | 11 Weeks | 1924-BBGA, FCBGA | - | - | 668 | - | - | -40°C~100°C TJ | Tray | 2016 | Zynq® UltraScale+™ MPSoC EG | Active | 4 (72 Hours) | - | - | - | - | 8542.31.00.01 | - | - | NOT SPECIFIED | - | - | - | NOT SPECIFIED | - | - | - | - | - | - | 500MHz, 600MHz, 1.2GHz | 256KB | - | Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2 | DMA, WDT | CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | MCU, FPGA | - | Zynq®UltraScale+™ FPGA, 926K+ Logic Cells | - | - | - | ROHS3 Compliant | ||
| XCZU17EG-1FFVE1924I | ||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | Mfr. ТипXCZU2CG-L2SBVA484EAnlielectronics Тип | Xilinx Inc. |
IC SOC CORTEX-A53 484FCBGA
Сборник данных
Сравнение
| Min.:1 Mult.:1 | 11 Weeks | 484-BFBGA, FCBGA | YES | - | 82 | - | - | 0°C~100°C TJ | Tray | 2016 | Zynq® UltraScale+™ MPSoC CG | Active | 4 (72 Hours) | 484 | - | - | ALSO AVAILABLE WITH 0.85V NOMINAL SUPPLY | 8542.31.00.01 | BOTTOM | BALL | NOT SPECIFIED | 0.72V | - | - | NOT SPECIFIED | - | R-PBGA-B484 | 0.742V | - | 0.698V | - | 533MHz, 1.3GHz | 256KB | MICROPROCESSOR CIRCUIT | Dual ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™ | DMA, WDT | CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | MCU, FPGA | - | Zynq®UltraScale+™ FPGA, 103K+ Logic Cells | - | - | - | ROHS3 Compliant | ||
| XCZU2CG-L2SBVA484E | ||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | Mfr. ТипXCZU17EG-1FFVE1924EAnlielectronics Тип | Xilinx Inc. |
IC SOC CORTEX-A53 1924FCBGA
Сборник данных
Сравнение
| Min.:1 Mult.:1 | 11 Weeks | 1924-BBGA, FCBGA | - | - | 668 | - | - | 0°C~100°C TJ | Tray | 2016 | Zynq® UltraScale+™ MPSoC EG | Active | 4 (72 Hours) | - | - | - | - | 8542.31.00.01 | - | - | NOT SPECIFIED | - | - | - | NOT SPECIFIED | - | - | - | - | - | - | 500MHz, 600MHz, 1.2GHz | 256KB | - | Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2 | DMA, WDT | CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | MCU, FPGA | - | Zynq®UltraScale+™ FPGA, 926K+ Logic Cells | - | - | - | ROHS3 Compliant | ||
| XCZU17EG-1FFVE1924E | ||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | Mfr. ТипXC7Z020-2CLG484CESAnlielectronics Тип | Xilinx Inc. |
IC SOC CORTEX-A9 ARTIX-7 484BGA
Сборник данных
Сравнение
| Min.:1 Mult.:1 | - | 484-LFBGA, CSPBGA | - | 484-CSPBGA (19x19) | 130 | - | - | 0°C~85°C TJ | Tray | 2010 | Zynq®-7000 | Obsolete | 3 (168 Hours) | - | 85°C | 0°C | - | - | - | - | - | - | - | 766MHz | - | XC7Z020 | - | - | - | - | CAN, EBI/EMI, Ethernet, I2C, MMC, SD, SDIO, SPI, UART, USART, USB | 766MHz | 256KB | - | Dual ARM® Cortex®-A9 MPCore™ with CoreSight™ | DMA | CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | MCU, FPGA | ARM | Artix™-7 FPGA, 85K Logic Cells | - | - | - | RoHS Compliant | ||
| XC7Z020-2CLG484CES | ||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | Mfr. ТипXCZU7CG-1FBVB900EAnlielectronics Тип | Xilinx Inc. |
IC SOC CORTEX-A53 900FCBGA
Сборник данных
Сравнение
| Min.:1 Mult.:1 | 11 Weeks | 900-BBGA, FCBGA | - | - | 204 | - | - | 0°C~100°C TJ | Tray | 2016 | Zynq® UltraScale+™ MPSoC CG | Active | 4 (72 Hours) | - | - | - | - | 8542.31.00.01 | - | - | NOT SPECIFIED | - | - | - | NOT SPECIFIED | - | - | - | - | - | - | 500MHz, 1.2GHz | 256KB | - | Dual ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™ | DMA, WDT | CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | MCU, FPGA | - | Zynq®UltraScale+™ FPGA, 504K+ Logic Cells | - | - | - | ROHS3 Compliant | ||
| XCZU7CG-1FBVB900E | ||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | Mfr. ТипXAZU3EG-1SBVA484QAnlielectronics Тип | Xilinx Inc. |
XAZU3EG-1SBVA484Q
Сборник данных
Сравнение
| Min.:1 Mult.:1 | 6 Weeks | 484-BFBGA, FCBGA | YES | - | 128 | - | - | -40°C~125°C TJ | Tray | - | Zynq® UltraScale+™ MPSoC EG | Active | - | 484 | - | - | - | 8542.31.00.01 | BOTTOM | BALL | NOT SPECIFIED | 0.85V | 0.8mm | - | NOT SPECIFIED | - | S-PBGA-B484 | - | - | - | - | 500MHz, 1.2GHz | 1.8MB | MICROPROCESSOR CIRCUIT | Quad ARM® Cortex®-A9 MPCore™ with CoreSight™, Dual ARM® Cortex®-R5 MPCore™ with CoreSight™ | DMA, WDT | CANbus, I2C, SPI, UART/USART, USB | MPU, FPGA | - | Zynq®UltraScale+™ FPGA, 154K+ Logic Cells | 2.61mm | 19mm | 19mm | ROHS3 Compliant | ||
| XAZU3EG-1SBVA484Q | ||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | Mfr. ТипXAZU4EV-1SFVC784IAnlielectronics Тип | Xilinx Inc. |
IC FPGA SOC ZU EV Q100 784SBGA
Сборник данных
Сравнение
| Min.:1 Mult.:1 | 11 Weeks | - | YES | - | - | 100°C | -40°C | - | - | - | - | Active | 3 (168 Hours) | 784 | - | - | - | 8542.31.00.01 | BOTTOM | BALL | NOT SPECIFIED | 0.85V | 0.8mm | - | NOT SPECIFIED | - | S-PBGA-B784 | - | INDUSTRIAL | - | - | - | - | MICROPROCESSOR CIRCUIT | - | - | - | - | - | - | 3.32mm | 23mm | 23mm | ROHS3 Compliant | ||
| XAZU4EV-1SFVC784I | ||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | Mfr. ТипXAZU2EG-1SBVA484QAnlielectronics Тип | Xilinx Inc. |
IC SOC CORTEX-A53 484FCBGA
Сборник данных
Сравнение
| Min.:1 Mult.:1 | 11 Weeks | 484-BFBGA, FCBGA | YES | - | 128 | - | - | -40°C~125°C TJ | Tray | - | Zynq® UltraScale+™ MPSoC EG | Active | - | 484 | - | - | - | 8542.31.00.01 | BOTTOM | BALL | NOT SPECIFIED | 0.85V | 0.8mm | - | NOT SPECIFIED | - | S-PBGA-B484 | - | - | - | - | 500MHz, 1.2GHz | 1.2MB | MICROPROCESSOR CIRCUIT | Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2 | DMA, WDT | CANbus, I2C, SPI, UART/USART, USB | MPU, FPGA | - | Zynq®UltraScale+™ FPGA, 103K+ Logic Cells | 2.61mm | 19mm | 19mm | ROHS3 Compliant | ||
| XAZU2EG-1SBVA484Q |
Индекс :
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