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- Integrated Circuits (ICs)
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- Embedded - System On Chip (SoC)
| Изображение | Тип | Марка | Объяснение | Установленная цена | Количество | RoHS | Factory Lead Time | Package / Case | Surface Mount | Number of Pins | Supplier Device Package | Base Product Number | Brand | Case Code - in | Case Code - mm | Duty Cycle - Max | Factory Pack QuantityFactory Pack Quantity | Manufacturer | Maximum Operating Temperature | Mfr | Minimum Operating Temperature | Mounting Styles | Number of I/Os | Operating Temperature (Max.) | Operating Temperature (Min.) | Package | Part # Aliases | Product Status | Resistor Values | RoHS | Supply Voltage-Max | Supply Voltage-Min | Unit Weight | Voltage-Input | Voltage, Rating | Operating Temperature | Packaging | Published | Series | Tolerance | Part Status | Moisture Sensitivity Level (MSL) | Number of Terminations | Temperature Coefficient | Type | Resistance | Max Operating Temperature | Min Operating Temperature | Applications | Power (Watts) | Additional Feature | HTS Code | Subcategory | Power Rating | Technology | Terminal Position | Terminal Form | Peak Reflow Temperature (Cel) | Supply Voltage | Terminal Pitch | Depth | Reach Compliance Code | Current Rating | Frequency | Time@Peak Reflow Temperature-Max (s) | Frequency Stability | Base Part Number | Termination Style | JESD-30 Code | Efficiency | Operating Supply Voltage | Supply Voltage-Max (Vsup) | Temperature Grade | Supply Voltage-Min (Vsup) | Inductance | Interface | Current - Output (Max) | Load Capacitance | Speed | RAM Size | uPs/uCs/Peripheral ICs Type | Core Processor | Number of Resistors | Peripherals | Connectivity | Voltage - Output | Architecture | Circuit Type | Product Type | Operating Temperature Range | ESR | Core Architecture | Form | Output Format | Primary Attributes | Flash Size | Product | Features | Product Category | Height | Height Seated (Max) | Length | Width | RoHS Status |
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![]() | Mfr. ТипXCZU7CG-L1FBVB900IAnlielectronics Тип | Xilinx Inc. |
IC SOC CORTEX-A53 900FCBGA
Сборник данных
Сравнение
| Min.:1 Mult.:1 | 11 Weeks | 900-BBGA, FCBGA | YES | - | - | - | - | - | - | - | - | - | - | - | - | - | 204 | - | - | - | - | - | - | - | - | - | - | - | - | -40°C~100°C TJ | Tray | 2016 | Zynq® UltraScale+™ MPSoC CG | - | Active | 4 (72 Hours) | 900 | - | - | - | - | - | - | - | ALSO AVAILABLE WITH 0.85V NOMINAL SUPPLY | 8542.31.00.01 | - | - | - | BOTTOM | BALL | NOT SPECIFIED | 0.72V | - | - | - | - | - | NOT SPECIFIED | - | - | - | R-PBGA-B900 | - | - | 0.742V | - | 0.698V | - | - | - | - | 500MHz, 1.2GHz | 256KB | MICROPROCESSOR CIRCUIT | Dual ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™ | - | DMA, WDT | CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | - | MCU, FPGA | - | - | - | - | - | - | - | Zynq®UltraScale+™ FPGA, 504K+ Logic Cells | - | - | - | - | - | - | - | - | ROHS3 Compliant | ||
| XCZU7CG-L1FBVB900I | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | Mfr. ТипXCZU17EG-3FFVD1760EAnlielectronics Тип | Xilinx Inc. |
IC SOC CORTEX-A53 1760FCBGA
Сборник данных
Сравнение
| Min.:1 Mult.:1 | 11 Weeks | 1760-BBGA, FCBGA | - | - | - | - | - | - | - | - | - | - | - | - | - | - | 308 | - | - | - | - | - | - | - | - | - | - | - | - | 0°C~100°C TJ | Tray | 2016 | Zynq® UltraScale+™ MPSoC EG | - | Active | 4 (72 Hours) | - | - | - | - | - | - | - | - | - | 8542.31.00.01 | - | - | - | - | - | NOT SPECIFIED | - | - | - | - | - | - | NOT SPECIFIED | - | - | - | - | - | - | - | - | - | - | - | - | - | 600MHz, 667MHz, 1.5GHz | 256KB | - | Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2 | - | DMA, WDT | CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | - | MCU, FPGA | - | - | - | - | - | - | - | Zynq®UltraScale+™ FPGA, 926K+ Logic Cells | - | - | - | - | - | - | - | - | ROHS3 Compliant | ||
| XCZU17EG-3FFVD1760E | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | Mfr. ТипXCZU2EG-3SBVA484EAnlielectronics Тип | Xilinx Inc. |
IC SOC CORTEX-A53 484FCBGA
Сборник данных
Сравнение
| Min.:1 Mult.:1 | - | 484-BFBGA, FCBGA | YES | - | - | - | - | - | - | - | - | - | - | - | - | - | 82 | - | - | - | - | - | - | - | - | - | - | - | - | 0°C~100°C TJ | Tray | 2013 | Zynq® UltraScale+™ MPSoC EG | - | Obsolete | 4 (72 Hours) | 484 | - | - | - | - | - | - | - | - | - | - | - | - | BOTTOM | BALL | - | 0.9V | - | - | compliant | - | - | - | - | - | - | S-PBGA-B484 | - | - | - | - | - | - | - | - | - | 600MHz, 667MHz, 1.5GHz | 256KB | MICROPROCESSOR CIRCUIT | Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2 | - | DMA, WDT | CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | - | MCU, FPGA | - | - | - | - | - | - | - | Zynq®UltraScale+™ FPGA, 103K+ Logic Cells | - | - | - | - | - | - | - | - | - | ||
| XCZU2EG-3SBVA484E | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | Mfr. ТипXCZU19EG-3FFVE1924EAnlielectronics Тип | Xilinx Inc. |
IC SOC CORTEX-A53 1924FCBGA
Сборник данных
Сравнение
| Min.:1 Mult.:1 | 11 Weeks | 1924-BBGA, FCBGA | - | - | - | - | - | - | - | - | - | - | - | - | - | - | 668 | - | - | - | - | - | - | - | - | - | - | - | - | 0°C~100°C TJ | Tray | 2016 | Zynq® UltraScale+™ MPSoC EG | - | Active | 4 (72 Hours) | - | - | - | - | - | - | - | - | - | 8542.31.00.01 | - | - | - | - | - | NOT SPECIFIED | - | - | - | - | - | - | NOT SPECIFIED | - | - | - | - | - | - | - | - | - | - | - | - | - | 600MHz, 667MHz, 1.5GHz | 256KB | - | Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2 | - | DMA, WDT | CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | - | MCU, FPGA | - | - | - | - | - | - | - | Zynq®UltraScale+™ FPGA, 1143K+ Logic Cells | - | - | - | - | - | - | - | - | ROHS3 Compliant | ||
| XCZU19EG-3FFVE1924E | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | Mfr. ТипXCZU2EG-3SFVA625EAnlielectronics Тип | Xilinx Inc. |
IC SOC CORTEX-A53 625FCBGA
Сборник данных
Сравнение
| Min.:1 Mult.:1 | - | 625-BFBGA, FCBGA | YES | - | - | - | - | - | - | - | - | - | - | - | - | - | 180 | - | - | - | - | - | - | - | - | - | - | - | - | 0°C~100°C TJ | Tray | 2013 | Zynq® UltraScale+™ MPSoC EG | - | Obsolete | 4 (72 Hours) | 625 | - | - | - | - | - | - | - | - | - | - | - | - | BOTTOM | BALL | - | 0.9V | - | - | compliant | - | - | - | - | - | - | S-PBGA-B625 | - | - | - | - | - | - | - | - | - | 600MHz, 667MHz, 1.5GHz | 256KB | MICROPROCESSOR CIRCUIT | Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2 | - | DMA, WDT | CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | - | MCU, FPGA | - | - | - | - | - | - | - | Zynq®UltraScale+™ FPGA, 103K+ Logic Cells | - | - | - | - | - | - | - | - | - | ||
| XCZU2EG-3SFVA625E | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | Mfr. ТипXC7Z035-2FFV676EAnlielectronics Тип | Xilinx Inc. |
IC SOC CORTEX-A9 800MHZ 676FCBGA
Сборник данных
Сравнение
| Min.:1 Mult.:1 | 11 Weeks | 676-BBGA, FCBGA | - | - | 676-FCBGA (27x27) | - | - | - | - | - | - | - | - | - | - | - | 130 | - | - | - | - | - | - | - | - | - | - | - | - | 0°C~100°C TJ | Bulk | 2010 | Zynq®-7000 | - | Active | 4 (72 Hours) | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | 800MHz | 256KB | - | Dual ARM® Cortex®-A9 MPCore™ with CoreSight™ | - | DMA | CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | - | MCU, FPGA | - | - | - | - | - | - | - | Kintex™-7 FPGA, 275K Logic Cells | - | - | - | - | - | - | - | - | ROHS3 Compliant | ||
| XC7Z035-2FFV676E | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | Mfr. ТипXAZU5EV-L1SFVC784IAnlielectronics Тип | Xilinx Inc. |
IC FPGA SOC ZUEV LP Q100 784SBGA
Сборник данных
Сравнение
| Min.:1 Mult.:1 | 11 Weeks | - | YES | - | - | - | - | - | - | - | - | - | - | - | - | - | - | 100°C | -40°C | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | Active | 3 (168 Hours) | 784 | - | - | - | - | - | - | - | - | 8542.31.00.01 | - | - | - | BOTTOM | BALL | NOT SPECIFIED | 0.72V | 0.8mm | - | - | - | - | NOT SPECIFIED | - | - | - | S-PBGA-B784 | - | - | - | INDUSTRIAL | - | - | - | - | - | - | - | MICROPROCESSOR CIRCUIT | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | 3.32mm | 23mm | 23mm | ROHS3 Compliant | ||
| XAZU5EV-L1SFVC784I | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | Mfr. ТипXCZU19EG-L1FFVE1924IAnlielectronics Тип | Xilinx Inc. |
IC SOC CORTEX-A53 1924FCBGA
Сборник данных
Сравнение
| Min.:1 Mult.:1 | 11 Weeks | 1924-BBGA, FCBGA | YES | - | - | - | - | - | - | - | - | - | - | - | - | - | 668 | - | - | - | - | - | - | - | - | - | - | - | - | -40°C~100°C TJ | Tray | 2016 | Zynq® UltraScale+™ MPSoC EG | - | Active | 4 (72 Hours) | - | - | - | - | - | - | - | - | ALSO AVAILABLE WITH 0.85V NOMINAL SUPPLY | 8542.31.00.01 | - | - | - | BOTTOM | BALL | NOT SPECIFIED | 0.72V | - | - | - | - | - | NOT SPECIFIED | - | - | - | R-PBGA-B1924 | - | - | 0.742V | - | 0.698V | - | - | - | - | 500MHz, 600MHz, 1.2GHz | 256KB | MICROPROCESSOR CIRCUIT | Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2 | - | DMA, WDT | CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | - | MCU, FPGA | - | - | - | - | - | - | - | Zynq®UltraScale+™ FPGA, 1143K+ Logic Cells | - | - | - | - | - | - | - | - | ROHS3 Compliant | ||
| XCZU19EG-L1FFVE1924I | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | Mfr. ТипXCZU17EG-L2FFVE1924EAnlielectronics Тип | Xilinx Inc. |
IC SOC CORTEX-A53 1924FCBGA
Сборник данных
Сравнение
| Min.:1 Mult.:1 | 11 Weeks | 1924-BBGA, FCBGA | YES | - | - | - | - | - | - | - | - | - | - | - | - | - | 668 | - | - | - | - | - | - | - | - | - | - | - | - | 0°C~100°C TJ | Tray | 2016 | Zynq® UltraScale+™ MPSoC EG | - | Active | 4 (72 Hours) | - | - | - | - | - | - | - | - | ALSO AVAILABLE WITH 0.85V NOMINAL SUPPLY | 8542.31.00.01 | - | - | - | BOTTOM | BALL | NOT SPECIFIED | 0.72V | - | - | - | - | - | NOT SPECIFIED | - | - | - | R-PBGA-B1924 | - | - | 0.742V | - | 0.698V | - | - | - | - | 533MHz, 600MHz, 1.3GHz | 256KB | MICROPROCESSOR CIRCUIT | Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2 | - | DMA, WDT | CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | - | MCU, FPGA | - | - | - | - | - | - | - | Zynq®UltraScale+™ FPGA, 926K+ Logic Cells | - | - | - | - | - | - | - | - | ROHS3 Compliant | ||
| XCZU17EG-L2FFVE1924E | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | Mfr. ТипXC7Z020-2CLG400CESAnlielectronics Тип | Xilinx Inc. |
IC SOC CORTEX-A9 ARTIX-7 400BGA
Сборник данных
Сравнение
| Min.:1 Mult.:1 | - | 400-LFBGA, CSPBGA | - | - | 400-CSPBGA (17x17) | - | - | - | - | - | - | - | - | - | - | - | 130 | - | - | - | - | - | - | - | - | - | - | - | - | 0°C~85°C TJ | Tray | 2010 | Zynq®-7000 | - | Obsolete | 3 (168 Hours) | - | - | - | - | 85°C | 0°C | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | 766MHz | - | - | XC7Z020 | - | - | - | - | - | - | - | - | CAN, EBI/EMI, Ethernet, I2C, MMC, SD, SDIO, SPI, UART, USART, USB | - | - | 766MHz | 256KB | - | Dual ARM® Cortex®-A9 MPCore™ with CoreSight™ | - | DMA | CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | - | MCU, FPGA | - | - | - | - | ARM | - | - | Artix™-7 FPGA, 85K Logic Cells | - | - | - | - | - | - | - | - | RoHS Compliant | ||
| XC7Z020-2CLG400CES | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | Mfr. ТипXCZU47DR-L1FFVE1156IAnlielectronics Тип | Xilinx |
IC ZUP RFSOC A53 FPGA LP 1156BGA
Сборник данных
Сравнение
| Min.:1 Mult.:1 | - | 1156-BBGA, FCBGA | - | - | 1156-FCBGA (35x35) | - | - | - | - | - | - | - | - | AUTEC POWER SYSTEMS | - | - | 366 | - | - | Case | - | Active | - | - | - | - | - | 100 ~ 240 VAC | - | -40°C ~ 100°C (TJ) | - | - | DT030GS (30W) | - | - | - | - | - | - | - | - | - | ITE (Commercial) | 30 W | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | Level VI | - | - | - | - | - | - | 536mA | - | 500MHz, 1.2GHz | 256KB | - | Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™ | - | DMA, WDT | CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | 56V | MCU, FPGA | - | - | - | - | - | Desktop | - | Zynq®UltraScale+™ FPGA, 930K+ Logic Cells | - | - | - | - | - | - | - | - | - | ||
| XCZU47DR-L1FFVE1156I | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | Mfr. ТипXCZU47DR-2FFVE1156EAnlielectronics Тип | Xilinx |
IC ZUP RFSOC A53 FPGA 1156BGA
Сборник данных
Сравнение
| Min.:1 Mult.:1 | - | 1156-BBGA, FCBGA | - | - | 1156-FCBGA (35x35) | CIR06 | - | - | - | - | - | - | - | ITT Cannon, LLC | - | - | 366 | - | - | Bulk | - | Active | - | - | - | - | - | - | - | 0°C ~ 100°C (TJ) | - | - | * | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | 533MHz, 1.333GHz | 256KB | - | Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™ | - | DMA, WDT | CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | - | MCU, FPGA | - | - | - | - | - | - | - | Zynq®UltraScale+™ FPGA, 930K+ Logic Cells | - | - | - | - | - | - | - | - | - | ||
| XCZU47DR-2FFVE1156E | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | Mfr. ТипXCZU46DR-L2FFVH1760IAnlielectronics Тип | Xilinx |
IC ZUP RFSOC A53 FPGA LP 1760BGA
Сборник данных
Сравнение
| Min.:1 Mult.:1 | - | 1760-BBGA, FCBGA | - | - | 1760-FCBGA (42.5x42.5) | - | - | - | - | - | - | - | - | Glenair | - | - | 574 | - | - | Retail Package | - | Active | - | - | - | - | - | - | - | -40°C ~ 100°C (TJ) | - | - | * | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | 533MHz, 1.333GHz | 256KB | - | Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™ | - | DDR, DMA, PCIe | CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | - | MCU, FPGA | - | - | - | - | - | - | - | Zynq®UltraScale+™ FPGA, 930K+ Logic Cells | - | - | - | - | - | - | - | - | - | ||
| XCZU46DR-L2FFVH1760I | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | Mfr. ТипXCVM1302-2LLEVSVD1760Anlielectronics Тип | Xilinx |
SoC FPGA XCVM1302-2LLEVSVD1760
Сборник данных
Сравнение
| Min.:1 Mult.:1 | - | 7 mm x 5 mm | - | - | 1760-FCBGA (40x40) | - | CTS Electronic Components | - | - | 55 % | 1000 | CTS | + 70 C | AMD Xilinx | - 20 C | - | 402 | - | - | Tray | - | Active | - | Details | 2.62 V | 2.37 V | - | - | - | 0°C ~ 100°C (TJ) | Reel | - | 637 | - | - | - | - | - | - | - | - | - | - | - | - | - | Oscillators | - | - | - | - | - | - | - | - | - | 55 mA | 155.52 MHz | - | 25 PPM | - | SMD/SMT | - | - | 700 mV | - | - | - | - | - | - | - | 450MHz, 1.08GHz | - | - | Dual ARM® Cortex®-A72 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5F with CoreSight™ | - | DDR, DMA, PCIe | CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | - | MPU, FPGA | - | Standard Oscillators | - | - | - | - | LVPECL | Versal™ Prime FPGA, 70k Logic Cells | - | - | - | Standard Clock Oscillators | 2 mm | - | 7 mm | 5 mm | - | ||
| XCVM1302-2LLEVSVD1760 | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | Mfr. ТипXCVM1402-2LLEVSVD1760Anlielectronics Тип | Xilinx |
SoC FPGA XCVM1402-2LLEVSVD1760
Сборник данных
Сравнение
| Min.:1 Mult.:1 | - | 1760-BFBGA, FCBGA | - | - | 1760-FCBGA (40x40) | - | ITT Cannon | - | - | - | 1 | ITT Cannon | + 110 C | AMD Xilinx | 0 C | - | 726 | - | - | Tray | 110704-0148 | Active | - | - | - | - | - | - | - | 0°C ~ 100°C (TJ) | - | - | KPT | - | - | - | - | - | - | - | - | - | - | - | - | - | D-Sub Connectors | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | 700 mV | - | - | - | - | - | - | - | 450MHz, 1.08GHz | - | - | Dual ARM® Cortex®-A72 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5F with CoreSight™ | - | DDR, DMA, PCIe | CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | - | MPU, FPGA | - | D-Sub Connectors - Standard Density | - | - | - | - | - | Versal™ Prime FPGA, 1.2M Logic Cells | - | - | - | D-Sub Standard Connectors | - | - | - | - | - | ||
| XCVM1402-2LLEVSVD1760 | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | Mfr. ТипXCVM1302-1LSIVSVD1760Anlielectronics Тип | Xilinx |
SoC FPGA XCVM1302-1LSIVSVD1760
Сборник данных
Сравнение
| Min.:1 Mult.:1 | - | 1760-BFBGA, FCBGA | - | - | 1760-FCBGA (40x40) | - | TE Connectivity / Holsworthy | 0805 | 2012 | - | 5000 | TE Connectivity | + 155 C | AMD Xilinx | - 55 C | PCB Mount | 402 | - | - | Tray | 5-1614959-1 | Active | - | Details | - | - | 0.000225 oz | - | 100 V | -40°C ~ 100°C (TJ) | MouseReel | - | CPF | 0.1 % | - | - | - | 25 PPM / C | High Stability Thin Film Precision Resistor | 1.37 MOhms | - | - | - | - | - | - | Resistors | 100 mW (1/10 W) | Thin Film | - | - | - | - | - | - | - | - | - | - | - | - | SMD/SMT | - | - | 700 mV | - | - | - | - | - | - | - | 400MHz, 1GHz | - | - | Dual ARM® Cortex®-A72 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5F with CoreSight™ | - | DDR, DMA, PCIe | CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | - | MPU, FPGA | - | Thin Film Resistors | - | - | - | - | - | Versal™ Prime FPGA, 70k Logic Cells | - | Precision Resistors Thin Film SMD | - | Thin Film Resistors - SMD | 0.55 mm | - | 2 mm | 1.25 mm | - | ||
| XCVM1302-1LSIVSVD1760 | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | Mfr. ТипXCVM1302-1LLIVSVD1760Anlielectronics Тип | Xilinx |
SoC FPGA XCVM1302-1LLIVSVD1760
Сборник данных
Сравнение
| Min.:1 Mult.:1 | - | 1760-BFBGA, FCBGA | - | - | 1760-FCBGA (40x40) | - | Glenair | - | - | - | 1 | Glenair | + 110 C | AMD Xilinx | - 40 C | - | 402 | - | - | Tray | - | Active | - | - | - | - | - | - | - | -40°C ~ 100°C (TJ) | - | - | 928 | - | - | - | - | - | - | - | - | - | - | - | - | - | Power | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | 700 mV | - | - | - | - | - | - | - | 400MHz, 1GHz | - | - | Dual ARM® Cortex®-A72 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5F with CoreSight™ | - | DDR, DMA, PCIe | CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | - | MPU, FPGA | - | Lighting Connectors | - | - | - | - | - | Versal™ Prime FPGA, 70k Logic Cells | - | - | - | Lighting Connectors | - | - | - | - | - | ||
| XCVM1302-1LLIVSVD1760 | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | Mfr. ТипXCVC1902-1LLIVSVA2197-5098Anlielectronics Тип | Xilinx |
SoC FPGA XCVC1902-1LLIVSVA2197-5098
Сборник данных
Сравнение
| Min.:1 Mult.:1 | - | - | - | - | - | - | Xilinx | - | - | - | 1 | Xilinx | + 110 C | - | - 40 C | - | - | - | - | - | - | - | - | Compliant | - | - | - | - | - | - | - | - | - | 40 % | - | - | - | - | - | - | - | - | - | - | - | - | SOC - Systems on a Chip | - | - | - | - | - | - | - | 7.5 mm | - | - | - | - | - | - | - | - | - | 700 mV | - | - | - | 5.8 µH | - | - | - | - | - | - | - | - | - | - | - | - | - | System-On-Modules - SOM | - | - | - | - | - | - | - | - | - | SoC FPGA | 7.5 mm | - | 9.4 mm | 6.5 mm | - | ||
| XCVC1902-1LLIVSVA2197-5098 | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | Mfr. ТипXCZU67DR-1FSVE1156IES9919Anlielectronics Тип | Xilinx |
SoC FPGA XCZU67DR-1FSVE1156IES9919
Сборник данных
Сравнение
| Min.:1 Mult.:1 | - | 1.6 mm x 1.2 mm | - | - | - | - | CTS Electronic Components | - | - | - | 3000 | CTS | + 70 C | - | - 20 C | - | - | - | - | - | - | - | - | Details | - | - | - | - | - | - | Reel | - | 416 | 15 PPM | - | - | - | - | - | - | - | - | - | - | - | - | Crystals | - | - | - | - | - | - | - | - | - | - | 50 MHz | - | 15 PPM | - | SMD/SMT | - | - | - | - | - | - | - | - | - | 18 pF | - | - | - | - | - | - | - | - | - | - | Crystals | - | 100 Ohms | - | - | - | - | - | - | - | Crystals | - | - | 1.6 mm | 1.2 mm | - | ||
| XCZU67DR-1FSVE1156IES9919 | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | Mfr. ТипXCVM2202-1MSEVSVC2197Anlielectronics Тип | Xilinx |
SoC FPGA XCVM2202-1MSEVSVC2197
Сборник данных
Сравнение
| Min.:1 Mult.:1 | - | 0402 (1005 metric) | - | 8 | - | - | CTS Electronic Components | - | - | - | 10000 | CTS | + 125 C | - | - 55 C | - | - | - | - | - | - | - | 82 kOhms | Details | - | - | 0.000023 oz | - | - | - | MouseReel | - | 74x | 5 % | - | - | - | 200 PPM / C | - | - | - | - | - | - | - | - | Resistors | - | - | - | - | - | - | - | - | - | - | - | - | - | - | SMD/SMT | - | - | 800 mV | - | - | - | - | - | - | - | - | - | - | - | 4 | - | - | - | - | Isolated | Resistor Networks & Arrays | - 55 C to + 125 C | - | - | - | - | - | - | Arrays | - | Resistor Networks & Arrays | 0.4 mm | - | 2 mm | 1 mm | - | ||
| XCVM2202-1MSEVSVC2197 |
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