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| Изображение | Тип | Марка | Объяснение | Установленная цена | Количество | RoHS | Factory Lead Time | Contact Plating | Mount | Package / Case | Surface Mount | Number of Pins | Supplier Device Package | Number of I/Os | Usage Level | Operating Temperature | Packaging | Published | Series | JESD-609 Code | Pbfree Code | Part Status | Moisture Sensitivity Level (MSL) | Number of Terminations | ECCN Code | Terminal Finish | Max Operating Temperature | Min Operating Temperature | Additional Feature | HTS Code | Terminal Position | Terminal Form | Peak Reflow Temperature (Cel) | Supply Voltage | Terminal Pitch | Reach Compliance Code | Frequency | Time@Peak Reflow Temperature-Max (s) | Base Part Number | JESD-30 Code | Qualification Status | Operating Supply Voltage | Supply Voltage-Max (Vsup) | Power Supplies | Supply Voltage-Min (Vsup) | Interface | Max Supply Voltage | Min Supply Voltage | Speed | RAM Size | uPs/uCs/Peripheral ICs Type | Core Processor | Peripherals | Clock Frequency | Propagation Delay | Connectivity | Architecture | Data Bus Width | Core Architecture | Max Frequency | Boundary Scan | Speed Grade | RAM (words) | Primary Attributes | Number of Registers | Bus Compatibility | UV Erasable | Height Seated (Max) | Length | Width | Radiation Hardening | RoHS Status |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
![]() | Mfr. ТипXCZU4EV-1SFVC784EAnlielectronics Тип | Xilinx Inc. |
XILINX - XCZU4EV-1SFVC784E - Microprocessor PSoC/MPSoC, Zynq Family UltraScale ARM Cortex-A53, ARM Cortex-R5, 1.5GHz, FCBGA-784
Сборник данных
Сравнение
| Min.:1 Mult.:1 | 11 Weeks | - | - | 784-BFBGA, FCBGA | - | - | - | 252 | - | 0°C~100°C TJ | Tray | 2016 | Zynq® UltraScale+™ MPSoC EV | - | - | Active | 4 (72 Hours) | - | - | - | - | - | - | 8542.31.00.01 | - | - | NOT SPECIFIED | - | - | - | - | NOT SPECIFIED | - | - | - | - | - | - | - | - | - | - | 500MHz, 600MHz, 1.2GHz | 256KB | - | Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2 | DMA, WDT | - | - | CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | MCU, FPGA | - | - | - | - | - | - | Zynq®UltraScale+™ FPGA, 192K+ Logic Cells | - | - | - | - | - | - | - | ROHS3 Compliant | ||
| XCZU4EV-1SFVC784E | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | Mfr. ТипXCZU6CG-1FFVB1156IAnlielectronics Тип | Xilinx Inc. |
IC SOC CORTEX-A53 1156FCBGA
Сборник данных
Сравнение
| Min.:1 Mult.:1 | 11 Weeks | - | - | 1156-BBGA, FCBGA | - | - | - | 328 | - | -40°C~100°C TJ | Bulk | 2016 | Zynq® UltraScale+™ MPSoC CG | - | - | Active | 4 (72 Hours) | - | - | - | - | - | - | 8542.31.00.01 | - | - | NOT SPECIFIED | - | - | - | - | NOT SPECIFIED | - | - | - | - | - | - | - | - | - | - | 500MHz, 1.2GHz | 256KB | - | Dual ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™ | DMA, WDT | - | - | CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | MCU, FPGA | - | - | - | - | - | - | Zynq®UltraScale+™ FPGA, 469K+ Logic Cells | - | - | - | - | - | - | - | ROHS3 Compliant | ||
| XCZU6CG-1FFVB1156I | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | Mfr. ТипXA7Z020-1CLG400QAnlielectronics Тип | Xilinx Inc. |
IC SOC CORTEX-A9 667MHZ 400BGA
Сборник данных
Сравнение
| Min.:1 Mult.:1 | 10 Weeks | Copper, Silver, Tin | Surface Mount | 400-LFBGA, CSPBGA | - | 400 | - | 130 | Automotive grade | -40°C~125°C TJ | Tray | 2010 | Automotive, AEC-Q100, Zynq®-7000 XA | e1 | - | Active | 3 (168 Hours) | 400 | EAR99 | Tin/Silver/Copper (Sn/Ag/Cu) | - | - | - | 8542.39.00.01 | BOTTOM | BALL | NOT SPECIFIED | - | 0.8mm | - | 667MHz | NOT SPECIFIED | - | - | Not Qualified | 1V | - | 11.8V | - | CAN, EBI/EMI, Ethernet, GPIO, I2C, MMC, SD, SDIO, SPI, UART, USART, USB | - | - | - | 256KB | MICROPROCESSOR CIRCUIT | Dual ARM® Cortex®-A9 MPCore™ with CoreSight™ | DMA | - | - | CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | MCU, FPGA | 32b | ARM | - | - | - | - | Artix™-7 FPGA, 85K Logic Cells | - | - | N | 1.6mm | 17mm | - | - | ROHS3 Compliant | ||
| XA7Z020-1CLG400Q | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | Mfr. ТипXC7Z010-L1CLG400IAnlielectronics Тип | Xilinx Inc. |
IC SOC CORTEX-A9 667MHZ 400BGA
Сборник данных
Сравнение
| Min.:1 Mult.:1 | 10 Weeks | Copper, Silver, Tin | Surface Mount | 400-LFBGA, CSPBGA | - | - | - | 130 | - | -40°C~100°C TJ | Tray | 2010 | Zynq®-7000 | e1 | - | Active | 3 (168 Hours) | 400 | EAR99 | Tin/Silver/Copper (Sn/Ag/Cu) | - | - | PL BLOCK OPERATES IN 0.97V TO 1.03V SUPPLY | 8542.39.00.01 | BOTTOM | BALL | NOT SPECIFIED | 1V | 0.8mm | - | 667MHz | NOT SPECIFIED | - | S-PBGA-B400 | - | - | - | - | - | CAN, EBI/EMI, Ethernet, I2C, MMC, SD, SDIO, SPI, UART, USART, USB | 1.05V | 950mV | - | 256KB | - | Dual ARM® Cortex®-A9 MPCore™ with CoreSight™ | DMA | - | - | CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | MCU, FPGA | - | ARM | - | YES | - | 256000 | Artix™-7 FPGA, 28K Logic Cells | 35200 | CAN; ETHERNET; I2C; SPI; UART; USB | - | 1.6mm | 17mm | 17mm | - | ROHS3 Compliant | ||
| XC7Z010-L1CLG400I | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | Mfr. ТипXC7Z035-3FFG900EAnlielectronics Тип | Xilinx Inc. |
IC SOC CORTEX-A9 800MHZ 900FCBGA
Сборник данных
Сравнение
| Min.:1 Mult.:1 | 10 Weeks | Copper, Silver, Tin | Surface Mount | 900-BBGA, FCBGA | - | - | - | 130 | - | 0°C~100°C TJ | Tray | 2010 | Zynq®-7000 | e1 | - | Active | 4 (72 Hours) | 900 | - | Tin/Silver/Copper (Sn/Ag/Cu) | - | - | - | - | BOTTOM | BALL | 245 | 1V | 1mm | - | 800MHz | 30 | - | S-PBGA-B900 | - | - | - | - | - | CAN, EBI/EMI, Ethernet, I2C, MMC, SD, SDIO, SPI, UART, USART, USB | 1.05V | 950mV | - | 256KB | - | Dual ARM® Cortex®-A9 MPCore™ with CoreSight™ | DMA | - | 90 ps | CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | MCU, FPGA | - | ARM | - | YES | 3 | 256000 | Kintex™-7 FPGA, 275K Logic Cells | 343800 | CAN; ETHERNET; I2C; SPI; UART; USB | - | - | - | - | - | ROHS3 Compliant | ||
| XC7Z035-3FFG900E | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | Mfr. ТипXCZU9EG-2FFVB1156EAnlielectronics Тип | Xilinx Inc. |
IC SOC CORTEX-A53 1156FCBGA
Сборник данных
Сравнение
| Min.:1 Mult.:1 | 11 Weeks | - | - | 1156-BBGA, FCBGA | - | - | - | 328 | - | 0°C~100°C TJ | Tray | 2013 | Zynq® UltraScale+™ MPSoC EG | - | yes | Active | 4 (72 Hours) | - | - | - | - | - | - | 8542.31.00.01 | - | - | NOT SPECIFIED | - | - | - | - | NOT SPECIFIED | - | - | - | - | - | - | - | - | - | - | 533MHz, 600MHz, 1.3GHz | 256KB | - | Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2 | DMA, WDT | - | - | CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | MCU, FPGA | - | - | - | - | - | - | Zynq®UltraScale+™ FPGA, 599K+ Logic Cells | - | - | - | - | - | - | - | ROHS3 Compliant | ||
| XCZU9EG-2FFVB1156E | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | Mfr. ТипXC7Z030-1FBG484CAnlielectronics Тип | Xilinx Inc. |
MPU Zynq-7000 Thumb-2 32-Bit 667MHz 1.2V/3.3V 484-Pin FCBGA
Сборник данных
Сравнение
| Min.:1 Mult.:1 | 10 Weeks | Copper, Silver, Tin | - | 484-BBGA, FCBGA | YES | 484 | - | 130 | - | 0°C~85°C TJ | Tray | 2009 | Zynq®-7000 | e1 | - | Active | 4 (72 Hours) | 484 | EAR99 | Tin/Silver/Copper (Sn/Ag/Cu) | - | - | - | 8542.39.00.01 | BOTTOM | BALL | 250 | 1V | 1mm | - | 667MHz | 30 | XC7Z030 | - | - | 1V | 1.05V | - | - | CAN, EBI/EMI, Ethernet, I2C, MMC, SD, SDIO, SPI, UART, USART, USB | - | - | - | 256KB | - | Dual ARM® Cortex®-A9 MPCore™ with CoreSight™ | DMA | - | - | CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | MCU, FPGA | 32b | ARM | - | YES | -1 | 256000 | Kintex™-7 FPGA, 125K Logic Cells | - | CAN; ETHERNET; I2C; SPI; UART; USB | - | 2.54mm | 23mm | - | No | ROHS3 Compliant | ||
| XC7Z030-1FBG484C | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | Mfr. ТипXCZU11EG-2FFVC1760IAnlielectronics Тип | Xilinx Inc. |
IC SOC CORTEX-A53 1760FCBGA
Сборник данных
Сравнение
| Min.:1 Mult.:1 | 11 Weeks | - | - | 1760-BBGA, FCBGA | - | - | - | 512 | - | -40°C~100°C TJ | Tray | 2016 | Zynq® UltraScale+™ MPSoC EG | - | - | Active | 4 (72 Hours) | - | - | - | - | - | - | 8542.31.00.01 | - | - | NOT SPECIFIED | - | - | - | - | NOT SPECIFIED | - | - | - | - | - | - | - | - | - | - | 533MHz, 600MHz, 1.3GHz | 256KB | - | Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2 | DMA, WDT | - | - | CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | MCU, FPGA | - | - | - | - | - | - | Zynq®UltraScale+™ FPGA, 653K+ Logic Cells | - | - | - | - | - | - | - | ROHS3 Compliant | ||
| XCZU11EG-2FFVC1760I | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | Mfr. ТипXC7Z007S-2CLG225IAnlielectronics Тип | Xilinx Inc. |
IC SOC CORTEX-A9 766MHZ 225BGA
Сборник данных
Сравнение
| Min.:1 Mult.:1 | 10 Weeks | - | - | 225-LFBGA, CSPBGA | YES | - | - | 54 | - | -40°C~100°C TJ | Tray | 2016 | Zynq®-7000 | e1 | yes | Active | 3 (168 Hours) | 225 | - | Tin/Silver/Copper (Sn/Ag/Cu) | - | - | - | - | BOTTOM | BALL | 260 | 1V | 0.8mm | - | - | 30 | - | S-PBGA-B225 | - | - | 1.05V | - | 0.95V | - | - | - | 766MHz | 256KB | - | Single ARM® Cortex®-A9 MPCore™ with CoreSight™ | DMA | 800MHz | - | CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | MCU, FPGA | - | - | - | YES | - | 256000 | Artix™-7 FPGA, 23K Logic Cells | - | CAN; ETHERNET; I2C; SPI; UART; USB | - | 1.5mm | 13mm | 13mm | - | ROHS3 Compliant | ||
| XC7Z007S-2CLG225I | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | Mfr. ТипXCZU4EG-1SFVC784EAnlielectronics Тип | Xilinx Inc. |
IC SOC CORTEX-A53 784FCBGA
Сборник данных
Сравнение
| Min.:1 Mult.:1 | 11 Weeks | - | - | 784-BFBGA, FCBGA | - | - | - | 252 | - | 0°C~100°C TJ | Tray | - | Zynq® UltraScale+™ MPSoC EG | - | - | Active | 4 (72 Hours) | - | - | - | - | - | - | 8542.31.00.01 | - | - | NOT SPECIFIED | - | - | - | - | NOT SPECIFIED | - | - | - | - | - | - | - | - | - | - | 500MHz, 600MHz, 1.2GHz | 256KB | - | Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2 | DMA, WDT | - | - | CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | MCU, FPGA | - | - | - | - | - | - | Zynq®UltraScale+™ FPGA, 192K+ Logic Cells | - | - | - | - | - | - | - | ROHS3 Compliant | ||
| XCZU4EG-1SFVC784E | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | Mfr. ТипXCZU4EV-1FBVB900EAnlielectronics Тип | Xilinx Inc. |
FPGA Zynq UltraScale Family 192150 Cells 20nm Technology 0.85V 900-Pin FCBGA Tray
Сборник данных
Сравнение
| Min.:1 Mult.:1 | 11 Weeks | - | - | 900-BBGA, FCBGA | - | - | - | 204 | - | 0°C~100°C TJ | Tray | 2016 | Zynq® UltraScale+™ MPSoC EV | - | - | Active | 4 (72 Hours) | - | - | - | - | - | - | 8542.31.00.01 | - | - | NOT SPECIFIED | - | - | - | - | NOT SPECIFIED | - | - | - | - | - | - | - | - | - | - | 500MHz, 600MHz, 1.2GHz | 256KB | - | Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2 | DMA, WDT | - | - | CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | MCU, FPGA | - | - | - | - | - | - | Zynq®UltraScale+™ FPGA, 192K+ Logic Cells | - | - | - | - | - | - | - | ROHS3 Compliant | ||
| XCZU4EV-1FBVB900E | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | Mfr. ТипXCZU3CG-1SFVC784IAnlielectronics Тип | Xilinx Inc. |
IC SOC CORTEX-A53 784FCBGA
Сборник данных
Сравнение
| Min.:1 Mult.:1 | 11 Weeks | - | - | 784-BFBGA, FCBGA | - | - | - | 252 | - | -40°C~100°C TJ | Bulk | 2016 | Zynq® UltraScale+™ MPSoC CG | - | - | Active | 4 (72 Hours) | - | - | - | - | - | - | 8542.31.00.01 | - | - | NOT SPECIFIED | - | - | - | - | NOT SPECIFIED | - | - | - | - | - | - | - | - | - | - | 500MHz, 1.2GHz | 256KB | - | Dual ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™ | DMA, WDT | - | - | CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | MCU, FPGA | - | - | - | - | - | - | Zynq®UltraScale+™ FPGA, 154K+ Logic Cells | - | - | - | - | - | - | - | ROHS3 Compliant | ||
| XCZU3CG-1SFVC784I | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | Mfr. ТипXC7Z100-1FFG1156IAnlielectronics Тип | Xilinx Inc. |
MPU Zynq-7000 RISC 32-Bit 667MHz 1.5V/2V/2.5V 1156-Pin FBGA
Сборник данных
Сравнение
| Min.:1 Mult.:1 | 10 Weeks | Copper, Silver, Tin | Surface Mount | 1156-BBGA, FCBGA | - | - | - | 250 | - | -40°C~100°C TJ | Tray | 2010 | Zynq®-7000 | e1 | - | Active | 4 (72 Hours) | - | 3A991.D | Tin/Silver/Copper (Sn/Ag/Cu) | - | - | - | 8542.39.00.01 | BOTTOM | BALL | 245 | 1V | 1mm | not_compliant | 667MHz | 30 | - | S-PBGA-B1156 | - | - | 1.05V | - | 0.95V | CAN, EBI/EMI, Ethernet, I2C, MMC, SD, SDIO, SPI, UART, USART, USB | - | - | - | 256KB | - | Dual ARM® Cortex®-A9 MPCore™ with CoreSight™ | DMA | - | - | CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | MCU, FPGA | 32b | ARM | - | YES | -1 | 256000 | Kintex™-7 FPGA, 444K Logic Cells | - | CAN; ETHERNET; I2C; SPI; UART; USB | - | 3.1mm | 35mm | - | - | ROHS3 Compliant | ||
| XC7Z100-1FFG1156I | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | Mfr. ТипXCZU3CG-1SBVA484EAnlielectronics Тип | Xilinx Inc. |
IC SOC CORTEX-A53 484FCBGA
Сборник данных
Сравнение
| Min.:1 Mult.:1 | 11 Weeks | - | - | 484-BFBGA, FCBGA | - | - | - | 82 | - | 0°C~100°C TJ | Tray | 2016 | Zynq® UltraScale+™ MPSoC CG | - | - | Active | 4 (72 Hours) | - | - | - | - | - | - | 8542.31.00.01 | - | - | NOT SPECIFIED | - | - | - | - | NOT SPECIFIED | - | - | - | - | - | - | - | - | - | - | 500MHz, 1.2GHz | 256KB | - | Dual ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™ | DMA, WDT | - | - | CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | MCU, FPGA | - | - | - | - | - | - | Zynq®UltraScale+™ FPGA, 154K+ Logic Cells | - | - | - | - | - | - | - | ROHS3 Compliant | ||
| XCZU3CG-1SBVA484E | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | Mfr. ТипXCZU9EG-2FFVB1156IAnlielectronics Тип | Xilinx Inc. |
IC SOC CORTEX-A53 1156FCBGA
Сборник данных
Сравнение
| Min.:1 Mult.:1 | 11 Weeks | - | - | 1156-BBGA, FCBGA | - | - | - | 328 | - | -40°C~100°C TJ | Tray | - | Zynq® UltraScale+™ MPSoC EG | - | - | Active | 4 (72 Hours) | - | - | - | - | - | - | 8542.31.00.01 | - | - | NOT SPECIFIED | - | - | - | - | NOT SPECIFIED | - | - | - | - | - | - | - | - | - | - | 533MHz, 600MHz, 1.3GHz | 256KB | - | Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2 | DMA, WDT | - | - | CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | MCU, FPGA | - | - | - | - | - | - | Zynq®UltraScale+™ FPGA, 599K+ Logic Cells | - | - | - | - | - | - | - | ROHS3 Compliant | ||
| XCZU9EG-2FFVB1156I | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | Mfr. ТипXCZU4EV-1SFVC784IAnlielectronics Тип | Xilinx Inc. |
IC SOC CORTEX-A53 784FCBGA
Сборник данных
Сравнение
| Min.:1 Mult.:1 | 11 Weeks | - | - | 784-BFBGA, FCBGA | - | - | - | 252 | - | -40°C~100°C TJ | Tray | 2016 | Zynq® UltraScale+™ MPSoC EV | - | - | Active | 4 (72 Hours) | - | - | - | - | - | - | 8542.31.00.01 | - | - | NOT SPECIFIED | - | - | - | - | NOT SPECIFIED | - | - | - | - | - | - | - | - | - | - | 500MHz, 600MHz, 1.2GHz | 256KB | - | Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2 | DMA, WDT | - | - | CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | MCU, FPGA | - | - | - | - | - | - | Zynq®UltraScale+™ FPGA, 192K+ Logic Cells | - | - | - | - | - | - | - | ROHS3 Compliant | ||
| XCZU4EV-1SFVC784I | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | Mfr. ТипXC7Z045-2FBG676EAnlielectronics Тип | Xilinx Inc. |
IC SOC CORTEX-A9 800MHZ 676FCBGA
Сборник данных
Сравнение
| Min.:1 Mult.:1 | 10 Weeks | - | - | 676-BBGA, FCBGA | - | - | 676-FCBGA (27x27) | 130 | - | 0°C~100°C TJ | Tray | 2009 | Zynq®-7000 | - | - | Active | 3 (168 Hours) | - | - | - | 100°C | 0°C | - | - | - | - | - | - | - | - | 800MHz | - | XC7Z045 | - | - | - | - | - | - | CAN, EBI/EMI, Ethernet, I2C, MMC, SD, SDIO, SPI, UART, USART, USB | - | - | 800MHz | 256KB | - | Dual ARM® Cortex®-A9 MPCore™ with CoreSight™ | DMA | - | - | CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | MCU, FPGA | 32b | ARM | 733MHz | - | -2 | - | Kintex™-7 FPGA, 350K Logic Cells | - | - | - | - | - | - | No | ROHS3 Compliant | ||
| XC7Z045-2FBG676E | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | Mfr. ТипXCZU9EG-1FFVB1156IAnlielectronics Тип | Xilinx Inc. |
IC SOC CORTEX-A53 1156FCBGA
Сборник данных
Сравнение
| Min.:1 Mult.:1 | 11 Weeks | - | - | 1156-BBGA, FCBGA | - | - | - | 328 | - | -40°C~100°C TJ | Tray | 2013 | Zynq® UltraScale+™ MPSoC EG | - | - | Active | 4 (72 Hours) | - | - | - | - | - | - | 8542.31.00.01 | - | - | NOT SPECIFIED | - | - | - | - | NOT SPECIFIED | - | - | - | - | - | - | - | - | - | - | 500MHz, 600MHz, 1.2GHz | 256KB | - | Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2 | DMA, WDT | - | - | CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | MCU, FPGA | - | - | - | - | - | - | Zynq®UltraScale+™ FPGA, 599K+ Logic Cells | - | - | - | - | - | - | - | ROHS3 Compliant | ||
| XCZU9EG-1FFVB1156I | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | Mfr. ТипXCZU15EG-L1FFVB1156IAnlielectronics Тип | Xilinx Inc. |
IC SOC CORTEX-A53 1156FCBGA
Сборник данных
Сравнение
| Min.:1 Mult.:1 | 11 Weeks | - | - | 1156-BBGA, FCBGA | YES | - | - | 328 | - | -40°C~100°C TJ | Tray | 2016 | Zynq® UltraScale+™ MPSoC EG | - | - | Active | 4 (72 Hours) | - | - | - | - | - | ALSO AVAILABLE WITH 0.85V NOMINAL SUPPLY | 8542.31.00.01 | BOTTOM | BALL | NOT SPECIFIED | 0.72V | - | - | - | NOT SPECIFIED | - | R-PBGA-B1156 | - | - | 0.742V | - | 0.698V | - | - | - | 500MHz, 600MHz, 1.2GHz | 256KB | MICROPROCESSOR CIRCUIT | Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2 | DMA, WDT | - | - | CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | MCU, FPGA | - | - | - | - | - | - | Zynq®UltraScale+™ FPGA, 747K+ Logic Cells | - | - | - | - | - | - | - | ROHS3 Compliant | ||
| XCZU15EG-L1FFVB1156I | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | Mfr. ТипXC7Z030-2SBG485EAnlielectronics Тип | Xilinx Inc. |
MPU Zynq-7000 RISC 32-Bit 800MHz 1.5V/2V/2.5V 485-Pin FBGA
Сборник данных
Сравнение
| Min.:1 Mult.:1 | 10 Weeks | Copper, Silver, Tin | Surface Mount | 484-FBGA, FCBGA | - | 485 | - | 130 | - | 0°C~100°C TJ | Tray | 2009 | Zynq®-7000 | e1 | - | Active | 4 (72 Hours) | 485 | EAR99 | Tin/Silver/Copper (Sn96.5Ag3.0Cu0.5) | - | - | PL BLOCK OPERATES IN 0.97V TO 1.03V SUPPLY | 8542.39.00.01 | BOTTOM | BALL | NOT SPECIFIED | 1V | 0.8mm | - | 800MHz | NOT SPECIFIED | - | - | Not Qualified | - | 1.05V | 11.8V | 0.95V | CAN, EBI/EMI, Ethernet, I2C, MMC, SD, SDIO, SPI, UART, USART, USB | - | - | - | 256KB | MICROPROCESSOR CIRCUIT | Dual ARM® Cortex®-A9 MPCore™ with CoreSight™ | DMA | - | - | CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | MCU, FPGA | 32b | ARM | - | YES | - | 256000 | Kintex™-7 FPGA, 125K Logic Cells | - | CAN; ETHERNET; I2C; SPI; UART; USB | N | 2.44mm | 19mm | - | - | ROHS3 Compliant | ||
| XC7Z030-2SBG485E |
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