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Классификация Марка Марка О Anli Запрос цены
ANLI Electronic parts stores,electronic components,electronic parts,electronics parts supply
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Изображение Тип Марка Объяснение Установленная цена Количество RoHS Factory Lead Time Contact Plating Mount Package / Case Surface Mount Number of Pins Memory Types Number of I/Os Operating Temperature Packaging Published Series JESD-609 Code Pbfree Code Part Status Moisture Sensitivity Level (MSL) Number of Terminations ECCN Code Terminal Finish Additional Feature HTS Code Terminal Position Terminal Form Peak Reflow Temperature (Cel) Supply Voltage Terminal Pitch Frequency Time@Peak Reflow Temperature-Max (s) Base Part Number JESD-30 Code Operating Supply Voltage Supply Voltage-Max (Vsup) Supply Voltage-Min (Vsup) Interface Max Supply Voltage Min Supply Voltage Speed RAM Size uPs/uCs/Peripheral ICs Type Core Processor Peripherals Clock Frequency Propagation Delay Connectivity Architecture Data Bus Width Core Architecture Boundary Scan Speed Grade RAM (words) Primary Attributes Number of Registers Bus Compatibility Height Seated (Max) Length Width Radiation Hardening RoHS Status
Xilinx Inc. XCZU2EG-2SFVC784I
Mfr. Тип
XCZU2EG-2SFVC784I
Anlielectronics Тип

Xilinx Inc.
IC SOC CORTEX-A53 784FCBGA
Сборник данных Сравнение
    Min.:1
    Mult.:1
    		 11 Weeks - - 784-BFBGA, FCBGA YES - - 252 -40°C~100°C TJ Tray 2013 Zynq® UltraScale+™ MPSoC EG - - Active 4 (72 Hours) 784 - - - 8542.31.00.01 BOTTOM BALL NOT SPECIFIED 0.85V - - NOT SPECIFIED - R-PBGA-B784 - 0.876V 0.825V - - - 533MHz, 600MHz, 1.3GHz 256KB MICROPROCESSOR CIRCUIT Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2 DMA, WDT - - CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG MCU, FPGA - - - - - Zynq®UltraScale+™ FPGA, 103K+ Logic Cells - - - - - - ROHS3 Compliant
    XCZU2EG-2SFVC784I
    XCZU2EG-2SFVC784I

    Xilinx Inc.
    RoHS :
    Инкапсуляция : -
    Есть складские запасы : -
    1 : -
    Xilinx Inc. XCZU15EG-2FFVB1156I
    Mfr. Тип
    XCZU15EG-2FFVB1156I
    Anlielectronics Тип

    		Xilinx Inc.
    IC SOC CORTEX-A53 1156FCBGA
    Сборник данных Сравнение
      Min.:1
      Mult.:1
      		 11 Weeks - - 1156-BBGA, FCBGA - - - 328 -40°C~100°C TJ Tray 2016 Zynq® UltraScale+™ MPSoC EG - - Active 4 (72 Hours) - - - - 8542.31.00.01 - - NOT SPECIFIED - - - NOT SPECIFIED - - - - - - - - 533MHz, 600MHz, 1.3GHz 256KB - Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2 DMA, WDT - - CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG MCU, FPGA - - - - - Zynq®UltraScale+™ FPGA, 747K+ Logic Cells - - - - - - ROHS3 Compliant
      XCZU15EG-2FFVB1156I
      XCZU15EG-2FFVB1156I

      Xilinx Inc.
      RoHS :
      Инкапсуляция : -
      Есть складские запасы : -
      1 : -
      Xilinx Inc. XCZU4EV-2SFVC784E
      Mfr. Тип
      XCZU4EV-2SFVC784E
      Anlielectronics Тип

      		Xilinx Inc.
      IC SOC CORTEX-A53 784FCBGA
      Сборник данных Сравнение
        Min.:1
        Mult.:1
        		 11 Weeks - - 784-BFBGA, FCBGA - - - 252 0°C~100°C TJ Tray 2016 Zynq® UltraScale+™ MPSoC EV - yes Active 4 (72 Hours) - - - - 8542.31.00.01 - - NOT SPECIFIED - - - NOT SPECIFIED - - - - - - - - 533MHz, 600MHz, 1.3GHz 256KB - Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2 DMA, WDT - - CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG MCU, FPGA - - - - - Zynq®UltraScale+™ FPGA, 192K+ Logic Cells - - - - - - ROHS3 Compliant
        XCZU4EV-2SFVC784E
        XCZU4EV-2SFVC784E

        Xilinx Inc.
        RoHS :
        Инкапсуляция : -
        Есть складские запасы : -
        1 : -
        Xilinx Inc. XC7Z045-3FBG676E
        Mfr. Тип
        XC7Z045-3FBG676E
        Anlielectronics Тип

        		Xilinx Inc.
        IC SOC CORTEX-A9 KINTEX7 676FBGA
        Сборник данных Сравнение
          Min.:1
          Mult.:1
          		 10 Weeks Copper, Silver, Tin - 676-BBGA, FCBGA YES - ROMless 130 0°C~100°C TJ Tray 2009 Zynq®-7000 e1 - Active 3 (168 Hours) 676 3A991.D Tin/Silver/Copper (Sn96.5Ag3.0Cu0.5) - 8542.39.00.01 BOTTOM BALL 245 1V 1mm 1GHz 30 XC7Z045 S-PBGA-B676 1V 1.05V - CAN, EBI/EMI, Ethernet, I2C, MMC, SD, SDIO, SPI, UART, USART, USB - - - 256KB - Dual ARM® Cortex®-A9 MPCore™ with CoreSight™ DMA - - CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG MCU, FPGA 32b ARM YES -3 256000 Kintex™-7 FPGA, 350K Logic Cells - CAN; ETHERNET; I2C; SPI; UART; USB 2.54mm 27mm - No ROHS3 Compliant
          XC7Z045-3FBG676E
          XC7Z045-3FBG676E

          Xilinx Inc.
          RoHS :
          Инкапсуляция : -
          Есть складские запасы : -
          1 : -
          Xilinx Inc. XCZU4EV-2SFVC784I
          Mfr. Тип
          XCZU4EV-2SFVC784I
          Anlielectronics Тип

          		Xilinx Inc.
          IC SOC CORTEX-A53 784FCBGA
          Сборник данных Сравнение
            Min.:1
            Mult.:1
            		 11 Weeks - - 784-BFBGA, FCBGA - - - 252 -40°C~100°C TJ Tray 2016 Zynq® UltraScale+™ MPSoC EV - - Active 4 (72 Hours) - - - - 8542.31.00.01 - - NOT SPECIFIED - - - NOT SPECIFIED - - - - - - - - 533MHz, 600MHz, 1.3GHz 256KB - Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2 DMA, WDT - - CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG MCU, FPGA - - - - - Zynq®UltraScale+™ FPGA, 192K+ Logic Cells - - - - - - ROHS3 Compliant
            XCZU4EV-2SFVC784I
            XCZU4EV-2SFVC784I

            Xilinx Inc.
            RoHS :
            Инкапсуляция : -
            Есть складские запасы : -
            1 : -
            Xilinx Inc. XC7Z015-L1CLG485I
            Mfr. Тип
            XC7Z015-L1CLG485I
            Anlielectronics Тип

            		Xilinx Inc.
            IC SOC CORTEX-A9 667MHZ 485CSBGA
            Сборник данных Сравнение
              Min.:1
              Mult.:1
              		 10 Weeks Copper, Silver, Tin Surface Mount 484-LFBGA, CSPBGA - - - 130 -40°C~100°C TJ Tray 2010 Zynq®-7000 e1 - Active 3 (168 Hours) 485 EAR99 Tin/Silver/Copper (Sn/Ag/Cu) PL BLOCK OPERATES IN 0.97V TO 1.03V SUPPLY 8542.39.00.01 BOTTOM BALL NOT SPECIFIED 1V 0.8mm 667MHz NOT SPECIFIED - S-PBGA-B485 - - - CAN, EBI/EMI, Ethernet, I2C, MMC, SD, SDIO, SPI, UART, USART, USB 1.05V 950mV - 256KB - Dual ARM® Cortex®-A9 MPCore™ with CoreSight™ DMA - 120 ps CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG MCU, FPGA - ARM YES - 256000 Artix™-7 FPGA, 74K Logic Cells 92400 CAN; ETHERNET; I2C; SPI; UART; USB 1.6mm 19mm 19mm - ROHS3 Compliant
              XC7Z015-L1CLG485I
              XC7Z015-L1CLG485I

              Xilinx Inc.
              RoHS :
              Инкапсуляция : -
              Есть складские запасы : -
              1 : -
              Xilinx Inc. XC7Z035-1FFG676C
              Mfr. Тип
              XC7Z035-1FFG676C
              Anlielectronics Тип

              		Xilinx Inc.
              IC SOC CORTEX-A9 667MHZ 676FCBGA
              Сборник данных Сравнение
                Min.:1
                Mult.:1
                		 10 Weeks - - 676-BBGA, FCBGA YES - - 130 0°C~85°C TJ Tray 2010 Zynq®-7000 e1 - Active 4 (72 Hours) 676 3A991.D Tin/Silver/Copper (Sn/Ag/Cu) PL BLOCK OPERATES IN 0.97V TO 1.03V SUPPLY 8542.39.00.01 BOTTOM BALL NOT SPECIFIED 1V 1mm 667MHz NOT SPECIFIED - S-PBGA-B676 - 1.05V 0.95V CAN, EBI/EMI, Ethernet, I2C, MMC, SD, SDIO, SPI, UART, USART, USB - - - 256KB - Dual ARM® Cortex®-A9 MPCore™ with CoreSight™ DMA - - CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG MCU, FPGA - ARM YES - 256000 Kintex™-7 FPGA, 275K Logic Cells - CAN; ETHERNET; I2C; SPI; UART; USB 3.37mm 27mm 27mm - ROHS3 Compliant
                XC7Z035-1FFG676C
                XC7Z035-1FFG676C

                Xilinx Inc.
                RoHS :
                Инкапсуляция : -
                Есть складские запасы : -
                1 : -
                Xilinx Inc. XCZU4CG-1SFVC784I
                Mfr. Тип
                XCZU4CG-1SFVC784I
                Anlielectronics Тип

                		Xilinx Inc.
                IC SOC CORTEX-A53 784FCBGA
                Сборник данных Сравнение
                  Min.:1
                  Mult.:1
                  		 11 Weeks - - 784-BFBGA, FCBGA - - - 252 -40°C~100°C TJ Tray 2016 Zynq® UltraScale+™ MPSoC CG - - Active 4 (72 Hours) - - - - 8542.31.00.01 - - NOT SPECIFIED - - - NOT SPECIFIED - - - - - - - - 500MHz, 1.2GHz 256KB - Dual ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™ DMA, WDT - - CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG MCU, FPGA - - - - - Zynq®UltraScale+™ FPGA, 192K+ Logic Cells - - - - - - ROHS3 Compliant
                  XCZU4CG-1SFVC784I
                  XCZU4CG-1SFVC784I

                  Xilinx Inc.
                  RoHS :
                  Инкапсуляция : -
                  Есть складские запасы : -
                  1 : -
                  Xilinx Inc. XCZU9EG-2FFVC900I
                  Mfr. Тип
                  XCZU9EG-2FFVC900I
                  Anlielectronics Тип

                  		Xilinx Inc.
                  IC SOC CORTEX-A53 900FCBGA
                  Сборник данных Сравнение
                    Min.:1
                    Mult.:1
                    		 11 Weeks - - 900-BBGA, FCBGA - - - 204 -40°C~100°C TJ Tray - Zynq® UltraScale+™ MPSoC EG e1 - Active 4 (72 Hours) - - Tin/Silver/Copper (Sn/Ag/Cu) - 8542.31.00.01 - - NOT SPECIFIED - - - NOT SPECIFIED - - - - - - - - 533MHz, 600MHz, 1.3GHz 256KB - Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2 DMA, WDT - - CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG MCU, FPGA - - - - - Zynq®UltraScale+™ FPGA, 599K+ Logic Cells - - - - - - ROHS3 Compliant
                    XCZU9EG-2FFVC900I
                    XCZU9EG-2FFVC900I

                    Xilinx Inc.
                    RoHS :
                    Инкапсуляция : -
                    Есть складские запасы : -
                    1 : -
                    Xilinx Inc. XC7Z020-L1CLG400I
                    Mfr. Тип
                    XC7Z020-L1CLG400I
                    Anlielectronics Тип

                    		Xilinx Inc.
                    IC SOC CORTEX-A9 667MHZ 400BGA
                    Сборник данных Сравнение
                      Min.:1
                      Mult.:1
                      		 10 Weeks Copper, Silver, Tin Surface Mount 400-LFBGA, CSPBGA - - - 130 -40°C~100°C TJ Tray 2010 Zynq®-7000 e1 - Active 3 (168 Hours) 400 3A991.D Tin/Silver/Copper (Sn/Ag/Cu) PL BLOCK OPERATES IN 0.97V TO 1.03V SUPPLY 8542.39.00.01 BOTTOM BALL NOT SPECIFIED 1V 0.8mm 667MHz NOT SPECIFIED - S-PBGA-B400 - - - CAN, EBI/EMI, Ethernet, I2C, MMC, SD, SDIO, SPI, UART, USART, USB 1.05V 950mV - 256KB - Dual ARM® Cortex®-A9 MPCore™ with CoreSight™ DMA - - CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG MCU, FPGA - ARM YES - 256000 Artix™-7 FPGA, 85K Logic Cells 106400 CAN; ETHERNET; I2C; SPI; UART; USB 1.6mm 17mm 17mm - ROHS3 Compliant
                      XC7Z020-L1CLG400I
                      XC7Z020-L1CLG400I

                      Xilinx Inc.
                      RoHS :
                      Инкапсуляция : -
                      Есть складские запасы : -
                      1 : -
                      Xilinx Inc. XC7Z030-L2FFG676I
                      Mfr. Тип
                      XC7Z030-L2FFG676I
                      Anlielectronics Тип

                      		Xilinx Inc.
                      IC SOC CORTEX-A9 800MHZ 676FCBGA
                      Сборник данных Сравнение
                        Min.:1
                        Mult.:1
                        		 10 Weeks Copper, Silver, Tin Surface Mount 676-BBGA, FCBGA - - - 130 -40°C~100°C TJ Tray 2010 Zynq®-7000 e1 - Active 4 (72 Hours) 676 3A991.D Tin/Silver/Copper (Sn/Ag/Cu) PL BLOCK OPERATES IN 0.97V TO 1.03V SUPPLY 8542.39.00.01 BOTTOM BALL NOT SPECIFIED 1V 1mm 800MHz NOT SPECIFIED - S-PBGA-B676 - - - CAN, EBI/EMI, Ethernet, I2C, MMC, SD, SDIO, SPI, UART, USART, USB 1.05V 950mV - 256KB - Dual ARM® Cortex®-A9 MPCore™ with CoreSight™ DMA - 100 ps CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG MCU, FPGA - ARM YES - 256000 Kintex™-7 FPGA, 125K Logic Cells 157200 CAN; ETHERNET; I2C; SPI; UART; USB 3.24mm 27mm 27mm - ROHS3 Compliant
                        XC7Z030-L2FFG676I
                        XC7Z030-L2FFG676I

                        Xilinx Inc.
                        RoHS :
                        Инкапсуляция : -
                        Есть складские запасы : -
                        1 : -
                        Xilinx Inc. XCZU4EG-1SFVC784I
                        Mfr. Тип
                        XCZU4EG-1SFVC784I
                        Anlielectronics Тип

                        		Xilinx Inc.
                        IC SOC CORTEX-A53 784FCBGA
                        Сборник данных Сравнение
                          Min.:1
                          Mult.:1
                          		 11 Weeks - - 784-BFBGA, FCBGA - - - 252 -40°C~100°C TJ Tray 2016 Zynq® UltraScale+™ MPSoC EG - - Active 4 (72 Hours) - - - - 8542.31.00.01 - - NOT SPECIFIED - - - NOT SPECIFIED - - - - - - - - 500MHz, 600MHz, 1.2GHz 256KB - Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2 DMA, WDT - - CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG MCU, FPGA - - - - - Zynq®UltraScale+™ FPGA, 192K+ Logic Cells - - - - - - ROHS3 Compliant
                          XCZU4EG-1SFVC784I
                          XCZU4EG-1SFVC784I

                          Xilinx Inc.
                          RoHS :
                          Инкапсуляция : -
                          Есть складские запасы : -
                          1 : -
                          Xilinx Inc. XCZU7EV-2FFVC1156I
                          Mfr. Тип
                          XCZU7EV-2FFVC1156I
                          Anlielectronics Тип

                          		Xilinx Inc.
                          IC SOC CORTEX-A53 1156FCBGA
                          Сборник данных Сравнение
                            Min.:1
                            Mult.:1
                            		 11 Weeks - - 1156-BBGA, FCBGA - - - 360 -40°C~100°C TJ Tray 2016 Zynq® UltraScale+™ MPSoC EV - - Active 4 (72 Hours) - - - - 8542.31.00.01 - - NOT SPECIFIED - - - NOT SPECIFIED - - - - - - - - 533MHz, 600MHz, 1.3GHz 256KB - Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2 DMA, WDT - - CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG MCU, FPGA - - - - - Zynq®UltraScale+™ FPGA, 504K+ Logic Cells - - - - - - ROHS3 Compliant
                            XCZU7EV-2FFVC1156I
                            XCZU7EV-2FFVC1156I

                            Xilinx Inc.
                            RoHS :
                            Инкапсуляция : -
                            Есть складские запасы : -
                            1 : -
                            Xilinx Inc. XCZU3CG-1SFVA625E
                            Mfr. Тип
                            XCZU3CG-1SFVA625E
                            Anlielectronics Тип

                            		Xilinx Inc.
                            IC SOC CORTEX-A53 625FCBGA
                            Сборник данных Сравнение
                              Min.:1
                              Mult.:1
                              		 11 Weeks - - 625-BFBGA, FCBGA - - - 180 0°C~100°C TJ Bulk 2016 Zynq® UltraScale+™ MPSoC CG - - Active 4 (72 Hours) - - - - 8542.31.00.01 - - NOT SPECIFIED - - - NOT SPECIFIED - - - - - - - - 500MHz, 1.2GHz 256KB - Dual ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™ DMA, WDT - - CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG MCU, FPGA - - - - - Zynq®UltraScale+™ FPGA, 154K+ Logic Cells - - - - - - ROHS3 Compliant
                              XCZU3CG-1SFVA625E
                              XCZU3CG-1SFVA625E

                              Xilinx Inc.
                              RoHS :
                              Инкапсуляция : -
                              Есть складские запасы : -
                              1 : -
                              Xilinx Inc. XCZU19EG-L1FFVC1760I
                              Mfr. Тип
                              XCZU19EG-L1FFVC1760I
                              Anlielectronics Тип

                              		Xilinx Inc.
                              IC SOC CORTEX-A53 1760FCBGA
                              Сборник данных Сравнение
                                Min.:1
                                Mult.:1
                                		 11 Weeks - - 1760-BBGA, FCBGA YES - - 512 -40°C~100°C TJ Tray 2016 Zynq® UltraScale+™ MPSoC EG - - Active 4 (72 Hours) - - - ALSO AVAILABLE WITH 0.85V NOMINAL SUPPLY 8542.31.00.01 BOTTOM BALL NOT SPECIFIED 0.72V - - NOT SPECIFIED - R-PBGA-B1760 - 0.742V 0.698V - - - 500MHz, 600MHz, 1.2GHz 256KB MICROPROCESSOR CIRCUIT Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2 DMA, WDT - - CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG MCU, FPGA - - - - - Zynq®UltraScale+™ FPGA, 1143K+ Logic Cells - - - - - - ROHS3 Compliant
                                XCZU19EG-L1FFVC1760I
                                XCZU19EG-L1FFVC1760I

                                Xilinx Inc.
                                RoHS :
                                Инкапсуляция : -
                                Есть складские запасы : -
                                1 : -
                                Xilinx Inc. XCZU2CG-1SFVC784E
                                Mfr. Тип
                                XCZU2CG-1SFVC784E
                                Anlielectronics Тип

                                		Xilinx Inc.
                                IC SOC CORTEX-A53 784FCBGA
                                Сборник данных Сравнение
                                  Min.:1
                                  Mult.:1
                                  		 11 Weeks - - 784-BFBGA, FCBGA - - - 252 0°C~100°C TJ Tray - Zynq® UltraScale+™ MPSoC CG - - Active 4 (72 Hours) - - - - 8542.31.00.01 - - NOT SPECIFIED - - - NOT SPECIFIED - - - - - - - - 500MHz, 1.2GHz 256KB - Dual ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™ DMA, WDT - - CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG MCU, FPGA - - - - - Zynq®UltraScale+™ FPGA, 103K+ Logic Cells - - - - - - ROHS3 Compliant
                                  XCZU2CG-1SFVC784E
                                  XCZU2CG-1SFVC784E

                                  Xilinx Inc.
                                  RoHS :
                                  Инкапсуляция : -
                                  Есть складские запасы : -
                                  1 : -
                                  Xilinx Inc. XC7Z014S-1CLG484I
                                  Mfr. Тип
                                  XC7Z014S-1CLG484I
                                  Anlielectronics Тип

                                  		Xilinx Inc.
                                  IC SOC CORTEX-A9 667MHZ 484BGA
                                  Сборник данных Сравнение
                                    Min.:1
                                    Mult.:1
                                    		 10 Weeks - - 484-LFBGA, CSPBGA YES - - 200 -40°C~100°C TJ Tray 2016 Zynq®-7000 e3 yes Active 3 (168 Hours) 484 - Matte Tin (Sn) - 8542.31.00.01 BOTTOM BALL NOT SPECIFIED 1V 0.8mm - NOT SPECIFIED - S-PBGA-B484 - 1.05V 0.95V - - - 667MHz 256KB - Single ARM® Cortex®-A9 MPCore™ with CoreSight™ DMA 667MHz - CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG MCU, FPGA - - YES - 256000 Artix™-7 FPGA, 65K Logic Cells - CAN; ETHERNET; I2C; SPI; UART; USB 1.6mm 19mm 19mm - ROHS3 Compliant
                                    XC7Z014S-1CLG484I
                                    XC7Z014S-1CLG484I

                                    Xilinx Inc.
                                    RoHS :
                                    Инкапсуляция : -
                                    Есть складские запасы : -
                                    1 : -
                                    Xilinx Inc. XC7Z045-L2FFG900I
                                    Mfr. Тип
                                    XC7Z045-L2FFG900I
                                    Anlielectronics Тип

                                    		Xilinx Inc.
                                    IC SOC CORTEX-A9 800MHZ 900FCBGA
                                    Сборник данных Сравнение
                                      Min.:1
                                      Mult.:1
                                      		 10 Weeks - - 900-BBGA, FCBGA YES - - 130 -40°C~100°C TJ Tray 2010 Zynq®-7000 e1 - Active 4 (72 Hours) 900 3A991.D Tin/Silver/Copper (Sn/Ag/Cu) PL BLOCK OPERATES IN 0.97V TO 1.03V SUPPLY 8542.39.00.01 BOTTOM BALL 245 1V 1mm 800MHz 30 - S-PBGA-B900 - 1.05V 0.95V CAN, EBI/EMI, Ethernet, I2C, MMC, SD, SDIO, SPI, UART, USART, USB - - - 256KB - Dual ARM® Cortex®-A9 MPCore™ with CoreSight™ DMA - - CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG MCU, FPGA - ARM YES - 256000 Kintex™-7 FPGA, 350K Logic Cells - CAN; ETHERNET; I2C; SPI; UART; USB 3.35mm 31mm 31mm - ROHS3 Compliant
                                      XC7Z045-L2FFG900I
                                      XC7Z045-L2FFG900I

                                      Xilinx Inc.
                                      RoHS :
                                      Инкапсуляция : -
                                      Есть складские запасы : -
                                      1 : -
                                      Xilinx Inc. XC7Z030-3FFG676E
                                      Mfr. Тип
                                      XC7Z030-3FFG676E
                                      Anlielectronics Тип

                                      		Xilinx Inc.
                                      MPU Zynq-7000 Thumb-2 32-Bit 1GHz 1.2V/3.3V 676-Pin FCBGA
                                      Сборник данных Сравнение
                                        Min.:1
                                        Mult.:1
                                        		 10 Weeks Copper, Silver, Tin - 676-BBGA, FCBGA YES 676 - 130 0°C~100°C TJ Tray 2009 Zynq®-7000 e1 - Active 4 (72 Hours) 676 3A991.D Tin/Silver/Copper (Sn/Ag/Cu) - 8542.39.00.01 BOTTOM BALL 245 1V 1mm 1GHz 30 XC7Z030 - 1V 1.05V - CAN, EBI/EMI, Ethernet, I2C, MMC, SD, SDIO, SPI, UART, USART, USB - - - 256KB - Dual ARM® Cortex®-A9 MPCore™ with CoreSight™ DMA - - CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG MCU, FPGA 32b ARM YES -3 256000 Kintex™-7 FPGA, 125K Logic Cells - CAN; ETHERNET; I2C; SPI; UART; USB 3.24mm 27mm - No ROHS3 Compliant
                                        XC7Z030-3FFG676E
                                        XC7Z030-3FFG676E

                                        Xilinx Inc.
                                        RoHS :
                                        Инкапсуляция : -
                                        Есть складские запасы : -
                                        1 : -
                                        Xilinx Inc. XCZU2EG-1SFVC784E
                                        Mfr. Тип
                                        XCZU2EG-1SFVC784E
                                        Anlielectronics Тип

                                        		Xilinx Inc.
                                        IC SOC CORTEX-A53 784FCBGA
                                        Сборник данных Сравнение
                                          Min.:1
                                          Mult.:1
                                          		 11 Weeks - - 784-BFBGA, FCBGA - - - 252 0°C~100°C TJ Tray 2013 Zynq® UltraScale+™ MPSoC EG - - Active 4 (72 Hours) - - - - 8542.31.00.01 - - NOT SPECIFIED - - - NOT SPECIFIED - - - - - - - - 500MHz, 600MHz, 1.2GHz 256KB - Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2 DMA, WDT - - CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG MCU, FPGA - - - - - Zynq®UltraScale+™ FPGA, 103K+ Logic Cells - - - - - - ROHS3 Compliant
                                          XCZU2EG-1SFVC784E
                                          XCZU2EG-1SFVC784E

                                          Xilinx Inc.
                                          RoHS :
                                          Инкапсуляция : -
                                          Есть складские запасы : -
                                          1 : -

                                          Integrated Circuits (ICs)

                                          Embedded - System On Chip (SoC) definition: A System On Chip (SoC) combines the required electronic circuits of various computer components onto a single, integrated chip (IC). SoC is ... Embedded - System On Chip (SoC) Product Listing: XCZU2EG-2SFVC784I,XCZU15EG-2FFVB1156I,XCZU4EV-2SFVC784E,XC7Z045-3FBG676E,XCZU4EV-2SFVC784I.Integrated Circuits (ICs) type:Embedded - Microcontrollers(129432),Memory(111901),PMIC - Supervisors(101743),PMIC - Voltage Regulators - Linear(101187),PMIC - Voltage Regulators - DC DC Switching Regulators(62822) .Embedded - System On Chip (SoC) has 1945 pieces of spot stock price information, you can click the "RFQ" button to confirm the inventory and price with the Anli.