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| Изображение | Тип | Марка | Объяснение | Установленная цена | Количество | RoHS | Factory Lead Time | Contact Plating | Mount | Mounting Type | Package / Case | Surface Mount | Number of Pins | Supplier Device Package | Weight | Number of I/Os | Usage Level | Operating Temperature | Packaging | Published | JESD-609 Code | Pbfree Code | Part Status | Moisture Sensitivity Level (MSL) | Number of Terminations | ECCN Code | Terminal Finish | Max Operating Temperature | Min Operating Temperature | HTS Code | Max Power Dissipation | Voltage - Supply | Terminal Position | Terminal Form | Peak Reflow Temperature (Cel) | Supply Voltage | Terminal Pitch | Frequency | Time@Peak Reflow Temperature-Max (s) | Base Part Number | Pin Count | JESD-30 Code | Qualification Status | Output Type | Operating Supply Voltage | Power Supplies | Number of Channels | Interface | Max Supply Voltage | Min Supply Voltage | Operating Supply Current | Number of Ports | Nominal Supply Current | Power Dissipation | Output Current | Max Supply Current | uPs/uCs/Peripheral ICs Type | Number of Bits | Clock Frequency | Data Rate | Max Frequency | Number of Transceivers | Interrupt Output | Current - Output Source/Sink | Features | Number of Receive Buffers | Number of Transmit Buffers | Height | Height Seated (Max) | Length | Width | REACH SVHC | RoHS Status | Lead Free |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
  | Mfr. ТипMCP23017-E/MLAnlielectronics Тип | Microchip Technology |
MICROCHIP - MCP23017-E/ML - I/O Expander, 16bit, 1.7 MHz, I2C, 1.8 V, 5.5 V, QFN
Сборник данных
Сравнение
| Min.:1 Mult.:1 | 12 Weeks | - | Surface Mount | Surface Mount | 28-VQFN Exposed Pad | - | 28 | - | 70.788759mg | 16 | - | -40°C~125°C | Tube | 2005 | e3 | yes | Active | 1 (Unlimited) | 28 | EAR99 | Matte Tin (Sn) - annealed | - | - | - | 700mW | 1.8V~5.5V | QUAD | NO LEAD | 260 | 5V | 0.65mm | - | 40 | MCP23017 | 28 | - | Not Qualified | Push-Pull | - | 5V | 1 | I2C | - | - | - | 2 | 1mA | - | 25mA | - | - | 16 | 1.7MHz | - | - | - | Yes | - | POR | - | - | - | - | 6mm | 6mm | No SVHC | ROHS3 Compliant | Lead Free | ||
| MCP23017-E/ML | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
 | Mfr. ТипMCP23017-E/SSAnlielectronics Тип | Microchip Technology |
MICROCHIP - MCP23017-E/SS - Ekspander I/O, 16-bitowy, 1.7 MHz, I2C, szeregowy, 4.5 V, 5.5 V, SSOP
Сборник данных
Сравнение
| Min.:1 Mult.:1 | 12 Weeks | - | Surface Mount | Surface Mount | 28-SSOP (0.209, 5.30mm Width) | - | 28 | - | 2.26799g | 16 | - | -40°C~125°C | Tube | 2016 | e3 | yes | Active | 1 (Unlimited) | 28 | EAR99 | Matte Tin (Sn) | - | - | - | 700mW | 1.8V~5.5V | DUAL | GULL WING | 260 | 5V | 0.65mm | - | 40 | MCP23017 | 28 | - | Not Qualified | Push-Pull | - | 5V | 1 | I2C | - | - | - | 2 | 1mA | - | 25mA | - | - | 16 | 1.7MHz | - | - | - | Yes | - | POR | - | - | - | 2mm | - | 5.3mm | No SVHC | ROHS3 Compliant | Lead Free | ||
| MCP23017-E/SS | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| | Mfr. ТипMCP23016-I/MLAnlielectronics Тип | Microchip Technology |
IC, EXPANDER, I/O, 16BIT, 28QFN - More Details
Сборник данных
Сравнение
| Min.:1 Mult.:1 | 13 Weeks | - | Surface Mount | Surface Mount | 28-VQFN Exposed Pad | - | 28 | - | - | 16 | Industrial grade | -40°C~85°C | Tube | 2002 | e3 | yes | Active | 1 (Unlimited) | 28 | EAR99 | Matte Tin (Sn) - annealed | - | - | 8542.39.00.01 | - | 2V~5.5V | QUAD | NO LEAD | 260 | 5V | 0.65mm | - | 40 | MCP23016 | 28 | - | Not Qualified | Push-Pull | - | 2.5/5V | - | I2C | - | - | - | 2 | - | - | - | - | - | 16 | 400kHz | - | - | - | Yes | 25mA | POR | - | - | - | 1mm | 6mm | 6mm | No SVHC | ROHS3 Compliant | Lead Free | ||
| MCP23016-I/ML | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
 | Mfr. ТипMCP23008T-E/MLAnlielectronics Тип | Microchip Technology |
IC I/O EXPANDER I2C 8B 20QFN
Сборник данных
Сравнение
| Min.:1 Mult.:1 | 8 Weeks | - | - | Surface Mount | 20-VFQFN Exposed Pad | YES | - | - | - | 8 | - | -40°C~125°C | Tape & Reel (TR) | 2005 | e3 | yes | Active | 1 (Unlimited) | 20 | EAR99 | Matte Tin (Sn) - annealed | - | - | - | - | 1.8V~5.5V | QUAD | NO LEAD | 260 | 5V | 0.5mm | - | 40 | MCP23008 | - | S-PQCC-N20 | Not Qualified | Push-Pull | 5.5V | 5V | - | I2C | - | - | - | 1 | - | 700mW | - | - | - | 8 | 1.7MHz | - | - | - | Yes | 25mA | POR | - | - | - | 1mm | 4mm | 4mm | - | ROHS3 Compliant | Lead Free | ||
| MCP23008T-E/ML | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
 | Mfr. ТипMCP23016-I/SPAnlielectronics Тип | Microchip Technology |
MICROCHIP - MCP23016-I/SP - IC, IO EXPANDER 16BIT, SPDIP28
Сборник данных
Сравнение
| Min.:1 Mult.:1 | 6 Weeks | - | Through Hole | Through Hole | 28-DIP (0.300, 7.62mm) | - | 28 | - | - | 16 | Industrial grade | -40°C~85°C | Tube | 2002 | e3 | yes | Active | 1 (Unlimited) | 28 | EAR99 | Matte Tin (Sn) | - | - | - | 1W | 2V~5.5V | DUAL | - | NOT APPLICABLE | 5V | 2.54mm | - | NOT APPLICABLE | MCP23016 | 28 | - | Not Qualified | Push-Pull | 5.5V | 2.5/5V | 1 | I2C | - | - | - | 2 | - | - | 25mA | - | - | 16 | 400kHz | - | - | - | Yes | - | POR | - | - | - | 4.06mm | 34.67mm | 7.62mm | No SVHC | ROHS3 Compliant | Lead Free | ||
| MCP23016-I/SP | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
 | Mfr. ТипMCP23S09-E/MGAnlielectronics Тип | Microchip Technology |
IC, EXPANDER, I/O, 8BIT, 16QFN - More Details
Сборник данных
Сравнение
| Min.:1 Mult.:1 | 16 Weeks | - | Surface Mount | Surface Mount | 16-VFQFN Exposed Pad | - | 16 | - | 69.598079mg | 8 | - | -40°C~125°C | Tube | 2009 | e3 | yes | Active | 1 (Unlimited) | 16 | EAR99 | Matte Tin (Sn) - annealed | - | - | - | - | 1.8V~5.5V | QUAD | NO LEAD | 260 | 5V | 0.5mm | - | 40 | MCP23S09 | 16 | - | Not Qualified | Open Drain | - | 2/5V | 1 | SPI | - | - | - | 1 | 1mA | - | - | - | PARALLEL IO PORT, GENERAL PURPOSE | 8 | 10MHz | - | - | - | Yes | 25mA | - | - | - | - | 0.9mm | 3mm | 3mm | No SVHC | ROHS3 Compliant | Lead Free | ||
| MCP23S09-E/MG | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
 | Mfr. ТипMCP23S08-E/SSAnlielectronics Тип | Microchip Technology |
MICROCHIP - MCP23S08-E/SS - I/O Expander, 8bit, 10 MHz, Serial, SPI, 1.8 V, 5.5 V, SSOP
Сборник данных
Сравнение
| Min.:1 Mult.:1 | 8 Weeks | - | Surface Mount | Surface Mount | 20-SSOP (0.209, 5.30mm Width) | - | 20 | - | 453.59237mg | 8 | - | -40°C~125°C | Tube | 2005 | e3 | yes | Active | 1 (Unlimited) | 20 | EAR99 | Matte Tin (Sn) | - | - | - | 700mW | 1.8V~5.5V | DUAL | GULL WING | 260 | 5V | 0.65mm | - | 40 | MCP23S08 | 20 | - | Not Qualified | Push-Pull | - | 5V | 1 | SPI | - | - | 1mA | 1 | 1mA | - | 25mA | - | - | 8 | 10MHz | - | - | - | Yes | - | POR | - | - | - | 2mm | 7.2mm | 5.3mm | No SVHC | ROHS3 Compliant | Lead Free | ||
| MCP23S08-E/SS | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
 | Mfr. ТипMCP23008-E/PAnlielectronics Тип | Microchip Technology |
MICROCHIP - MCP23008-E/P - I/O Expander, 8bit, 1.7 MHz, I2C, Serial, 4.5 V, 5.5 V, DIP
Сборник данных
Сравнение
| Min.:1 Mult.:1 | 1 Weeks | - | Through Hole | Through Hole | 18-DIP (0.300, 7.62mm) | - | 18 | - | - | 8 | - | -40°C~125°C | Tube | 2003 | e3 | yes | Active | 1 (Unlimited) | 18 | EAR99 | Matte Tin (Sn) | - | - | - | - | 1.8V~5.5V | DUAL | - | NOT SPECIFIED | 5V | 2.54mm | - | NOT SPECIFIED | MCP23008 | 18 | - | Not Qualified | Push-Pull | - | 5V | 1 | I2C | - | - | - | 1 | 1mA | 700mW | 25mA | - | - | 8 | 1.7MHz | - | - | - | Yes | - | POR | - | - | - | 5.334mm | - | 7.62mm | No SVHC | ROHS3 Compliant | Lead Free | ||
| MCP23008-E/P | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
 | Mfr. ТипMCP25020-I/SLAnlielectronics Тип | Microchip Technology |
MICROCHIP - MCP25020-I/SL - CAN I/O EXPANDER, 1MBPS, 5.5V SOIC-14
Сборник данных
Сравнение
| Min.:1 Mult.:1 | 9 Weeks | - | Surface Mount | Surface Mount | 14-SOIC (0.154, 3.90mm Width) | - | 14 | - | - | 8 | Industrial grade | -40°C~85°C | Tube | 2007 | e3 | yes | Active | 1 (Unlimited) | 14 | EAR99 | Matte Tin (Sn) - annealed | - | - | - | - | 2.75V~5.5V | DUAL | GULL WING | 260 | 5V | - | - | 40 | MCP25020 | 14 | - | - | Push-Pull | - | - | - | CAN V2.0b | - | - | - | - | 20mA | - | - | 20mA | MICROPROCESSOR CIRCUIT | 8 | 25MHz | 1 Mbps | - | 1 | No | 25mA | EEPROM, POR, PWM | 2 | 3 | 1.5mm | - | 8.65mm | 3.9mm | No SVHC | ROHS3 Compliant | Lead Free | ||
| MCP25020-I/SL | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
 | Mfr. ТипMCP23018-E/MJAnlielectronics Тип | Microchip Technology |
MICROCHIP MCP23018-E/MJ.Bus Frequency:3.4MHz
Сборник данных
Сравнение
| Min.:1 Mult.:1 | 10 Weeks | - | Surface Mount | Surface Mount | 24-VFQFN Exposed Pad | - | 24 | - | 928.191737mg | 16 | - | -40°C~125°C | Tube | 2008 | e3 | - | Active | 1 (Unlimited) | 24 | EAR99 | Matte Tin (Sn) - annealed | - | - | 8542.39.00.01 | 700mW | 1.8V~5.5V | QUAD | NO LEAD | 260 | 5V | 0.5mm | - | 40 | MCP23018 | 24 | - | Not Qualified | Open Drain | - | 2/5V | - | I2C | - | - | - | 2 | - | - | 25mA | - | - | 16 | 3.4MHz | - | - | - | Yes | - | POR | - | - | - | 0.9mm | 4mm | 4mm | No SVHC | ROHS3 Compliant | Lead Free | ||
| MCP23018-E/MJ | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| | Mfr. ТипMCP23009-E/SSAnlielectronics Тип | Microchip Technology |
IC, I/O EXPANDER, 8BIT, 3.4MHZ, SSOP-20 - More Details
Сборник данных
Сравнение
| Min.:1 Mult.:1 | 14 Weeks | - | Surface Mount | Surface Mount | 20-SSOP (0.209, 5.30mm Width) | - | 20 | - | - | 8 | - | -40°C~125°C | Tube | - | e3 | yes | Active | 1 (Unlimited) | 20 | EAR99 | Matte Tin (Sn) - annealed | - | - | - | - | 1.8V~5.5V | DUAL | GULL WING | 260 | 5V | 0.65mm | - | 40 | MCP23009 | 20 | - | Not Qualified | Open Drain | - | 2/5V | 1 | I2C | - | - | - | 1 | 1mA | 700mW | 200mA | - | - | 8 | 3.4MHz | - | - | - | Yes | 25mA | POR | - | - | - | 2mm | 7.2mm | 5.3mm | No SVHC | ROHS3 Compliant | Lead Free | ||
| MCP23009-E/SS | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| | Mfr. ТипMCP23S08T-E/MLAnlielectronics Тип | Microchip Technology |
IC I/O EXPANDER SPI 8B 20QFN
Сборник данных
Сравнение
| Min.:1 Mult.:1 | 8 Weeks | Tin | - | Surface Mount | 20-VFQFN Exposed Pad | YES | - | - | - | 8 | - | -40°C~125°C | Tape & Reel (TR) | 2007 | e3 | yes | Active | 1 (Unlimited) | 20 | EAR99 | - | - | - | - | - | 1.8V~5.5V | QUAD | NO LEAD | 260 | 5V | 0.5mm | - | 40 | MCP23S08 | 20 | R-PQCC-N20 | Not Qualified | Push-Pull | 5.5V | 5V | - | SPI | - | - | - | 1 | - | 700mW | - | - | - | 8 | 10MHz | - | - | - | Yes | 25mA | POR | - | - | - | 1mm | 4mm | 4mm | - | ROHS3 Compliant | Lead Free | ||
| MCP23S08T-E/ML | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
 | Mfr. ТипMCP23018-E/SSAnlielectronics Тип | Microchip Technology |
IC, I/O EXPANDER, 16BIT, 3.4MHZ, SSOP-24 - More Details
Сборник данных
Сравнение
| Min.:1 Mult.:1 | 10 Weeks | - | Surface Mount | Surface Mount | 24-SSOP (0.209, 5.30mm Width) | - | 24 | - | 220.105698mg | 16 | - | -40°C~125°C | Tube | 2008 | e3 | yes | Active | 1 (Unlimited) | 24 | EAR99 | Matte Tin (Sn) - annealed | - | - | 8542.39.00.01 | 700mW | 1.8V~5.5V | DUAL | GULL WING | 260 | 5V | 0.65mm | - | 40 | MCP23018 | 24 | - | Not Qualified | Open Drain | - | 2/5V | - | I2C | - | - | - | 2 | - | - | 400mA | - | - | 16 | 3.4MHz | - | - | - | Yes | 25mA | POR | - | - | - | 2mm | 8.2mm | 5.3mm | No SVHC | ROHS3 Compliant | - | ||
| MCP23018-E/SS | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
 | Mfr. ТипMCP23S08T-E/SOAnlielectronics Тип | Microchip Technology |
IC I/O EXPANDER SPI 8B 18SOIC
Сборник данных
Сравнение
| Min.:1 Mult.:1 | 7 Weeks | - | - | Surface Mount | 18-SOIC (0.295, 7.50mm Width) | YES | 18 | - | - | 8 | - | -40°C~125°C | Tape & Reel (TR) | 2006 | e3 | yes | Active | 1 (Unlimited) | 18 | EAR99 | Matte Tin (Sn) | - | - | - | - | 1.8V~5.5V | DUAL | GULL WING | 260 | 5V | - | - | 40 | MCP23S08 | 18 | - | Not Qualified | Push-Pull | 5.5V | 5V | 1 | SPI | - | - | - | 1 | 1mA | 700mW | - | - | - | 8 | 10MHz | - | - | - | Yes | 25mA | POR | - | - | - | 2.65mm | - | 7.5mm | - | ROHS3 Compliant | Lead Free | ||
| MCP23S08T-E/SO | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| | Mfr. ТипMCP23S08-E/MLAnlielectronics Тип | Microchip Technology |
IC I/O EXPANDER SPI 8B 20QFN
Сборник данных
Сравнение
| Min.:1 Mult.:1 | 8 Weeks | - | Surface Mount | Surface Mount | 20-VFQFN Exposed Pad | - | 20 | 20-QFN-EP (4x4) | - | 8 | - | -40°C~125°C | Tray | 2006 | - | - | Active | 1 (Unlimited) | - | - | - | 125°C | -40°C | - | - | 1.8V~5.5V | - | - | - | - | - | 10MHz | - | MCP23S08 | - | - | - | Push-Pull | - | - | 1 | SPI | 5.5V | 1.8V | - | - | 1mA | 700mW | - | - | - | - | 10MHz | - | 10MHz | - | Yes | 25mA | POR | - | - | - | - | - | - | No SVHC | ROHS3 Compliant | Lead Free | ||
| MCP23S08-E/ML | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
 | Mfr. ТипMCP23S18-E/SOAnlielectronics Тип | Microchip Technology |
MICROCHIP MCP23S18-E/SO IC, I/O EXPANDER, 16BIT, 10MHZ, SOIC-28
Сборник данных
Сравнение
| Min.:1 Mult.:1 | 13 Weeks | Tin | Surface Mount | Surface Mount | 28-SOIC (0.295, 7.50mm Width) | - | 28 | - | 2.214806g | 16 | - | -40°C~125°C | Tube | 2000 | e3 | - | Active | 1 (Unlimited) | 28 | EAR99 | - | - | - | - | 700mW | 1.8V~5.5V | DUAL | GULL WING | 260 | 5V | - | - | 40 | MCP23S18 | 28 | - | Not Qualified | Open Drain | - | 2/5V | 1 | SPI | - | - | - | 2 | 1mA | - | 25mA | - | PARALLEL IO PORT, GENERAL PURPOSE | 16 | 10MHz | - | - | - | Yes | - | - | - | - | - | 2.65mm | - | 7.5mm | No SVHC | ROHS3 Compliant | Lead Free | ||
| MCP23S18-E/SO | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| | Mfr. ТипMCP25050-I/SLAnlielectronics Тип | Microchip Technology |
MICROCHIP MCP25050-I/SL CAN I/O EXPANDER, 4MHZ, SOIC-14
Сборник данных
Сравнение
| Min.:1 Mult.:1 | 8 Weeks | - | Surface Mount | Surface Mount | 14-SOIC (0.154, 3.90mm Width) | - | 14 | - | - | 8 | Industrial grade | -40°C~85°C | Tube | 1998 | e3 | yes | Active | 1 (Unlimited) | 14 | EAR99 | Matte Tin (Sn) | - | - | - | - | 2.7V~5.5V | DUAL | GULL WING | 260 | 5V | - | - | 40 | MCP25050 | 14 | - | - | Push-Pull | - | 3/5V | - | CAN V2.0b | - | - | - | - | 20mA | - | - | 20mA | MICROPROCESSOR CIRCUIT | 8 | 25MHz | 1 Mbps | - | 1 | No | 25mA | ADC, EEPROM, POR, PWM | - | - | 1.25mm | - | 8.65mm | 3.9mm | No SVHC | ROHS3 Compliant | Lead Free | ||
| MCP25050-I/SL | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| | Mfr. ТипMCP25025-I/SLAnlielectronics Тип | Microchip Technology |
IC I/O EXPANDER CAN 8B 14SOIC
Сборник данных
Сравнение
| Min.:1 Mult.:1 | 8 Weeks | - | Surface Mount | Surface Mount | 14-SOIC (0.154, 3.90mm Width) | - | 14 | - | - | 8 | Industrial grade | -40°C~85°C | Tube | 2007 | e3 | yes | Active | 1 (Unlimited) | 14 | EAR99 | Matte Tin (Sn) | - | - | - | - | 2.7V~5.5V | DUAL | GULL WING | 260 | 5V | - | - | 40 | MCP25025 | 14 | - | - | Push-Pull | - | 3/5V | - | CAN (1-Wire) | - | - | - | - | 20mA | - | - | 20mA | MICROPROCESSOR CIRCUIT | 8 | 4MHz | 1 Mbps | - | 1 | No | 25mA | EEPROM, POR, PWM | - | - | - | - | - | 3.9mm | - | ROHS3 Compliant | Lead Free | ||
| MCP25025-I/SL | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| | Mfr. ТипMCP23S18T-E/MJAnlielectronics Тип | Microchip Technology |
IC I/O EXPANDER SPI 16B 24QFN
Сборник данных
Сравнение
| Min.:1 Mult.:1 | 8 Weeks | - | Surface Mount | Surface Mount | 24-VFQFN Exposed Pad | - | 24 | - | 928.191737mg | 16 | - | -40°C~125°C | Tape & Reel (TR) | 2007 | e3 | - | Active | 1 (Unlimited) | 24 | EAR99 | Matte Tin (Sn) - annealed | - | - | 8542.39.00.01 | 700mW | 1.8V~5.5V | QUAD | NO LEAD | 260 | 5V | 0.5mm | - | 40 | MCP23S18 | 24 | - | Not Qualified | Open Drain | - | 2/5V | - | SPI | - | - | 1mA | 2 | - | - | 25mA | - | PARALLEL IO PORT, GENERAL PURPOSE | 16 | 10MHz | - | - | - | Yes | - | - | - | - | - | 0.9mm | 4mm | 4mm | - | ROHS3 Compliant | Lead Free | ||
| MCP23S18T-E/MJ | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| | Mfr. ТипMCP23S08-E/PAnlielectronics Тип | Microchip Technology |
MICROCHIP - MCP23S08-E/P - 8BIT EXPANDER, I/O, SPI I/F, DIP18
Сборник данных
Сравнение
| Min.:1 Mult.:1 | 8 Weeks | - | Through Hole | Through Hole | 18-DIP (0.300, 7.62mm) | - | 18 | - | 1.270087g | 8 | - | -40°C~125°C | Tube | 2005 | e3 | yes | Active | 1 (Unlimited) | 18 | EAR99 | Matte Tin (Sn) | - | - | - | 700mW | 1.8V~5.5V | DUAL | - | NOT SPECIFIED | 5V | 2.54mm | - | NOT SPECIFIED | MCP23S08 | 18 | - | Not Qualified | Push-Pull | - | 5V | 1 | SPI | - | - | 1mA | 1 | 1mA | - | 25mA | - | - | 8 | 10MHz | - | - | - | Yes | - | POR | - | - | - | 5.334mm | - | 7.62mm | No SVHC | ROHS3 Compliant | Lead Free | ||
| MCP23S08-E/P |
Индекс :
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