| Изображение | Тип | Марка | Объяснение | Установленная цена | Количество | RoHS | Factory Lead Time | Mount | Package / Case | Surface Mount | Number of Pins | Number of Terminals | Access Time-Max | Brand | Clock Frequency-Max (fCLK) | Data Rate Architecture | Factory Pack QuantityFactory Pack Quantity | Ihs Manufacturer | Interface Type | Manufacturer | Manufacturer Part Number | Maximum Clock Frequency | Maximum Clock Rate | Maximum Operating Supply Voltage | Maximum Operating Temperature | Memory Types | Minimum Operating Supply Voltage | Minimum Operating Temperature | Moisture Sensitive | Moisture Sensitivity Levels | Mounting | Mounting Styles | Number of I/O Lines | Number of Words | Number of Words Code | Operating Temperature-Max | Operating Temperature-Min | Package Body Material | Package Code | Package Description | Package Equivalence Code | Package Shape | Package Style | Part Life Cycle Code | Part Package Code | Reflow Temperature-Max (s) | Risk Rank | RoHS | Rohs Code | Supplier Package | Supply Voltage-Max | Supply Voltage-Min | Supply Voltage-Nom (Vsup) | Timing Type | Tradename | Typical Operating Supply Voltage | Unit Weight | Usage Level | Operating Temperature | Packaging | Series | JESD-609 Code | Pbfree Code | ECCN Code | Type | Terminal Finish | Max Operating Temperature | Min Operating Temperature | Additional Feature | HTS Code | Subcategory | Technology | Terminal Position | Terminal Form | Peak Reflow Temperature (Cel) | Number of Functions | Terminal Pitch | Reach Compliance Code | Pin Count | JESD-30 Code | Qualification Status | Operating Supply Voltage | Supply Voltage-Max (Vsup) | Power Supplies | Temperature Grade | Supply Voltage-Min (Vsup) | Max Supply Voltage | Min Supply Voltage | Memory Size | Number of Ports | Nominal Supply Current | Operating Mode | Supply Current-Max | Access Time | Architecture | Data Bus Width | Organization | Output Characteristics | Seated Height-Max | Memory Width | Address Bus Width | Product Type | Density | Standby Current-Max | Memory Density | Screening Level | Parallel/Serial | I/O Type | Sync/Async | Word Size | Memory IC Type | Standby Voltage-Min | Access Mode | Self Refresh | Product Category | Length | Width | Radiation Hardening |
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![]() | Mfr. ТипGS832236AGB-150IAnlielectronics Тип | GSI Technology |
Cache SRAM, 1MX36, 7.5ns, CMOS, PBGA119, 14 X 22 MM, 1.27 MM PITCH, ROHS COMPLIANT, FPBGA-119
Сборник данных
Сравнение
| Min.:1 Mult.:1 | 8 Weeks | - | BGA-119 | YES | - | 119 | 7.5 ns | GSI Technology | 150 MHz | SDR | 14 | GSI TECHNOLOGY | Parallel | GSI Technology | GS832236AGB-150I | 150 MHz | 133@Flow-Through/150@Pipelined MHz | 2.7, 3.6 V | + 85 C | SDR | 2.3, 3 V | - 40 C | Yes | 3 | Surface Mount | SMD/SMT | 36 Bit | 1 MWords | 1000000 | 85 °C | -40 °C | PLASTIC/EPOXY | BGA | BGA, BGA119,7X17,50 | BGA119,7X17,50 | RECTANGULAR | GRID ARRAY | Active | BGA | NOT SPECIFIED | 5.12 | Details | Yes | FBGA | 3.6 V | 2.3 V | 2.5 V | Synchronous | SyncBurst | 2.5, 3.3 V | - | Industrial grade | -40 to 100 °C | Tray | GS832236AGB | e1 | Yes | 3A991.B.2.B | Pipeline/Flow Through | Tin/Silver/Copper (Sn/Ag/Cu) | - | - | ALSO OPERATES AT 3.3V SUPPLY, PIPELINED ARCHITECTURE, FLOW THROUGH | 8542.32.00.41 | Memory & Data Storage | CMOS | BOTTOM | BALL | 260 | 1 | 1.27 mm | compliant | 119 | R-PBGA-B119 | Not Qualified | - | 2.7 V | 2.5/3.3 V | INDUSTRIAL | 2.3 V | - | - | 36 Mbit | 4 | - | SYNCHRONOUS | 210 mA, 220 mA | 7.5 ns | Flow-Through/Pipelined | - | 1 M x 36 | 3-STATE | 1.99 mm | 36 | 20 Bit | SRAM | 36 Mbit | 0.04 A | 37748736 bit | Industrial | PARALLEL | COMMON | - | - | CACHE SRAM | 2.3 V | - | - | SRAM | 22 mm | 14 mm | - | ||
| GS832236AGB-150I | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | Mfr. ТипGS864436E-200IAnlielectronics Тип | GSI Technology |
Cache SRAM, 2MX36, 6.5ns, CMOS, PBGA165, 15 X 17 MM, 1 MM PITCH, FPBGA-165
Сборник данных
Сравнение
| Min.:1 Mult.:1 | - | - | BGA-165 | - | - | - | - | GSI Technology | - | SDR | 15 | - | Parallel | GSI Technology | - | 200 MHz | 153.8@Flow-Through/200@Pipelined MHz | 2.7, 3.6 V | + 85 C | SDR | 2.3, 3 V | - 40 C | Yes | - | Surface Mount | SMD/SMT | 36 Bit | 2 MWords | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | FBGA | 3.6 V | 2.3 V | - | Synchronous | SyncBurst | 2.5, 3.3 V | - | Industrial grade | -40 to 85 °C | Tray | GS864436E | - | - | - | Synchronous Burst | - | - | - | - | - | Memory & Data Storage | - | - | - | - | - | - | - | 165 | - | - | - | - | - | - | - | - | - | 72 Mbit | 4 | - | - | 295 mA, 380 mA | 6.5 ns | Flow-Through/Pipelined | - | 2 M x 36 | - | - | - | 21 Bit | SRAM | 72 Mbit | - | - | Industrial | - | - | - | - | - | - | - | - | SRAM | - | - | - | ||
| GS864436E-200I | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | Mfr. ТипGS816118DD-250Anlielectronics Тип | GSI Technology |
Cache SRAM, 1MX18, 5.5ns, CMOS, PBGA165, FPBGA-165
Сборник данных
Сравнение
| Min.:1 Mult.:1 | - | - | BGA-165 | - | - | - | - | GSI Technology | - | - | 36 | - | Parallel | GSI Technology | - | 250 MHz | - | - | + 70 C | SDR | - | 0 C | Yes | - | - | SMD/SMT | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | N | - | - | 3.6 V | 2.3 V | - | - | SyncBurst | - | - | - | - | Tray | GS816118DD | - | - | - | Pipeline/Flow Through | - | - | - | - | - | Memory & Data Storage | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | 18 Mbit | - | - | - | 210 mA, 230 mA | 5.5 ns | - | - | 1 M x 18 | - | - | - | - | SRAM | - | - | - | - | - | - | - | - | - | - | - | - | SRAM | - | - | - | ||
| GS816118DD-250 | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | Mfr. ТипGS816132DGD-200Anlielectronics Тип | GSI Technology |
Cache SRAM, 512KX32, 6.5ns, CMOS, PBGA165, ROHS COMPLIANT, FPBGA-165
Сборник данных
Сравнение
| Min.:1 Mult.:1 | - | - | BGA-165 | - | - | - | - | GSI Technology | - | - | 36 | - | Parallel | GSI Technology | - | 200 MHz | - | - | + 70 C | SDR | - | 0 C | Yes | - | - | SMD/SMT | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | Details | - | - | 3.6 V | 2.3 V | - | - | SyncBurst | - | - | - | - | Tray | GS816132DGD | - | - | - | Pipeline/Flow Through | - | - | - | - | - | Memory & Data Storage | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | 18 Mbit | - | - | - | 210 mA | 6.5 ns | - | - | 512 k x 32 | - | - | - | - | SRAM | - | - | - | - | - | - | - | - | - | - | - | - | SRAM | - | - | - | ||
| GS816132DGD-200 | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | Mfr. ТипGS8672D37BE-450IAnlielectronics Тип | GSI Technology |
Standard SRAM, 2MX36, 0.45ns, CMOS, PBGA165, FPBGA-165
Сборник данных
Сравнение
| Min.:1 Mult.:1 | - | - | BGA-165 | - | - | - | - | GSI Technology | - | - | 15 | - | Parallel | GSI Technology | - | 450 MHz | - | - | + 85 C | QDR-II | - | - 40 C | Yes | - | - | SMD/SMT | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | 1.9 V | 1.7 V | - | - | SigmaQuad-II+ | - | - | - | - | Tray | GS8672D37BE | - | - | - | SigmaQuad-II+ | - | - | - | - | - | Memory & Data Storage | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | 72 Mbit | - | - | - | 2.07 A | - | - | - | 2 M x 36 | - | - | - | - | SRAM | - | - | 72 | - | - | - | - | - | - | - | - | - | SRAM | - | - | - | ||
| GS8672D37BE-450I | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | Mfr. ТипGS8182D19BD-300Anlielectronics Тип | GSI Technology |
DDR SRAM, 1MX18, 0.45ns, CMOS, PBGA165, 13 X 15 MM, 1 MM PITCH, FPBGA-165
Сборник данных
Сравнение
| Min.:1 Mult.:1 | - | - | BGA-165 | - | - | - | - | GSI Technology | - | - | 18 | - | Parallel | GSI Technology | - | 300 MHz | - | - | + 70 C | DDR | - | 0 C | Yes | - | - | SMD/SMT | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | N | - | - | 1.9 V | 1.7 V | - | - | SigmaQuad-II+ | - | - | - | - | Tray | GS8182D19BD | - | - | - | SigmaQuad II+ | - | - | - | - | - | Memory & Data Storage | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | 18 Mbit | - | - | - | 490 mA | - | - | - | 1 M x 18 | - | - | - | - | SRAM | - | - | - | - | - | - | - | - | - | - | - | - | SRAM | - | - | - | ||
| GS8182D19BD-300 | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | Mfr. ТипGS8672Q19BGE-400IAnlielectronics Тип | GSI Technology |
SRAM
Сборник данных
Сравнение
| Min.:1 Mult.:1 | - | - | BGA-165 | - | - | - | - | - | - | - | 15 | - | Parallel | - | - | 400 MHz | - | - | + 85 C | QDR-II | - | - 40 C | Yes | - | - | SMD/SMT | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | Details | - | - | 1.9 V | 1.7 V | - | - | SigmaQuad-II+ | - | - | - | - | Tray | GS8672Q19BGE | - | - | - | SigmaQuad-II+ | - | 100 °C | -40 °C | - | - | - | - | - | - | - | - | - | - | - | - | - | 1.8 V | - | - | - | - | - | - | 72 Mbit | 2 | - | - | 1.38 A | - | - | - | 4 M x 18 | - | - | - | 21 b | - | 72 Mb | - | 72 | - | - | - | - | - | - | - | - | - | - | - | - | No | ||
| GS8672Q19BGE-400I | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | Mfr. ТипGS816118DGD-150Anlielectronics Тип | GSI Technology |
Cache SRAM, 1MX18, 7.5ns, CMOS, PBGA165, ROHS COMPLIANT, FPBGA-165
Сборник данных
Сравнение
| Min.:1 Mult.:1 | - | - | BGA-165 | - | - | - | - | GSI Technology | - | - | 36 | - | Parallel | GSI Technology | - | 150 MHz | - | - | + 70 C | SDR | - | 0 C | Yes | - | - | SMD/SMT | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | Details | - | - | 3.6 V | 2.3 V | - | - | SyncBurst | - | - | - | - | Tray | GS816118DGD | - | - | - | Pipeline/Flow Through | - | - | - | - | - | Memory & Data Storage | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | 18 Mbit | - | - | - | 170 mA, 180 mA | 7.5 ns | - | - | 1 M x 18 | - | - | - | - | SRAM | - | - | - | - | - | - | - | - | - | - | - | - | SRAM | - | - | - | ||
| GS816118DGD-150 | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | Mfr. ТипGS8321Z36AD-200Anlielectronics Тип | GSI Technology |
ZBT SRAM, 1MX36, CMOS, PBGA165, 13 X 15 MM, 1 MM PITCH, FPBGA-165
Сборник данных
Сравнение
| Min.:1 Mult.:1 | - | - | BGA-165 | - | - | - | - | - | - | SDR | - | - | Parallel | - | - | 200 MHz | 153.8@Flow-Through/200@Pipelined MHz | 2.7, 3.6 V | + 70 C | - | 2.3, 3 V | 0 C | - | - | Surface Mount | SMD/SMT | 36 Bit | 1 MWords | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | FBGA | 3.6 V | 2.3 V | - | Synchronous | - | 2.5, 3.3 V | - | Commercial grade | 0 to 85 °C | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | 165 | - | - | - | - | - | - | - | - | - | 36 Mbit | 4 | - | - | 205 mA, 240 mA | 6.5 ns | Flow-Through/Pipelined | - | 1 M x 36 | - | - | - | 20 Bit | - | 36 Mbit | - | - | Commercial | - | - | - | - | - | - | - | - | - | - | - | - | ||
| GS8321Z36AD-200 | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | Mfr. ТипGS832272GC-200Anlielectronics Тип | GSI Technology |
Cache SRAM, 512KX72, 7.5ns, CMOS, PBGA209, 14 X 22 MM, 1 MM PITCH, ROHS COMPLIANT, BGA-209
Сборник данных
Сравнение
| Min.:1 Mult.:1 | 8 Weeks | - | BGA-209 | YES | - | 209 | 7.5 ns | GSI Technology | 200 MHz | - | 14 | GSI TECHNOLOGY | Parallel | GSI Technology | GS832272GC-200 | 200 MHz | - | 2.7, 3.6 V | + 70 C | SDR | 2.3, 3 V | 0 C | Yes | 3 | - | SMD/SMT | 72 Bit | 524288 words | 512000 | 70 °C | - | PLASTIC/EPOXY | LBGA | LBGA, BGA209,11X19,40 | BGA209,11X19,40 | RECTANGULAR | GRID ARRAY, LOW PROFILE | Active | BGA | NOT SPECIFIED | 1.45 | Details | Yes | - | 3.6 V | 2.3 V | 2.5 V | Synchronous | SyncBurst | 2.5, 3.3 V | - | Commercial grade | 0 to 70 °C | Tray | GS832272GC | e1 | Yes | 3A991.B.2.B | SCD/DCD Pipeline/Flow Through | TIN SILVER COPPER | - | - | FLOW-THROUGH OR PIPELINED ARCHITECTURE; ALSO OPERATES AT 3.3V SUPPLY | 8542.32.00.41 | Memory & Data Storage | CMOS | BOTTOM | BALL | 260 | 1 | 1 mm | compliant | 209 | R-PBGA-B209 | Not Qualified | - | 2.7 V | 2.5/3.3 V | COMMERCIAL | 2.3 V | - | - | 36 Mbit | - | - | SYNCHRONOUS | 235 mA, 320 mA | 7.5@Flow-Through/3@P | - | - | 512 k x 72 | 3-STATE | 1.7 mm | 72 | - | SRAM | - | 0.06 A | 36 | Commercial | PARALLEL | COMMON | - | - | CACHE SRAM | 2.38 V | - | - | SRAM | 22 mm | 14 mm | - | ||
| GS832272GC-200 | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | Mfr. ТипGS8162Z18DGB-250IAnlielectronics Тип | GSI Technology |
ZBT SRAM, 1MX18, 5.5ns, CMOS, PBGA119, ROHS COMPLIANT, FPBGA-119
Сборник данных
Сравнение
| Min.:1 Mult.:1 | 10 Weeks | - | BGA-119 | YES | - | 119 | 5.5 ns | GSI Technology | - | - | 21 | GSI TECHNOLOGY | Parallel | GSI Technology | GS8162Z18DGB-250I | 250 MHz | - | - | + 85 C | SDR | - | - 40 C | Yes | - | - | SMD/SMT | - | 1048576 words | 1000000 | 85 °C | -40 °C | PLASTIC/EPOXY | BGA | BGA, | - | RECTANGULAR | GRID ARRAY | Active | BGA | NOT SPECIFIED | 5.26 | Details | Yes | - | 3.6 V | 2.3 V | 2.5 V | - | NBT SRAM | - | - | - | - | Tray | GS8162Z18DGB | - | - | 3A991.B.2.B | NBT Pipeline/Flow Through | - | - | - | FLOW-THROUGH OR PIPELINED ARCHITECTURE; ALSO OPERATES AT 3.3V SUPPLY | 8542.32.00.41 | Memory & Data Storage | CMOS | BOTTOM | BALL | NOT SPECIFIED | 1 | 1.27 mm | compliant | 119 | R-PBGA-B119 | Not Qualified | - | 2.7 V | - | INDUSTRIAL | 2.3 V | - | - | 18 Mbit | - | - | SYNCHRONOUS | 230 mA, 250 mA | 5.5 ns | - | - | 1 M x 18 | - | 1.99 mm | 18 | - | SRAM | - | - | 18874368 bit | - | PARALLEL | - | - | - | ZBT SRAM | - | - | - | SRAM | 22 mm | 14 mm | - | ||
| GS8162Z18DGB-250I | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | Mfr. ТипGS4576C36GL-25IAnlielectronics Тип | GSI Technology |
DRAM 16M x 36 (288Meg) LLDRAM IICommon I/O
Сборник данных
Сравнение
| Min.:1 Mult.:1 | - | - | uBGA-144 | YES | - | 144 | - | - | - | - | 18 | GSI TECHNOLOGY | - | - | GS4576C36GL-25I | 400 MHz | - | - | + 95 C | - | - | - 40 C | Yes | - | - | SMD/SMT | - | 16777216 words | 16000000 | 85 °C | -40 °C | PLASTIC/EPOXY | TFBGA | TFBGA, | - | RECTANGULAR | GRID ARRAY, THIN PROFILE, FINE PITCH | End Of Life | BGA | NOT SPECIFIED | 5.09 | Details | Yes | - | 1.9 V | 1.7 V | 1.8 V | - | - | - | 0.423288 oz | - | - | Tray | - | - | - | 3A991.B.2.B | SDRAM - DDR | - | - | - | AUTO/SELF REFRESH | 8542.32.00.32 | - | CMOS | BOTTOM | BALL | NOT SPECIFIED | 1 | 0.8 mm | compliant | 144 | R-PBGA-B144 | Not Qualified | - | 1.9 V | - | INDUSTRIAL | 1.7 V | - | - | 576 Mbit | 1 | - | SYNCHRONOUS | 570 mA | 20 ns | - | 36 bit | 16 M x 36 | - | 1.2 mm | 36 | - | - | - | - | 603979776 bit | - | - | - | - | - | DDR DRAM | - | MULTI BANK PAGE BURST | YES | - | 18.5 mm | 11 mm | - | ||
| GS4576C36GL-25I | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | Mfr. ТипGS4576C18GL-25IAnlielectronics Тип | GSI Technology |
DRAM 32M x 18 (288Meg) LLDRAM IICommon I/O
Сборник данных
Сравнение
| Min.:1 Mult.:1 | - | - | uBGA-144 | YES | - | 144 | - | - | - | - | 18 | GSI TECHNOLOGY | - | - | GS4576C18GL-25I | 400 MHz | - | - | + 95 C | - | - | - 40 C | Yes | - | - | SMD/SMT | - | 33554432 words | 32000000 | 85 °C | -40 °C | PLASTIC/EPOXY | TFBGA | TFBGA, | - | RECTANGULAR | GRID ARRAY, THIN PROFILE, FINE PITCH | End Of Life | BGA | NOT SPECIFIED | 5.09 | Details | Yes | - | 1.9 V | 1.7 V | 1.8 V | - | - | - | 0.423288 oz | - | - | Tray | - | - | - | 3A991.B.2.B | SDRAM - DDR | - | - | - | AUTO/SELF REFRESH | 8542.32.00.32 | - | CMOS | BOTTOM | BALL | NOT SPECIFIED | 1 | 0.8 mm | compliant | 144 | R-PBGA-B144 | Not Qualified | - | 1.9 V | - | INDUSTRIAL | 1.7 V | - | - | 576 Mbit | 1 | - | SYNCHRONOUS | 500 mA | 20 ns | - | 18 bit | 32 M x 18 | - | 1.2 mm | 18 | - | - | - | - | 603979776 bit | - | - | - | - | - | DDR DRAM | - | MULTI BANK PAGE BURST | YES | - | 18.5 mm | 11 mm | - | ||
| GS4576C18GL-25I | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | Mfr. ТипGS816018BGT-150Anlielectronics Тип | GSI Technology |
Cache SRAM, 1MX18, 7.5ns, CMOS, PQFP100, ROHS COMPLIANT, TQFP-100
Сборник данных
Сравнение
| Min.:1 Mult.:1 | - | - | - | YES | - | 100 | 7.5 ns | - | 150 MHz | - | - | GSI TECHNOLOGY | - | GSI Technology | GS816018BGT-150 | - | - | - | - | - | - | - | - | 3 | - | - | - | 1048576 words | 1000000 | 70 °C | - | PLASTIC/EPOXY | LQFP | LQFP, QFP100,.63X.87 | QFP100,.63X.87 | RECTANGULAR | FLATPACK, LOW PROFILE | Obsolete | QFP | NOT SPECIFIED | 5.39 | - | Yes | - | - | - | 2.5 V | - | - | - | - | - | - | - | - | e3 | Yes | 3A991.B.2.B | - | PURE MATTE TIN | - | - | FLOW-THROUGH OR PIPELINED ARCHITECTURE; ALSO OPERATES AT 3.3V SUPPLY | 8542.32.00.41 | SRAMs | CMOS | QUAD | GULL WING | 260 | 1 | 0.65 mm | compliant | 100 | R-PQFP-G100 | Not Qualified | - | 2.7 V | 2.5/3.3 V | COMMERCIAL | 2.3 V | - | - | - | - | - | SYNCHRONOUS | 0.185 mA | - | - | - | 1MX18 | 3-STATE | 1.6 mm | 18 | - | - | - | 0.04 A | 18874368 bit | - | PARALLEL | COMMON | - | - | CACHE SRAM | 2.3 V | - | - | - | 20 mm | 14 mm | - | ||
| GS816018BGT-150 | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | Mfr. ТипGS74116AGP-10Anlielectronics Тип | GSI Technology |
Standard SRAM, 256KX16, 10ns, CMOS, PDSO44, 0.400 INCH, ROHS COMPLIANT, TSOP2-44
Сборник данных
Сравнение
| Min.:1 Mult.:1 | 6 Weeks | Surface Mount | TSOP-44 | YES | 44 | 44 | 10 ns | GSI Technology | - | - | 135 | GSI TECHNOLOGY | Parallel | GSI Technology | GS74116AGP-10 | - | - | 3.6 V | + 70 C | SDR | 3 V | 0 C | Yes | 3 | Surface Mount | SMD/SMT | 16 Bit | 256 kWords | 256000 | 70 °C | - | PLASTIC/EPOXY | TSOP2 | TSOP2, TSOP44,.46,32 | TSOP44,.46,32 | RECTANGULAR | SMALL OUTLINE, THIN PROFILE | Active | TSOP2 | NOT SPECIFIED | 1.36 | Compliant | Yes | TSOP-II | 3.6 V | 3 V | 3.3 V | Asynchronous | - | 3.3000 V | 0.016882 oz | Commercial grade | 0 to 70 °C | - | GS74116AGP | e3 | Yes | 3A991.B.2.B | Asynchronous | Matte Tin (Sn) | 70 °C | 0 °C | - | 8542.32.00.41 | Memory & Data Storage | CMOS | DUAL | GULL WING | 260 | 1 | 0.8 mm | compliant | 44 | R-PDSO-G44 | Not Qualified | 3.3 V | 3.6 V | 3.3 V | COMMERCIAL | 3 V | 3.6 V | 3 V | 4 Mbit | 1 | 105 mA | ASYNCHRONOUS | 105 mA | 10 ns | - | - | 256 k x 16 | 3-STATE | 1.2 mm | 16 | 18 Bit | SRAM | 4 Mbit | 0.01 A | 4194304 bit | Commercial | PARALLEL | COMMON | Asynchronous | 16 b | STANDARD SRAM | 3 V | - | - | SRAM | 18.41 mm | 10.16 mm | No | ||
| GS74116AGP-10 | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | Mfr. ТипGS81302TT38GE-500IAnlielectronics Тип | GSI Technology |
DDR SRAM, 4MX36, 0.45ns, CMOS, PBGA165, 15 X 17 MM, 1 MM PITCH, ROHS COMPLIANT, FPBGA-165
Сборник данных
Сравнение
| Min.:1 Mult.:1 | - | - | BGA-165 | - | - | - | - | GSI Technology | - | - | 10 | - | Parallel | GSI Technology | - | 500 MHz | - | 1.9 V | + 85 C | DDR-II | 1.7 V | - 40 C | Yes | - | - | SMD/SMT | 36 Bit | - | - | - | - | - | - | - | - | - | - | - | - | - | - | Details | - | - | 1.9 V | 1.7 V | - | Synchronous | SigmaDDR-II+ | 1.8000 V | - | Industrial grade | -40 to 100 °C | Tray | GS81302TT38GE | - | - | - | SigmaDDR-II+ | - | - | - | - | - | Memory & Data Storage | - | - | - | - | - | - | - | 165 | - | - | - | - | - | - | - | - | - | 144 Mbit | - | - | - | 1.31 A | 0.45 | - | - | 4 M x 36 | - | - | - | - | SRAM | - | - | 144 | Industrial | - | - | - | - | - | - | - | - | SRAM | - | - | - | ||
| GS81302TT38GE-500I | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | Mfr. ТипGS81302TT19E-400IAnlielectronics Тип | GSI Technology |
DDR SRAM, 8MX18, 0.45ns, CMOS, PBGA165, 15 X 17 MM, 1 MM PITCH, FPBGA-165
Сборник данных
Сравнение
| Min.:1 Mult.:1 | 12 Weeks | - | BGA-165 | YES | - | 165 | 0.45 ns | GSI Technology | - | DDR | 10 | GSI TECHNOLOGY | Parallel | GSI Technology | GS81302TT19E-400I | 400 MHz | 400 MHz | 1.9 V | + 85 C | DDR-II | 1.7 V | - 40 C | Yes | - | Surface Mount | SMD/SMT | 18 Bit | 8 MWords | 8000000 | 85 °C | -40 °C | PLASTIC/EPOXY | LBGA | LBGA, | - | RECTANGULAR | GRID ARRAY, LOW PROFILE | Not Recommended | BGA | NOT SPECIFIED | 5.06 | - | No | FBGA | 1.9 V | 1.7 V | 1.8 V | Synchronous | SigmaDDR-II+ | 1.8000 V | - | Industrial grade | -40 to 100 °C | Tray | GS81302TT19E | - | No | 3A991.B.2.B | SigmaDDR-II+ B2 | - | - | - | PIPELINED ARCHITECTURE, LATE WRITE | 8542.32.00.41 | Memory & Data Storage | CMOS | BOTTOM | BALL | NOT SPECIFIED | 1 | 1 mm | compliant | 165 | R-PBGA-B165 | Not Qualified | - | 1.9 V | - | INDUSTRIAL | 1.7 V | - | - | 144 Mbit | 1 | - | SYNCHRONOUS | 905 mA | - | Pipelined | - | 8 M x 18 | - | 1.5 mm | 18 | 22 Bit | SRAM | 144 Mbit | - | 150994944 bit | Industrial | PARALLEL | - | - | - | DDR SRAM | - | - | - | SRAM | 17 mm | 15 mm | - | ||
| GS81302TT19E-400I | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | Mfr. ТипGS832218AB-150Anlielectronics Тип | GSI Technology |
Cache SRAM, 2MX18, 7.5ns, CMOS, PBGA119, 14 X 22 MM, 1.27 MM PITCH, FPBGA-119
Сборник данных
Сравнение
| Min.:1 Mult.:1 | 8 Weeks | - | BGA-119 | YES | - | 119 | 7.5 ns | - | 150 MHz | SDR | - | GSI TECHNOLOGY | Parallel | GSI Technology | GS832218AB-150 | 150 MHz | 133@Flow-Through/150@Pipelined MHz | 2.7, 3.6 V | + 70 C | - | 2.3, 3 V | 0 C | - | - | Surface Mount | SMD/SMT | 18 Bit | 2 MWords | 2000000 | 70 °C | - | PLASTIC/EPOXY | BGA | BGA, BGA119,7X17,50 | BGA119,7X17,50 | RECTANGULAR | GRID ARRAY | Active | BGA | NOT SPECIFIED | 5.11 | - | No | FBGA | 3.6 V | 2.3 V | 2.5 V | Synchronous | - | 2.5, 3.3 V | - | Commercial grade | 0 to 85 °C | - | - | e0 | No | 3A991.B.2.B | - | Tin/Lead (Sn/Pb) | - | - | ALSO OPERATES AT 3.3V SUPPLY, PIPELINED ARCHITECTURE, FLOW THROUGH | 8542.32.00.41 | SRAMs | CMOS | BOTTOM | BALL | NOT SPECIFIED | 1 | 1.27 mm | compliant | 119 | R-PBGA-B119 | Not Qualified | - | 2.7 V | 2.5/3.3 V | COMMERCIAL | 2.3 V | - | - | 36 Mbit | 2 | - | SYNCHRONOUS | 175 mA, 190 mA | 7.5 ns | Flow-Through/Pipelined | - | 2 M x 18 | 3-STATE | 1.99 mm | 18 | 21 Bit | - | 36 Mbit | 0.03 A | 37748736 bit | Commercial | PARALLEL | COMMON | - | - | CACHE SRAM | 2.3 V | - | - | - | 22 mm | 14 mm | - | ||
| GS832218AB-150 | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | Mfr. ТипGS832218AB-333Anlielectronics Тип | GSI Technology |
Cache SRAM, 2MX18, 4.5ns, CMOS, PBGA119, 14 X 22 MM, 1.27 MM PITCH, FPBGA-119
Сборник данных
Сравнение
| Min.:1 Mult.:1 | 8 Weeks | - | BGA-119 | YES | - | 119 | 4.5 ns | - | 333 MHz | SDR | - | GSI TECHNOLOGY | Parallel | GSI Technology | GS832218AB-333 | 333 MHz | 222@Flow-Through/333@Pipelined MHz | 2.7, 3.6 V | + 70 C | - | 2.3, 3 V | 0 C | - | - | Surface Mount | SMD/SMT | 18 Bit | 2 MWords | 2000000 | 70 °C | - | PLASTIC/EPOXY | BGA | BGA, BGA119,7X17,50 | BGA119,7X17,50 | RECTANGULAR | GRID ARRAY | Active | BGA | NOT SPECIFIED | 5.11 | - | No | FBGA | 3.6 V | 2.3 V | 2.5 V | Synchronous | - | 2.5, 3.3 V | - | Commercial grade | 0 to 85 °C | - | GS832218AB | e0 | No | 3A991.B.2.B | - | Tin/Lead (Sn/Pb) | - | - | ALSO OPERATES AT 3.3V SUPPLY, PIPELINED ARCHITECTURE, FLOW THROUGH | 8542.32.00.41 | SRAMs | CMOS | BOTTOM | BALL | NOT SPECIFIED | 1 | 1.27 mm | compliant | 119 | R-PBGA-B119 | Not Qualified | - | 2.7 V | 2.5/3.3 V | COMMERCIAL | 2.3 V | - | - | 36 Mbit | 2 | - | SYNCHRONOUS | 0.3 mA | 4.5 ns | Flow-Through/Pipelined | - | 2MX18 | 3-STATE | 1.99 mm | 18 | 21 Bit | - | 36 Mbit | 0.03 A | 37748736 bit | Commercial | PARALLEL | COMMON | - | - | CACHE SRAM | 2.3 V | - | - | - | 22 mm | 14 mm | - | ||
| GS832218AB-333 | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | Mfr. ТипGS8162Z18DB-150IVAnlielectronics Тип | GSI Technology |
ZBT SRAM, 1MX18, 7.5ns, CMOS, PBGA119, FPBGA-119
Сборник данных
Сравнение
| Min.:1 Mult.:1 | - | - | BGA-119 | - | - | - | - | GSI Technology | - | SDR | 21 | - | Parallel | GSI Technology | - | 150 MHz | 133.3@Flow-Through/150@Pipelined MHz | 2, 2.7 V | + 85 C | SDR | 1.7, 2.3 V | - 40 C | Yes | - | Surface Mount | SMD/SMT | 18 Bit | 1 MWords | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | FBGA | 2.7 V | 1.7 V | - | Synchronous | NBT SRAM | 1.8, 2.5 V | - | Industrial grade | -40 to 100 °C | Tray | GS8162Z18DB | - | - | - | NBT Pipeline/Flow Through | - | - | - | - | - | Memory & Data Storage | - | - | - | - | - | - | - | 119 | - | - | - | - | - | - | - | - | - | 18 Mbit | 2 | - | - | 180 mA, 200 mA | 7.5 ns | Flow-Through/Pipelined | - | 1 M x 18 | - | - | - | 20 Bit | SRAM | 18 Mbit | - | - | Industrial | - | - | - | - | - | - | - | - | SRAM | - | - | - | ||
| GS8162Z18DB-150IV |
Индекс :
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