| Изображение | Тип | Марка | Объяснение | Установленная цена | Количество | RoHS | Surface Mount | Number of Terminals | Access Time-Max | Clock Frequency-Max (fCLK) | Ihs Manufacturer | Moisture Sensitivity Levels | Number of Words | Number of Words Code | Operating Temperature-Max | Operating Temperature-Min | Package Body Material | Package Code | Package Description | Package Equivalence Code | Package Shape | Package Style | Part Life Cycle Code | Part Package Code | Rohs Code | Supply Voltage-Nom (Vsup) | JESD-609 Code | Pbfree Code | ECCN Code | Terminal Finish | Additional Feature | HTS Code | Terminal Position | Terminal Form | Peak Reflow Temperature (Cel) | Number of Functions | Terminal Pitch | Reach Compliance Code | Time@Peak Reflow Temperature-Max (s) | Pin Count | JESD-30 Code | Qualification Status | Supply Voltage-Max (Vsup) | Temperature Grade | Supply Voltage-Min (Vsup) | Number of Ports | Operating Mode | Supply Current-Max | Organization | Output Characteristics | Seated Height-Max | Memory Width | Standby Current-Max | Memory Density | Screening Level | Parallel/Serial | I/O Type | Memory IC Type | Standby Voltage-Min | Output Enable | Length | Width |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
![]() | Mfr. ТипIDT70V3399S133BFGAnlielectronics Тип | Integrated Device Technology Inc |
Dual-Port SRAM, 128KX18, 4.2ns, CMOS, CBGA208, 15 X 15 MM X 1.4 MM, 0.80 MM PITCH, GREEN, FPBGA-208
Сборник данных
Сравнение
| Min.:1 Mult.:1 | YES | 208 | 4.2 ns | 133 MHz | INTEGRATED DEVICE TECHNOLOGY INC | 3 | 131072 words | 128000 | 70 °C | - | CERAMIC, METAL-SEALED COFIRED | LFBGA | LFBGA, BGA208,17X17,32 | BGA208,17X17,32 | SQUARE | GRID ARRAY, LOW PROFILE, FINE PITCH | Transferred | BGA | Yes | 3.3 V | e1 | Yes | 3A991.B.2.A | Tin/Silver/Copper (Sn/Ag/Cu) | FLOW-THROUGH OR PIPELINED ARCHITECTURE | 8542.32.00.41 | BOTTOM | BALL | 260 | 1 | 0.8 mm | compliant | 30 | 208 | S-CBGA-B208 | Not Qualified | 3.45 V | COMMERCIAL | 3.15 V | 2 | SYNCHRONOUS | 0.4 mA | 128KX18 | 3-STATE | 1.7 mm | 18 | 0.03 A | 2359296 bit | - | PARALLEL | COMMON | MULTI-PORT SRAM | 3.15 V | - | 15 mm | 15 mm | ||
| IDT70V3399S133BFG | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | Mfr. ТипIDT8M624S60CBAnlielectronics Тип | Integrated Device Technology Inc |
Description: SRAM Module, 64KX16, 60ns, CMOS, CDMA40
Сборник данных
Сравнение
| Min.:1 Mult.:1 | NO | 40 | 60 ns | - | INTEGRATED DEVICE TECHNOLOGY INC | - | 65536 words | 64000 | 125 °C | -55 °C | CERAMIC, METAL-SEALED COFIRED | DIP | - | DIP40,.6 | RECTANGULAR | MICROELECTRONIC ASSEMBLY | Obsolete | - | No | 5 V | e0 | - | 3A001.A.2.C | TIN LEAD | TTL COMPATIBLE INPUTS/OUTPUTS | 8542.32.00.41 | DUAL | THROUGH-HOLE | - | 1 | 2.54 mm | not_compliant | - | - | R-CDMA-T40 | Not Qualified | 5.5 V | MILITARY | 4.5 V | - | ASYNCHRONOUS | 0.34 mA | 64KX16 | 3-STATE | - | 16 | 0.08 A | 1048576 bit | MIL-STD-883 Class B (Modified) | PARALLEL | COMMON | SRAM MODULE | 4.5 V | - | - | - | ||
| IDT8M624S60CB | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | Mfr. ТипIDT7187L55CBAnlielectronics Тип | Integrated Device Technology Inc |
Standard SRAM, 64KX1, 55ns, CMOS, CDIP22, 0.300 INCH, HERMETIC SEALED, SIDE BRAZED, DIP-22
Сборник данных
Сравнение
| Min.:1 Mult.:1 | NO | 22 | 55 ns | - | INTEGRATED DEVICE TECHNOLOGY INC | - | 65536 words | 64000 | 125 °C | -55 °C | CERAMIC, METAL-SEALED COFIRED | DIP | DIP, DIP22,.3 | DIP22,.3 | RECTANGULAR | IN-LINE | Obsolete | DIP | No | 5 V | e0 | No | 3A001.A.2.C | TIN LEAD | - | 8542.32.00.41 | DUAL | THROUGH-HOLE | - | 1 | 2.54 mm | not_compliant | - | 22 | R-CDIP-T22 | Not Qualified | 5.5 V | MILITARY | 4.5 V | 1 | ASYNCHRONOUS | 0.095 mA | 64KX1 | 3-STATE | 5.08 mm | 1 | 0.0006 A | 65536 bit | 38535Q/M;38534H;883B | PARALLEL | SEPARATE | STANDARD SRAM | 2 V | NO | 27.432 mm | 7.62 mm | ||
| IDT7187L55CB | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | Mfr. ТипIDT8M624S45CBAnlielectronics Тип | Integrated Device Technology Inc |
Description: SRAM Module, 64KX16, 45ns, CMOS, CDMA40
Сборник данных
Сравнение
| Min.:1 Mult.:1 | NO | 40 | 45 ns | - | INTEGRATED DEVICE TECHNOLOGY INC | - | 65536 words | 64000 | 125 °C | -55 °C | CERAMIC, METAL-SEALED COFIRED | DIP | - | DIP40,.6 | RECTANGULAR | MICROELECTRONIC ASSEMBLY | Obsolete | - | No | 5 V | e0 | - | 3A001.A.2.C | TIN LEAD | TTL COMPATIBLE INPUTS/OUTPUTS | 8542.32.00.41 | DUAL | THROUGH-HOLE | - | 1 | 2.54 mm | not_compliant | - | - | R-CDMA-T40 | Not Qualified | 5.5 V | MILITARY | 4.5 V | - | ASYNCHRONOUS | 0.34 mA | 64KX16 | 3-STATE | - | 16 | 0.08 A | 1048576 bit | MIL-STD-883 Class B (Modified) | PARALLEL | COMMON | SRAM MODULE | 4.5 V | - | - | - | ||
| IDT8M624S45CB | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | Mfr. ТипIDT7130SA45L52Anlielectronics Тип | Integrated Device Technology Inc |
Description: Multi-Port SRAM, 1KX8, 45ns, CMOS, CQCC52, LCC-52
Сборник данных
Сравнение
| Min.:1 Mult.:1 | YES | 52 | 45 ns | - | INTEGRATED DEVICE TECHNOLOGY INC | - | 1024 words | 1000 | 70 °C | - | CERAMIC, METAL-SEALED COFIRED | QCCN | QCCN, LCC52,.75SQ | LCC52,.75SQ | SQUARE | CHIP CARRIER | Obsolete | LCC | No | 5 V | e0 | No | EAR99 | TIN LEAD | INTERRUPT FLAG; AUTOMATIC POWER-DOWN | 8542.32.00.41 | QUAD | NO LEAD | - | 1 | 1.27 mm | not_compliant | - | 52 | S-CQCC-N52 | Not Qualified | 5.5 V | COMMERCIAL | 4.5 V | 2 | ASYNCHRONOUS | 0.19 mA | 1KX8 | 3-STATE | 2.2098 mm | 8 | 0.015 A | 8192 bit | - | PARALLEL | COMMON | MULTI-PORT SRAM | 4.5 V | YES | 19.05 mm | 19.05 mm | ||
| IDT7130SA45L52 | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | Mfr. ТипIDT7005L20JBAnlielectronics Тип | Integrated Device Technology Inc |
Description: Dual-Port SRAM, 8KX8, 20ns, CMOS, PQCC68, 0.950 X 0.950 INCH, 0.120 INCH HEIGHT, PLASTIC, LCC-68
Сборник данных
Сравнение
| Min.:1 Mult.:1 | YES | 68 | 20 ns | - | INTEGRATED DEVICE TECHNOLOGY INC | 1 | 8192 words | 8000 | 125 °C | -55 °C | PLASTIC/EPOXY | QCCJ | QCCJ, LDCC68,1.0SQ | LDCC68,1.0SQ | SQUARE | CHIP CARRIER | Transferred | LCC | No | 5 V | e0 | No | 3A001.A.2.C | TIN LEAD | - | 8542.32.00.41 | QUAD | J BEND | 225 | 1 | 1.27 mm | not_compliant | 20 | 68 | S-PQCC-J68 | Not Qualified | 5.5 V | MILITARY | 4.5 V | 2 | ASYNCHRONOUS | 0.32 mA | 8KX8 | 3-STATE | 4.572 mm | 8 | 0.004 A | 65536 bit | - | PARALLEL | COMMON | MULTI-PORT SRAM | 2 V | - | 24.2062 mm | 24.2062 mm | ||
| IDT7005L20JB | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | Mfr. ТипIDT8M824S45CBAnlielectronics Тип | Integrated Device Technology Inc |
Description: SRAM Module, 128KX8, 45ns, CMOS, CDMA32
Сборник данных
Сравнение
| Min.:1 Mult.:1 | NO | 32 | 45 ns | - | INTEGRATED DEVICE TECHNOLOGY INC | - | 131072 words | 128000 | 125 °C | -55 °C | CERAMIC, METAL-SEALED COFIRED | DIP | - | DIP32,.6 | RECTANGULAR | MICROELECTRONIC ASSEMBLY | Obsolete | - | No | 5 V | e0 | - | 3A001.A.2.C | TIN LEAD | TTL COMPATIBLE INPUTS/OUTPUTS | 8542.32.00.41 | DUAL | THROUGH-HOLE | - | 1 | 2.54 mm | not_compliant | - | - | R-CDMA-T32 | Not Qualified | 5.5 V | MILITARY | 4.5 V | - | ASYNCHRONOUS | 0.265 mA | 128KX8 | 3-STATE | - | 8 | 0.08 A | 1048576 bit | 38535Q/M;38534H;883B | PARALLEL | COMMON | SRAM MODULE | 4.5 V | - | - | - | ||
| IDT8M824S45CB | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | Mfr. ТипIDT7005S20PFBAnlielectronics Тип | Integrated Device Technology Inc |
Dual-Port SRAM, 8KX8, 20ns, CMOS, PQFP64, 14 X 14 MM, 1.40 MM HEIGHT, TQFP-64
Сборник данных
Сравнение
| Min.:1 Mult.:1 | YES | 64 | 20 ns | - | INTEGRATED DEVICE TECHNOLOGY INC | 3 | 8192 words | 8000 | 125 °C | -55 °C | PLASTIC/EPOXY | LQFP | LQFP, QFP64,.66SQ,32 | QFP64,.66SQ,32 | SQUARE | FLATPACK, LOW PROFILE | Obsolete | QFP | No | 5 V | e0 | No | 3A001.A.2.C | TIN LEAD | - | 8542.32.00.41 | QUAD | GULL WING | 240 | 1 | 0.8 mm | not_compliant | 30 | 64 | S-PQFP-G64 | Not Qualified | 5.5 V | MILITARY | 4.5 V | 2 | ASYNCHRONOUS | 0.37 mA | 8KX8 | 3-STATE | 1.6 mm | 8 | 0.03 A | 65536 bit | - | PARALLEL | COMMON | MULTI-PORT SRAM | 4.5 V | - | 14 mm | 14 mm | ||
| IDT7005S20PFB | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | Mfr. ТипIDT7165L35JAnlielectronics Тип | Integrated Device Technology Inc |
Standard SRAM, 8KX8, 35ns, CMOS, PQCC32, PLASTIC, LCC-32
Сборник данных
Сравнение
| Min.:1 Mult.:1 | YES | 32 | 35 ns | - | INTEGRATED DEVICE TECHNOLOGY INC | 1 | 8192 words | 8000 | 70 °C | - | PLASTIC/EPOXY | QCCJ | PLASTIC, LCC-32 | LDCC32,.5X.6 | RECTANGULAR | CHIP CARRIER | Obsolete | QFJ | No | 5 V | e0 | - | EAR99 | TIN LEAD | - | 8542.32.00.41 | QUAD | J BEND | 225 | 1 | 1.27 mm | not_compliant | 20 | 32 | R-PQCC-J32 | Not Qualified | 5.5 V | COMMERCIAL | 4.5 V | 1 | ASYNCHRONOUS | 0.13 mA | 8KX8 | 3-STATE | 3.55 mm | 8 | 0.00006 A | 65536 bit | - | PARALLEL | COMMON | STANDARD SRAM | 2 V | YES | 13.97 mm | 11.43 mm | ||
| IDT7165L35J | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | Mfr. ТипIDT7025L25PFBAnlielectronics Тип | Integrated Device Technology Inc |
Dual-Port SRAM, 8KX16, 25ns, CMOS, PQFP100, TQFP-100
Сборник данных
Сравнение
| Min.:1 Mult.:1 | YES | 100 | 25 ns | - | INTEGRATED DEVICE TECHNOLOGY INC | 3 | 8192 words | 8000 | 125 °C | -55 °C | PLASTIC/EPOXY | LFQFP | LFQFP, | - | SQUARE | FLATPACK, LOW PROFILE, FINE PITCH | Obsolete | QFP | No | 5 V | e0 | No | 3A001.A.2.C | Tin/Lead (Sn85Pb15) | CONFIGURABLE AS 8K X 16 | 8542.32.00.41 | QUAD | GULL WING | 240 | 1 | 0.5 mm | not_compliant | 20 | 100 | S-PQFP-G100 | Not Qualified | 5.5 V | MILITARY | 4.5 V | - | ASYNCHRONOUS | - | 8KX16 | - | 1.6 mm | 16 | - | 131072 bit | MIL-PRF-38535 | PARALLEL | - | DUAL-PORT SRAM | - | - | 14 mm | 14 mm | ||
| IDT7025L25PFB | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | Mfr. ТипIDT6116SA120L32BAnlielectronics Тип | Integrated Device Technology Inc |
Description: Standard SRAM, 2KX8, 120ns, CMOS, CQCC32, LCC-32
Сборник данных
Сравнение
| Min.:1 Mult.:1 | YES | 32 | 120 ns | - | INTEGRATED DEVICE TECHNOLOGY INC | - | 2048 words | 2000 | 125 °C | -55 °C | CERAMIC, METAL-SEALED COFIRED | QCCN | LCC-32 | LCC32,.45X.55 | RECTANGULAR | CHIP CARRIER | Obsolete | QFJ | No | 5 V | e0 | - | 3A001.A.2.C | Tin/Lead (Sn/Pb) | - | 8542.32.00.41 | QUAD | NO LEAD | - | 1 | 1.27 mm | not_compliant | - | 32 | R-CQCC-N32 | Not Qualified | 5.5 V | MILITARY | 4.5 V | 1 | ASYNCHRONOUS | 0.1 mA | 2KX8 | 3-STATE | 3.048 mm | 8 | 0.01 A | 16384 bit | 38535Q/M;38534H;883B | PARALLEL | COMMON | STANDARD SRAM | 4.5 V | YES | 13.97 mm | 11.43 mm | ||
| IDT6116SA120L32B | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | Mfr. ТипIDT71V3548S133PFAnlielectronics Тип | Integrated Device Technology Inc |
Description: ZBT SRAM, 256KX18, 4.2ns, CMOS, PQFP100, 14 X 20 MM, 1.40 MM HEIGHT, PLASTIC, TQFP-100
Сборник данных
Сравнение
| Min.:1 Mult.:1 | YES | 100 | 4.2 ns | 133 MHz | INTEGRATED DEVICE TECHNOLOGY INC | 3 | 262144 words | 256000 | 70 °C | - | PLASTIC/EPOXY | LQFP | 14 X 20 MM, 1.40 MM HEIGHT, PLASTIC, TQFP-100 | QFP100,.63X.87 | RECTANGULAR | FLATPACK, LOW PROFILE | Obsolete | QFP | No | 3.3 V | e0 | - | 3A991.B.2.A | Tin/Lead (Sn85Pb15) | PIPELINED ARCHITECTURE | 8542.32.00.41 | QUAD | GULL WING | 225 | 1 | 0.65 mm | not_compliant | 20 | 100 | R-PQFP-G100 | Not Qualified | 3.465 V | COMMERCIAL | 3.135 V | - | SYNCHRONOUS | 0.3 mA | 256KX18 | 3-STATE | 1.6 mm | 18 | 0.04 A | 4718592 bit | - | PARALLEL | COMMON | ZBT SRAM | 3.14 V | - | 20 mm | 14 mm | ||
| IDT71V3548S133PF | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | Mfr. Тип70V3389S6BFGAnlielectronics Тип | Integrated Device Technology Inc |
Dual-Port SRAM, 64KX18, 6ns, CMOS, CBGA208, 15 X 15 MM X 1.40 MM, 0.80 MM PITCH, GREEN, FPBGA-208
Сборник данных
Сравнение
| Min.:1 Mult.:1 | YES | 208 | 6 ns | 83 MHz | INTEGRATED DEVICE TECHNOLOGY INC | 3 | 65536 words | 64000 | 70 °C | - | CERAMIC, METAL-SEALED COFIRED | TFBGA | TFBGA, BGA208,17X17,32 | BGA208,17X17,32 | SQUARE | GRID ARRAY, THIN PROFILE, FINE PITCH | Transferred | BGA | Yes | 3.3 V | e1 | Yes | 3A991.B.2.A | Tin/Silver/Copper (Sn/Ag/Cu) | PIPELINED OUTPUT MODE; SELF-TIMED WRITE CYCLE | 8542.32.00.41 | BOTTOM | BALL | 260 | 1 | 0.8 mm | compliant | 30 | 208 | S-CBGA-B208 | Not Qualified | 3.45 V | COMMERCIAL | 3.15 V | 2 | SYNCHRONOUS | 0.31 mA | 64KX18 | 3-STATE | 1.2 mm | 18 | 0.015 A | 1179648 bit | - | PARALLEL | COMMON | MULTI-PORT SRAM | 3.15 V | - | 15 mm | 15 mm | ||
| 70V3389S6BFG | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | Mfr. ТипIDT7132SA90XCBAnlielectronics Тип | Integrated Device Technology Inc |
Multi-Port SRAM, 2KX8, 90ns, CMOS, CDIP48
Сборник данных
Сравнение
| Min.:1 Mult.:1 | NO | 48 | 90 ns | - | INTEGRATED DEVICE TECHNOLOGY INC | - | 2048 words | 2000 | 125 °C | -55 °C | CERAMIC | SDIP | - | SDIP48,.4 | RECTANGULAR | IN-LINE, SHRINK PITCH | Obsolete | - | No | 5 V | e0 | - | 3A001.A.2.C | Tin/Lead (Sn/Pb) | - | 8542.32.00.41 | DUAL | THROUGH-HOLE | - | - | 1.78 mm | not_compliant | - | - | R-XDIP-T48 | Not Qualified | - | MILITARY | - | 2 | ASYNCHRONOUS | - | 2KX8 | 3-STATE | - | 8 | 0.03 A | 16384 bit | 38535Q/M;38534H;883B | PARALLEL | COMMON | MULTI-PORT SRAM | - | - | - | - | ||
| IDT7132SA90XCB | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | Mfr. ТипIDT71V546S117PFIAnlielectronics Тип | Integrated Device Technology Inc |
Description: ZBT SRAM, 128KX36, 4.5ns, CMOS, PQFP100, 14 X 20 MM, PLASTIC, TQFP-100
Сборник данных
Сравнение
| Min.:1 Mult.:1 | YES | 100 | 4.5 ns | 117 MHz | INTEGRATED DEVICE TECHNOLOGY INC | 3 | 131072 words | 128000 | 85 °C | -40 °C | PLASTIC/EPOXY | LQFP | 14 X 20 MM, PLASTIC, TQFP-100 | QFP100,.63X.87 | RECTANGULAR | FLATPACK, LOW PROFILE | Obsolete | QFP | No | 3.3 V | e0 | No | 3A991.B.2.A | Tin/Lead (Sn85Pb15) | - | 8542.32.00.41 | QUAD | GULL WING | 225 | 1 | 0.65 mm | not_compliant | 20 | 100 | R-PQFP-G100 | Not Qualified | 3.465 V | INDUSTRIAL | 3.135 V | - | SYNCHRONOUS | 0.285 mA | 128KX36 | 3-STATE | 1.6 mm | 36 | 0.045 A | 4718592 bit | - | PARALLEL | COMMON | ZBT SRAM | 3.14 V | - | 20 mm | 14 mm | ||
| IDT71V546S117PFI | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | Mfr. ТипIDT70V24L25PFGAnlielectronics Тип | Integrated Device Technology Inc |
Dual-Port SRAM, 4KX16, 25ns, CMOS, PQFP100, 14 X 14 MM, 1.40 MM HEIGHT, GREEN, PLASTIC, TQFP-100
Сборник данных
Сравнение
| Min.:1 Mult.:1 | YES | 100 | 25 ns | - | INTEGRATED DEVICE TECHNOLOGY INC | 3 | 4096 words | 4000 | 70 °C | - | PLASTIC/EPOXY | LFQFP | LFQFP, QFP100,.63SQ,20 | QFP100,.63SQ,20 | SQUARE | FLATPACK, LOW PROFILE, FINE PITCH | Transferred | QFP | Yes | 3.3 V | e3 | Yes | EAR99 | Matte Tin (Sn) - annealed | - | 8542.32.00.41 | QUAD | GULL WING | 260 | 1 | 0.5 mm | compliant | 30 | 100 | S-PQFP-G100 | Not Qualified | 3.6 V | COMMERCIAL | 3 V | 2 | ASYNCHRONOUS | 0.165 mA | 4KX16 | 3-STATE | 1.6 mm | 16 | 0.0025 A | 65536 bit | - | PARALLEL | COMMON | MULTI-PORT SRAM | 3 V | - | 14 mm | 14 mm | ||
| IDT70V24L25PFG | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | Mfr. ТипIDT7130LA25JBAnlielectronics Тип | Integrated Device Technology Inc |
Dual-Port SRAM, 1KX8, 25ns, CMOS, PQCC52, PLASTIC, LCC-52
Сборник данных
Сравнение
| Min.:1 Mult.:1 | YES | 52 | 25 ns | - | INTEGRATED DEVICE TECHNOLOGY INC | 1 | 1024 words | 1000 | 125 °C | -55 °C | PLASTIC/EPOXY | QCCJ | QCCJ, LDCC52,.8SQ | LDCC52,.8SQ | SQUARE | CHIP CARRIER | Transferred | LCC | No | 5 V | e0 | No | 3A001.A.2.C | TIN LEAD | - | 8542.32.00.41 | QUAD | J BEND | 225 | 1 | 1.27 mm | not_compliant | 20 | 52 | S-PQCC-J52 | Not Qualified | 5.5 V | MILITARY | 4.5 V | 2 | ASYNCHRONOUS | 0.22 mA | 1KX8 | 3-STATE | 4.57 mm | 8 | 0.004 A | 8192 bit | MIL-PRF-38535 | PARALLEL | COMMON | MULTI-PORT SRAM | 2 V | - | 19.1262 mm | 19.1262 mm | ||
| IDT7130LA25JB | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | Mfr. ТипIDT70V9089S7PFAnlielectronics Тип | Integrated Device Technology Inc |
Dual-Port SRAM, 64KX8, 18ns, CMOS, PQFP100, 14 X 14 MM, 1.40 MM HEIGHT, TQFP-100
Сборник данных
Сравнение
| Min.:1 Mult.:1 | YES | 100 | 18 ns | 83 MHz | INTEGRATED DEVICE TECHNOLOGY INC | 3 | 65536 words | 64000 | 70 °C | - | PLASTIC/EPOXY | LFQFP | 14 X 14 MM, 1.40 MM HEIGHT, TQFP-100 | QFP100,.63SQ,20 | SQUARE | FLATPACK, LOW PROFILE, FINE PITCH | Transferred | QFP | No | 3.3 V | e0 | No | 3A991.B.2.B | Tin/Lead (Sn85Pb15) | FLOW-THROUGH OR PIPELINED ARCHITECTURE | 8542.32.00.41 | QUAD | GULL WING | 240 | 1 | 0.5 mm | not_compliant | 20 | 100 | S-PQFP-G100 | Not Qualified | 3.6 V | COMMERCIAL | 3 V | 2 | SYNCHRONOUS | 0.335 mA | 64KX8 | 3-STATE | 1.6 mm | 8 | 0.005 A | 524288 bit | - | PARALLEL | COMMON | MULTI-PORT SRAM | 3 V | - | 14 mm | 14 mm | ||
| IDT70V9089S7PF | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | Mfr. ТипIDT7006S45PFAnlielectronics Тип | Integrated Device Technology Inc |
Multi-Port SRAM, 16KX8, 45ns, CMOS, PQFP64, PLASTIC, TQFP-64
Сборник данных
Сравнение
| Min.:1 Mult.:1 | YES | 64 | 45 ns | - | INTEGRATED DEVICE TECHNOLOGY INC | 3 | 16384 words | 16000 | 70 °C | - | PLASTIC/EPOXY | LQFP | PLASTIC, TQFP-64 | QFP64,.66SQ,32 | SQUARE | FLATPACK, LOW PROFILE | Obsolete | QFP | No | 5 V | e0 | - | EAR99 | TIN LEAD | INTERRUPT FLAG; ARBITER; SEMAPHORE | 8542.32.00.41 | QUAD | GULL WING | 240 | 1 | 0.8 mm | not_compliant | 30 | 64 | S-PQFP-G64 | Not Qualified | 5.5 V | COMMERCIAL | 4.5 V | 2 | ASYNCHRONOUS | 0.34 mA | 16KX8 | 3-STATE | 1.6 mm | 8 | 0.015 A | 131072 bit | - | PARALLEL | COMMON | MULTI-PORT SRAM | 4.5 V | YES | 14 mm | 14 mm | ||
| IDT7006S45PF | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
![]() | Mfr. ТипIDT7132LA25PAnlielectronics Тип | Integrated Device Technology Inc |
Dual-Port SRAM, 2KX8, 25ns, CMOS, PDIP48, 0.550 X 2.430 INCH, 0.180 INCH HEIGHT, PLASTIC, DIP-48
Сборник данных
Сравнение
| Min.:1 Mult.:1 | NO | 48 | 25 ns | - | INTEGRATED DEVICE TECHNOLOGY INC | - | 2048 words | 2000 | 70 °C | - | PLASTIC/EPOXY | DIP | 0.550 X 2.430 INCH, 0.180 INCH HEIGHT, PLASTIC, DIP-48 | DIP48,.6 | RECTANGULAR | IN-LINE | Obsolete | DIP | No | 5 V | e0 | - | EAR99 | Tin/Lead (Sn85Pb15) | BATTERY BACK UP | 8542.32.00.41 | DUAL | THROUGH-HOLE | - | 1 | 2.54 mm | not_compliant | - | 48 | R-PDIP-T48 | Not Qualified | 5.5 V | COMMERCIAL | 4.5 V | 2 | ASYNCHRONOUS | 0.17 mA | 2KX8 | 3-STATE | 5.08 mm | 8 | 0.0015 A | 16384 bit | - | PARALLEL | COMMON | MULTI-PORT SRAM | 2 V | - | 61.849 mm | 15.24 mm | ||
| IDT7132LA25P |
Индекс :
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