Memory Products For Sale - PDF - Integrated Circuits (ICs) -Page48

Изображение	Тип	Марка	Объяснение	Установленная цена	Количество	RoHS	Factory Lead Time	Lifecycle Status	Contact Plating	Mount	Mounting Type	Package / Case	Surface Mount	Supplier Device Package	Material	Number of Terminals	Active Read Current - Max	Base Product Number	Brand	Clock Frequency-Max (fCLK)	Factory Pack QuantityFactory Pack Quantity	Ihs Manufacturer	Interface Type	Manufacturer	Manufacturer Part Number	Maximum Clock Frequency	Maximum Operating Temperature	Memory Types	Mfr	Minimum Operating Temperature	Mounting Styles	MSL	Number of Words	Number of Words Code	Operating Temperature-Max	Operating Temperature-Min	Package	Package Body Material	Package Code	Package Description	Package Shape	Package Style	Part # Aliases	Part Life Cycle Code	Product Status	Reflow Temperature-Max (s)	Risk Rank	RoHS	Rohs Code	Supplier Package	Supply Voltage-Max	Supply Voltage-Min	Supply Voltage-Nom (Vsup)	Timing Type	Tradename	Usage Level	Operating Temperature	Packaging	Series	Tolerance	JESD-609 Code	Temperature Coefficient	Type	Resistance	Terminal Finish	Max Operating Temperature	Min Operating Temperature	Composition	Subcategory	Power Rating	Technology	Voltage - Supply	Terminal Position	Terminal Form	Peak Reflow Temperature (Cel)	Number of Functions	Terminal Pitch	Reach Compliance Code	Military Standard	JESD-30 Code	Supply Voltage-Max (Vsup)	Temperature Grade	Supply Voltage-Min (Vsup)	Max Supply Voltage	Min Supply Voltage	Memory Size	Operating Mode	Clock Frequency	Access Time	Memory Format	Memory Interface	Data Bus Width	Organization	Seated Height-Max	Memory Width	Write Cycle Time - Word, Page	Product Type	Density	Memory Density	Screening Level	Parallel/Serial	Memory IC Type	Legend	Programming Voltage	Background Color	Language	Product Category	Memory Organization	Diameter	Length	Width	Radiation Hardening	Lead Free

Изображение	Тип	Марка	Объяснение	Количество	Factory Lead Time	Lifecycle Status	Contact Plating	Mount	Mounting Type	Package / Case	Surface Mount	Supplier Device Package	Material	Number of Terminals	Active Read Current - Max	Base Product Number	Brand	Clock Frequency-Max (fCLK)	Factory Pack QuantityFactory Pack Quantity	Ihs Manufacturer	Interface Type	Manufacturer	Manufacturer Part Number	Maximum Clock Frequency	Maximum Operating Temperature	Memory Types	Mfr	Minimum Operating Temperature	Mounting Styles	MSL	Number of Words	Number of Words Code	Operating Temperature-Max	Operating Temperature-Min	Package	Package Body Material	Package Code	Package Description	Package Shape	Package Style	Part # Aliases	Part Life Cycle Code	Product Status	Reflow Temperature-Max (s)	Risk Rank	RoHS	Rohs Code	Supplier Package	Supply Voltage-Max	Supply Voltage-Min	Supply Voltage-Nom (Vsup)	Timing Type	Tradename	Usage Level	Operating Temperature	Packaging	Series	Tolerance	JESD-609 Code	Temperature Coefficient	Type	Resistance	Terminal Finish	Max Operating Temperature	Min Operating Temperature	Composition	Subcategory	Power Rating	Technology	Voltage - Supply	Terminal Position	Terminal Form	Peak Reflow Temperature (Cel)	Number of Functions	Terminal Pitch	Reach Compliance Code	Military Standard	JESD-30 Code	Supply Voltage-Max (Vsup)	Temperature Grade	Supply Voltage-Min (Vsup)	Max Supply Voltage	Min Supply Voltage	Memory Size	Operating Mode	Clock Frequency	Access Time	Memory Format	Memory Interface	Data Bus Width	Organization	Seated Height-Max	Memory Width	Write Cycle Time - Word, Page	Product Type	Density	Memory Density	Screening Level	Parallel/Serial	Memory IC Type	Legend	Programming Voltage	Background Color	Language	Product Category	Memory Organization	Diameter	Length	Width	Radiation Hardening	Lead Free
	Mfr. Тип MT62F1G32D2DS-023 AUT:B TR Anlielectronics Тип	Micron Technology	LPDDR5 32G 1GX32 FBGA Сборник данных Сравнение	Min.:1 Mult.:1	-	-	-	-	Surface Mount	200-WFBGA	-	200-WFBGA (10x14.5)	-	-	-	-	Micron	-	1050	-	-	Micron Technology	-	-	-	Volatile	Micron Technology Inc.	-	SMD/SMT	-	-	-	-	-	Tape & Reel (TR)	-	-	-	-	-	-	-	Active	-	-	-	-	-	-	-	-	-	-	-	-40°C ~ 125°C	-	Automotive, AEC-Q100	-	-	-	-	-	-	-	-	-	Memory & Data Storage	-	SDRAM - Mobile LPDDR5	1.05V	-	-	-	-	-	-	-	-	-	-	-	-	-	32Gbit	-	3.2 GHz	-	DRAM	Parallel	-	-	-	-	-	DRAM	-	-	-	-	-	-	-	-	-	DRAM	1G x 32	-	-	-	-	-
MT62F1G32D2DS-023 AUT:B TR Micron Technology RoHS : Инкапсуляция : - Есть складские запасы : - 1 : -
	Mfr. Тип MT53E1536M32D4DE-046 AAT:C Anlielectronics Тип	Micron Technology	LPDDR4 48G 1.5GX32 FBGA AAT Сборник данных Сравнение	Min.:1 Mult.:1	-	-	-	-	Surface Mount	200-TFBGA	-	200-TFBGA (10x14.5)	-	-	-	-	Micron	-	1360	-	-	Micron Technology	-	-	-	Volatile	Micron Technology Inc.	-	-	-	-	-	-	-	Tray	-	-	-	-	-	-	-	Active	-	-	-	-	-	-	-	-	-	-	-	-40°C ~ 105°C (TC)	-	Automotive, AEC-Q100	-	-	-	-	-	-	-	-	-	Memory & Data Storage	-	SDRAM - Mobile LPDDR4	1.06V ~ 1.17V	-	-	-	-	-	-	-	-	-	-	-	-	-	48Gbit	-	2.133 GHz	3.5 ns	DRAM	Parallel	-	-	-	-	18ns	DRAM	-	-	-	-	-	-	-	-	-	DRAM	1.5G x 32	-	-	-	-	-
MT53E1536M32D4DE-046 AAT:C Micron Technology RoHS : Инкапсуляция : - Есть складские запасы : - 1 : -
	Mfr. Тип MT62F2G32D4DS-023 WT:B Anlielectronics Тип	Micron Technology	LPDDR5 64G 2GX32 FBGA Сборник данных Сравнение	Min.:1 Mult.:1	-	-	-	-	Surface Mount	200-WFBGA	-	200-WFBGA (10x14.5)	-	-	-	-	-	-	-	-	-	-	-	-	-	Volatile	Micron Technology Inc.	-	SMD/SMT	-	-	-	-	-	Box	-	-	-	-	-	-	-	Active	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	SDRAM - Mobile LPDDR5	1.05V	-	-	-	-	-	-	-	-	-	-	-	-	-	64Gbit	-	4.266 GHz	-	DRAM	Parallel	-	2 G x 32	-	-	-	-	-	-	-	-	-	-	-	-	-	-	2G x 32	-	-	-	-	-
MT62F2G32D4DS-023 WT:B Micron Technology RoHS : Инкапсуляция : - Есть складские запасы : - 1 : -
	Mfr. Тип MT53E1G32D2FW-046 WT:B Anlielectronics Тип	Micron Technology	LPDDR4 32G 1GX32 FBGA DDP Сборник данных Сравнение	Min.:1 Mult.:1	-	-	-	-	Surface Mount	200-TFBGA	-	200-TFBGA (10x14.5)	-	-	-	MT53E1G32	Micron	-	1360	-	-	Micron Technology	-	-	-	Volatile	Micron Technology Inc.	-	SMD/SMT	MSL 3 - 168 hours	-	-	-	-	Tray	-	-	-	-	-	-	-	Active	-	-	Details	-	-	-	-	-	-	-	-	-25°C ~ 85°C (TC)	-	-	-	-	-	-	-	-	-	-	-	Memory & Data Storage	-	SDRAM - Mobile LPDDR4	1.06V ~ 1.17V	-	-	-	-	-	-	-	-	-	-	-	-	-	32 Gbit	-	2.133 GHz	3.5 ns	DRAM	Parallel	-	1 G x 32	-	-	18ns	DRAM	-	-	-	-	-	-	-	-	-	DRAM	1G x 32	-	-	-	-	-
MT53E1G32D2FW-046 WT:B Micron Technology RoHS : Инкапсуляция : - Есть складские запасы : - 1 : -
	Mfr. Тип MT62F1G64D4EK-023 AAT:C TR Anlielectronics Тип	Micron Technology	LPDDR5 64GBIT 64 441/441 TFBGA 4 AT Сборник данных Сравнение	Min.:1 Mult.:1	-	-	-	-	-	-	-	-	-	-	-	-	Micron	-	2000	-	-	Micron Technology	-	-	-	-	Micron Technology Inc.	-	-	-	-	-	-	-	Tape & Reel (TR)	-	-	-	-	-	557172-REEL	-	Active	-	-	Details	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	Memory & Data Storage	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	DRAM	-	-	-	-	-	-	-	-	-	DRAM	-	-	-	-	-	-
MT62F1G64D4EK-023 AAT:C TR Micron Technology RoHS : Инкапсуляция : - Есть складские запасы : - 1 : -
	Mfr. Тип MTFC128GAZAQJP-AAT Anlielectronics Тип	Micron Technology	EMMC 1T Сборник данных Сравнение	Min.:1 Mult.:1	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	SMD/SMT	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	Memory & Data Storage	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	128Gbit	-	200MHz	-	-	-	-	-	-	-	-	eMMC	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-
MTFC128GAZAQJP-AAT Micron Technology RoHS : Инкапсуляция : - Есть складские запасы : - 1 : -
	Mfr. Тип CT32G4RFD4266.36FD1 Anlielectronics Тип	Micron Technology	DRAM Module DDR4 RDIMM SDRAM 32 GB Сборник данных Сравнение	Min.:1 Mult.:1	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	32	-	-	-	-	-	-	-	-	-	-	-	-	-	-
CT32G4RFD4266.36FD1 Micron Technology RoHS : Инкапсуляция : - Есть складские запасы : - 1 : -
	Mfr. Тип MT53D768M32D2NP-046 WT:A TR Anlielectronics Тип	Micron Technology	DRAM Chip LPDDR4 SDRAM 24G-bit 768M X 32 1.1V Surface Mount FBGA T/R Сборник данных Сравнение	Min.:1 Mult.:1	-	-	Lead, Tin	Through Hole	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	Micron Technology Inc.	-	-	-	-	-	-	-	Tape & Reel (TR)	-	-	-	-	-	-	-	Obsolete	-	-	Non-Compliant	-	-	-	-	-	-	-	-	-	Tape & Reel	-	1 %	-	100 ppm/°C	-	16.9 kΩ	-	150 °C	-65 °C	Metal Film	-	125 mW	-	-	-	-	-	-	-	-	MIL-PRF-39017	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	1.68 mm	4.75 mm	1.68 mm	No	Contains Lead
MT53D768M32D2NP-046 WT:A TR Micron Technology RoHS : Инкапсуляция : - Есть складские запасы : - 1 : -
	Mfr. Тип MT53E384M32D2FW-046 IT:E TR Anlielectronics Тип	Micron Technology	DRAM Chip LPDDR4 12Gbit 384M X 32 1.1V 200-Pin TFBGA T/R Сборник данных Сравнение	Min.:1 Mult.:1	-	-	-	-	Surface Mount	200-TFBGA	-	200-TFBGA (10x14.5)	-	-	-	-	-	-	-	-	-	-	-	-	-	Volatile	Micron Technology Inc.	-	SMD/SMT	-	-	-	-	-	Tape & Reel (TR)	-	-	-	-	-	-	-	Active	-	-	-	-	-	-	-	-	-	-	-	-40°C ~ 95°C (TC)	-	-	-	-	-	-	-	-	-	-	-	-	-	SDRAM - Mobile LPDDR4X	1.06V ~ 1.17V	-	-	-	-	-	-	-	-	-	-	-	-	-	12Gbit	-	2.133 GHz	3.5 ns	DRAM	Parallel	-	-	-	-	18ns	-	-	-	-	-	-	-	-	-	-	-	384M x 32	-	-	-	-	-
MT53E384M32D2FW-046 IT:E TR Micron Technology RoHS : Инкапсуляция : - Есть складские запасы : - 1 : -
	Mfr. Тип MT29GZ6A6BPIET-046IT.112 TR Anlielectronics Тип	Micron Technology	NAND MCP 16GB Сборник данных Сравнение	Min.:1 Mult.:1	-	-	-	-	-	-	-	-	-	-	-	-	Micron	-	2000	-	-	Micron Technology	-	-	-	-	Micron Technology Inc.	-	-	-	-	-	-	-	Tape & Reel (TR)	-	-	-	-	-	-	-	Active	-	-	-	-	-	-	-	-	-	-	-	-	Reel	-	-	-	-	-	-	-	-	-	-	Memory & Data Storage	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	16 Gbit	-	-	-	-	-	-	-	-	-	-	Multichip Packages	-	-	-	-	-	-	-	-	-	Multichip Packages	-	-	-	-	-	-
MT29GZ6A6BPIET-046IT.112 TR Micron Technology RoHS : Инкапсуляция : - Есть складские запасы : - 1 : -
	Mfr. Тип MT29F2T08EMLGEJ4-ITF:G Anlielectronics Тип	Micron Technology	TLC 2T 256GX8 VBGA QDP Сборник данных Сравнение	Min.:1 Mult.:1	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	Micron Technology Inc.	-	-	-	-	-	-	-	Box	-	-	-	-	-	-	-	Active	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-
MT29F2T08EMLGEJ4-ITF:G Micron Technology RoHS : Инкапсуляция : - Есть складские запасы : - 1 : -
	Mfr. Тип MTFC32GAZAOTD-AAT Anlielectronics Тип	Micron Technology	UFS 256G Сборник данных Сравнение	Min.:1 Mult.:1	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	Micron Technology Inc.	-	-	-	-	-	-	-	Box	-	-	-	-	-	-	-	Active	-	-	-	-	TFBGA	-	-	-	-	-	-	-40 to 105 °C	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	256 GB	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-
MTFC32GAZAOTD-AAT Micron Technology RoHS : Инкапсуляция : - Есть складские запасы : - 1 : -
	Mfr. Тип MT29F4T08EULGEM4-ITF:G TR Anlielectronics Тип	Micron Technology	TLC 4T X8 LBGA Сборник данных Сравнение	Min.:1 Mult.:1	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	Micron Technology Inc.	-	-	-	-	-	-	-	Tape & Reel (TR)	-	-	-	-	-	-	-	Active	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-
MT29F4T08EULGEM4-ITF:G TR Micron Technology RoHS : Инкапсуляция : - Есть складские запасы : - 1 : -
	Mfr. Тип MTFC64GAZAOTD-AAT TR Anlielectronics Тип	Micron Technology	UFS 512G Сборник данных Сравнение	Min.:1 Mult.:1	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	Micron Technology Inc.	-	-	-	-	-	-	-	Tape & Reel (TR)	-	-	-	-	-	-	-	Active	-	-	-	-	TFBGA	-	-	-	-	-	-	-40 to 105 °C	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	512 GB	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-
MTFC64GAZAOTD-AAT TR Micron Technology RoHS : Инкапсуляция : - Есть складские запасы : - 1 : -
	Mfr. Тип MT53E256M16D1FW-046 AUT:B Anlielectronics Тип	Micron Technology	LPDDR4 4G 256MX16 FBGA Сборник данных Сравнение	Min.:1 Mult.:1	-	-	-	-	Surface Mount	200-TFBGA	-	200-TFBGA (10x14.5)	-	-	-	-	-	-	-	-	-	-	-	-	-	Volatile	Micron Technology Inc.	-	-	-	-	-	-	-	Box	-	-	-	-	-	-	-	Active	-	-	-	-	-	-	-	-	-	-	-	-40°C ~ 125°C (TC)	-	Automotive, AEC-Q100	-	-	-	-	-	-	-	-	-	-	-	SDRAM - Mobile LPDDR4X	1.06V ~ 1.17V	-	-	-	-	-	-	-	-	-	-	-	-	-	4Gbit	-	2.133 GHz	3.5 ns	DRAM	Parallel	-	-	-	-	18ns	-	-	-	-	-	-	-	-	-	-	-	256M x 16	-	-	-	-	-
MT53E256M16D1FW-046 AUT:B Micron Technology RoHS : Инкапсуляция : - Есть складские запасы : - 1 : -
	Mfr. Тип MT53E2G32D4DE-046 AAT:A TR Anlielectronics Тип	Micron Technology	LPDDR4 64G 1GX64 FBGA QDP Сборник данных Сравнение	Min.:1 Mult.:1	-	-	-	-	Surface Mount	200-TFBGA	-	200-TFBGA (10x14.5)	-	-	-	-	-	-	-	-	-	-	-	2.133 GHz	+ 105 C	Volatile	Micron Technology Inc.	- 40 C	SMD/SMT	-	-	-	-	-	Tape & Reel (TR)	-	-	-	-	-	-	-	Active	-	-	-	-	-	1.1 V	-	-	-	-	-	-40°C ~ 105°C (TC)	-	Automotive, AEC-Q100	-	-	-	SDRAM Mobile - LPDDR4	-	-	-	-	-	-	-	SDRAM - Mobile LPDDR4X	1.06V ~ 1.17V	-	-	-	-	-	-	-	-	-	-	-	-	-	64Gbit	-	2.133 GHz	3.5 ns	DRAM	Parallel	32 bit	2 G x 32	-	-	18ns	-	-	-	-	-	-	-	-	-	-	-	2G x 32	-	-	-	-	-
MT53E2G32D4DE-046 AAT:A TR Micron Technology RoHS : Инкапсуляция : - Есть складские запасы : - 1 : -
	Mfr. Тип MT42L32M32D1U08MWC1 Anlielectronics Тип	Micron Technology	LPDDR2 1G DIE 32MX32 Сборник данных Сравнение	Min.:1 Mult.:1	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-
MT42L32M32D1U08MWC1 Micron Technology RoHS : Инкапсуляция : - Есть складские запасы : - 1 : -
	Mfr. Тип MT62F1G64D8EK-031 WT:B TR Anlielectronics Тип	Micron Technology	LPDDR5 64G 1GX64 FBGA 8DP Сборник данных Сравнение	Min.:1 Mult.:1	-	-	-	-	Surface Mount	441-TFBGA	-	441-TFBGA (14x14)	-	-	-	-	-	-	-	-	-	-	-	-	-	Volatile	Micron Technology Inc.	-	-	-	-	-	-	-	Tape & Reel (TR)	-	-	-	-	-	-	-	Active	-	-	-	-	-	-	-	-	-	-	-	-25°C ~ 85°C	-	-	-	-	-	-	-	-	-	-	-	-	-	SDRAM - Mobile LPDDR5	1.05V	-	-	-	-	-	-	-	-	-	-	-	-	-	64Gbit	-	3.2 GHz	-	DRAM	Parallel	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	1G x 64	-	-	-	-	-
MT62F1G64D8EK-031 WT:B TR Micron Technology RoHS : Инкапсуляция : - Есть складские запасы : - 1 : -
	Mfr. Тип MT25QU128ABB1ESE-0AUT Anlielectronics Тип	Micron Technology	NOR Flash SPI Serial 1.7V to 2V 128Mbit 16M X 8bit 8-Pin SOP2 Сборник данных Сравнение	Min.:1 Mult.:1	-	-	-	-	Surface Mount	8-SOIC (0.209, 5.30mm Width)	-	8-SO	-	-	35 mA	MT25QU128	Micron	-	1800	-	SPI	Clarostat-Honeywell	73JA200	-	+ 125 C	Non-Volatile	Micron Technology Inc.	- 40 C	SMD/SMT	-	-	-	-	-	Tape & Reel (TR);Cut Tape (CT);Digi-Reel®;	-	-	-	-	-	-	-	Active	-	-	Details	-	-	3.6 V	2.7 V	-	Synchronous	-	-	-40°C ~ 125°C (TA)	Tray	*	-	-	-	-	-	-	-	-	-	Memory & Data Storage	-	FLASH - NOR	1.7V ~ 2V	-	-	-	-	-	-	-	-	-	-	-	-	-	128Mbit	-	166 MHz	-	FLASH	SPI	8 bit	16 M x 8	-	-	1.8ms	NOR Flash	-	-	-	-	-	-	-	-	-	NOR Flash	16M x 8	-	-	-	-	-
MT25QU128ABB1ESE-0AUT Micron Technology RoHS : Инкапсуляция : - Есть складские запасы : - 1 : -
	Mfr. Тип MT35XU01GBBA2G12-0SIT Anlielectronics Тип	Micron Technology	NOR Flash SPI FLASH NOR SLC 128MX8 TBGA DDP Сборник данных Сравнение	Min.:1 Mult.:1	3 Weeks	Production (Last Updated: 2 years ago)	-	-	-	-	YES	-	Polystyrene	24	-	-	Micron	200 MHz	1122	MICRON TECHNOLOGY INC	-	Brady	125647	-	-	-	-	-	-	-	134217728 words	128000000	85 °C	-40 °C	-	PLASTIC/EPOXY	TBGA	TBGA,	RECTANGULAR	GRID ARRAY, THIN PROFILE	-	Active	-	30	5.78	Details	Yes	TBGA	-	-	1.8 V	-	Xccela	Industrial grade	-40 to 85 °C	Tray	MT35X	-	e1	-	Warning Signs	-	Tin/Silver/Copper (Sn/Ag/Cu)	-	-	-	Memory & Data Storage	-	CMOS	-	BOTTOM	BALL	260	1	1 mm	compliant	-	R-PBGA-B24	2 V	INDUSTRIAL	1.7 V	2 V	1.7 V	-	SYNCHRONOUS	-	-	-	-	-	128MX8	1.2 mm	8	-	NOR Flash	1 Gb	1073741824 bit	Industrial	SERIAL	FLASH	Empty Oxygen Cylinders Do Not Use	1.8 V	Red	English	NOR Flash	-	-	8 mm	6 mm	-	-
MT35XU01GBBA2G12-0SIT Micron Technology RoHS : Инкапсуляция : - Есть складские запасы : - 1 : -

Integrated Circuits (ICs)

Memory definition: Memory is a component used to store programs and various data information. A memory cell is actually a type of sequential logic circuit. A m... Memory Product Listing: MT62F1G32D2DS-023 AUT:B TR,MT53E1536M32D4DE-046 AAT:C,MT62F2G32D4DS-023 WT:B,MT53E1G32D2FW-046 WT:B,MT62F1G64D4EK-023 AAT:C TR.Integrated Circuits (ICs) type:Embedded - Microcontrollers(129432),Memory(111901),PMIC - Supervisors(101743),PMIC - Voltage Regulators - Linear(101187),PMIC - Voltage Regulators - DC DC Switching Regulators(62822) .Memory has 10000 pieces of spot stock price information, you can click the "RFQ" button to confirm the inventory and price with the Anli.

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Integrated Circuits (ICs)