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  • Material Declaration NC7SZ373L6X
  • Die Material, Mold Compound 03/Oct/2008
  • Marking Content 19/Nov/2013
  • Mult Dev Assem/DS Chg 9/Jan/2019
  • Mult Devices 24/Oct/2017

NC7SZ373L6X

ON Semiconductor
Latch Transparent 3-ST 1-CH D-Type 6-Pin MicroPak W T/R
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Mult. :
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