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5111991235 Технические параметры
3M 5111991235 technical specifications, attributes, parameters and parts with similar specifications to Silicon Labs SI1084-A-GM.
| Свойство продукта | Значение свойства | |
|---|---|---|
| Классификация | Card Edge Connectors - Edgeboard Connectors | |
| Марка | 3M | |
| Mounting Type | Surface Mount | |
| Contact Plating | Gold | |
| Housing Material | Polyamide (PA46), Nylon 4/6, Glass Filled | |
| Number of Positions or Pins (Grid) | 16 (2 x 8) | |
| Contact Material - Mating | Beryllium Copper | |
| Contact Material - Post | Brass | |
| Contact Finish Mating | Gold | |
| Wire Size | 28 AWG | |
| Base/Housing Material | Polyester Elastomer | |
| Operating Temperature | -55°C ~ 105°C | |
| Series | EJECT-A-DIP™ | |
| Packaging | Bulk | |
| Part Status | Active |
| Свойство продукта | Значение свойства | |
|---|---|---|
| Termination | Solder | |
| Type | DIP, 0.3 (7.62mm) Row Spacing | |
| Color | Gray | |
| Gender | Plug-Plug | |
| Current Rating | 3A | |
| Pitch - Mating | 0.100 (2.54mm) | |
| Contact Finish - Post | Tin | |
| Contact Resistance | -- | |
| Termination Post Length | 0.040 (1.02mm) | |
| Pitch - Post | 0.100 (2.54mm) | |
| Features | Closed Frame | |
| Contact Finish Thickness - Mating | 10.0µin (0.25µm) | |
| Contact Finish Thickness - Post | 200.0µin (5.08µm) | |
| Card Thickness | 1.57 mm | |
| Material Flammability Rating | UL94 V-0 |
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