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AM27S29/BRA Технические параметры
Advanced Micro Devices AM27S29/BRA technical specifications, attributes, parameters and parts with similar specifications to Silicon Labs SI1084-A-GM.
| Свойство продукта | Значение свойства | |
|---|---|---|
| Классификация | Memory | |
| Марка | ||
| Package / Case | 20-CDIP (0.300", 7.62mm) | |
| Mounting Type | Through Hole | |
| Surface Mount | NO | |
| Supplier Device Package | 20-CDIP | |
| Number of Terminals | 20Terminals | |
| Mfr | Advanced Micro Devices | |
| Memory Types | Non-Volatile | |
| Product Status | Active | |
| Package | Bulk | |
| Base Product Number | AM27S29 | |
| Package Description | CERAMIC, DIP-20 | |
| Package Style | IN-LINE | |
| Number of Words Code | 512Words Codes | |
| Package Body Material | CERAMIC, GLASS-SEALED | |
| Operating Temperature-Min | -55 °C | |
| Access Time-Max | 70 ns | |
| Operating Temperature-Max | 125 °C | |
| Manufacturer Part Number | AM27S29/BRA | |
| Number of Words | 512 wordsWord | |
| Supply Voltage-Nom (Vsup) | 5 V | |
| Package Code | DIP | |
| Package Shape | RECTANGULAR | |
| Manufacturer | Rochester Electronics LLC | |
| Part Life Cycle Code | Obsolete | |
| Ihs Manufacturer | ROCHESTER ELECTRONICS LLC | |
| Risk Rank | 5.26 | |
| Part Package Code | DIP | |
| Series | - |
| Свойство продукта | Значение свойства | |
|---|---|---|
| Operating Temperature | -55°C ~ 125°C (TC) | |
| ECCN Code | EAR99 | |
| HTS Code | 8542.32.00.71 | |
| Voltage - Supply | 4.5V ~ 5.5V | |
| Terminal Position | DUAL | |
| Terminal Form | THROUGH-HOLE | |
| Number of Functions | 1Function | |
| Terminal Pitch | 2.54 mm | |
| Reach Compliance Code | unknown | |
| Pin Count | 20 | |
| JESD-30 Code | R-GDIP-T20 | |
| Qualification Status | Not Qualified | |
| Supply Voltage-Max (Vsup) | 5.5 V | |
| Temperature Grade | MILITARY | |
| Supply Voltage-Min (Vsup) | 4.5 V | |
| Memory Size | 4Kbit | |
| Operating Mode | ASYNCHRONOUS | |
| Access Time | 70 ns | |
| Memory Format | PROM | |
| Memory Interface | Parallel | |
| Organization | 512X8 | |
| Seated Height-Max | 5.08 mm | |
| Memory Width | 8 | |
| Write Cycle Time - Word, Page | - | |
| Memory Density | 4096 bit | |
| Parallel/Serial | PARALLEL | |
| Memory IC Type | OTP ROM | |
| Memory Organization | 512 x 8 | |
| Width | 7.62 mm | |
| Length | 24.257 mm |
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