Локаль
Язык
- English
- русский
Валюта
- CNY-¥
- RUB-₽
Цена такой валюты может меняться в зависимости от курса только для справки
ALTERA 10AS016C4U19I3SG technical specifications, attributes, parameters and parts with similar specifications to Silicon Labs SI1084-A-GM.
| Свойство продукта | Значение свойства | |
|---|---|---|
| Классификация | Embedded - System On Chip (SoC) | |
| Марка | ALTERA | |
| Package / Case | Axial | |
| Surface Mount | YES | |
| Number of Pins | 484Pins | |
| Supplier Device Package | Axial | |
| Number of Terminals | 484Terminals | |
| Number of I/Os | 192I/Os | |
| RoHS | Compliant | |
| Moisture Sensitive | Yes | |
| L1 Cache Instruction Memory | 2 x 32 kB | |
| Maximum Clock Frequency | 1.2 GHz | |
| Number of Logic Elements | 160000 LELogic Element | |
| Maximum Operating Temperature | + 100 C | |
| Unit Weight | 0.423288 oz | |
| Minimum Operating Temperature | - 40 C | |
| Factory Pack QuantityFactory Pack Quantity | 1 | |
| Mounting Styles | SMD/SMT | |
| Number of Logic Array Blocks - LABs | 20000 LABLogic Array Blocks - LAB | |
| Part # Aliases | 964681 | |
| Manufacturer | Intel | |
| Brand | Intel / Altera | |
| Tradename | Arria 10 SoC | |
| L1 Cache Data Memory | 2 x 32 kB | |
| Data RAM Size | - | |
| Package Description | FBGA, BGA484,22X22,32 | |
| Package Style | GRID ARRAY, FINE PITCH | |
| Package Body Material | PLASTIC/EPOXY | |
| Package Equivalence Code | BGA484,22X22,32 | |
| Operating Temperature-Min | -40 °C | |
| Supply Voltage-Nom | 0.9 V | |
| Reflow Temperature-Max (s) | NOT SPECIFIED | |
| Supply Voltage-Min | 0.87 V | |
| Operating Temperature-Max | 100 °C | |
| Rohs Code | Yes | |
| Manufacturer Part Number | 10AS016C4U19I3SG | |
| Package Code | FBGA | |
| Package Shape | SQUARE | |
| Part Life Cycle Code | Active | |
| Ihs Manufacturer | INTEL CORP | |
| Supply Voltage-Max | 0.93 V | |
| Risk Rank | 1.96 | |
| Operating Temperature | -65°C ~ 175°C | |
| Series | Military, MIL-PRF-55182/01, RNC55 | |
| Packaging | Bulk | |
| Size / Dimension | 0.094 Dia x 0.250 L (2.39mm x 6.35mm) | |
| Tolerance | ±0.1% |
| Свойство продукта | Значение свойства | |
|---|---|---|
| Part Status | Active | |
| Number of Terminations | 2Terminations | |
| Temperature Coefficient | ±50ppm/°C | |
| Resistance | 22.6 kOhms | |
| Max Operating Temperature | 100 °C | |
| Min Operating Temperature | -40 °C | |
| Composition | Metal Film | |
| Power (Watts) | 0.125W, 1/8W | |
| HTS Code | 8542.39.00.01 | |
| Subcategory | SOC - Systems on a Chip | |
| Technology | CMOS | |
| Terminal Position | BOTTOM | |
| Terminal Form | BALL | |
| Peak Reflow Temperature (Cel) | NOT SPECIFIED | |
| Terminal Pitch | 0.8 mm | |
| Reach Compliance Code | compliant | |
| JESD-30 Code | S-PBGA-B484 | |
| Number of Outputs | 192Outputs | |
| Qualification Status | Not Qualified | |
| Operating Supply Voltage | 1.8 V | |
| Failure Rate | P (0.1%) | |
| Power Supplies | 0.9 V | |
| Temperature Grade | INDUSTRIAL | |
| Speed | 1.5GHz | |
| RAM Size | 256KB | |
| Core Processor | Dual ARM® Cortex®-A9 MPCore™ with CoreSight™ | |
| Peripherals | DMA, POR, WDT | |
| Program Memory Size | - | |
| Connectivity | EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | |
| Architecture | MCU, FPGA | |
| Number of Inputs | 192Inputs | |
| Seated Height-Max | 3.25 mm | |
| Programmable Logic Type | FIELD PROGRAMMABLE GATE ARRAY | |
| Product Type | SoC FPGA | |
| Speed Grade | 3 | |
| Number of Transceivers | 6 TransceiverTransceiver | |
| Primary Attributes | FPGA - 160K Logic Elements | |
| Number of Registers | 246040Registers | |
| Number of Logic Cells | 160000Logic Cells | |
| Number of Cores | 2 CoreCore | |
| Flash Size | -- | |
| Features | Military, Moisture Resistant, Weldable | |
| Product Category | SoC FPGA | |
| Height Seated (Max) | -- | |
| Width | 19 mm | |
| Length | 19 mm |