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10AS016E4F27E3SG Технические параметры
ALTERA 10AS016E4F27E3SG technical specifications, attributes, parameters and parts with similar specifications to Silicon Labs SI1084-A-GM.
| Свойство продукта | Значение свойства | |
|---|---|---|
| Классификация | Embedded - System On Chip (SoC) | |
| Марка | ALTERA | |
| Package / Case | 672-BBGA, FCBGA | |
| Supplier Device Package | 672-FBGA (27x27) | |
| Material | Silicone, Ceramic Filled | |
| Shape | Square | |
| Package | Bulk | |
| Base Product Number | A17883 | |
| Mfr | Laird Technologies - Thermal Materials | |
| Product Status | Active | |
| Number of I/Os | 240I/Os | |
| RoHS | Non-Compliant | |
| Moisture Sensitive | Yes | |
| L1 Cache Instruction Memory | 2 x 32 kB | |
| Maximum Clock Frequency | 1.2 GHz | |
| Number of Logic Elements | 160000 LELogic Element | |
| Factory Pack QuantityFactory Pack Quantity | 1 | |
| Mounting Styles | SMD/SMT | |
| Number of Logic Array Blocks - LABs | 20000 LABLogic Array Blocks - LAB | |
| Part # Aliases | 964702 | |
| Manufacturer | Intel | |
| Brand | Intel / Altera | |
| Tradename | Arria 10 SoC | |
| L1 Cache Data Memory | 2 x 32 kB | |
| Data RAM Size | - | |
| Series | Tflex™ HD80000 | |
| Operating Temperature | 0°C ~ 100°C (TJ) |
| Свойство продукта | Значение свойства | |
|---|---|---|
| Packaging | Tray | |
| Part Status | Active | |
| Type | Gap Filler Pad, Sheet | |
| Color | Teal | |
| Subcategory | SOC - Systems on a Chip | |
| Speed | 1.5GHz | |
| RAM Size | 256KB | |
| Core Processor | Dual ARM® Cortex®-A9 MPCore™ with CoreSight™ | |
| Peripherals | DMA, POR, WDT | |
| Program Memory Size | - | |
| Connectivity | EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | |
| Usage | - | |
| Architecture | MCU, FPGA | |
| Shelf Life | 12 Months | |
| Adhesive | - | |
| Storage/Refrigeration Temperature | 32°F ~ 95°F (0°C ~ 35°C) | |
| Product Type | SoC FPGA | |
| Shelf Life Start | Date of Certification | |
| Backing, Carrier | - | |
| Outline | 228.60mm x 228.60mm | |
| Primary Attributes | FPGA - 160K Logic Elements | |
| Thermal Conductivity | 6.0W/m-K | |
| Number of Cores | 2 CoreCore | |
| Flash Size | -- | |
| Thermal Resistivity | - | |
| Product Category | SoC FPGA | |
| Thickness | 0.150 (3.81mm) |
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