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10AS032H2F35I1SG Технические параметры
ALTERA 10AS032H2F35I1SG technical specifications, attributes, parameters and parts with similar specifications to Silicon Labs SI1084-A-GM.
| Свойство продукта | Значение свойства | |
|---|---|---|
| Классификация | Embedded - System On Chip (SoC) | |
| Марка | ALTERA | |
| Package / Case | Axial | |
| Surface Mount | YES | |
| Supplier Device Package | Axial | |
| Number of Terminals | 1152Terminals | |
| Product Status | Active | |
| Mfr | Vishay Dale | |
| Base Product Number | RNC55 | |
| Package | Tape & Reel (TR) | |
| Number of I/Os | 384I/Os | |
| RoHS | Non-Compliant | |
| Package Description | 35 X 35 MM, ROHS COMPLIANT, FBGA-1152 | |
| Package Style | GRID ARRAY | |
| Package Body Material | PLASTIC/EPOXY | |
| Operating Temperature-Min | -40 °C | |
| Supply Voltage-Nom | 0.9 V | |
| Supply Voltage-Min | 0.87 V | |
| Operating Temperature-Max | 100 °C | |
| Rohs Code | Yes | |
| Manufacturer Part Number | 10AS032H2F35I1SG | |
| Package Code | BGA | |
| Package Shape | SQUARE | |
| Manufacturer | Intel Corporation | |
| Part Life Cycle Code | Obsolete | |
| Ihs Manufacturer | INTEL CORP | |
| Supply Voltage-Max | 0.93 V | |
| Risk Rank | 5.66 | |
| Series | Military, MIL-PRF-55182/01, RNC55 | |
| Operating Temperature | -65°C ~ 175°C | |
| Packaging | Tray |
| Свойство продукта | Значение свойства | |
|---|---|---|
| Size / Dimension | 0.094 Dia x 0.250 L (2.39mm x 6.35mm) | |
| Tolerance | ±1% | |
| Part Status | Discontinued at Digi-Key | |
| Number of Terminations | 2Terminations | |
| Temperature Coefficient | ±50ppm/°C | |
| Resistance | 10 Ohms | |
| Composition | Metal Film | |
| Power (Watts) | 0.125W, 1/8W | |
| HTS Code | 8542.39.00.01 | |
| Terminal Position | BOTTOM | |
| Terminal Form | BALL | |
| Terminal Pitch | 1 mm | |
| Reach Compliance Code | compliant | |
| JESD-30 Code | S-PBGA-B1152 | |
| Failure Rate | R (0.01%) | |
| Temperature Grade | INDUSTRIAL | |
| Speed | 1.5GHz | |
| RAM Size | 256KB | |
| Core Processor | Dual ARM® Cortex®-A9 MPCore™ with CoreSight™ | |
| Peripherals | DMA, POR, WDT | |
| Connectivity | EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | |
| Architecture | MCU, FPGA | |
| Seated Height-Max | 3.5 mm | |
| Programmable Logic Type | FIELD PROGRAMMABLE GATE ARRAY | |
| Primary Attributes | FPGA - 320K Logic Elements | |
| Flash Size | -- | |
| Features | Military, Moisture Resistant, Weldable | |
| Height Seated (Max) | - | |
| Width | 35 mm | |
| Length | 35 mm |
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