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10AS032H4F35I3LG Технические параметры
ALTERA 10AS032H4F35I3LG technical specifications, attributes, parameters and parts with similar specifications to Silicon Labs SI1084-A-GM.
| Свойство продукта | Значение свойства | |
|---|---|---|
| Классификация | Embedded - System On Chip (SoC) | |
| Марка | ALTERA | |
| Mounting Type | Panel Mount | |
| Surface Mount | YES | |
| Mounting Feature | Flange | |
| Shell Material | Composite | |
| Insert Material | Thermoplastic | |
| Number of Terminals | 1152Terminals | |
| Backshell Material, Plating | - | |
| Voltage, Rating | - | |
| Package | Bulk | |
| Primary Material | Composite | |
| Base Product Number | ACT90 | |
| Mfr | TE Connectivity Deutsch Connectors | |
| Product Status | Discontinued at Digi-Key | |
| Contact Materials | Copper Alloy | |
| Contact Finish Mating | Gold | |
| Number of I/Os | 384I/Os | |
| Package Description | BGA, BGA1152,34X34,40 | |
| Package Style | GRID ARRAY | |
| Package Body Material | PLASTIC/EPOXY | |
| Package Equivalence Code | BGA1152,34X34,40 | |
| Operating Temperature-Min | -40 °C | |
| Supply Voltage-Nom | 0.9 V | |
| Reflow Temperature-Max (s) | NOT SPECIFIED | |
| Supply Voltage-Min | 0.87 V | |
| Risk Rank | 5.45 | |
| Supply Voltage-Max | 0.93 V | |
| Ihs Manufacturer | INTEL CORP | |
| Part Life Cycle Code | Active | |
| Manufacturer | Intel Corporation | |
| Package Shape | SQUARE | |
| Package Code | BGA | |
| Manufacturer Part Number | 10AS032H4F35I3LG | |
| Rohs Code | Yes | |
| Operating Temperature-Max | 100 °C | |
| Operating Temperature | -65°C ~ 200°C | |
| Series | MIL-DTL-38999 Series III, ACT | |
| Packaging | Tray | |
| Part Status | Active | |
| Termination | Crimp | |
| Connector Type | Receptacle, Male Pins |
| Свойство продукта | Значение свойства | |
|---|---|---|
| Number of Positions | 6Positions | |
| Color | Silver | |
| Applications | Aerospace, Military | |
| HTS Code | 8542.39.00.01 | |
| Fastening Type | Threaded | |
| Subcategory | Field Programmable Gate Arrays | |
| Current Rating (Amps) | 23A | |
| Technology | CMOS | |
| Terminal Position | BOTTOM | |
| Orientation | N (Normal) | |
| Terminal Form | BALL | |
| Shielding | Shielded | |
| Peak Reflow Temperature (Cel) | NOT SPECIFIED | |
| Ingress Protection | Environment Resistant | |
| Terminal Pitch | 1 mm | |
| Reach Compliance Code | compliant | |
| Shell Finish | Nickel | |
| Shell Size - Insert | 17-6 | |
| JESD-30 Code | S-PBGA-B1152 | |
| Number of Outputs | 384Outputs | |
| Qualification Status | Not Qualified | |
| Power Supplies | 0.9 V | |
| Temperature Grade | INDUSTRIAL | |
| Speed | 1.5GHz | |
| RAM Size | 256KB | |
| Shell Size, MIL | E | |
| Core Processor | Dual ARM® Cortex®-A9 MPCore™ with CoreSight™ | |
| Peripherals | DMA, POR, WDT | |
| Connectivity | EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | |
| Cable Opening | - | |
| Architecture | MCU, FPGA | |
| Number of Inputs | 384Inputs | |
| Seated Height-Max | 3.5 mm | |
| Programmable Logic Type | FIELD PROGRAMMABLE GATE ARRAY | |
| Primary Attributes | FPGA - 320K Logic Elements | |
| Number of Logic Cells | 320000Logic Cells | |
| Flash Size | -- | |
| Features | - | |
| Width | 35 mm | |
| Length | 35 mm | |
| Contact Finish Thickness - Mating | - | |
| Material Flammability Rating | - |
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