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XA7Z030-1FBG484I Технические параметры

AMD  XA7Z030-1FBG484I technical specifications, attributes, parameters and parts with similar specifications to Silicon Labs SI1084-A-GM.

Свойство продукта Значение свойства
Классификация Embedded - System On Chip (SoC)
Марка AMD
Mounting Type Free Hanging (In-Line)
Package / Case 484-BBGA, FCBGA
Mounting Feature -
Contact Shape Circular
Shell Material Zinc Die Cast
Supplier Device Package 484-FCBGA (23x23)
Insert Material Polyamide (PA66), Nylon 6/6
Package Bulk
Base Product Number MB1JJN
Contact Sizes 1.0mm (5), 2.0mm (4)
Mfr Amphenol Sine Systems Corp
Product Status Active
Number of I/Os 130I/Os
Operating Temperature -20°C ~ 130°C
Series MotionGrade™ M23 Power Standard Series, Threaded
Connector Type Receptacle Housing
Type For Male Pins
Number of Positions 9 (5 + 3 Power + PE)Position
Fastening Type Threaded
Свойство продукта Значение свойства
Contact Type Crimp
Orientation Keyed
Shielding Shielded
Ingress Protection IP67 - Dust Tight, Waterproof
Shell Finish Nickel
Shell Size - Insert M23-9
Housing Color Silver
Note Contacts Not Included
Speed 667MHz
RAM Size 256KB
Shell Size, MIL -
Core Processor Dual ARM® Cortex®-A9 MPCore™ with CoreSight™
Peripherals DMA
Connectivity CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Architecture MCU, FPGA
Includes -
Primary Attributes Kintex™-7 FPGA, 125K Logic Cells
Flash Size -
Features -
Material Flammability Rating UL94 V-0
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