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XC7Z045-3FFG676E Технические параметры

AMD  XC7Z045-3FFG676E technical specifications, attributes, parameters and parts with similar specifications to Silicon Labs SI1084-A-GM.

Свойство продукта Значение свойства
Классификация Embedded - System On Chip (SoC)
Марка AMD
Mounting Type Surface Mount, MLCC
Package / Case 0603 (1608 Metric)
Supplier Device Package 676-FCBGA (27x27)
Lead Free Status / RoHS Status Lead free / RoHS Compliant
Voltage Rated 200V
Instruction Set Architecture Thumb-2
I/O Voltage 1.2, 3.3 V
Supplier Package FCBGA
Number of CPU Cores 2CPU Cores
Mounting Surface Mount
Number of I/Os 130I/Os
Package Tray
Base Product Number XC7Z045
Mfr AMD
Product Status Active
Operating Temperature -55°C ~ 150°C
Series GA
Packaging Tape & Reel (TR)
Size / Dimension 0.063 L x 0.032 W (1.60mm x 0.80mm)
Tolerance ±2%
Свойство продукта Значение свойства
Moisture Sensitivity Level (MSL) 1 (Unlimited)
Temperature Coefficient C0G, NP0
Applications Automotive
Capacitance 270pF
Pin Count 676
Operating Supply Voltage 1 V
Failure Rate -
Lead Spacing -
Speed 1GHz
RAM Size 256KB
Lead Style -
Core Processor Dual ARM® Cortex®-A9 MPCore™ with CoreSight™
Peripherals DMA
Connectivity CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Architecture MCU, FPGA
Data Bus Width 32 Bit
Primary Attributes Kintex™-7 FPGA, 350K Logic Cells
Flash Size -
Features -
Height Seated (Max) -
Thickness (Max) 0.038 (0.97mm)
Ratings AEC-Q200
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