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XCVU23P-1FSVJ1760E Технические параметры

AMD  XCVU23P-1FSVJ1760E technical specifications, attributes, parameters and parts with similar specifications to Silicon Labs SI1084-A-GM.

Свойство продукта Значение свойства
Классификация Embedded - FPGAs (Field Programmable Gate Array)
Марка AMD
Mounting Type Panel Mount
Package / Case 1760-BBGA, FCBGA
Supplier Device Package 1760-FCBGA (42.5x42.5)
Housing Material Copper Alloy
Body Material --
Contact Material - Plating Silver
Contact Materials Beryllium Copper
Voltage Rated --
Number of I/Os 644I/Os
Package Tray
Mfr AMD
Product Status Active
Operating Temperature --
Series 35FM3
Packaging Bulk
Part Status Active
Termination Solder Eyelet(s)
Connector Type Jack
Свойство продукта Значение свойства
Gender Female
Voltage - Supply 0.825V ~ 0.876V
Shielding Unshielded
Insulation Color --
Cable Opening --
Thread Size 3/8-32
Number of Logic Elements/Cells 2252250Logic Elements/Cells
Number of Positions/Contacts 3 Conductors, 3 ContactsPositions/Contact
Includes 3 pcs - 1 Connector, 1 Nut, 1 Washer
Total RAM Bits 77909197
Number of LABs/CLBs 128700LABs/CLBs
Internal Switch(s) Does Not Contain Switch
Body Color Silver
Panel Hole Size 0.390 (9.91 mm)
Industry Recognized Mating Diameter 3.50mm (0.141, 1/8, Mini Plug) - Headphone
Actual Diameter --
Signal Lines Stereo
Mating Length/Depth --
Features --
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