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XCZU19EG-1FFVD1760I Технические параметры

AMD  XCZU19EG-1FFVD1760I technical specifications, attributes, parameters and parts with similar specifications to Silicon Labs SI1084-A-GM.

Свойство продукта Значение свойства
Классификация Embedded - System On Chip (SoC)
Марка AMD
Mounting Type Free Hanging (In-Line)
Package / Case 1760-BBGA, FCBGA
Mounting Feature -
Contact Shape Circular
Shell Material Aluminum Alloy
Supplier Device Package 1760-FCBGA (42.5x42.5)
Insert Material Plastic
Package Bulk
Base Product Number KJB6T
Contact Sizes 22D
Mfr ITT Cannon, LLC
Product Status Active
Number of I/Os 308I/Os
Operating Temperature -65°C ~ 175°C
Series KJB
Connector Type Plug Housing
Type For Male Pins
Number of Positions 6Positions
Fastening Type Threaded
Свойство продукта Значение свойства
Contact Type Crimp
Orientation C
Shielding Shielded
Ingress Protection Environment Resistant
Shell Finish Cadmium over Electroless Nickel
Shell Size - Insert 9-35
Housing Color Olive Drab
Note Contacts Not Included
Speed 500MHz, 600MHz, 1.2GHz
RAM Size 256KB
Shell Size, MIL -
Core Processor Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2
Peripherals DMA, WDT
Connectivity CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Architecture MCU, FPGA
Includes -
Primary Attributes Zynq®UltraScale+™ FPGA, 1143K+ Logic Cells
Flash Size -
Features Coupling Nut
Material Flammability Rating -
Просмотр сходства
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