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AMD XCZU4EG-1FBVB900I technical specifications, attributes, parameters and parts with similar specifications to Silicon Labs SI1084-A-GM.
| Свойство продукта | Значение свойства | |
|---|---|---|
| Классификация | Embedded - System On Chip (SoC) | |
| Марка | AMD | |
| Package / Case | 900-BBGA, FCBGA | |
| Supplier Device Package | 900-FCBGA (31x31) | |
| Housing Material | Plastic | |
| Voltage, Rating | 12 V | |
| RoHS | Compliant | |
| Airflow | 55.62 CFM | |
| Number of I/Os | 204I/Os | |
| Package | Tray | |
| Base Product Number | XCZU4 | |
| Mfr | AMD | |
| Product Status | Active | |
| Packaging | Box | |
| Operating Temperature | -40°C ~ 100°C (TJ) | |
| Series | Zynq® UltraScale+™ MPSoC EG |
| Свойство продукта | Значение свойства | |
|---|---|---|
| Termination | Wire Leads | |
| Power Rating | 10.2 W | |
| Speed | 500MHz, 600MHz, 1.2GHz | |
| RAM Size | 256KB | |
| Core Processor | Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2 | |
| Peripherals | DMA, WDT | |
| Connectivity | CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | |
| Architecture | MCU, FPGA | |
| Bearing Type | Ball | |
| Primary Attributes | Zynq®UltraScale+™ FPGA, 192K+ Logic Cells | |
| Flash Size | - | |
| Width | 38 mm | |
| Height | 60 mm | |
| Length | 60 mm | |
| Lead Free | Lead Free |