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XC17512LPDG8C Технические параметры

AMD Xilinx  XC17512LPDG8C technical specifications, attributes, parameters and parts with similar specifications to Silicon Labs SI1084-A-GM.

Свойство продукта Значение свойства
Классификация Memory
Марка
Surface Mount NO
Number of Terminals 8Terminals
Rohs Code Yes
Part Life Cycle Code Obsolete
Ihs Manufacturer XILINX INC
Part Package Code DIP
Package Description DIP,
Moisture Sensitivity Levels 1
Number of Words 524288 wordsWord
Number of Words Code 512000Words Codes
Operating Temperature-Max 70 °C
Package Body Material PLASTIC/EPOXY
Package Code DIP
Package Shape RECTANGULAR
Package Style IN-LINE
Supply Voltage-Nom (Vsup) 3.3 V
JESD-609 Code e3
ECCN Code EAR99
Terminal Finish Matte Tin (Sn)
Additional Feature USED FOR STORING THE CONFIGURATION BITSTREAMS OF XILINX FPGAS
HTS Code 8542.32.00.51
Свойство продукта Значение свойства
Terminal Position DUAL
Terminal Form THROUGH-HOLE
Peak Reflow Temperature (Cel) 260
Number of Functions 1Function
Terminal Pitch 2.54 mm
Reach Compliance Code compliant
Time@Peak Reflow Temperature-Max (s) 40
Pin Count 8
JESD-30 Code R-PDIP-T8
Qualification Status Not Qualified
Supply Voltage-Max (Vsup) 3.6 V
Temperature Grade COMMERCIAL
Supply Voltage-Min (Vsup) 3 V
Operating Mode SYNCHRONOUS
Organization 512KX1
Seated Height-Max 4.5974 mm
Memory Width 1
Memory Density 524288 bit
Parallel/Serial SERIAL
Memory IC Type CONFIGURATION MEMORY
Length 9.3599 mm
Width 7.62 mm
Просмотр сходства

XC17512LPDG8C Документы

XC17512LPDG8C brand manufacturers: AMD Xilinx, Anli stock, XC17512LPDG8C reference price.AMD Xilinx. XC17512LPDG8C parameters, XC17512LPDG8C Datasheet PDF and pin diagram description download.You can use the XC17512LPDG8C Memory, DSP Datesheet PDF, find XC17512LPDG8C pin diagram and circuit diagram and usage method of function,XC17512LPDG8C electronics tutorials.You can download from the Anli.