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XCZU19EG-3FFVC1760I Технические параметры

AMD Xilinx  XCZU19EG-3FFVC1760I technical specifications, attributes, parameters and parts with similar specifications to Silicon Labs SI1084-A-GM.

Свойство продукта Значение свойства
Классификация Embedded - Microcontrollers - Application Specific
Марка
Surface Mount YES
Number of Terminals 1760Terminals
Rohs Code Yes
Part Life Cycle Code Transferred
Ihs Manufacturer XILINX INC
Package Description BGA,
Date Of Intro 2017-02-15
Moisture Sensitivity Levels 4
Operating Temperature-Max 100 °C
Operating Temperature-Min -40 °C
Package Body Material PLASTIC/EPOXY
Package Code BGA
Package Shape SQUARE
Свойство продукта Значение свойства
Package Style GRID ARRAY
Supply Voltage-Nom 0.9 V
JESD-609 Code e1
Terminal Finish TIN SILVER COPPER
HTS Code 8542.31.00.01
Terminal Position BOTTOM
Terminal Form BALL
Terminal Pitch 1 mm
Reach Compliance Code compliant
JESD-30 Code S-PBGA-B1760
Temperature Grade INDUSTRIAL
uPs/uCs/Peripheral ICs Type PROGRAMMABLE SoC
Seated Height-Max 3.71 mm
Length 42.5 mm
Width 42.5 mm
Просмотр сходства
XCZU19EG-3FFVC1760I brand manufacturers: AMD Xilinx, Anli stock, XCZU19EG-3FFVC1760I reference price.AMD Xilinx. XCZU19EG-3FFVC1760I parameters, XCZU19EG-3FFVC1760I Datasheet PDF and pin diagram description download.You can use the XCZU19EG-3FFVC1760I Embedded - Microcontrollers - Application Specific, DSP Datesheet PDF, find XCZU19EG-3FFVC1760I pin diagram and circuit diagram and usage method of function,XCZU19EG-3FFVC1760I electronics tutorials.You can download from the Anli.