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XCZU3EG-1LSFVA625I Технические параметры
AMD Xilinx XCZU3EG-1LSFVA625I technical specifications, attributes, parameters and parts with similar specifications to Silicon Labs SI1084-A-GM.
| Свойство продукта | Значение свойства | |
|---|---|---|
| Классификация | Embedded - Microcontrollers | |
| Марка | ||
| Surface Mount | YES | |
| Number of Terminals | 625Terminals | |
| Rohs Code | Yes | |
| Part Life Cycle Code | Transferred | |
| Ihs Manufacturer | XILINX INC | |
| Date Of Intro | 2018-03-09 | |
| Moisture Sensitivity Levels | 4 | |
| Operating Temperature-Max | 100 °C | |
| Operating Temperature-Min | -40 °C | |
| Package Body Material | PLASTIC/EPOXY | |
| Package Code | FBGA | |
| Package Equivalence Code | BGA625,25X25,32 | |
| Package Shape | SQUARE | |
| Package Style | GRID ARRAY, FINE PITCH | |
| Supply Voltage-Nom | 0.85 V |
| Свойство продукта | Значение свойства | |
|---|---|---|
| JESD-609 Code | e1 | |
| Terminal Finish | Tin/Silver/Copper (Sn/Ag/Cu) | |
| HTS Code | 8542.31.00.01 | |
| Terminal Position | BOTTOM | |
| Terminal Form | BALL | |
| Peak Reflow Temperature (Cel) | 250 | |
| Terminal Pitch | 0.8 mm | |
| Reach Compliance Code | compliant | |
| Time@Peak Reflow Temperature-Max (s) | 30 | |
| JESD-30 Code | S-PBGA-B625 | |
| Temperature Grade | INDUSTRIAL | |
| uPs/uCs/Peripheral ICs Type | PROGRAMMABLE SoC | |
| Seated Height-Max | 3.43 mm | |
| Bus Compatibility | CAN, I2C, SPI, UART | |
| Length | 21 mm | |
| Width | 21 mm |
XCZU3EG-1LSFVA625I Документы
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